JP2006186403A5 - - Google Patents

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Publication number
JP2006186403A5
JP2006186403A5 JP2006099577A JP2006099577A JP2006186403A5 JP 2006186403 A5 JP2006186403 A5 JP 2006186403A5 JP 2006099577 A JP2006099577 A JP 2006099577A JP 2006099577 A JP2006099577 A JP 2006099577A JP 2006186403 A5 JP2006186403 A5 JP 2006186403A5
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JP
Japan
Prior art keywords
region
semiconductor substrate
forming
element active
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006099577A
Other languages
English (en)
Japanese (ja)
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JP2006186403A (ja
JP4659662B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2006099577A priority Critical patent/JP4659662B2/ja
Priority claimed from JP2006099577A external-priority patent/JP4659662B2/ja
Publication of JP2006186403A publication Critical patent/JP2006186403A/ja
Publication of JP2006186403A5 publication Critical patent/JP2006186403A5/ja
Application granted granted Critical
Publication of JP4659662B2 publication Critical patent/JP4659662B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006099577A 1997-04-28 2006-03-31 半導体装置及びその製造方法 Expired - Fee Related JP4659662B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006099577A JP4659662B2 (ja) 1997-04-28 2006-03-31 半導体装置及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP12494397 1997-04-28
JP20245297 1997-07-11
JP2006099577A JP4659662B2 (ja) 1997-04-28 2006-03-31 半導体装置及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP10045692A Division JPH1187664A (ja) 1997-04-28 1998-02-26 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2006186403A JP2006186403A (ja) 2006-07-13
JP2006186403A5 true JP2006186403A5 (enrdf_load_stackoverflow) 2006-08-24
JP4659662B2 JP4659662B2 (ja) 2011-03-30

Family

ID=36739214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006099577A Expired - Fee Related JP4659662B2 (ja) 1997-04-28 2006-03-31 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP4659662B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5579577B2 (ja) * 2010-11-09 2014-08-27 ラピスセミコンダクタ株式会社 半導体装置の製造方法
US9847133B2 (en) 2016-01-19 2017-12-19 Ememory Technology Inc. Memory array capable of performing byte erase operation
US11177180B2 (en) * 2020-02-11 2021-11-16 Taiwan Semiconductor Manufacturing Co., Ltd. Profile control of a gap fill structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59155968A (ja) * 1983-02-25 1984-09-05 Toshiba Corp 半導体記憶装置
JPS6079768A (ja) * 1983-10-07 1985-05-07 Hitachi Ltd 半導体集積回路装置
JPS61281558A (ja) * 1985-06-07 1986-12-11 Toshiba Corp Ｍｏｓ型半導体装置
JPH02125470A (ja) * 1988-06-15 1990-05-14 Seiko Instr Inc 半導体不揮発性メモリ
JPH03253072A (ja) * 1990-03-02 1991-11-12 Hitachi Ltd 半導体装置
JPH05267619A (ja) * 1992-01-23 1993-10-15 Toshiba Corp 半導体装置および半導体装置の製造方法
JP3344598B2 (ja) * 1993-11-25 2002-11-11 株式会社デンソー 半導体不揮発メモリ装置
JPH08130295A (ja) * 1994-09-08 1996-05-21 Mitsubishi Electric Corp 半導体記憶装置および半導体装置
JPH08222710A (ja) * 1995-02-17 1996-08-30 Mitsubishi Electric Corp 半導体装置
JPH08288379A (ja) * 1995-02-17 1996-11-01 Nippon Steel Corp 半導体装置及びその製造方法
JPH0955483A (ja) * 1995-06-09 1997-02-25 Mitsubishi Electric Corp 半導体記憶装置
JP4053647B2 (ja) * 1997-02-27 2008-02-27 株式会社東芝 半導体記憶装置及びその製造方法

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