JP2006179925A - 容量デバイス、有機誘電ラミネート、およびそのようなデバイスを組み込んだプリント配線板、ならびにそれらの製造方法 - Google Patents
容量デバイス、有機誘電ラミネート、およびそのようなデバイスを組み込んだプリント配線板、ならびにそれらの製造方法 Download PDFInfo
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Abstract
【解決手段】本発明の誘電性組成物が常誘電性フィラーとポリマーとを含み、前記誘電性フィラーは50〜150の誘電率を有する。
【選択図】図2
Description
10〜150の誘電率で且つ高い絶縁抵抗及び破壊電圧を有する常誘電性セラミックフィラーは、本発明に対して本質的である。本明細書において常誘電性セラミックフィラーは、電圧に対して電荷及び分極の線形応答(linear response)を示すセラミック粒子を意味するものと定義される。常誘電性フィラーは、加えられた電界を取り除いた後、結晶構造内で全体的な電荷の可逆性分極を示す。従来より、強誘電性(ferroelectric)フィラーは、それらが一般に常誘電性フィラーよりも高い誘電率を有するので、誘電体の誘電率を高めるために用いられている。強誘電性材料のより高い誘電率は、電圧に対する電荷及び分極の非線形応答によるものである。この非線形応答は、強誘電性材料の重要な特性である。また、強誘電性フィラーは、結晶構造中の非可逆性変化のため、加えられた電界による分極に関してヒステリシス現象を示す。強誘電性フィラーはより高い誘電率を有するが、強誘電性特性のために多数の否定的電気特性を有している。強誘電性材料は、常誘電性材料よりも低い絶縁抵抗(高い漏れ電流)を有する傾向がある。また、強誘電性材料は、より低い誘電耐電圧を有し、且つ温度と共により広く静電容量が変化する傾向がある。充填材入りポリマーフィルムに対して高い静電容量を実現するために、3つの要素が利用できる:フィラー粉末の誘電率を増加する、フィラー粉末の濃度を増加する、又は充填材入りポリマーフィルムの厚さを減少する。確かに、強誘電性フィラーはより高い誘電率という優位点を有している。しかしながら、常誘電性フィラーのより高い誘電耐電圧及びより低い漏れ電流により、これらのキャパシタフィルムは、より高い濃度で充填され、且つより薄いフィルムに含有され、そしてさらに、必要とされる全ての電気特性を得ることができる。
ポリマーは、この発明の組成物にとって重要である。ポリマーの最も重要な特性の一つは、常誘電性フィラー及び任意選択的なその他のフィラーを組成物中に分散できることである。本発明に有用なポリマーは、エポキシ樹脂、アクリル樹脂、ポリウレタン及びポリイミドである。本発明の使用に適切なポリイミドは、Kanakarajan等の特許文献2に開示され、それらは本明細書中に組み込まれる。
強誘電性セラミックフィラー、溶媒、分散剤、接着剤、ならびに当業者に既知のその他の添加剤などの他の構成成分を、組成物に添加してもよい。
本発明の組成物は、常誘電性フィラー及び任意選択的にその他の追加のフィラーを供給し、そのフィラーを望ましいポリマーと混合し、そして、従来のダイカスティング技術などの当業者に既知の技術で組成物をフィルム形状に成形することにより、「フィルム」に作成される。このフィルムを単層又は多層構造として形成してもよい。
本発明のフィルムは、本発明の誘電性組成物の単層又は多層から形成されたキャパシタなどの種々の電子部品、例えば、平面キャパシタ・ラミネートの形成に利用することができる。
30 ICデバイス
42 はんだパッド
48 はんだ接合
50 表面実装技術(SMT)キャパシタ
52 はんだパッド
58 はんだ接合
59 回路トレース
60 回路トレース
70 回路トレース
80 バイヤホール(スルーホールバイヤ)
200 容量デバイス
201 括弧(})
210 下部電極
211 導電回路トレース
212 第一の金属箔
220 誘電体
222 第一の誘電層
226 第二の誘電層
227 薄い接着層
240 上部電極又は上部極板
242 第二の金属箔
245 導電(回路)トレース
248 ギャップ
250 めっきスルーホールバイヤ
260 導電回路トレース
270 ICデバイス
272 はんだパッド
274 はんだ接合
280 誘電層
282 ラミネート材料(誘電層)
2000 プリント配線板
Claims (14)
- 常誘電性フィラー及びポリマー材料を含む誘電性組成物であって、50〜150の誘電率を有することを特徴とする組成物。
- 前記常誘電性フィラーは5〜55体積%の量で含まれることを特徴とする請求項1に記載の組成物。
- さらに溶媒を含むことを特徴とする請求項1に記載の組成物。
- 前記常誘電性フィラーは、TiO2、Ta2O5、Hf2O5、Nb2O5、Al2O3、ステアタイト及びそれらの混合物からなる群から選択されることを特徴とする請求項1に記載の組成物。
- 前記常誘電性フィラーの平均粒度は2ミクロンより小さいことを特徴とする請求項1に記載の組成物。
- 前記ポリマーは、エポキシ樹脂、アクリル樹脂、ポリウレタン及びポリイミドから選択されることを特徴とする請求項1に記載の組成物。
- さらに強誘電性フィラーを含むことを特徴とする請求項1に記載の組成物。
- 前記強誘電性フィラーは、一般式ABO3のペロブスカイト、結晶性チタン酸バリウム(BT)、チタン酸バリウムストロンチウム(BST)、チタン酸ジルコン酸鉛(PZT)、チタン酸鉛ランタン、ジルコン酸チタン酸鉛ランタン(PLZT)、ニオブ酸マグネシウム鉛(PMN)、及びチタン酸カルシウム銅、ならびにそれらの混合物からなる群から選択されることを特徴とする請求項7に記載の組成物。
- 前記組成物は、加工されてフィルムに形成されることを特徴とする請求項1に記載の組成物。
- 二つの導電性電極の間に配置された請求項1に記載の誘電性組成物を含むことを特徴とするキャパシタ。
- 請求項10に記載のフィルムを含むことを特徴とするキャパシタ。
- 埋込型平面キャパシタを形成する方法であって、
請求項1に記載の誘電性組成物を提供するステップ;
前記請求項1に記載の誘電性組成物を第一の金属層に付け、そのようにして金属面と誘電体面が形成されるステップ;
前記誘電体面に第二の金属層を付けるステップ;
を含むことを特徴とする方法。 - 請求項12に記載の方法で形成されたことを特徴とする埋込型平面キャパシタ。
- 請求項11に記載のキャパシタを含むことを特徴とするプリント配線板。
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US63781604P | 2004-12-21 | 2004-12-21 | |
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US64872605P | 2005-02-01 | 2005-02-01 | |
US60/648,726 | 2005-02-01 |
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EP1675131B1 (en) | 2009-01-28 |
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DE602005012569D1 (de) | 2009-03-19 |
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