JP2006173400A5 - - Google Patents

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Publication number
JP2006173400A5
JP2006173400A5 JP2004364774A JP2004364774A JP2006173400A5 JP 2006173400 A5 JP2006173400 A5 JP 2006173400A5 JP 2004364774 A JP2004364774 A JP 2004364774A JP 2004364774 A JP2004364774 A JP 2004364774A JP 2006173400 A5 JP2006173400 A5 JP 2006173400A5
Authority
JP
Japan
Prior art keywords
plane layer
wiring pattern
ground plane
layer
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004364774A
Other languages
English (en)
Japanese (ja)
Other versions
JP4717431B2 (ja
JP2006173400A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004364774A priority Critical patent/JP4717431B2/ja
Priority claimed from JP2004364774A external-priority patent/JP4717431B2/ja
Publication of JP2006173400A publication Critical patent/JP2006173400A/ja
Publication of JP2006173400A5 publication Critical patent/JP2006173400A5/ja
Application granted granted Critical
Publication of JP4717431B2 publication Critical patent/JP4717431B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004364774A 2004-12-16 2004-12-16 プリント配線板 Expired - Fee Related JP4717431B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004364774A JP4717431B2 (ja) 2004-12-16 2004-12-16 プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004364774A JP4717431B2 (ja) 2004-12-16 2004-12-16 プリント配線板

Publications (3)

Publication Number Publication Date
JP2006173400A JP2006173400A (ja) 2006-06-29
JP2006173400A5 true JP2006173400A5 (https=) 2008-02-14
JP4717431B2 JP4717431B2 (ja) 2011-07-06

Family

ID=36673806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004364774A Expired - Fee Related JP4717431B2 (ja) 2004-12-16 2004-12-16 プリント配線板

Country Status (1)

Country Link
JP (1) JP4717431B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5320704B2 (ja) * 2007-08-24 2013-10-23 日本電気株式会社 多層プリント基板、多層プリント基板と同軸コネクタとの接続構造
JP5049841B2 (ja) * 2008-03-28 2012-10-17 株式会社東芝 多層基板
WO2019216188A1 (ja) 2018-05-08 2019-11-14 株式会社村田製作所 伝送線路及びその実装構造

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0397975A (ja) * 1989-09-06 1991-04-23 Hosokawa Micron Corp 合成皮革
JP2654414B2 (ja) * 1991-07-19 1997-09-17 沖電気工業株式会社 高速信号伝送用回路基板
JPH06260773A (ja) * 1993-03-03 1994-09-16 Oki Electric Ind Co Ltd 高速信号伝送用回路基板のパッド部の構造
JPH07307578A (ja) * 1994-05-13 1995-11-21 Oki Electric Ind Co Ltd 高速信号伝送用回路基板の部品搭載用パッド部の構造
JPH0936504A (ja) * 1995-07-20 1997-02-07 Oki Electric Ind Co Ltd プリント基板の信号伝送線路の配線構造
JPH11317572A (ja) * 1998-05-06 1999-11-16 Hitachi Ltd 特性インピーダンス調整プリント基板
JP3201345B2 (ja) * 1998-05-13 2001-08-20 日本電気株式会社 多層プリント配線板

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