JP2006173400A5 - - Google Patents
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- Publication number
- JP2006173400A5 JP2006173400A5 JP2004364774A JP2004364774A JP2006173400A5 JP 2006173400 A5 JP2006173400 A5 JP 2006173400A5 JP 2004364774 A JP2004364774 A JP 2004364774A JP 2004364774 A JP2004364774 A JP 2004364774A JP 2006173400 A5 JP2006173400 A5 JP 2006173400A5
- Authority
- JP
- Japan
- Prior art keywords
- plane layer
- wiring pattern
- ground plane
- layer
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004364774A JP4717431B2 (ja) | 2004-12-16 | 2004-12-16 | プリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004364774A JP4717431B2 (ja) | 2004-12-16 | 2004-12-16 | プリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006173400A JP2006173400A (ja) | 2006-06-29 |
| JP2006173400A5 true JP2006173400A5 (https=) | 2008-02-14 |
| JP4717431B2 JP4717431B2 (ja) | 2011-07-06 |
Family
ID=36673806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004364774A Expired - Fee Related JP4717431B2 (ja) | 2004-12-16 | 2004-12-16 | プリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4717431B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5320704B2 (ja) * | 2007-08-24 | 2013-10-23 | 日本電気株式会社 | 多層プリント基板、多層プリント基板と同軸コネクタとの接続構造 |
| JP5049841B2 (ja) * | 2008-03-28 | 2012-10-17 | 株式会社東芝 | 多層基板 |
| WO2019216188A1 (ja) | 2018-05-08 | 2019-11-14 | 株式会社村田製作所 | 伝送線路及びその実装構造 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0397975A (ja) * | 1989-09-06 | 1991-04-23 | Hosokawa Micron Corp | 合成皮革 |
| JP2654414B2 (ja) * | 1991-07-19 | 1997-09-17 | 沖電気工業株式会社 | 高速信号伝送用回路基板 |
| JPH06260773A (ja) * | 1993-03-03 | 1994-09-16 | Oki Electric Ind Co Ltd | 高速信号伝送用回路基板のパッド部の構造 |
| JPH07307578A (ja) * | 1994-05-13 | 1995-11-21 | Oki Electric Ind Co Ltd | 高速信号伝送用回路基板の部品搭載用パッド部の構造 |
| JPH0936504A (ja) * | 1995-07-20 | 1997-02-07 | Oki Electric Ind Co Ltd | プリント基板の信号伝送線路の配線構造 |
| JPH11317572A (ja) * | 1998-05-06 | 1999-11-16 | Hitachi Ltd | 特性インピーダンス調整プリント基板 |
| JP3201345B2 (ja) * | 1998-05-13 | 2001-08-20 | 日本電気株式会社 | 多層プリント配線板 |
-
2004
- 2004-12-16 JP JP2004364774A patent/JP4717431B2/ja not_active Expired - Fee Related
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