JP2006173364A - Stage device and exposure device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage device which enables reduction in size and weight. <P>SOLUTION: When a stage WST whereon an object is mounted is driven in an X-axis direction by a first driving mechanism, the reaction force of a driving force acts on a part of the first driving mechanism. However, in this process, a first counter weight 79 with prescribed weight is moved by a control device with respect to an X-axis direction in the opposite direction of the movement direction of a stage via first axial linear motors 80A, 80B. In the process, the control device drives a first counter weight at a velocity in accordance with the weight of the stage WST and the first counter weight 79, and thereby the reaction force can be canceled by the reaction force of the driving force of the first counter weight. Accordingly, the weight of the first counter weight can be reduced compared to the case that the reaction force of the stage is canceled by the free motion of the first counter weight following the principle of the conservation of momentum. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a stage apparatus and an exposure apparatus, and more particularly to a stage apparatus having a reaction force canceling mechanism for canceling a reaction force when a stage is driven, and an exposure apparatus including the stage apparatus.

  2. Description of the Related Art In recent years, in the lithography process in the manufacture of semiconductor elements, liquid crystal display elements, etc., with the high integration of semiconductors, etc., a fine pattern is formed with a high throughput through a photosensitive object such as a wafer or a substrate such as a glass plate (hereinafter referred to as “wafer” Step-and-repeat reduction projection exposure apparatus (so-called stepper), step-and-scan scanning projection exposure apparatus (so-called scanning stepper (also called scanner)), etc. The sequential movement type exposure apparatus is mainly used.

  In this type of exposure apparatus, a wafer stage is driven in a two-dimensional plane by a linear motor as a driving apparatus for driving the wafer, and the wafer is held on the wafer stage and a voice coil motor or the like is used to tilt and incline the Z axis A wafer stage apparatus having a coarse / fine movement structure having a wafer table that is micro-driven in a direction is generally used.

  When the stage is driven using a linear motor, the reaction force of the driving force acts on the stator of the linear motor, and there is a possibility that part of the vibration caused by the reaction force deteriorates the exposure accuracy. Therefore, an exposure apparatus that drives the stage using a linear motor is usually provided with a mechanism that cancels the reaction force as much as possible. As this reaction force canceling mechanism, a counter mass (counter weight) mechanism using a law of conservation of momentum is used relatively often (see, for example, Patent Document 1 and Patent Document 2).

  However, since the counter mass mechanism uses the principle that the product of the mass of the stage and the moving speed matches the product of the mass of the counter mass and the moving speed, the mass and moving distance between the stage and the counter mass are determined. Have a certain relationship. That is, if the mass of the counter mass, that is, the weight is increased in order to reduce the movement stroke of the counter mass, the entire stage apparatus becomes heavy. On the other hand, if the mass (weight) of the counter mass is reduced, the counter mass can be moved. Since it is necessary to set a large stroke, the stage apparatus becomes large as a result.

  In particular, when the wafer stage is two-dimensionally driven by a linear motor, a linear motor that drives the wafer stage in a single axis direction (referred to as a “first axis drive motor” for convenience), and a wafer stage that is integrated with the linear motor. A two-axis linear motor system having a linear motor (referred to as a “second-axis drive motor” for convenience) driven in another axial direction orthogonal to the one axis is often employed. The reaction force of the driving force of the wafer stage is not only transmitted to the stator of the first shaft drive motor, but is also transmitted to the stator of the second shaft drive motor via the stator. Force processing has become extremely difficult, and as a result, it has been difficult to realize further improvement in position controllability of the wafer stage.

JP-A-8-63231 US Pat. No. 6,255,796

The present invention has been made under the circumstances described above. From a first viewpoint, a stage (WST) on which an object (W) is placed; a first driving the stage in a first axial direction; A driving mechanism (XLM ₁ , XLM ₂ ); a first counterweight (79) having a predetermined weight for canceling a reaction force of the driving force of the stage in the first axis direction; A first shaft linear motor (80A) having a stator (78A) provided at least partially inside and a mover (78B) connected to the first counterweight; and the first shaft linear And a control device (50) for moving the first counterweight in a direction opposite to a moving direction of the stage with respect to the first axis direction by a motor.

  According to this, when the stage on which the object is placed is driven in the first axial direction by the first driving mechanism, the reaction force of the driving force acts on a part of the first driving mechanism. At this time, the first counterweight having a predetermined weight is moved by the control device with respect to the first axis direction in the direction opposite to the moving direction of the stage via the first axis linear motor. In this case, the control device drives the first counterweight at a speed corresponding to the weight of the stage and the first counterweight, so that the reaction force of the driving force of the first counterweight It becomes possible to cancel the reaction force. As a result, the weight of the first counterweight can be reduced compared with the case where the reaction force of the stage is canceled out by the free movement of the first counterweight according to the law of conservation of momentum, and the stage device is reduced in size and weight. Is possible.

  Here, it is closed that the operating axis of the total driving force with respect to the counterweight by the linear motor is set on the driving shaft on which the driving force generated by the first driving mechanism acts when driving the stage in the first axis direction. The number of the first counterweights is not particularly limited from the viewpoint of realizing the reaction force cancellation in the first axis direction.

  According to a second aspect of the present invention, there is provided an exposure apparatus for exposing a substrate (W) to form a pattern on the substrate, the stage apparatus of the present invention having the substrate placed on the stage. An exposure apparatus is provided.

  According to this, since the stage apparatus reduced in size and weight is provided, as a result, the exposure apparatus can be reduced in size and weight.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 schematically shows a configuration of an exposure apparatus 10 according to an embodiment.

  The exposure apparatus 10 synchronously moves a reticle R as a mask and a wafer W as a substrate (and an object) in a one-dimensional direction (here, a Y-axis direction that is a direction perpendicular to the paper surface in FIG. 1). A step-and-scan type scanning exposure apparatus (that is, a so-called scanner (also called a scanning stepper) that transfers a circuit pattern formed on the reticle R to a plurality of shot areas on the wafer W via the projection optical system PL. )).

  The exposure apparatus 10 includes an illumination system 12 that illuminates the reticle R with the illumination light IL, a reticle stage RST on which the reticle R is mounted, a projection optical system PL that projects the illumination light IL through the reticle R onto the wafer W, and the wafer. A wafer stage device 20 including a wafer stage WST as a stage on which W is placed is provided.

  The illumination system 12 has a slit-like illumination area that extends in the left-right direction in FIG. 1 on the reticle R defined by a field stop (reticle blind) (not shown) inside the illumination system 12 by illumination light IL. Illuminate with good illuminance. Here, as the illumination light IL, for example, ArF excimer laser light (wavelength 193 nm) is used.

  On reticle stage RST, reticle R is fixed by, for example, vacuum suction (or electrostatic suction). Reticle stage RST is driven by reticle stage drive unit 22 in the X-axis direction, Y-axis direction, and θz direction (in the XY plane perpendicular to the optical axis AX of projection optical system PL described later) in the XY plane. It can be driven minutely in the rotation direction around the Z axis) and can be driven at the scanning speed specified in the scanning direction (Y axis direction) along the upper surface of the reticle stage base 30. Here, the reticle stage drive unit 22 is actually a mechanism using a linear motor, a voice coil motor, or the like as a drive source, but is shown as a simple block in FIG. 1 for convenience of illustration. Note that as the reticle stage RST, a coarse movement stage that is driven one-dimensionally in the Y-axis direction, and the reticle R is minutely moved in the direction of at least three degrees of freedom (X-axis direction, Y-axis direction, and θz direction) with respect to the coarse movement stage. You may employ | adopt the stage of the coarse / fine movement structure which has a fine movement stage which can be driven.

  The position of the reticle stage RST in the XY plane (including θz rotation) is resolved by a reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 16 via a movable mirror 15 to a resolution of about 0.5 to 1 nm, for example. Always detected. Position information of reticle stage RST from reticle interferometer 16 (including rotation information such as θz rotation amount (yaw amount)) is supplied to main control device 50 as a control device. Main controller 50 controls driving of reticle stage RST via reticle stage driving unit 22 based on position information of reticle stage RST. Instead of the movable mirror 15, for example, the end surface of the reticle stage RST may be mirror-finished to form a reflective surface (corresponding to the reflective surface of the movable mirror 15).

  As the projection optical system PL, for example, a double-side telecentric reduction system whose projection magnification is 1/4 (or 1/5) is used. For this reason, when the illumination light (ultraviolet pulse light) IL is irradiated from the illumination system 12 onto the reticle R, a light flux from a portion illuminated by the ultraviolet pulse light in the circuit pattern region formed on the reticle R is projected. An image of the circuit pattern (partially reduced image) in the irradiation area of the illumination light IL (the above-described illumination area) is incident on the optical system PL, and the image plane side of the projection optical system PL is irradiated with each pulse of ultraviolet pulse light. In the center of the field of view, the image is limited to a slit shape (or rectangular shape (polygonal shape)) elongated in the X-axis direction. As a result, a partial reduced image of the circuit pattern is formed on the resist layer on the surface of one of the plurality of shot areas on the wafer W arranged on the imaging plane of the projection optical system PL.

  Wafer stage device 20 is arranged below projection optical system PL in FIG. 1, and includes wafer stage WST, a drive system for driving wafer stage WST, and the like. Here, each component of the wafer stage apparatus 20 will be described in detail with reference to the drawings.

  As shown in FIGS. 1 and 2, wafer stage WST is arranged above surface plate 44 placed on base 46 provided on floor F of the clean room.

  As shown in FIG. 2, the base 46 has a rectangular shape in plan view (viewed from above), and is thicker at the four corners than the other parts, and is higher than the other parts. Projecting convex portions 46a to 46d are formed. The surface plate 44 is a plate-like member that is rectangular in plan view (as viewed from above), and is disposed at a position that does not mechanically interfere with the convex portions 46 a to 46 d at the center of the upper surface of the base 46. The upper surface of the surface plate 44 is finished with a very high degree of flatness and serves as a guide surface when the wafer stage WST is moved. Hereinafter, the upper surface of the surface plate 44 is also referred to as a “guide surface”.

  As shown in FIG. 2, wafer stage WST includes wafer table WTB for holding wafer W, and stage main body 100 for supporting wafer table WTB via a micro-drive mechanism to be described later.

  As shown in the exploded perspective view of FIG. 3, the stage main body 100 has a predetermined thickness for connecting a pair of frame-shaped members 94A and 94B having a rectangular YZ cross section and the vicinity of the lower ends of the frame-shaped members 94A and 94B. Connecting plate 95D, and three plates 95A, 95B, and 95C that are thinner than the connecting plate 95D installed between the frame-like members 94A and 94B at a predetermined interval in the vertical direction.

  A pair of opposed surfaces (upper and lower surfaces) inside the frame-shaped members 94A and 94B are provided with a static gas bearing (not shown) (for example, an air bearing).

  As shown in FIG. 5A, a plurality of gas hydrostatic bearings (for example, air bearings) 194 are provided on the bottom surface of the connecting plate 95D, and the stage main body 100 is interposed via these gas hydrostatic bearings 194. Further, it is levitated and supported above the upper surface (guide surface) of the stage surface plate 44 via a clearance of about several μm.

  Magnetic pole units 76A and 76B as first movable portions are provided on the lower surface of the plate 95A and the upper surface of the plate 95B (see FIG. 5A). Each of the magnetic pole units 76A and 76B has a plurality of field magnets arranged at predetermined intervals along the X-axis direction in the inside thereof, and the space between the magnetic pole units 76A and 76B is related to the X-axis direction. An alternating magnetic field is formed.

  Similarly, magnetic pole units 76C and 76D as first movable parts similar to the magnetic pole units 76A and 76B are provided on the lower surface of the plate 95C and the upper surface of the connecting plate 95D, respectively (see FIG. 5A). An alternating magnetic field is formed in the space between 76C and 76D in the X-axis direction.

  In addition, two permanent magnets 75 elongated in the X-axis direction are provided on the lower surface of the plate 95B and the upper surface of the plate 95C in a state of being aligned in the Y-axis direction (FIGS. 5A and 5B). )reference). Among these permanent magnets 75, magnets provided on the same plate have opposite polarities, and permanent magnets opposed in the Z-axis direction have opposite polarities. Therefore, a magnetic field in which the direction of the magnetic flux is in the + Z direction (or -Z direction) is generated between the magnets facing in the Z-axis direction (see FIG. 5B).

  As shown in FIG. 3, Y fine movement mechanisms 99A and 99B are provided on the one frame-like member 94A. An X fine movement mechanism 99C is provided on the upper surface of the plate 95A, and Z fine movement mechanisms 96a to 96c are provided in the vicinity of the X fine movement mechanism 99C. Each of these fine movement mechanisms includes a stator and a mover, and each mover is provided on the wafer table WTB side. In FIG. 3, the wafer table WTB is indicated by an imaginary line (two-point difference line) for convenience of illustration and easy understanding of the explanation.

  More specifically, the Y fine movement mechanisms 99A and 99B are disposed on the frame member 94A at a predetermined interval in the X-axis direction. These Y fine movement mechanisms 99A and 99B are fixed to the upper surface of the frame member 94A and the mover 97b attached to the −Y side end surface of wafer table WTB, as representatively shown for Y fine movement mechanism 99A in FIG. The wafer table WTB is finely driven in the two-degree-of-freedom directions in the Y-axis direction and the θz direction (rotation direction about the Z-axis) by these Y fine movement mechanisms 99A and 99B. The

  As shown in FIG. 3, the X fine movement mechanism 99 </ b> C is disposed substantially at the center of the upper surface of the plate 95 </ b> A. The X fine movement mechanism 99C includes a voice coil motor similar to the Y fine movement mechanism 99A, which includes a mover provided on the lower surface of the wafer table WTB and a stator provided on the upper surface of the stage main body 100 (plate 95A). The wafer table WTB is finely driven in the X-axis direction by the X fine movement mechanism 99C.

  The Z fine movement mechanisms 96a to 96c are respectively disposed at positions that are the vertices of substantially isosceles triangles (or regular triangles) on the upper surface of the plate 95A. Each of Z fine movement mechanisms 96a to 96c includes a voice coil motor that supports wafer table WTB and independently finely drives in the Z-axis direction. Accordingly, Z fine movement mechanisms 96a to 96c slightly drive wafer table WTB in three degrees of freedom in the Z-axis direction, θx direction (rotation direction around X axis), and θy direction (rotation direction around Y axis). .

  In the present embodiment, the Y fine movement mechanisms 99A and 99B, the X fine movement mechanism 99C, and the Z fine movement mechanisms 96a to 96c are controlled by the main controller 50 in FIG. 1, whereby the wafer table WTB is placed on the stage main body 100. Microdrive is performed in a total of six degrees of freedom in the X, Y, Z, θx, θy, and θz directions.

  On the wafer table WTB, as shown in FIGS. 1 and 2, etc., the wafer W is fixed by electrostatic chucking (or vacuum chucking) via a wafer holder WH. On the upper surface of wafer table WTB, as shown in FIG. 1, movable mirror 102 to which a measurement beam from wafer laser interferometer (hereinafter referred to as “wafer interferometer”) 104 is irradiated is fixed.

  Here, on wafer table WTB, as shown in FIG. 2, Y movable mirror 102a extending in the X-axis direction is fixed to one side (+ Y side) side surface in the Y-axis direction. An X moving mirror 102b extending in the Y-axis direction is fixed to one side surface (−X side) in the direction.

  Wafer stage WST configured in this manner is in a state of being engaged with X-axis stator unit 200, as shown in FIG. This X-axis stator unit 200 has a cross-sectional shape extending in the X-axis direction and arranged parallel to the horizontal plane at a predetermined interval in the vertical direction as shown in FIG. A pair of X-axis stators 61A and 61B as a first fixed portion of an I-shape (that is, an H-shape having a low height) that is turned sideways, and in parallel between these X-axis stators 61A and 61B A Y-axis stator 63 having a similar cross-sectional shape, and a pair of X-axis counter mass mechanisms 88A disposed at predetermined intervals on the + Y side and the −Y side of these stators 61A, 61B, 63, 88B and the stators 61A, 61B, 63 and the X-axis counter mass mechanisms 88A, 88B are fixed to one end (−X end) and the other end (+ X end) in the longitudinal direction, respectively. X-axis counter mass mechanism 8A, 88B are integrated on the connecting plates 65A, 65B, the -X side connecting plate 65A is fixed to the -X side surface and extends in the Y-axis direction, and the + X side mounting plate 65B is provided on the + X side surface. Frame-shaped member 51B.

  In the assembled state of FIG. 2, as shown in FIG. 5A, the X-axis stator 61A is inserted between the magnetic pole units 76A and 76B provided on the stage body 100, and the X-axis stator 61B is The Y-axis stator 63 is inserted into the gap between the permanent magnets 75 provided on the plates 95B and 95C, respectively, between the magnetic pole units 76C and 76D.

The X-axis stators 61A and 61B are formed of an armature unit having a plurality of armature coils at predetermined intervals (predetermined pitch) along the X-axis direction. In the present embodiment, an electromagnetic force (Lorentz force) generated by electromagnetic interaction between the alternating magnetic field between the magnetic pole units 76A and 76B and the armature coil of the X-axis stator 61A located in the alternating magnetic field, and The stage body 100 (wafer) is generated by electromagnetic force (Lorentz force) generated by electromagnetic interaction between the alternating magnetic field between the magnetic pole units 76C and 76D and the armature coil of the X-axis stator 61B located in the alternating magnetic field. Stage WST) is driven in the X-axis direction. That, X-axis stators 61A and a pair of magnetic pole units 76A, by the 76B, X-axis linear motor XLM ₁ of moving magnet type is configured, X-axis stator 61B and a pair of magnetic pole units 76C, by the 76D, moving magnet A type X-axis linear motor XLM ₂ is configured. These X-axis linear motors XLM ₁ and XLM ₂ constitute a first drive mechanism that drives wafer stage WST in the X-axis direction (first axis direction).

  Inside the Y-axis stator 63, as shown in FIG. 5B, for example, a magnetic field in the + Z direction formed between the upper and lower permanent magnets 75 on the -Y side, and the upper and lower permanent magnets on the + Y side. 75 One electric machine in shape (including size) and arrangement that can simultaneously generate current flows in the −X direction and the + X direction in a −Z direction magnetic field formed between 75 A child coil is disposed. Therefore, the electromagnetic interaction between the current in the -X direction flowing through the armature coil and the magnetic field in the + Z direction and the electromagnetic interaction between the current in the + X direction and the magnetic field in the -Z direction cause the electromagnetic force in the + Y direction to be applied to the armature coil. A force is generated, and a reaction force is generated to drive the four permanent magnets 75, that is, the stage main body 100 in the -Y direction. Of course, if the direction of the current flowing through the armature coil is opposite to the above, a driving force for driving the stage body 100 in the + Y direction is generated. That is, Y-axis stator 63 and four permanent magnets 75 constitute Y-axis fine movement motor 72 that minutely drives wafer stage WST in the Y-axis direction.

  In the present embodiment, the main controller 50 controls the magnitude and direction of the current supplied to the armature coil constituting the Y-axis stator 63, and the wafer stage main body 100 is moved to the Y-axis. The magnitude and direction of the driving force (reaction force of Lorentz force) that drives the stator 63 in the Y-axis direction is arbitrarily controlled.

  Further, as shown in FIG. 5A, a target 141B is provided on the −Y side end surface of the Y-axis stator 63, and electrostatic force is applied to the + Y side surface of the frame-shaped member 94A facing the target 141B. A capacitance sensor (probe) 141A is provided. The capacitance formed between the capacitance sensor 141A and the target 141B changes according to the change in the distance between the capacitance sensor 141A and the target 141B. Therefore, the distance can be detected by detecting the capacitance of the capacitance sensor 141A. The output of the capacitance sensor 141A is supplied to the main controller 50. Main controller 50 maintains the distance between capacitance sensor 141A and target 141B, that is, the position of wafer stage WST in the Y-axis direction at a constant value based on the output of capacitance sensor 141A. It has become.

  Returning to FIG. 3, the X-axis counter mass mechanisms 88A and 88B are arranged at positions equidistant from the X-axis stators 61A and 61B and the Y-axis stator 63 on one side and the other side in the Y-axis direction. Yes. Of these X-axis counter mass mechanisms 88A and 88B, one X-axis counter mass mechanism 88A includes a casing 68 formed of a cylindrical member having a rectangular cross section and an interior of the casing 68, as shown in FIG. A stator 78A composed of an armature unit extending along the X-axis direction substantially at the center in the Y-axis direction of the bottom surface, and a plurality of the first linear motor 80A as the first-axis linear motor together with the stator 78A And a first counterweight 79 having a predetermined weight (for example, about half the weight of the wafer stage WST) provided with the mover 78B. ing.

  The first counterweight 79 is formed with a recess having a predetermined depth (height) surrounding the stator 78A from above and from both sides at the center of the bottom surface in the Y-axis direction. A pair of movers 78B is provided.

  In addition, a gas static pressure bearing (not shown) is provided on the bottom surface and both side surfaces of the first counterweight 79, and the first counterweight 79 is attached to the housing 68 via the gas static pressure bearing. It is supported in a non-contact manner through a clearance of several μm. The first counterweight 79 is preferably composed of a member having a relatively high density.

  Since the X-axis counter mass mechanism 88A is configured in this way, the first counter is driven by the driving force generated by the electromagnetic interaction between the stator 78A and the pair of movers 78B constituting the linear motor 80A. The weight 79 is driven in the X axis direction (first axis direction). The linear motor 80A is controlled by the main controller 50. The other X-axis counter mass mechanism 88B is configured in the same manner as the X-axis counter mass mechanism 88A, and a second linear motor 80B (see FIG. 3) as a first axis linear motor constituting the X-axis counter mass mechanism 88B. It is controlled by the main controller 50.

In the assembled state shown in FIG. 2, the X-axis counter mass mechanisms 88A and 88B are inserted into the internal spaces of the frame-shaped members 94A and 94B constituting the stage main body 100 described above. That is, wafer stage WST is engaged with X-axis counter mass mechanisms 88A and 88B in a state where frame members 94A and 94B surround the entire outer peripheral surface of casing 68 of X-axis counter mass mechanisms 88A and 88B. As described above, the static gas bearings (not shown) are provided on the inner surfaces of the frame members 94A and 94B, and these static gas bearings face the respective housings 68 of the counter mass mechanisms 88A and 88B. ing. The frame-shaped members 94A and 94B are supported in a non-contact manner on the respective housings 68 of the counter mass mechanisms 88A and 88B by the static pressure of the pressurized gas ejected between the gas static pressure bearing and the housing 68. ing. Therefore, when the wafer stage WST is driven in the X-axis direction by the linear motors XLM ₁ and XLM ₂ described above, the frame-shaped members 94A and 94B constituting the wafer stage WST are provided in the respective housings of the X-axis counter mass mechanisms 88A and 88B. The body 68 is guided in the X-axis direction without contact.

  As shown in FIG. 4, the frame-shaped members 51 </ b> A and 51 </ b> B are attached to outer peripheral portions of prismatic guide members 52 </ b> A and 52 </ b> B. The surfaces of the guide members 52A and 52B are finished with high flatness. As shown in FIG. 4 and FIG. 2, one guide member 52A has one end (−Y end) in the longitudinal direction (Y-axis direction) by the support members 160A and 160B on the convex portions 46a and 46b of the base 46. Portion) and the other end portion (+ Y end portion) are supported, whereby the guide member 52A is supported horizontally. The other guide member 52B is horizontally supported by the support members 160C and 160D on the convex portions 46c and 46d of the base 46.

  On the inner surfaces of the frame-shaped members 51A and 51B, gas static pressure bearings for ejecting pressurized gas to the guide members 52A and 52B are provided, and the frame-shaped members 51A and 51B are generated by the static pressure of the pressurized gas. Is supported in a non-contact manner with respect to the guide members 52A and 52B.

  As shown in FIG. 4, a Y-axis movable element 62A as a second movable part is attached to the upper surface of one frame-like member 51A. The Y-axis movable element 62A includes a yoke having a U-shaped XZ section and a plurality of field magnets respectively disposed at predetermined intervals along the Y-axis direction on the inner facing surfaces (upper surface and lower surface) of the yoke. is doing. In this case, an alternating magnetic field is formed in the Y-axis direction in the inner space of the yoke. The Y-axis movable element 62A is engaged with a Y-axis stator 64A as a second fixed portion whose longitudinal direction is the Y-axis direction in a non-contact manner. The Y-axis stator 64A includes a casing having a T-shaped XZ cross section and an armature coil (not shown) disposed at a predetermined interval along the Y-axis direction inside (or the outer surface of) the casing. It is configured to include. As shown in FIG. 2, the Y-axis stator 64 </ b> A is fixed to the + X side surface of the Y-axis counter mass mechanism 56 </ b> A whose longitudinal direction is the Y-axis direction fixed to the −X end of the base 46. .

  The upper surface of the other frame-shaped member 51B is provided with a Y-axis movable element 62C as a second movable part configured similarly to the Y-axis movable element 62A, and the Y-axis movable element 62C includes a Y-axis movable element. The Y-axis stator 64 </ b> C is configured in the same manner as 64 </ b> A, and is engaged in a non-contact manner as a second fixing portion whose longitudinal direction is the Y-axis direction. The Y-axis stator 64 </ b> C is fixed to the −X side surface of the Y-axis counter mass mechanism 56 </ b> A whose longitudinal direction is the Y-axis direction fixed to the + X end of the base 46.

  In the present embodiment, it is generated by electromagnetic interaction between the current flowing through the armature coils constituting the Y-axis stators 64A and 64C and the alternating magnetic field generated by the field magnets constituting the Y-axis movers 62A and 62C. Wafer stage WST is driven in the Y-axis direction along guides 52A and 52B integrally with X-axis stator unit 200 by a driving force (a reaction force of Lorentz force). That is, in this embodiment, the Y-axis mover 62A and the Y-axis stator 64A constitute a Y-axis linear motor 66A composed of a moving magnet type linear motor, and the Y-axis mover 62C and the Y-axis stator 64C. Thus, a Y-axis linear motor 66C composed of a moving magnet type linear motor is configured.

  Further, Y-axis movers similar to those described above are provided on the lower surfaces of the frame-shaped members 51A and 51B, respectively, and Y-axis stators configured in the same manner as described above are not in contact with the Y-axis movers. Is engaged. In FIG. 4, a pair of Y-axis linear motors constituted by these Y-axis stator and Y-axis mover are shown as Y-axis linear motors 66B and 66D. The Y-axis stators constituting the Y-axis linear motors 66B and 66D are actually on the + X side surface of the Y-axis counter mass mechanism 56A and the -X side surface of the Y-axis counter mass mechanism 56A. They are fixed (the Y-axis linear motor 66D is not shown in FIG. 2).

The four Y-axis linear motors 66 </ b> A to 66 </ b> D are controlled by the main controller 50. In main controller 50, the driving force generated by each of Y-axis linear motors 66A and 66C is set to a value corresponding to the position of wafer stage WST in the X-axis direction, and further, the values of Y-axis linear motors 66A and 66B are set. By controlling the Y-axis linear motors 66A to 66D so that the driving force generated by each of the driving forces generated by each of the Y-axis linear motors 66A and 66C is a predetermined ratio of the driving force, Wafer stage WST can be driven in the Y-axis direction at substantially its center of gravity. In the main controller 50, the ratio between the driving forces generated by the Y-axis linear motors 66A and 66B and the ratio between the driving forces generated by the Y-axis linear motors 66C and 66D are set to the above values. Maintaining and making the total of the driving forces generated by the Y-axis linear motors 66A and 66B and the total driving force generated by the Y-axis linear motors 66A and 66B different from the above allows the wafer stage WST to be moved to the Z-axis. It is also possible to rotate around. In other words, in the present embodiment, the above-described four Y-axis linear motors 66A to 66D are used to move the components including wafer stage WST and X-axis linear motors (first drive mechanisms) XLM ₁ and XLM ₂ in the Y-axis direction ( A second drive mechanism for driving in the second axial direction) is configured.

  The one Y-axis counter mass mechanism 56A includes a casing 152 made of a cylindrical member having a rectangular cross section and a longitudinal direction (Y-axis) of the casing 152, as shown in FIG. Direction) and is installed between the cover members 158A and 158B fixed to the opening ends of the other end and the cover members 158A and 158B, and arranged side by side along the X-axis direction in the internal space of the housing 152 The pair of linear motors 154A and 154B as the second axis linear motors each having the pair of stators 153A and the pair of linear motors 154A and 154B are driven in the Y-axis direction in the internal space of the casing 152. And a rectangular parallelepiped second counterweight 156.

  The linear motors 154A and 154B include a mover 153B provided in an opening formed in the vicinity of the + X side end surface and in the vicinity of the −X side end surface of the second counterweight 156, and the stator disposed in the opening. 153A, and a driving force for driving the counterweight 156 in the Y-axis direction is generated by electromagnetic interaction between the mover 153B and the stator 153A. That is, the linear motors 154A and 154B constitute a third linear motor that drives the counterweight 156 in the Y-axis direction.

  A gas static pressure bearing (not shown) is provided on the bottom surface of the second counterweight 156, and the counterweight 156 floats to the housing 152 via a clearance of several μm via the gas static pressure bearing. It is supported. The counterweight 156 is preferably made of a member having a relatively high density so that the mass (weight) is as large as possible. However, here, the total of the wafer stage WST and the X-axis stator unit 200 is used. It is assumed that the mass (weight) is about 1/2 of the mass (total weight).

  The other Y-axis counter mass mechanism 56B is configured in the same manner as the Y-axis counter mass mechanism 56A, as shown in FIG. 6B. That is, the Y-axis counter mass mechanism 56B includes linear motors 154A 'and 154B' as fourth linear motors that drive the counterweight 156 'in the Y-axis direction within the casing 152'.

  In the Y-axis counter mass mechanisms 56A and 56B configured in this way, the linear motors 154A, 154B, 154A ', and 154B' are controlled by the main controller 50.

  The position of the wafer stage WST in the XY plane (including θz rotation) passes through the movable mirror 102, that is, the Y movable mirror 102a and the X movable mirror 102b, respectively, with a resolution of, for example, about 0.5 to 1 nm. It is always measured by the interferometer 102. In this case, corresponding to the movable mirrors 102a and 102b, the wafer interferometer also includes a Y interferometer that irradiates the reflection surface of the Y movable mirror 102a with a laser beam (length measurement beam), and a laser on the reflection surface of the X movable mirror 102b. And an X interferometer for irradiating a beam (length measuring beam). As described above, a plurality of movable mirrors and wafer interferometers are provided. In FIG. 1, these are typically shown as the movable mirror 102 and the wafer interferometer 104.

  In the exposure apparatus 10 of the present embodiment, as the X interferometer and the Y interferometer, a multi-axis interferometer having a plurality of measurement axes is used, and the X and Y positions and the yawing (around the Z axis) of the wafer table WTB are used. In addition to θz rotation, which is rotation of the rotation, pitching (θx rotation, which is rotation around the X axis), and rolling (θy rotation, which is rotation around the Y axis)) can be measured. For example, the end surface of wafer table WTB may be mirror-finished to form a reflecting surface (corresponding to the reflecting surfaces of the aforementioned moving mirrors 102a and 102b). In addition, the multi-axis interferometer described above is inclined by 45 ° to a reflective surface installed on a pedestal (not shown) on which the projection optical system PL is placed via a reflective surface installed on a part of the stage main body 100. The relative position information regarding the optical axis direction (Z-axis direction) of the projection optical system PL may be detected by irradiating the laser beam.

The position information (or speed information) of wafer table WTB (wafer stage WST) measured by wafer interferometer 104 is sent to main controller 50, and main controller 50 receives position information (or speed information) of wafer stage WST. Based on the Y axis linear motors 66A to 66D, the X axis linear motors XLM ₁ and XLM ₂ , the Y fine movement mechanisms 99A and 99B, and the X fine movement mechanism 99C, the position in the XY plane of the wafer stage WST is controlled. ing.

  As shown in FIG. 1, the exposure apparatus 10 of the present embodiment has a light source whose on / off is controlled by the main controller 50, and has a large number of pinholes or slits toward the image plane of the projection optical system PL. Many oblique incidence methods including an irradiation system AFa that irradiates a light beam for forming an image from an oblique direction with respect to the optical axis AX, and a light receiving system AFb that receives a reflected light beam on the surface of the wafer W. A focal position detection system including a point focal position detection system is further provided. A detailed configuration of a multipoint focal position detection system similar to the focal position detection system (AFa, AFb) of the present embodiment is disclosed in, for example, Japanese Patent Laid-Open No. 6-283403 (corresponding US Pat. No. 5,448,332). ) And the like. In main controller 50, for example, at the time of scanning exposure, based on a defocus signal (defocus signal) from light receiving system AFb, for example, an S curve signal, Z axis of wafer table WTB is passed through Z fine movement mechanisms 96a to 96c. The movement in the direction and the tilt with respect to the two-dimensional plane (that is, the rotation in the θx and θy directions) are controlled, that is, the surface of the shot area on the wafer W is irradiated within the irradiation area of the illumination light IL. Auto focus (auto focus) and auto leveling are executed.

  According to the exposure apparatus 10 of the present embodiment configured as described above, in the same manner as a normal scanning stepper, reticle alignment, baseline measurement of an alignment system (not shown), and EGA (Enhanced Global Alignment) method are used. After a predetermined preparatory work such as wafer alignment is performed, a step-and-scan exposure operation is performed as follows.

First, the main controller 50 controls the Y-axis linear motors 66A to 66D and the X-axis linear motors XLM ₁ and XLM ₂ while monitoring the measurement value of the wafer interferometer 104 based on the wafer alignment result, Wafer stage WST is moved to an acceleration start position for exposure of a first shot area (first shot area) on wafer W held on wafer table WTB.

  Next, main controller 50 starts relative scanning in the Y-axis direction between reticle stage RST and wafer stage WST, performs scanning exposure on the first shot area on wafer W, and circuit for reticle R in the first shot area. The pattern is reduced and transferred via the projection optical system PL.

  During the scanning exposure, the main controller 50 controls the reticle stage driving unit 22 and the Y-axis linear motors 66A to 66D while monitoring the measurement values of the reticle interferometer 16 and the wafer interferometer 104. The stage RST and the wafer stage WST are relatively scanned. During this relative scanning (at least during exposure), it is necessary to move both of them accurately and in synchronization. Therefore, main controller 50 finely adjusts the position of wafer table WTB in the Y-axis direction using Y fine movement mechanisms 99A and 99B so that the tracking error of reticle stage RST with respect to wafer table WTB does not occur as much as possible. Yes.

  Further, during scanning exposure, auto focus and auto leveling based on the output of the focus position detection system (AFa, AFb) described above are executed by the main controller 50 via the Z fine movement mechanisms 96a to 96c.

  When the first shot scanning exposure is thus completed, main controller 50 moves wafer stage WST stepwise in the X-axis direction, and starts acceleration for exposure of the second shot area (second shot area). Moved to position. Then, under the control of the main controller 50, the same scanning exposure as described above is performed on the second shot area.

  In this way, the scanning exposure of the shot area on the wafer W and the stepping operation between the shot areas are repeatedly performed, and the circuit pattern of the reticle R is sequentially transferred to all the exposure target shot areas on the wafer W.

Here, when wafer stage WST is driven in the X-axis direction by a stepping operation or the like, the reaction force of the driving force (the driving force generated by X-axis linear motors XLM ₁ and XLM ₂ ) is the X-axis stator. Although acting on the X-axis stator unit 200 provided with 61A and 61B, in this embodiment, the main controller 50 drives the wafer stage WST simultaneously with the driving of the wafer stage WST by the X-axis linear motors XLM ₁ and XLM _2. Since the first counter weight 79 constituting the X-axis counter mass mechanisms 88A and 88B is driven in the opposite direction to the wafer stage WST through the linear motors 88A and 88B, respectively, the reaction force of the driving force of the linear motor XLM _1, wafer stage WST by XLM _2, the driving force of the two first counterweight 79 Completely it can be canceled by force. This will be described in further detail below.

  That is, assuming that the mass of wafer stage WST is M and the mass of one first counterweight 79 is m, the relationship of M = 2m is established in the present embodiment as described above. Therefore, when the speed in the + X direction (or −X direction) of wafer stage WST is V and the speed of the first counterweight is v = −V, the following expression (1) is established by the above operation.

MV + 2 mV = 2 mV-2 mV = 0 (1)
Therefore, in the present embodiment, as described above, the main controller 50 controls the X-axis linear motors XLM ₁ and XLM ₂ and the linear motors 88A and 88B at the same time, so that the wafer stage WST and the X-axis stator unit 200 are controlled. Contains the momentum of the system that contains it. In this case, the reaction force of the driving force (thrust) of wafer stage WST acts on X-axis stator unit 200, and the driving force (thrust) of a pair of counterweights 79 (the driving force (thrust) of wafer stage WST) Since the reaction force having the same magnitude and the opposite direction acts on the X-axis stator unit 200, considering that the time derivative of the speed is acceleration, the sum of the reaction forces is obtained by storing the above momentum. Is zero. However, if forces of the same size and opposite directions act on different points of the same object, these forces may become couples and act on the object. In this embodiment, the X-axis linear motor The action point (drive shaft) of the resultant force of the driving force of wafer stage WST by XLM ₁ and XLM _{2 and} the action point (drive shaft) of the resultant force of the first counterweight 79 by the pair of linear motors 88A and 88B are: As a result, the action point of the reaction force of the resultant force is also set on the same axis. Accordingly, the main controller 50 controls the X-axis linear motors XLM ₁ and XLM ₂ and the linear motors 88A and 88B at the same time as described above, so that the wafer stage WST and the X-axis stator unit 200 are controlled. The reaction force of the driving force of the wafer stage WST by the X-axis linear motors XLM ₁ and XLM ₂ (including the moment resulting from the reaction force) can be almost completely canceled. It is like that. Therefore, the reaction force does not have any influence on the outside of the system.

When the relationship between the mass M of the wafer stage WST and the mass m of the first counterweight is M ≠ 2m, the main controller 50 passes the wafer via the X-axis linear motors XLM ₁ and XLM _2. At the same time as the stage WST is driven at the speed V, the first counterweight 79 of each of the X-axis counter mass mechanisms 88A and 88B is moved at a speed (v = −M · V / (2 m)) via the linear motors 80A and 80B, respectively. Needless to say, feed-forward control may be performed so as to drive.

  Further, when the wafer stage WST is driven in the Y-axis direction together with the X-axis stator unit 200 during the above-described step-and-scan exposure operation, the driving force (Y-axis linear motors 66A and 66B) is driven. And the reaction force of the driving force generated by the Y-axis linear motors 66C and 66D), the housing 152 of the Y-axis counter mass mechanism 56A provided with the Y-axis stators of the Y-axis linear motors 66A and 66B, the Y-axis linear Although acting on the housing 152 ′ of the Y-axis counter mass mechanism 56B provided with the Y-axis stators of the motors 66C and 66D, in the present embodiment, the main controller 50 includes the Y-axis linear motors 66A and 66B and Simultaneously driving the Y-axis direction of the X-axis stator unit 200 and wafer stage WST by the Y-axis linear motors 66C and 66D, the Y-axis By driving the second counterweights 156, 156 ′ in the opposite direction to the wafer stage WST by the linear motors 154A, 154B, 154A ′, 154B ′ constituting the unmounting mechanisms 56A, 56B, respectively, the Y-axis linear motor 66A is driven. , 66B and the Y-axis linear motors 66C, 66D completely cancel the reaction force of the driving force of the wafer stage WST and the X-axis stator unit 200 by the reaction force of the second counterweights 156, 156 ′. can do. This will be briefly described below.

  First, the case where wafer stage WST is located at the center in the X-axis direction of X-axis stator unit 200 will be described. In this case, main controller 50 controls Y-axis counter mass mechanism 56A simultaneously with driving in the Y-axis direction of X-axis stator unit 200 and wafer stage WST by Y-axis linear motors 66A and 66B and Y-axis linear motors 66C and 66D. , 56B are driven at the same speed in the opposite direction to wafer stage WST.

  In the present embodiment, a relationship of N = 2n is established, where n is the mass of one second counterweight and N is the total mass of the wafer stage WST and the X-axis stator unit 200. Therefore, the speed in the + Y direction (or −Y direction) of wafer stage WST and X-axis stator unit 200 (hereinafter, both are collectively referred to as “moving part” for convenience) is V ′, and the speed of the second counterweight is When v ′ = − V ′, the following equation (2) is established.

NV '+ 2nv' = 2nV'-2nV '= 0 (2)
Further, the reaction force of the driving force in the Y-axis direction of the moving part by the Y-axis linear motors 66A and 66B and the Y-axis linear motors 66C and 66D is caused by the housing 152 of the Y-axis counter mass mechanism 56A and the Y-axis counter mass mechanism 56B. Each acts on the casing 152 '. The reaction force of the driving force of the second counterweights 156, 156 ′ of the Y-axis countermass mechanisms 56A, 56B acts on the housings 152 of the Y-axis countermass mechanisms 56A, 56B, respectively.

  In this case, the reaction force of the driving force in the Y-axis direction of the moving part by the Y-axis linear motors 66A and 66B is the same as the reaction force of the driving force of the second counterweight 156 of the Y-axis counter mass mechanism 56A. The direction is opposite. In this embodiment, the resultant force of the driving force in the Y-axis direction on the moving part by the Y-axis linear motors 66A and 66B and the resultant force of the driving force on the second counterweight 156 by the linear motors 154A and 154B are substantially the same. Acts on the axis. Therefore, the reaction force of the driving force by the Y-axis linear motors 66A and 66B acting on the casing 152 of the Y-axis counter mass mechanism 56A is canceled by the reaction force of the driving force of the second counterweight 156.

  For the same reason, the reaction force of the driving force by the Y-axis linear motors 66C and 66D acting on the casing 152 ′ of the Y-axis counter mass mechanism 56B is canceled by the reaction force of the driving force of the second counterweight 156 ′. The

  Therefore, in both of the Y-axis counter mass mechanisms 56A and 56B, a closed system in which the reaction force acting when the wafer stage WST is driven does not have any influence on the outside of the system is substantially constituted. .

  When the relationship between the mass N of the moving part and the mass n of the second counterweights 156 and 156 ′ is N ≠ 2n, the main controller 50 determines that the Y-axis linear motors 66A and 66B and the Y-axis The moving unit is driven at a speed V ′ through the linear motors 66C and 66D, and at the same time, the second counter weights 156 and 156 ′ of the Y-axis counter mass mechanisms 56A and 56B are respectively connected to the linear motors 154A, 154B, 154A ′ and 154B ′. The feedforward control may be performed so as to drive at a speed (v ′ = − N · V ′ / (2n)).

  For example, when wafer stage WST is located slightly on the + X side (or -X side) from the center position in the X-axis direction of X-axis stator unit 200, the center of gravity of the moving unit is on the + X side (or -X side). Stop by. Therefore, main controller 50 monitors the position of wafer stage WST in the X-axis direction via interferometer 104, calculates the position of the center of gravity based on the monitoring result, and calculates Y-axis linear motor 66A, The driving force generated by the linear motors 66A and 66B and the linear motors 66C and 66D is adjusted according to the ratio of the distances to the operating point of the driving force of each of the 66B and the Y-axis linear motors 66C and 66D. The resultant force of 66D driving force acts on the center of gravity of the moving part. Further, at this time, the main controller 50 uses a pair of linear motors 154A constituting the Y-axis counter mass mechanism 56A to generate a driving force having the same magnitude as the resultant driving force generated by the Y-axis linear motors 66A and 66B and in the opposite direction. , 154B is generated, and a pair of linear motors 154A ′, 154B ′ constituting the Y-axis counter mass mechanism 56B generates a driving force having the same magnitude as that of the driving force generated by the Y-axis linear motors 66C, 66D and in the opposite direction. Each linear motor is controlled to generate.

  As is apparent from the above description, in this embodiment, the stage device is configured by the wafer stage device 20 and the main control device 50 as a control device for controlling each linear motor constituting the wafer stage device 20. ing.

As described above, according to the stage apparatus according to the present embodiment, when the wafer stage WST on which the wafer W is placed is driven in the X-axis direction by the X-axis linear motors XLM ₁ and XLM ₂ , The reaction force acts on the X-axis stators 61A and 61B constituting the X-axis linear motors XLM ₁ and XLM ₂ and the X-axis stator unit 200 provided with the X-axis stators 61A and 61B. At this time, the main controller 50 causes the pair of first counter weights 79 to move in the direction opposite to the moving direction of wafer stage WST with respect to the X-axis direction via first and second linear motors 80A and 80B. . In this case, main controller 50 drives the pair of first counter weights 79 at a speed corresponding to the weight of wafer stage WST and first counter weight 79, so that first counter weight 79 is obtained. The reaction force can be offset by the reaction force of the driving force. Therefore, the weight of the first counterweight 79 can be reduced compared with the case where the reaction force of the driving force of the wafer stage is canceled by the free movement of the first counterweight according to the law of conservation of momentum. It becomes possible to reduce the size and weight. In the present embodiment, a pair of first and second linear motors 80A and 80B are provided on the drive shaft on which the driving force generated by the X-axis linear motors XLM ₁ and XLM ₂ acts when the stage in the X-axis direction is driven. Since the operating axis of the total driving force with respect to the first counterweight 79 is set, generation of a rotational moment when the reaction force of the driving force of the wafer stage WST is canceled by the reaction force of the driving force of the first counterweight 79 is generated. Can also be prevented. Accordingly, the reaction force cancellation in the X-axis direction can be realized by the closed system, and the reaction force can be prevented from affecting the outside of the closed system.

  When main controller 50 drives wafer stage WST in the Y-axis direction integrally with X-axis stator unit 200 by Y-axis linear motors 66A and 66B and Y-axis linear motors 66C and 66D, Second counterweights 156 and 156 ′ constituting countermass mechanisms 52A and 52B are respectively connected to wafer stage WST and X-axis stator unit 200 in the Y-axis direction via linear motors 154A, 154B, 154A ′ and 154B ′. By driving in the direction opposite to the movement, the reaction force generated by driving wafer stage WST and X-axis stator unit 200 can be canceled by the reaction force generated by driving counterweights 156 and 156 ′.

  Further, according to the exposure apparatus 10 of the present embodiment, since the stage apparatus reduced in size and weight as described above is provided, the exposure apparatus can be reduced in size and weight as a result.

  In addition, wafer stage apparatus 20 according to the present embodiment uses Y-axis fine movement motor 72 in order to maintain the relative position of wafer stage WST with respect to X-axis stator unit 200 in the Y-axis direction. Since the fine motor 72 constitutes a kind of magnetic guide, compared to the case where a bearing such as an air bearing is used to maintain the above relative position, a fine atmosphere 72 or a predetermined gas atmosphere (for example, nitrogen or It is more suitable for use in an inert gas atmosphere such as halogen.

  Instead of at least one of the Y-axis linear motors 66A to 66D, a Y-axis movable element 62A ′ composed of a magnetic pole unit as shown in FIG. 7 (however, the U-shaped yoke is omitted in FIG. 7). And a Y-axis stator 64A ′ composed of an armature unit may be employed.

  That is, as shown in FIG. 7, the Y-axis movable element 62A ′ includes a plurality of first permanent magnets 290 arranged along the Y-axis direction and two Y-axis arranged side by side in the X-axis direction. The Y-axis stator 64A ′ has a plurality of rectangular shapes that are elongated in the X-axis direction and are arranged at predetermined intervals along the Y-axis direction inside the housing. And a rectangular second armature coil 195 disposed on the + X side of the plurality of first armature coils 190 and extending in the Y-axis direction. In the first permanent magnet 290, magnets adjacent in the Y-axis direction and magnets adjacent in the Z-axis direction have opposite polarities, and the second permanent magnet 295 includes magnets adjacent in the X-axis direction, Y-axis Magnets adjacent to each other are opposite in polarity.

  When such a configuration is adopted as the Y-axis linear motor, an electric current is supplied to each first armature coil 190, whereby the alternating current in the Y-axis direction formed by the current and the plurality of first permanent magnets 290 is provided. Due to the electromagnetic interaction with the magnetic field, it is possible to generate a driving force (reaction force of Lorentz force) for driving the Y-axis movable element 62A ′ in the Y-axis direction, and the second armature coil 195 When the current is supplied, the driving force for driving the Y-axis movable element 62A ′ in the X-axis direction by electromagnetic interaction between the current and the magnetic field in the Z-axis direction formed by the second permanent magnet 295. (Reaction force of Lorentz force) can be generated. As a result, the Y-axis stator unit can be driven with a long stroke in the Y-axis direction and can be finely driven in the X-axis direction.

  In the above embodiment, the case where an interferometer is used for position measurement of wafer stage WST has been described. However, the present invention is not limited to this, and an encoder is used instead of or together with the interferometer. Is also possible. For example, in order to measure the position of the wafer stage WST in the Y-axis direction, a “Dual2D encoder” is interposed between at least one lower surface of the pair of frame-like members 51A and 51B constituting the X-axis stator unit 200 and the base 46. It is good also as providing the encoder for two-dimensional position measurement called "." In this case, a scale formed on a single glass plate is provided on the upper surface of the base 46, and two probes are provided on a part of wafer stage WST (X-axis stator unit 200). Using this “Dual2D encoder”, the position of the X-axis stator unit 200 (that is, wafer stage WST) in the Y-axis direction, the position of the X-axis stator unit 200 in the X-axis direction, and the rotation around the Z-axis are measured. Is possible. Further, in order to measure the relative position of wafer stage WST and X-axis stator unit 200 in the X-axis direction, the same two-dimensional surface is applied to a part of wafer stage WST and a part of X-axis stator unit 200. An encoder for measuring the inner position may be provided. As a result, it is possible to measure the relative positional relationship between wafer stage WST and X-axis stator unit 200 in the X-axis direction, the Y-axis direction, and the rotation direction around the Z-axis.

  In the above embodiment, the wafer table WTB can be driven in the direction of six degrees of freedom on the stage main body 100. However, the present invention is not limited to this, and for example, the wafer table WTB and the stage main body 100 And the stage main body may be driven in 6 degrees of freedom.

  Moreover, arrangement | positioning and number of each gas static pressure bearing in the said embodiment may be arbitrary.

  In the above embodiment, the case where the present invention is applied to the stage apparatus 20 including the wafer stage WST capable of two-dimensional movement has been described. However, the present invention is not limited to this, and the stage apparatus includes a reticle stage. It is also possible to apply the present invention. Also in this case, since the reaction force due to the driving of the reticle stage is not affected outside the system including the driving mechanism for driving the reticle stage and the counter mass mechanism, high-precision exposure can be realized.

  In the above embodiment, the case where a total of four Y-axis linear motors are provided, two on the + X side and two on the −X side has been described. However, the present invention is not limited to this, and the X-axis stator unit is provided. A pair of (two) Y-axis linear motors including a pair of movers provided at both ends of 200 and a pair of stators corresponding to the pair of movers may be provided.

  In the above embodiment, the X-axis counter mass mechanisms 88A and 88B drive one first counter weight 79 by one linear motor 80A, and the Y-axis counter mass 56A (56B) has a pair of linear motors 154A. , 154B (154A ′, 154B ′) drives the counter weight 156 (156 ′), but the present invention is not limited to this, and two linear motors are used in the X-axis counter mass mechanisms 88A, 88B. The counter weight 79 may be driven, or the Y-axis counter mass mechanisms 56A and 56B may drive the counter weight 156 (156 ′) by one linear motor.

  In the above embodiment, the case where a moving magnet type linear motor is adopted as the X-axis linear motor or the Y-axis linear motor has been described. However, the present invention is not limited to this, and the mover is an armature unit. Thus, it is possible to adopt a moving coil type linear motor whose stator is composed of a magnetic pole unit.

  In the above-described embodiment, the case where the present invention is applied to a scanning stepper is illustrated, but the scope of the present invention is not limited to this, and the present invention makes the mask and the substrate stationary. The present invention can also be suitably applied to a stationary exposure apparatus such as a stepper that performs exposure in a state. The present invention can also be suitably applied to a step-and-stitch type exposure apparatus.

  Further, the object to be exposed by the exposure apparatus is not limited to a wafer for semiconductor manufacturing as in the above-described embodiment. For example, the object for manufacturing a display apparatus such as a liquid crystal display element, a plasma display, or an organic EL is used. It may be a substrate for manufacturing a rectangular glass plate, a thin film magnetic head, an image sensor (CCD or the like), a mask or a reticle.

  In the above embodiment, it is needless to say that the illumination light IL of the exposure apparatus is not limited to light having a wavelength of 100 nm or more, and light having a wavelength of less than 100 nm may be used. For example, in recent years, in order to expose a pattern of 70 nm or less, EUV (Extreme Ultraviolet) light in a soft X-ray region (for example, a wavelength region of 5 to 15 nm) is generated using an SOR or a plasma laser as a light source, and its exposure wavelength Development of an EUV exposure apparatus using an all-reflection reduction optical system designed under (for example, 13.5 nm) and a reflective mask is underway. Furthermore, the present invention is also applied to an immersion type exposure apparatus and the like disclosed in, for example, International Publication WO99 / 49504, which fills a liquid (for example, pure water) between the projection optical system PL and the wafer. be able to.

  The present invention can also be applied to an exposure apparatus using a charged particle beam such as an electron beam or an ion beam. The electron beam exposure apparatus may be any of a pencil beam method, a variable shaped beam method, a cell projection method, a blanking aperture array method, and a mask projection method.

  The stage apparatus according to the present invention is not limited to the exposure apparatus, but may be any other substrate processing apparatus (for example, a laser repair apparatus, a substrate inspection apparatus, etc.), a sample positioning apparatus in other precision machines, a wire bonding apparatus, or the like. It can be widely applied to.

  An illumination unit composed of a plurality of lenses and the like, a projection optical system, and the like are incorporated in the exposure apparatus body, and optical adjustment is performed. Then, the above-mentioned X-axis stator, X-axis mover, Y-axis stator, wafer stage, reticle stage, and various other parts are adjusted in combination mechanically and electrically, and further integrated adjustment (electric adjustment, By performing the operation check or the like, the exposure apparatus according to the present invention such as the exposure apparatus 100 of the above embodiment can be manufactured. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  For semiconductor devices, pattern transfer characteristics are adjusted by a step of designing the function and performance of the device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, and the adjustment method described above. The exposure apparatus according to the embodiment is manufactured through a lithography step for transferring a pattern formed on a mask onto a photosensitive object, a device assembly step (including a dicing process, a bonding process, and a packaging process), an inspection step, and the like. In this case, since the exposure apparatus of the above embodiment is used in the lithography step, a highly integrated device can be manufactured with a high yield.

  As described above, the stage apparatus of the present invention is suitable for holding and driving an object. The exposure apparatus of the present invention is suitable for exposing a substrate and forming a pattern on the substrate.

It is the schematic which shows the exposure apparatus which concerns on one Embodiment. It is a perspective view which shows a wafer stage apparatus. It is a disassembled perspective view of a wafer stage apparatus which shows a wafer section and X axis stator unit partly crushing, and showing a section. It is a perspective view which takes out and shows a part of wafer stage apparatus. FIG. 5A is a diagram for explaining the structure of the stage main body, and FIG. 5B is a diagram for explaining the configuration and operation of the Y-axis fine movement motor. 6A is a perspective view showing a part of the Y-axis countermass mechanism 56A in a cutaway state, and FIG. 6B is a perspective view showing a part of the Y-axis countermass mechanism 56B in a cutaway state. is there. It is a figure which shows the modification of a Y-axis linear motor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Exposure apparatus, 20 ... Wafer stage apparatus (part of stage apparatus), 50 ... Main controller (control apparatus, part of stage apparatus), 61A, 61B ... X-axis movable element (first fixed part), 62A 62C ... Y-axis mover (second movable part), 64A, 64C ... Y-axis stator (second fixed part), 66A to 66D ... Y-axis linear motor (second drive mechanism), 76A, 76B ... Magnetic pole unit (First movable part), 76C, 76D ... magnetic pole unit (first movable part), 78A ... stator, 78B ... mover, 79 ... first counterweight, 80A ... first linear motor (first axis linear motor) ), 80B ... second linear motor (first axis linear motor), 153A ... stator, 153B ... mover, 154A, 154B ... linear motor (third linear motor, second axis linear motor), 154A'154B '... Linear motors (fourth linear motor, a second shaft linear motors), 156, 156 '... second counterweight, W ... wafer (object, substrate), WST ... wafer stage (stage), XLM _1, XLM ₂ ... X-axis Linear motor (first drive mechanism).

Claims (9)

A stage on which the object is placed;
A first drive mechanism for driving the stage in a first axis direction;
A first counterweight having a predetermined weight for canceling a reaction force of the driving force in the first axis direction of the stage;
A first shaft linear motor having a stator provided at least partially inside the first counterweight, and a mover connected to the counterweight;
And a control device that moves the first counterweight in a direction opposite to the moving direction of the stage with respect to the first axis direction by the first axis linear motor.   The stage apparatus according to claim 1, wherein the first counterweight is connected to at least a part of the first drive mechanism. A pair of first counterweights arranged separately in a second axial direction perpendicular to the first axial direction are provided;
The stage according to claim 1 or 2, wherein a first linear motor and a second linear motor that individually drive the pair of first counter weights are provided as the first axis linear motor. apparatus.   The said control apparatus controls the thrust which each of the said 1st linear motor and a 2nd linear motor generate | occur | produces according to the position of the said 2nd axial direction of the said stage. Stage device.   5. The apparatus according to claim 1, further comprising a second drive mechanism that drives the stage and the first drive mechanism in a second axial direction orthogonal to the first axial direction. Stage equipment. A second counterweight having a predetermined weight for canceling a reaction force of the driving force in the second axis direction of the stage;
A second shaft linear motor having a stator provided at least partially inside the second counterweight, and a mover connected to the second counterweight;
The said control apparatus moves the said 2nd counterweight in the direction opposite to the moving direction regarding the said 2nd axis direction of the said stage with the said 2nd axis | shaft linear motor. A stage apparatus according to claim 1. The first drive mechanism includes a first movable part connected to the stage and a first fixed part that drives the first movable part in the first axial direction in cooperation with the first movable part. And
The second drive mechanism cooperates with each of the second movable parts and a pair of second movable parts respectively provided at one end and the other end of the first fixed part. A pair of second fixed portions that respectively drive the movable portion in the second axial direction;
A pair of second counterweights are provided corresponding to the pair of second movable parts, and a third linear motor and a fourth linear motor that individually drive the pair of second counterweights as the second axis linear motor. The stage apparatus according to claim 6, wherein a linear motor is provided.   The stage according to claim 7, wherein the control device controls a thrust applied to each of the third linear motor and the fourth linear motor according to a position of the stage in the first axial direction. apparatus. An exposure apparatus that exposes a substrate and forms a pattern on the substrate,
An exposure apparatus comprising: the stage device according to claim 1, wherein the substrate is placed on the stage.

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