JPWO2004105105A1 - Stage apparatus, exposure apparatus, and device manufacturing method - Google Patents

Abstract

The stage (WST) is guided by the guide surface (44a) of the first surface plate (44), and is finely driven in the X-axis direction drive and the Y-axis direction and the rotation directions around the Z-axis together with the mover unit. The Further, the stage is driven in the Y-axis direction integrally with the stator unit. In this case, the stator unit is supported in the Z-axis direction by the support surface formed on the second surface plate (46A, 46B) that is vibrationally separated from the first surface plate on which the guide surface of the stage is formed. To do. As a result, even if vibration occurs in the Y-axis stator due to the Y-axis direction drive of the stage, the vibration is only transmitted to the second surface plate that supports the Y-axis stator. It is not transmitted to one surface plate. Therefore, vibrations can be avoided from being transmitted to the stage via the first surface plate, so that the position control accuracy of the stage can be maintained high.

Description

  The present invention relates to a stage apparatus, an exposure apparatus, and a device manufacturing method, and more specifically, a stage apparatus having a stage on which an object is placed and movable in a two-dimensional plane, an exposure apparatus including the stage apparatus, and The present invention relates to a device manufacturing method using the exposure apparatus.

  In a lithography process for manufacturing a semiconductor element, a liquid crystal display element, etc., a wafer or a glass plate on which a resist or the like is applied via a projection optical system with a pattern formed on a mask or reticle (hereinafter collectively referred to as “reticle”) A step-and-repeat reduction projection exposure apparatus (so-called stepper) that transfers onto a photosensitive object such as a wafer (hereinafter referred to as a “wafer”), or a step-and-scan type scan that is an improvement of this stepper. A mold projection exposure apparatus (so-called scanning stepper) is mainly used.

  In a projection exposure apparatus such as a stepper, a stage apparatus including a stage that holds a wafer that is an object to be exposed and moves two-dimensionally and a drive mechanism that drives the stage is used. In recent years, as a stage device, a linear motor type stage device having a linear motor as a drive source has become mainstream. The linear motor type stage device includes a first axis linear motor that drives the stage in the first axis direction, and a first axis linear motor and the stage that are integrally formed with the second axis direction that is orthogonal to the first axis. A two-axis linear motor type stage device including a pair of second-axis linear motors that are driven in a relatively large number is used. In this case, the positional relationship in the second axis direction between the stator of the first axis linear motor and the stage is maintained substantially constant by a gas static pressure bearing or a magnetic bearing provided therebetween.

  In a conventional two-axis drive linear motor type stage device, each second-axis linear motor is, for example, a linear as a stator whose both ends are supported by a support member or a vibration isolator installed on the floor surface. One having a guide and a slider as a mover that moves in the longitudinal direction of the linear guide by an electromagnetic force generated by electromagnetic interaction between the guide and the linear guide is used. In this case, each slider is provided on one end and the other end in the longitudinal direction of the linear guide constituting the stator of the first axis linear motor, and on a surface plate on which a guide surface for guiding the stage is formed. It is designed to move along. Further, the stage can be slightly rotated integrally with the first axis linear motor by slightly varying the driving forces generated by the pair of second axis linear motors. In recent years, the stage is often supported so as to be levitated and supported via a non-contact bearing, such as an air bearing, with respect to the guide surface on the surface of the surface plate (see, for example, Patent Documents 1 and 2).

  However, in the stage device of the two-axis drive linear motor system described in Patent Document 1, the pair of second-axis linear motor stators (linear guides) has a beam structure. When driven with a driving force exceeding a certain level, the linear guide is likely to vibrate. When the vibration occurs, the slider floats as a mover (and the stator of the first axis linear motor floats on the guide surface). There is a risk that the vibration of the surface plate may be transmitted to the stage via the air bearing that floats and supports the stage. This is because air bearings that are so rigid that a clearance between the guide surfaces (so-called bearing gaps) can be maintained substantially constant are usually used.

  In recent years, with the integration of semiconductor elements, scanning steppers that can perform exposure with higher precision than steppers have become the mainstream. In the case of this scanning stepper, a reticle stage with a reticle mounted thereon is used. Although it is necessary to improve the synchronization accuracy with respect to the scanning direction (synchronous movement direction) with the stage that holds the wafer that is the object to be exposed, in the stage apparatus described in Patent Document 1 or Patent Document 2, the stage is very small. Since the structure can only rotate, the synchronization accuracy depends exclusively on the tracking accuracy with respect to the stage on the reticle stage side.

  However, as the integration of semiconductor devices in the future increases, it is certain that the precision of reticle and wafer synchronization required for scanning steppers will become even stricter. Improvement of the position controllability of the stage that holds the lens is expected.

JP 11-352266 A JP-A-8-233964

  The present invention has been made under such circumstances, and a first object of the invention is to provide a stage apparatus capable of improving the position controllability of a stage on which an object is placed.

  A second object of the present invention is to provide an exposure apparatus capable of improving the accuracy of pattern transfer onto a photosensitive object.

  A third object of the present invention is to provide a device manufacturing method capable of improving the productivity of a highly integrated device.

  According to a first aspect of the present invention, a stage on which an object is placed; a mover unit provided on the stage; and an electromagnetic interaction between the mover unit, the stage is moved to a first axis. And a small amount around the second axis direction orthogonal to the first axis and the third axis orthogonal to the first axis and the second axis in a plane parallel to the moving surface of the stage. A first drive mechanism having a stator unit extending in the first axial direction for driving; a pair of first movable parts respectively provided at one end and the other end in the first axial direction of the stator unit; A pair of first fixed members for generating a driving force for driving the stator unit in the second axial direction integrally with the corresponding first movable member by electromagnetic interaction between the child and each first movable member. A second drive mechanism having a child; A first surface plate on which a guide surface for guiding a guide is formed; and a vibration-isolated from the first surface plate, and a support surface for supporting the stator unit in the third axial direction is formed, And a second stage plate supporting each of the pair of first stators.

  According to this, the stage is guided by the guide surface formed on the first surface plate, is integral with the mover unit constituting the first drive mechanism, and electromagnetically moves between the mover unit and the stator unit. The driving force generated by the action drives in the first axis direction and finely drives in the second axis direction and the rotation direction around the third axis. The stage is guided by a guide surface formed on the first surface plate, and electromagnetic interaction between a pair of first stators constituting the second drive mechanism and a pair of first movers corresponding thereto. The pair of first movers are driven in the second axial direction integrally with the stator units provided at the one end and the other end in the longitudinal direction by the driving force generated by, respectively. In this case, the stator unit constituting the first drive mechanism is supported in the third axial direction by the support surface formed on the second surface plate that is vibrationally separated from the first surface plate.

  Therefore, even when vibration occurs in the pair of first stators when the stage is driven in the second axial direction by the second drive mechanism together with the stator unit, the vibrations are also generated by the pair of first fixed members. It is transmitted only to the second surface plate that supports each of the children, and is not transmitted to the first surface plate. Even if the vibration of each first stator is transmitted to the corresponding first mover, the stator unit provided with each first mover at both ends thereof is supported by the support surface of the second surface plate. Since it is supported in three axial directions, vibrations are transmitted to the second surface plate, but are not transmitted to the first surface plate that is vibrationally separated from the second surface plate. Further, the vibration of each first mover hardly affects the stator unit. In addition, since the stage can be finely driven in the second axis direction by the driving force generated by the electromagnetic interaction between the mover unit and the stator unit, the first of the stage (mover unit) and the stator unit can be It is not necessary to provide an air bearing or the like in order to maintain the positional relationship in the biaxial direction, and the stage can be accurately moved to a desired position in the second axial direction. In this case, the movement of the stator unit in the second axial direction does not directly affect the stage. Thereby, the drive of the stage in the second axis direction does not become a vibration factor of the stage, and the position control accuracy of the stage can be kept high when driving in the second axis direction.

  The stage is driven in the first axial direction along the stator unit while being guided by the guide surface by the driving force generated by the electromagnetic interaction between the mover unit and the stator unit. In this case, the stage does not vibrate. Further, even if the reaction force due to this driving is transmitted to the second surface plate supporting each first stator via the stator unit, this vibration is not transmitted to the first surface plate.

  In this case, the stator unit and the mover unit allow the relative position change in the third axis direction between the first surface plate and the second surface plate during the stage scanning, The interval in the third axis direction can be set.

  In the first stage apparatus of the present invention, the stator unit includes a second stator extending in the first axial direction, and one side and the other side in the second axial direction centering on the second stator. A pair of third stators extending in the first axial direction and the mover unit minutely drives the stage in the second axial direction by electromagnetic interaction with the second stator. A pair of second movable elements that generate a driving force and a pair of third stators that individually perform electromagnetic interaction and generate a driving force that drives the stage in the first axial direction. A third mover can be included.

  In the first stage apparatus of the present invention, the stage includes a stage main body provided with the mover unit, and a table that holds the object on the stage main body and can be micro-driven at least in the third axis direction. Can be included.

  In the first stage device of the present invention, the second drive mechanism includes a pair of moving coil linear motors in which each of the first movers includes an armature unit, and each of the first stators includes a magnetic pole unit. It can be made up of.

  In the first stage device of the present invention, a first bearing mechanism provided on the stage so as to face the guide surface and supporting the stage in a non-contact manner with respect to the guide surface; A second bearing mechanism that is provided facing the support surface of the second surface plate and supports the stator unit in a non-contact manner with respect to the support surface.

  In the first stage device of the present invention, each first stator is allowed to move relative to at least the second axial direction in a state where the frictional force between the first stator and the second surface plate is substantially zero. Can be.

  In this case, it is possible to further include two position adjusting mechanisms for adjusting the positions of the first stators in the second axial direction.

  In this case, the second drive mechanism includes a pair of moving coil type linear motors each having a magnetic pole unit as a stator, and each of the position adjusting mechanisms has a part of the magnetic pole unit as a mover. can do.

  In the first stage apparatus of the present invention, the stator unit is allowed to move at least in the first axial direction in a state where the frictional force between the stage and the guide surface is substantially zero. It can be.

  In this case, a pair of the second surface plates are provided corresponding to the pair of first stators, and at least one specific surface plate of the pair of second surface plates is movable with respect to the floor surface. And a transmission mechanism that transmits a reaction force generated when the mover unit is driven in the first axial direction to the specific surface plate via the stator unit.

  In this case, it is possible to further include a canceling mechanism that is provided on the specific surface plate and cancels a rotational moment generated on the specific surface plate due to the action of the reaction force.

  In this case, various configurations can be considered as the canceling mechanism. For example, the canceling mechanism is driven by a stator fixed on the specific surface plate and electromagnetic interaction between the stator, And a mover that generates a reaction force in a direction to cancel the rotation of the specific surface plate due to the rotational moment.

  In this case, the cancellation mechanism moves the mover in a predetermined direction by a predetermined amount according to the position of the first mover in the second axis direction and the amount of driving of the stage in the first axis direction. It can be driven to.

  According to a second aspect of the present invention, a stage on which an object is placed; a mover unit provided on the stage; and an electromagnetic interaction between the mover unit, And a small amount around the second axis direction orthogonal to the first axis and the third axis orthogonal to the first axis and the second axis in a plane parallel to the moving surface of the stage. A first drive mechanism having a stator unit extending in the first axial direction for driving; a pair of first movable parts respectively provided at one end and the other end in the first axial direction of the stator unit; A pair of first fixed members for generating a driving force for driving the stator unit in the second axial direction integrally with the corresponding first movable member by electromagnetic interaction between the child and each first movable member. A second drive mechanism having a child; Wherein each of the first stator, a second stage apparatus characterized by being supported in a state of being allowed to move about at least said second axial direction.

  According to this, the first drive mechanism drives the stage with a predetermined stroke in the first axial direction by electromagnetic interaction between the mover unit provided on the stage and the stator unit extending in the first axial direction. In addition, the second drive mechanism is fixedly driven in the second axis direction orthogonal to the first axis and the third axis orthogonal to the first axis and the second axis in a plane parallel to the moving surface of the stage. Integrated with the corresponding first movable element by electromagnetic interaction between the pair of first movable elements respectively provided at one end and the other end in the first axial direction of the child unit, and the pair of first stators Thus, the stator unit is driven in the second axial direction. That is, the stage is driven with a predetermined stroke in the first and second axial directions by the first driving mechanism and the second driving mechanism, and is finely driven around the second and third axes. Yes. Further, since the pair of first stators are supported in a state in which movement in at least the second axial direction is allowed, the reaction force generated when the first movable element is driven in the second axial direction is received. The reaction force is absorbed (cancelled) when the first stator moves in the second axial direction by a predetermined distance according to the law of conservation of momentum. Accordingly, since the driving of the stator unit (the pair of first movable elements) in the second axis direction does not become a factor of the stage vibration, the position control accuracy of the stage can be maintained high.

  In this case, the stator unit may be allowed to move relative to the stage at least in the first axial direction with a frictional force between them being substantially zero.

  The second stage device of the present invention may further include a first position adjusting mechanism that adjusts the position of at least one of the first stators in the first axial direction.

  The second stage device of the present invention may further include a second position adjusting mechanism that adjusts the position of each first stator in the second axial direction.

  In the second stage apparatus of the present invention, at least one of the first stators is supported so as to be movable in the first axial direction by a reaction force generated when the stator unit is driven in the first axial direction. Can be.

  In this case, it is possible to further include a canceling mechanism that cancels a rotational moment generated in at least one of the first stators due to the action of the reaction force. Alternatively, a first surface plate that supports the stage; a second surface plate that supports each of the pair of first stators and at least one of which is movable with respect to a floor surface; It is possible to further include a transmission mechanism that transmits a reaction force generated during driving in the first axial direction to the at least one second surface plate via the stator unit.

  In this case, it is possible to further include a canceling mechanism that cancels a rotational moment generated in the at least one second surface plate due to the action of the reaction force.

  In this case, the canceling mechanism is driven by electromagnetic interaction between the stator fixed on the at least one second surface plate; and the at least one second surface due to the rotational moment. And a mover that generates a reaction force in a direction that cancels out the rotation of the surface plate.

  According to a third aspect of the present invention, there is provided an exposure apparatus for transferring a pattern formed on a mask onto a photosensitive object, wherein the photosensitive object is placed on the stage as the object. An exposure apparatus comprising any one of the second stage apparatuses.

  According to this, since either of the first and second stage devices of the present invention in which the photosensitive object is placed on the stage as an object is provided, it becomes possible to improve the position controllability of the photosensitive object. The pattern formed on the mask can be accurately transferred onto the photosensitive object.

  In this case, a projection optical system that projects the pattern onto the photosensitive object; a mask stage on which the mask is placed; and the mask stage and the stage are synchronized with respect to the second axis direction. And a synchronous movement device that moves relative to the projection optical system.

  Further, in the lithography process, by transferring the device pattern onto the substrate using the exposure apparatus of the present invention, the productivity of highly integrated microdevices can be improved. Therefore, it can be said that this invention is a device manufacturing method using the exposure apparatus of this invention from another viewpoint.

FIG. 1 is a drawing schematically showing an exposure apparatus according to an embodiment.
FIG. 2 is a perspective view showing the wafer stage device of FIG.
FIG. 3A is a view of the wafer stage as viewed from the −X side.
FIG. 3B is a plan view showing the wafer stage and the stator unit.
FIG. 4 is a view for explaining the configuration of an air bearing 51B provided on the attachment member 65B.
FIG. 5A is a diagram (No. 1) for explaining a drive control method for a pair of X-axis linear motors.
FIG. 5B is a diagram (No. 2) for explaining the drive control method for the pair of X-axis linear motors.
FIG. 6 is a view for explaining the relationship between the position adjusting mechanism and the Y-axis stator.
FIG. 7A is a diagram (No. 1) for explaining the configuration of a canceling mechanism.
FIG. 7B is a diagram (No. 2) for explaining the configuration of the canceling mechanism.
FIG. 8 is a view for explaining a driving method and an operation of the canceling mechanism.
FIG. 9 is a perspective view showing a configuration of a stage apparatus according to a first modification.
[FIG. 10A] FIG. 10A is a diagram (part 1) for explaining a control method of the canceling mechanism in the stage device of the first modified example.
FIG. 10B is a diagram (No. 2) for explaining the control method of the canceling mechanism in the stage device of the first modification.
FIG. 11 is a perspective view showing a configuration of a stage apparatus according to a second modification.
FIG. 12 is a perspective view showing a configuration of a stage apparatus according to a third modification.
FIG. 13 is a flowchart for explaining a device manufacturing method according to the present invention.
FIG. 14 is a flowchart showing a specific example of step 204 in FIG.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 schematically shows an exposure apparatus 10 according to an embodiment in partial cross section.

  The exposure apparatus 10 synchronously moves a reticle R as a mask and a wafer W as a photosensitive object (and an object) in a one-dimensional direction (here, a Y-axis direction that is a direction perpendicular to the plane of FIG. 1). A scanning exposure apparatus of a step-and-scan method, that is, a so-called scanning stepper, which transfers a circuit pattern formed on the reticle R to a plurality of shot areas on the wafer W via the projection optical system PL.

  The exposure apparatus 10 includes an illumination system 12 that illuminates the reticle R with illumination light IL, a reticle stage RST on which the reticle R is mounted, a projection optical system PL that projects illumination light IL emitted from the reticle R onto the wafer W, A stage device 20 on which the wafer W is placed is provided.

The illumination system 12 includes a light source, an optical integrator (fly-eye lens, internal reflection type integrator) as disclosed in, for example, Japanese Patent Laid-Open No. 6-349701 and US Pat. No. 5,534,970 corresponding thereto. Or an illumination optical system including a relay lens, a variable ND filter, a reticle blind, a dichroic mirror, and the like (all not shown). To the extent permitted by national legislation in the designated country (or selected selected country) designated in this international application, the disclosures in the above publications and corresponding US patents are incorporated herein by reference. In the illumination system 12, a slit-like (or rectangular) illumination area (this illumination area is defined by the reticle blind) extending in the X-axis direction on the reticle R on which a circuit pattern or the like is formed is defined by the illumination light IL. Illuminate with almost uniform illumination. Here, as the illumination light IL, far ultraviolet light such as KrF excimer laser light (wavelength 248 nm), vacuum ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or F ₂ laser light (wavelength 157 nm), or the like is used. As the illumination light IL, it is also possible to use an ultraviolet bright line (g-line, i-line, etc.) from an ultra-high pressure mercury lamp.

  Here, each drive unit in the illumination system 12, such as a variable ND filter and a reticle blind, is controlled by an unillustrated illumination control device (exposure controller) in response to an instruction from the main control device 50.

  On reticle stage RST, reticle R is fixed, for example, by vacuum suction. Reticle stage RST is driven by reticle stage drive unit 22 in the X-axis direction, Y-axis direction, and θz direction (in the XY plane perpendicular to the optical axis AX of projection optical system PL described later) in the XY plane. It can be driven minutely in the rotational direction around the Z axis) and can be driven at a scanning speed designated in a predetermined scanning direction (Y axis direction) along the upper surface of the reticle stage base 30. The reticle stage drive unit 22 is a mechanism that uses a linear motor, a voice coil motor, or the like as a drive source, but is shown as a simple block in FIG. 1 for convenience of illustration. Note that the reticle stage RST includes a coarse movement stage that is one-dimensionally driven in the Y-axis direction, and the reticle R in at least three degrees of freedom with respect to the coarse movement stage (X-axis direction, Y-axis direction, and θz direction). Of course, a coarse / fine movement stage having a fine movement stage that can be finely driven may be employed.

  The position of the reticle stage RST in the XY plane (including θz rotation) is resolved by a reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 16 via a movable mirror 15 to a resolution of about 0.5 to 1 nm, for example. Always detected. Position information (including rotation information such as the θz rotation amount (yaw amount)) of reticle stage RST from reticle interferometer 16 is supplied to main controller 50. Main controller 50 controls driving of reticle stage RST via reticle stage driving unit 22 based on position information of reticle stage RST. Instead of the movable mirror 15, for example, the end surface of the reticle stage RST may be mirror-finished to form a reflective surface (corresponding to the reflective surface of the movable mirror 15).

  As the projection optical system PL, a reduction system in which both the object plane side (reticle side) and the image plane side (wafer side) are telecentric and the projection magnification is 1/4 (or 1/5) is used. For this reason, when the illumination light (ultraviolet pulsed light) IL is irradiated from the illumination system 12 onto the reticle R, the image forming light beam from the portion illuminated by the ultraviolet pulsed light in the circuit pattern region formed on the reticle R. Is incident on the projection optical system PL, and an image (partial inverted image) of the circuit pattern in the irradiation area (the above-described illumination area) of the illumination light IL is an image of the projection optical system PL for each pulse irradiation of ultraviolet pulse light. In the center of the field of view on the surface side, the image is limited and formed into a slit shape (or rectangular shape (polygon)) elongated in the X-axis direction. Thereby, the partially inverted image of the projected circuit pattern is reduced and transferred to the resist layer on the surface of one of the plurality of shot areas on the wafer W arranged on the imaging plane of the projection optical system PL. .

As the projection optical system PL, when KrF excimer laser light, ArF excimer laser light, or the like is used as the illumination light IL, a refraction system composed only of refractive optical elements (lens elements) is mainly used. _{When two} laser beams are used, for example, a refractive optical element and a reflective optical element (concave mirror or beam) disclosed in JP-A-3-282527 and the corresponding US Pat. No. 5,220,454 are disclosed. A so-called catadioptric system (catadioptric system) in combination with a splitter or the like, or a reflective system composed only of reflective optical elements is mainly used. To the extent permitted by national legislation in the designated country (or selected selected country) designated in this international application, the disclosures in the above publications and corresponding US patents are incorporated herein by reference. However, it is possible to use a refraction system when using F ₂ laser light.

  The stage device 20 is disposed below the projection optical system PL in FIG. 1, and drives the wafer stage WST as a stage for holding the wafer W, and drives the wafer stage WST in the X axis (first axis) direction with a predetermined stroke. At the same time, the first drive mechanism that finely drives in the Y axis (second axis) direction and the rotation direction (θz direction) around the Z axis (third axis), and the wafer stage WST are integrated with the first drive mechanism as Y A second drive mechanism that drives in the axial direction is provided.

  Hereinafter, each part of the configuration of the stage apparatus 20 will be described in detail with reference to other drawings as appropriate, centering on FIG.

  Wafer stage WST is positioned above first surface plate 44 that is rectangular in plan view (viewed from above) and is supported substantially horizontally by a plurality of (for example, three) vibration isolation units 92 on floor surface F of the clean room. Is arranged. The upper surface 44a of the first surface plate 44 is finished with a very high flatness and serves as a guide surface for guiding the wafer stage WST. Hereinafter, the upper surface 44a of the first surface plate 44 is also referred to as a “guide surface 44a”.

  The plurality of vibration isolation units 92 insulate the micro vibration (dark vibration) transmitted from the floor surface F to the first surface plate 44 at the micro G level. In addition, as the plurality of vibration isolation units 92, the first surface plate 44 is actively controlled based on the output of a vibration sensor such as a semiconductor accelerometer fixed to a predetermined position of the first surface plate 44. Of course, it is possible to use an active vibration isolator.

  As shown in FIG. 2, wafer stage WST includes wafer table WTB for holding wafer W and stage body 100 for supporting wafer table WTB via Z / tilt drive mechanisms 96a to 96c. .

  As shown in FIG. 3A, the stage main body 100 is constituted by a frame body having a rectangular YZ section. The stage main body 100 is arranged at a predetermined interval in the Y-axis direction between the top plate 99a and the bottom plate 99b disposed at a predetermined interval in the Z-axis direction, and between the top plate 99a and the bottom plate 99b. Have two side plates 99c and 99d. Among these, a polygonal plate member is used as the top plate 99a in plan view (viewed from above), and rectangular plate members are used as the remaining plates 99b, 99c, and 99d.

  As shown in FIG. 3A, a plurality of gas static pressure bearings (for example, air bearings) 94 as a first bearing mechanism are provided on the bottom surface of the bottom plate 99b. By spraying pressurized gas (for example, helium or nitrogen gas (or clean air)) from the gas static pressure bearing 94 toward the guide surface 44a of the first surface plate 44 described above, the static pressure of the pressurized gas is reduced. Due to the balance between the pressure and the own weight of wafer stage WST (whole), wafer stage WST is levitated and supported above guide surface 44a through a clearance of about several μm.

  As shown in FIG. 3A, a magnetic pole unit 76A as a second mover is fixed to the center of the lower surface of the top plate 99a. Also, magnetic pole units 76B and 76C as a pair of third movers are provided on one side and the other side of the magnetic pole unit 76A on the lower surface of the top plate 99a in the Y-axis direction. Among these magnetic pole units 76A to 76C, the magnetic pole unit 76A is a pair of a frame-shaped member 31 made of a magnetic body having a rectangular YZ section and a pair of opposing surfaces (upper surface and lower surface) inside the frame-shaped member 31. Permanent magnets 33A and 33B extending in the X-axis direction. The permanent magnet 33A and the permanent magnet 33B have opposite polarities. Therefore, a magnetic field having a magnetic flux direction of -Z direction (or -Z direction) is generated between the permanent magnet 33A and the permanent magnet 33B.

  As shown in FIG. 3A, one of the remaining magnetic pole units 76B and 76C includes a frame-shaped member 35 made of a magnetic body having a rectangular YZ cross section, and an inner side of the frame-shaped member 35. A plurality of field magnets 37 are disposed on the pair of opposing surfaces (upper surface and lower surface) at predetermined intervals along the X-axis direction. In this case, the field magnets 37 adjacent in the X-axis direction and the field magnets 37 facing each other in the Z-axis direction have opposite polarities. For this reason, an alternating magnetic field is formed in the internal space of the frame-shaped member 35 in the X-axis direction. The other magnetic pole unit 76C is configured similarly to the magnetic pole unit 76B.

  3A and 3B, the stator unit 60 includes an armature unit 61A as a second stator having a Y-shaped cross section extending in the X-axis direction. The armature units 61B and 61C as a pair of third stators having a H-shaped cross section extending in parallel with a predetermined interval on the ± Y side of the armature unit 61A, and the armature units 61A to 61C. It has a pair of attachment members 65A and 65B that integrate one end and the other end in the longitudinal direction.

  Among these, the armature unit 61A is inserted into a space formed by the permanent magnets 33A and 33B and the frame-shaped member 31 constituting the magnetic pole unit 76A described above. The armature unit 61B is inserted into the internal space of the magnetic pole unit 76B described above. The armature unit 61C is inserted into the internal space of the magnetic pole unit 76C described above. In the present embodiment, when the stator unit 60 and the wafer stage main body 100 are assembled, the armature units 61A to 61C are connected in a state where one end in the longitudinal direction of the armature units 61A to 61C is connected by, for example, the mounting member 65A. Are inserted into the internal spaces of the corresponding magnetic pole units 76A to 76C, respectively, and one end in the longitudinal direction of the armature units 61A to 61C is connected by an attachment member 65B after the insertion. It ’s fine.

  In the armature unit 61A, for example, one is arranged in such a manner that current can flow only in the −X direction or only in the −X direction in a magnetic field in the Z-axis direction formed in the magnetic pole unit 76A. A plurality of armature coils are provided. In this case, as the armature coil, for example, a pair of annular coils extending in the X-axis direction and arranged at predetermined intervals in the Y-axis direction can be used.

  In the present embodiment, the magnitude and direction of the current supplied to the armature coils constituting the armature unit 61A are controlled by the main controller 50, whereby the magnetic pole unit 76A is controlled by the armature. The magnitude and direction of the driving force (Lorentz force) that drives the unit 61A in the Y-axis direction is arbitrarily controlled. In other words, armature unit 61A and magnetic pole unit 76A constitute a Y-axis fine movement motor 75A that minutely drives wafer stage WST in the Y-axis direction. Hereinafter, the armature unit 61A is also referred to as a Y-axis fine movement stator 61A, and the magnetic pole unit 76A is also referred to as a Y-axis fine movement movable element 76A.

A plurality of armature coils are arranged in the armature units 61B and 61C at predetermined intervals (predetermined pitch) along the X-axis direction. In the present embodiment, the magnitude and direction of the current supplied to at least one armature coil located in the alternating magnetic field in the X-axis direction formed in the internal space of each of the magnetic pole units 76B and 76C is the main control. The apparatus 50 controls the magnetic pole units 76B and 76C provided in the stage main body 100 to drive the armature units 61B and 61C in the X-axis direction (Lorentz). The magnitude and direction of the force) are arbitrarily controlled. In this case, for example, as shown in FIG. 5 (A), by causing the driving force f ₁ of the X-axis direction at symmetrical positions with respect to the center of gravity Gs of wafer stage WST, a wafer stage WST (the center of gravity of the) 2 × it can be driven in the X-axis direction with a force of f _1. Further, as shown in FIG. 5B, by generating driving forces f ₁ and −f ₁ having the same magnitude and opposite directions at symmetrical positions with respect to the center of gravity Gs of wafer stage WST, wafer stage WST is generated. Can be rotated around the center of gravity Gs.

  That is, the armature units 61B and 61C and the magnetic pole units 76B and 76C that engage with the armature units 61B and 61C, respectively, drive the wafer stage WST with a predetermined stroke in the X-axis direction, and move the wafer stage WST in the rotation direction around the Z-axis. The moving magnet type X-axis linear motors 75B and 75C that are finely driven are configured. Hereinafter, the armature units 61B and 61C are also referred to as X-axis stators 61B and 61C, and the magnetic pole units 76B and 76C are also referred to as X-axis movers 76B and 76C.

  Further, as is clear from the above description, the mover unit is constituted by the Y-axis fine movement movable element 76A and the X-axis movable elements 76B and 76C provided in the stage main body 100, and the movable element unit and the above-described movable element unit The stator unit 60 constitutes a first drive mechanism that drives the wafer stage WST with a predetermined stroke in the X-axis direction by electromagnetic interaction and finely drives it about the Y-axis direction and the Z-axis.

  On one side (−X side) and the other side (−X side) of the first surface plate 44 in the X-axis direction, as shown in FIG. A pair of second surface plates 46A and 46B are arranged symmetrically. Among these, one 2nd surface plate 46A located in the -X side of the 1st surface plate 44 is being fixed on the floor surface F of a clean room, and the edge part of the + X side (inner side) is made into a convex part. ing. An upper surface (hereinafter also referred to as “first surface”) 146a (see FIG. 2) of the convex portion is a support surface that supports the stator unit 60 in the Z-axis direction as described later. A guide member having a U-shaped cross section having a longitudinal direction in the Y-axis direction as shown in FIG. 2 is provided on a surface (hereinafter also referred to as “second surface” for convenience) 146b outside the convex portion. 48A is fixed.

  The other second surface plate 46B located on the + X side of the first surface plate 44 is levitated and supported on the floor surface F of the clean room via a gas static pressure bearing (for example, an air bearing) 42. The second surface plate 46B is symmetrical to the second surface plate 46A, but has the same shape. The second surface plate 46B is formed to be slightly longer in the Y-axis direction than the above-described second surface plate 46A (see FIG. 2).

  As shown in FIG. 2, the second surface plate 46B has a −X side (inner side) end portion as a convex portion, and an upper surface (hereinafter also referred to as “first surface” for convenience) 146c of the convex portion. The side surfaces (146e, 146f (see FIG. 4)) on the ± X side are support surfaces that support the stator unit 60 in the Z-axis direction and the X-axis direction as described later. Further, a guide member 48B having the same shape as the above-described guide member 48A is fixed to a surface 146d (hereinafter also referred to as “second surface” for convenience) that is lowered by one step outside the convex portion.

  As shown in FIG. 3 (B), a pair of armature units 64A as first movers are attached to one end and the other end of the stator unit 60 via attachment members 65A and 65B, respectively. 64B is provided.

  Further, on the bottom surfaces of the mounting members 65A and 65B, static gas bearings (eg, air bearings) 51A and 51B as second bearing mechanisms (not shown in FIG. 2 for one of the second bearing mechanisms 51B). 4).

  As shown in FIG. 2, the static gas bearing 51A provided on one attachment member 65A is disposed to face the upper surface (first surface) 146a of the convex portion of the second surface plate 46A described above. . A pressurized gas (for example, helium or nitrogen gas (or clean air)) is ejected from the gas static pressure bearing 51A toward the first surface 146a, and the bearing of the gas static pressure bearing 51A is generated by the static pressure of the pressurized gas. A clearance of about several μm is formed between the surface and the first surface 146a.

  As shown in FIG. 4, the static gas bearing 51 </ b> B provided on the other mounting member 65 </ b> B is disposed to face the first surface 146 c of the second surface plate 46 </ b> B. From this gas static pressure bearing 51B, pressurized gas is ejected toward the first surface 146c, and due to the static pressure of the pressurized gas, several μm is formed between the bearing surface of the gas static pressure bearing 51B and the first surface 146c. A certain degree of clearance is formed.

  That is, the entire stator unit 60 and the pair of armature units 64A and 64B are in non-contact with the first surfaces 146a and 146c of the second surface plates 46A and 46B by the static gas bearings 51A and 51B in the Z-axis direction. Is supported.

  As shown in FIG. 4, a pair of static gas bearings 151a and 151b are fixed to one side and the other side of the air bearing 51B in the X-axis direction. Among these, one gas static pressure bearing 151a is arrange | positioned facing the side surface 146e of the convex part of the 2nd surface plate 46B, and is ejecting pressurized gas toward this side surface 146e. The other gas static pressure bearing 151b is arranged to face the side surface 146f of the convex portion of the second surface plate 46B, and jets pressurized gas toward the side surface 146f. In this case, due to the balance of the static pressure (pressure in the gap) of the pressurized gas ejected from the gas static pressure bearings 151a and 151b, between the convex portion and each gas static pressure bearing is about several μm. A clearance is formed and maintained. In the present embodiment, the convex portion of the second surface plate 46B also serves as a yaw guide for the stator unit 60. Also, a transmission mechanism is configured to transmit reaction force generated when the wafer stage WST (movable unit) is driven in the X-axis direction to the second surface plate 46B via the stator unit 60 by the static gas bearings 151a and 151b. ing.

  As described above, the vibration isolation unit 92 that supports the first surface plate 44 has a function of insulating vibration transmitted from the floor surface F. For this purpose, the anti-vibration unit 92 may be configured so that the first surface plate 44 can be finely driven in the Z axis direction. Further, even when the vibration isolation unit 92 is an active vibration isolation device having an actuator and an air mount, for example, the vibration control function is achieved by actively moving the first surface plate 44 in the Z-axis direction by the actuator. Can also work. Moreover, you may make it suppress a vibration by moving the 1st surface plate 44 to a 6 degrees-of-freedom direction (X, Y, Z, (theta) x, (theta) y, (theta) z direction) with an active vibration isolator as needed. Further, in order to maintain the positional relationship in the Z-axis direction between the wafer holding surface of wafer stage WST and the focal position of projection optical system PL, the first surface plate 44 is moved in the Z-axis direction by an actuator or the like. It is also possible. When the first surface plate 44 is moved in this way, the wafer stage WST on the guide surface 44 a of the first surface plate 44 also functions substantially the same as the first surface plate 44. Therefore, when the first surface plate 44 is configured to be movable in the Z-axis direction, a relative position change in the Z-axis direction occurs between the first surface plate 44 and the second surface plates 46A and 46B. Further, even when the first surface plate 44 is configured to move (rotate) in the θx and θy directions, the relative position in the Z-axis direction between the first surface plate 44 and the second surface plates 46A and 46B. Changes occur. In the configuration of the present embodiment, the Y-axis fine movement motor 75A and the X-axis linear motors 75B and 75C are first fixed with the respective movers (magnetic pole units 76A, 76B, and 76C) fixed to the wafer stage WST. Supported on a board 44. Each stator (armature units 61A, 61B, 61C) is supported on the second surface plates 46A, 46B via a pair of mounting members 65A, 65B. As a result, when the relative position between the first surface plate 44 and the second surface plates 46A and 46B in the Z-axis direction changes, the Y-axis fine movement motor 75A and the X-axis linear motors 75B and 75C The relative position in the Z-axis direction with the stator also changes. Accordingly, the distance (gap) in the Z-axis direction between the mover and the stator of each of the motors 75A, 75B, and 75C is fixed even if the first surface plate 44 moves in the Z-axis direction. It is necessary to determine in advance a value that does not contact the child. For example, when the range in which the first surface plate 44 can be moved in the Z-axis direction by the image stabilization unit 92 is set to ± 0.3 to 3.0 mm from the reference position during scanning exposure, the motors 75A, 75B, and 75C are movable. The distance between the child and the stator in the Z-axis direction is preferably set to about 0.4 to 4.0 mm. In this case, each of the motors 75A, 75B, and 75C is preferably configured so that the output in the driving direction does not change depending on the gap distance between the mover and the stator. Further, when the Z position of the first surface plate 44 is changed during maintenance of the stage device 20 (for example, when the vibration isolation unit 92 has an air mount and the air is removed) Etc.) needs to prevent the mover and the stator of each of the motors 75A, 75B, and 75C from contacting each other. At this time, if the contact cannot be prevented only by the distance between the mover and the stator, a stopper or the like is provided in advance, and after this stopper can be prevented, The position in the Z-axis direction may be changed. In addition, when the parallelism of the guide surface between the first surface plate 44 and the second surface plates 46A and 46B changes, the clearance in the gas static pressure bearings 51A, 51B, 151a and 151b decreases. There may be cases where the guide surface of the board comes into contact. Therefore, for example, a hinge mechanism (not shown) provided with a leaf spring, a flexure, or the like is provided between the attachment member 65B and the stator unit 60 and between the attachment member 65A and the gas static pressure bearing 51A. You may comprise so that the change of can be accept | permitted. In this case, the hinge mechanism provided between the attachment member 65B and the stator unit 60 is configured to have a degree of freedom in the θy direction, and the hinge mechanism provided between the attachment member 65A and the gas static pressure bearing 51A is A configuration having degrees of freedom in the θx direction and the θy direction may be used. Even if the parallelism between the first surface plate 44 and the second surface plates 46A and 46B is changed by these hinge mechanisms, the gas static pressure bearings 51A, 51B, 151a, and 151b are rotated in the rotational direction by deformation of the hinge mechanism. Stress (stress) does not act, and it becomes possible to maintain a predetermined clearance in each of these static gas bearings.

  Returning to FIG. 2, a pair of magnetic pole units 62A and 62B as first stators are disposed along the Y-axis direction above the second surface plates 46A and 46B so as to face the pair of armature units 64A and 64B, respectively. It is extended.

  As shown in FIG. 2, one of the magnetic pole units 62A and 62B has a rectangular plate-like upper plate member 54A and the same shape as the upper plate member 54A in plan view (viewed from above). A yoke 60A comprising a lower plate member 54B having an intermediate member 56 having a U-shaped cross-section (U-shape) provided in a state of connecting the upper plate member 54A and the lower plate member 54B, and the yoke 60A A plurality of field magnets 108 are disposed on the pair of opposing surfaces (upper surface and lower surface) at predetermined intervals along the Y-axis direction. In this case, the field magnets 108 adjacent in the Y-axis direction and the field magnets 108 facing each other in the Z-axis direction have opposite polarities. For this reason, an alternating magnetic field is formed in the internal space of the yoke 60A in the Y-axis direction.

  The other magnetic pole unit 62B is configured similarly to the magnetic pole unit 64A. That is, the upper plate member 54A having a rectangular plate shape in plan view (viewed from above), the lower plate member 54B having the same shape as the upper plate member 54A, and the upper plate member 54A and the lower plate member 54B are connected. A yoke 60B composed of an intermediate member 56 having a U-shaped cross section (U-shape) provided in a state and a pair of opposing surfaces (upper surface and lower surface) of the yoke 60B are arranged at predetermined intervals along the Y-axis direction. And a plurality of field magnets 108 provided. An alternating magnetic field is also formed in the inner space of the yoke 60B in the Y-axis direction.

  The armature units 64A and 64B are configured by a casing whose inside is hollow, and armature coils (not shown) disposed in the casing at predetermined intervals along the Y-axis direction.

  Accordingly, Lorentz generated by electromagnetic interaction between the current flowing through the armature coils constituting the armature units 64A and 64B and the magnetic field (alternating magnetic field) generated by the field magnets constituting the magnetic pole units 62A and 62B, respectively. The armature units 64A and 64B (that is, the stator unit 60) are driven in the Y-axis direction along the magnetic pole units 62A and 62B by the force. That is, in this embodiment, the armature units 64A and 64B and the magnetic pole units 62A and 62B constitute a pair of Y-axis linear motors 66A and 66B as a second drive mechanism, each of which includes a moving coil type linear motor. Has been. Therefore, hereinafter, the magnetic pole units 62A and 62B are also called Y-axis stators 62A and 62B, and the armature units 64A and 64B are also called Y-axis movers 64A and 64B.

  Further, a prismatic slide member 68A having the longitudinal direction in the Y-axis direction is fixed to the lower surface of one magnetic pole unit (Y-axis stator) 62A, and the lower surface of the other magnetic pole unit (Y-axis stator) 62B. A prismatic slide member 68B having a longitudinal direction in the Y-axis direction is fixed.

  As shown in FIG. 2, one slide member 68A is disposed such that the side surfaces and the lower surface on both sides in the X-axis direction face the three inner surfaces of the U-shaped guide member 48A. The slide member 68A is supported in a non-contact manner by the guide member 48A from three directions (+ X direction, -X direction and -Z direction) through gas static pressure bearings (for example, air bearings) (not shown). In this case, a predetermined clearance is formed between the lower surface of the Y-axis stator 62A and the guide member 48A.

  As shown in FIG. 2, the other slide member 68B is disposed in such a manner that the side surfaces and the lower surface on both sides in the X-axis direction face the three inner surfaces of the U-shaped guide member 48B. The slide member 68B is supported in a non-contact manner by the guide member 48B from three directions (+ X direction, -X direction, and -Z direction) through gas static pressure bearings (not shown) (for example, air bearings). In this case, a predetermined clearance is formed between the lower surface of the Y-axis stator 62B and the guide member 48B.

  The Z / tilt driving mechanisms 96a to 96c are respectively arranged at positions on the upper surface of the stage main body 100 that are substantially vertexes of an equilateral triangle. Each of the Z / tilt driving mechanisms 96a to 96c includes a voice coil motor that supports the wafer table WTB and independently drives it slightly in the Z-axis direction. Accordingly, the wafer table WTB is slightly driven by the Z / tilt driving mechanisms 96a to 96c in the three-degree-of-freedom directions in the Z-axis direction, the θx direction (the rotation direction around the X axis), and the θy direction (the rotation direction around the Y axis). Is done. In the present embodiment, the Z / tilt drive mechanisms 96a to 96c are controlled by the main controller 50 of FIG.

  On the wafer table WTB supported on the stage main body 100 by the Z / tilt drive mechanisms 96a to 96c, as shown in FIG. 1, the wafer W is fixed by electrostatic chucking or vacuum chucking via the wafer holder 25. ing. The position (including the θz rotation) of wafer table WTB in the XY plane is determined by a wafer laser interferometer (hereinafter referred to as “wafer interferometer”) 104 via a movable mirror 102 with a resolution of about 0.5 to 1 nm, for example. It is constantly measured.

  Here, on the wafer table WTB, actually, as shown in FIG. 2, a Y movable mirror 102a extending in the X-axis direction is fixed to one end (+ Y side) of the Y-axis direction. An X moving mirror 102b extending in the Y axis direction is fixed to one end (−X side) in the axial direction. The outer surfaces of these movable mirrors 102a and 102b are reflective surfaces that are mirror-finished. Corresponding to the moving mirrors 102a and 102b, the wafer interferometer also has a Y interferometer that irradiates a laser beam (length measuring beam) on the reflecting surface of the Y moving mirror 102a and a reflecting surface of the X moving mirror 102b. An X interferometer that irradiates a laser beam (length measuring beam) is provided.

  As described above, a plurality of movable mirrors and wafer interferometers are provided. In FIG. 1, these are typically shown as the movable mirror 102 and the wafer interferometer 104.

  In this case, as the X interferometer and the Y interferometer, a multi-axis interferometer having a plurality of measurement axes is used, and the X and Y positions of the wafer table WTB and yawing (the θz rotation that is a rotation around the Z axis) are used. ), Pitching (θx rotation that is rotation around the X axis), and rolling (θy rotation that is rotation around the Y axis)) can also be measured. For example, the end surface of wafer table WTB may be mirror-finished to form a reflecting surface (corresponding to the reflecting surfaces of the aforementioned moving mirrors 102a and 102b). In addition, the multi-axis interferometer described above tilts the laser beam to a reflective surface installed on a gantry (not shown) on which the projection optical system PL is placed via a reflective surface installed on the wafer table WTB with an inclination of 45 °. Irradiation may be performed to detect relative position information regarding the optical axis direction (Z-axis direction) of the projection optical system PL.

  The position information (or speed information) of wafer table WTB (wafer stage WST) measured by wafer interferometer 104 is sent to main controller 50, and main controller 50 stores the position information (or speed information) of wafer stage WST. Based on the Y axis linear motors 66A and 66B, the X axis linear motors 75B and 75C, and the Y axis fine movement motor 75A, the position in the XY plane of the wafer stage WST is controlled.

  As shown in FIG. 2, the stage device 20 further includes two position adjusting mechanisms 52A and 52B that adjust the positions of the Y-axis stators 62A and 62B in the Y-axis direction. As shown in FIG. 2, one of the position adjustment mechanisms 52B has an armature unit 74 supported on the floor surface F at a predetermined height position via a support member 72 as a stator. The magnetic pole unit 62B, that is, a moving magnet type linear motor having a part of the Y-axis stator 62B as a mover.

  That is, as shown in FIG. 6, the armature unit 74 has an internal space (a plurality of field magnets) of the yoke 60B through a rectangular opening OP formed in the intermediate member 56 of the yoke 60B constituting the Y-axis stator 62B. Is inserted in a space where an alternating magnetic field is formed. At least one armature coil is provided inside the armature unit 74, and the Lorentz force generated by the electromagnetic interaction between the current in the X-axis direction flowing through the armature coil and the alternating magnetic field. Thus, the Y-axis stator 62B is driven in the Y-axis direction with respect to the armature unit 74. In this case, the magnitude and direction of the current supplied to the armature coil in the armature unit 74 are controlled by the main controller 50 in FIG.

  The other position adjustment mechanism 52A is configured by a moving magnet type linear motor having the same configuration as the position adjustment mechanism 52B described above, and drives the Y-axis stator 62A in the Y-axis direction.

  The timing for adjusting the position of the Y-axis stator by these position adjusting mechanisms 52A and 52B will be described later.

  Stage device 20 further includes a canceling mechanism that cancels the rotational moment generated in second platen 46B due to the reaction force generated when wafer stage WST is driven in the X-axis direction. As shown in FIG. 2, the canceling mechanism 78 is disposed at the −Y side end of the second surface 146d of the second surface plate 46B. As shown in FIGS. 2 and 7A, the canceling mechanism 78 includes a fixed portion 78A fixed on the second surface plate 46B, and a movable portion 78B that moves along the longitudinal direction of the fixed portion 78A. And.

  As shown in FIG. 7B, the fixing portion 78 </ b> A includes a guide 179 having a substantially U-shaped cross section and a stator RMa fixed to the upper surface of the guide 179. In this case, the guide 179 is directly fixed on the second surface plate 46B. The stator RMa has an I-shaped cross section, and a plurality of armature coils are disposed therein.

  As shown in FIG. 7B, the movable portion 78B includes a movable element RMb and a pair of heavy objects (mass) 178A and 178B fixed to both sides of the movable element RMb in the Y-axis direction. . The mover RMb is composed of a cylindrical member having a rectangular cross section and a plurality of field magnets fixed to a pair of opposing surfaces (both side surfaces in the Y-axis direction) inside the cylindrical member.

  In a state where the stator RMa and the mover RMb are engaged as shown in FIG. 7A, an electromagnetic wave between a current flowing in the stator RMa and a magnetic field formed in the mover RMb. Due to the interaction, the driving force in the X-axis direction acts on the mover RMb. That is, the moving magnet type linear motor RM is constituted by the stator RMa and the mover RMb.

  In addition, a gas static pressure bearing (not shown) is provided on a part of the portion of the masses 178A and 178B facing the guide 179 fixed on both sides in the Y axis direction of the mover RMb. Thus, the masses 178A and 178B are levitated and supported with respect to the guide 179 through a clearance of several μm. These masses 178A and 178B are provided to generate a large reaction force (force) with a small stroke. As the masses 178A and 178B, it is desirable to make the mass as large as possible, for example, by configuring the masses with a relatively high density member.

  The canceling mechanism 78 (that is, the linear motor RM) configured as described above is controlled by the main controller 50 of FIG. 1 as described later.

  As shown in FIG. 2, the stage device 20 further includes a voice coil motor 80 that can drive the second surface plate 46B in the X-axis direction. The voice coil motor 80 has a flat plate-like movable element 81 projecting on the side surface on the + X side of the second surface plate 46B and a support member 83 so as to engage with the movable element 81 in a non-contact manner. And a stator 82 having a U-shaped cross section disposed above the floor surface F. In this case, for example, the mover 81 is an armature unit having an armature coil therein, and the stator 82 is provided with field magnets having opposite polarities on a pair of opposed surfaces (upper surface and lower surface) inside thereof. It can be a magnetic pole unit.

  The mover 81 is provided at a position in the Y-axis direction corresponding to the center of gravity of the second surface plate 46B. Therefore, when the voice coil motor 80 is driven by the main controller 50, it is possible to drive the second surface plate 46B in the X-axis direction without rotating the second surface plate 46B by θz.

  Returning to FIG. 1, the exposure apparatus 10 of the present embodiment has a light source whose on / off is controlled by the main controller 50, and forms many pinholes or slit images toward the image plane of the projection optical system PL. Of the oblique incidence system comprising an irradiation system AFa that irradiates an imaging light beam for the purpose from an oblique direction with respect to the optical axis AX, and a light receiving system AFb that receives the reflected light beam on the surface of the wafer W. A focal position detection system comprising a multipoint focal position detection system is further provided. A detailed configuration of a multipoint focal position detection system similar to the focal position detection system (AFa, AFb) of the present embodiment is disclosed in, for example, Japanese Patent Laid-Open No. 6-283403 and US Pat. No. 5,448, corresponding thereto. No. 332 and the like. To the extent permitted by national legislation in the designated country (or selected selected country) designated in this international application, the disclosures in the above publications and corresponding US patents are incorporated herein by reference.

  Main controller 50 performs wafer table WTB via Z / tilt drive mechanisms 96a to 96c based on a defocus signal (defocus signal) from light receiving system AFb, for example, an S curve signal, during scanning exposure described later. Of the wafer table WTB is controlled based on the detection result of the multipoint focal position detection system (AFa, AFb). By controlling the movement, the imaging plane of the projection optical system PL and the surface of the wafer W (shot area) are substantially matched within the irradiation area of the illumination light IL (exposure area having an imaging relationship with the illumination area). Auto focus (auto focus) and auto leveling are performed (in other words, the surface of the shot area is set within the focal depth of the projection optical system PL in the exposure area) To do.

  According to the exposure apparatus 10 of the present embodiment configured as described above, similarly to a normal scanning stepper, reticle alignment, baseline measurement of an alignment system (not shown), and EGA (enhanced global alignment) method are used. After a predetermined preparatory work such as wafer alignment is performed, a step-and-scan exposure operation is performed as follows.

  The above-described preparation operations such as reticle alignment and baseline measurement are disclosed in detail in, for example, Japanese Patent Application Laid-Open No. 7-176468 and US Pat. No. 5,646,413 corresponding thereto, followed by this. EGA is disclosed in detail in JP-A-61-44429 and US Pat. No. 4,780,617 corresponding thereto. As long as the national laws of the designated country (or selected selected country) designated in this international application permit, the disclosures in the above publications and the corresponding US patents are incorporated herein by reference. .

  That is, main controller 50 places wafer stage WST at the acceleration start position for exposure of the first shot area (first shot area) on wafer W held on wafer table WTB based on the result of wafer alignment. Moving. This movement is performed by the main controller 50 controlling the Y-axis linear motors 66A and 66B and the X-axis linear motors 75B and 75C based on the measurement value of the wafer interferometer 104.

  Next, main controller 50 starts relative scanning in the Y-axis direction between reticle stage RST and wafer stage WST, performs scanning exposure on the first shot area on wafer W, and circuit for reticle R in the first shot area. The pattern is reduced and transferred via the projection optical system PL.

  Here, at the time of scanning exposure, main controller 50 controls reticle stage driving unit 22 and Y-axis linear motors 66A and 66B while monitoring the measurement values of reticle interferometer 22 and wafer interferometer 104. The reticle stage RST and the wafer stage WST are relatively scanned. During this relative scanning (at least during exposure), it is necessary to synchronize both with high accuracy. Considering this point, main controller 50 uses Y-axis fine movement motor 75A to finely adjust the position of wafer stage WST in the Y-axis direction so that the tracking error of reticle stage RST with respect to wafer stage WST does not occur as much as possible. Is going.

  During scanning exposure, autofocus and autoleveling based on the output of the focus position detection system (AFa, AFb) described above are executed by the main controller 50 via the Z / tilt drive mechanisms 96a to 96c.

  When the first shot scanning exposure is thus completed, main controller 50 moves wafer stage WST stepwise in the X-axis direction, and starts acceleration for exposure of the second shot area (second shot area). Moved to position. Then, under the control of the main controller 50, the same scanning exposure as described above is performed on the second shot area.

  In this way, the scanning exposure of the shot area on the wafer W and the stepping operation between the shot areas are repeatedly performed, and the circuit pattern of the reticle R is sequentially transferred to all the exposure target shot areas on the wafer W.

  When wafer stage WST is driven in the Y-axis direction together with stator unit 60 during the above-described step-and-scan exposure operation, the reaction force generated by the drive causes Y-axis that constitutes Y-axis linear motors 66A and 66B. It acts on the stators 62A and 62B. Due to the reaction force, the Y-axis stators 62A and 62B are driven in the Y-axis direction along the guides 48A and 48B. In this case, the guides 48A and 48B and the sliders 68A and 68B fixed to the Y-axis stators 62A and 62B are not in contact with each other by a static gas bearing, so that the momentum conservation law is substantially established. The Y-axis stators 62A and 62B move, and the aforementioned reaction force is almost completely canceled.

  However, when the Y-axis stators 62A and 62B are repeatedly moved by a distance corresponding to the reaction force, the Y-axis stators 62A and 62B are displaced from a predetermined reference position, and in the worst case, the wafer stage WST is necessary. May be out of range. Therefore, in the present embodiment, the main controller 50 configures the position adjustment mechanisms 52A and 52B described above at a timing that does not affect the exposure accuracy, that is, at a time when, for example, the exposure operation or the alignment operation is not performed. The Y-axis stators 62A and 62B are returned to a predetermined reference position by controlling the current supplied to the armature coil.

  Further, based on the target position of wafer stage WST in the Y-axis direction, Y-axis stator 62A, is positioned so that the reaction force generated when wafer stage WST is driven to the target position is canceled by the momentum conservation law. The position adjustment mechanisms 52A and 52B may be controlled at all times so that 62B moves. Even in this case, it is preferable to control the position adjusting mechanisms 52A and 52B to be driven at the timing when the exposure operation and the alignment operation are not performed.

  On the other hand, when wafer stage WST is driven along the X-axis direction, the reaction force due to the drive acts on stator unit 60, and stator unit 60 attempts to move in the opposite direction to wafer stage WST. . In this case, since the stator unit 60 maintains the position in the X-axis direction with respect to the second surface plate 46B via the static gas bearings 151a and 151b, the reaction force in the X-axis direction described above is the second constant force. The stator unit 60 and the second surface plate 46B are integrally moved in the opposite direction to the wafer stage WST.

  In this case, since the second surface plate 46B is levitated and supported on the floor surface F, the stator unit 60 and the second surface plate 46B are integrally formed in the X-axis direction so that the momentum conservation law is substantially established. Thus, the reaction force due to the driving of wafer stage WST in the X-axis direction is almost completely canceled. In addition, only the stator unit 60 does not move for canceling the reaction force in this way, but the second surface plate 46B moves together with the stator unit 60. Therefore, as the weight thereof increases, the second platen 46B moves in the X-axis direction. It is possible to keep the moving stroke small.

In this case, the center of gravity of the system composed of members supported by the second surface plate 46B such as the second surface plate 46B, the guide member 48B, and the Y-axis stator 62B is a reaction force generated by driving the wafer stage WST in the X-axis direction. However, as shown in FIG. 8, when the wafer stage WST is located at a distance L1 away from the center of gravity Gp of the system and a reaction force acts on that position. , rotation moment (torque) _{M 1} is generated in the second plate 46B. Therefore, in the present embodiment, the main control device 50 rotates the movable portion 78B constituting the canceling mechanism 78 in the X-axis direction according to the magnitude of the reaction force and the position of the action point. to offset the moments M ₁ in the closed system including a second plate 46B.

More specifically, main controller 50 determines the reaction force (F ₁ ) due to movement of wafer stage WST in the X-axis direction and the distance from the center of gravity Gp of the system to the point where reaction force (F ₁ ) acts ( L1), the rotational moment around the center of gravity (M ₁ ), the reaction force (F ₂ ) due to the movement of the movable portion 78B of the canceling mechanism 78 in the X-axis direction, and the reaction force (F ₂ ) The movable portion 78B of the canceling mechanism 78 is driven and controlled so that the rotational moment about the center of gravity generated according to the distance (L2) to the point at which ₂ ) acts is the same in the opposite direction. As a result, the moment (M ₁ ) acting around the center of gravity Gp of the system including the second surface plate 46B can be canceled in the system including the second surface plate 46B, and the second surface plate due to the rotational moment M ₁ is obtained. The rotation of 46B can be prevented.

In the present embodiment, it is possible to cancel the rotational moment acting on the system including the second surface plate 46B as described above. However, the second surface plate 46B has a reaction force F ₁ and a reaction force F ₂ . Due to the action of the resultant force, the X-axis direction moves although it is a minute amount while following the momentum conservation law. As the second surface plate 46B moves, the stator unit 60 and the pair of Y-axis movers 64A and 64B move in the X-axis direction with respect to the second surface plate 46B and the like. If such movement is repeated, the second surface plate 46B, the stator unit 60, and the like are displaced from the reference position. If the displacement is increased, the control of the Y-axis linear motor 66A is affected. That is, for example, the Y-axis movable element 64A may be disengaged from the internal space of the Y-axis stator 62A, or the air bearing 51A may be disengaged from the first surface 146a of the second surface plate 46A. Therefore, in order to prevent such a situation from occurring, the main controller 50 controls the driving of the voice coil motor 80 while the exposure operation and the alignment operation are not performed, and the second surface plate 46B and The stator unit 60 is appropriately moved to a predetermined reference position or the vicinity thereof.

  Further, based on the target position of wafer stage WST in the X-axis direction, the second surface plate 46B and the second surface plate 46B are positioned so that the reaction force generated when wafer stage WST is driven to the target position is canceled by the momentum conservation law. The voice coil motor 80 may be constantly controlled so that the stator unit 60 moves. Even in this case, it is preferable to control the voice coil motor 80 to be driven at a timing when the exposure operation and the alignment operation are not performed.

  By doing as described above, the reaction force generated during the exposure operation and the alignment operation is almost completely canceled, and the influence of the rotational moment given to the second surface plate 46B or the like by the reaction force can be suppressed as much as possible. In addition, it is possible to reliably avoid the occurrence of inability to control the Y-axis linear motor.

  As described above in detail, according to the stage apparatus 20 according to the present embodiment, the wafer stage WST is guided by the guide surface 44a formed on the first surface plate 44, and constitutes the first drive mechanism described above. The shaft linear motors 75B and 75C are driven with a predetermined stroke in the X-axis direction and are finely driven in the rotation direction around the Z-axis. Wafer stage WST is finely driven in the Y-axis direction by Y-axis fine movement motor 75A constituting the first drive mechanism. Further, wafer stage WST is guided by guide surface 44a formed on first surface plate 44, and a pair of Y-axis movers 65A corresponding to a pair of Y-axis stators 64A and 64B constituting the second drive mechanism, The pair of Y-axis movers 65A and 65B has one end and the other end in the longitudinal direction due to a driving force generated by electromagnetic interaction with 65B (that is, a driving force of the pair of Y-axis linear motors 66A and 66B). Are driven in the Y-axis direction integrally with the stator unit 60 provided respectively.

  In this case, the stator unit 60 (including the X-axis stators 61B and 61C and the Y-axis fine movement stator 61A) constituting the first drive mechanism (Y-axis fine movement motor 75A, X-axis linear motors 75B and 75C) The first surface 146a and 146c of the second surface plates 46A and 46B separated from the first surface plate 44 are supported in the Z-axis direction.

  Therefore, when the wafer stage WST is driven in the Y-axis direction by the pair of Y-axis linear motors 66A and 66B together with the stator unit 60, even if vibration occurs in the pair of Y-axis stators 64A and 64B, The vibration is transmitted only to the second surface plates 46A and 46B that individually support the Y-axis stators 64A and 64B, and is not transmitted to the first surface plate 44 that is vibrationally separated from these. Even if the vibrations of the Y-axis stators 64A and 64B are transmitted to the corresponding Y-axis movers 65A and 65B, the stator unit 60 provided with the Y-axis movers 65A and 65B at both ends thereof is Since the support surfaces 146a and 146B of the pair of second surface plates 46A and 46B are supported in a non-contact manner with respect to the Z-axis direction via the static gas bearings, vibration is transmitted to the second surface plates 46A and 46B. However, it is not transmitted to the first surface plate 44 that is vibrationally separated from the second surface plates 46A and 46B. Further, the vibrations of the Y-axis movers 65A and 65B hardly affect the stator unit 60. The anti-vibration unit 92 is not necessarily provided if there is no influence of vibration transmitted to the first surface plate 44. When the vibration isolation unit 92 is not provided, the first surface plate 44 and the second surface plates 46A and 46B may be configured integrally.

  Further, the wafer is generated by a driving force generated by electromagnetic interaction between the mover unit (specifically, the Y-axis fine movement mover 76A) and the stator unit 60 (specifically, the Y-axis fine movement stator 61A). Since stage WST can be finely driven in the Y-axis direction (scanning direction), an air bearing or the like is provided in order to maintain the positional relationship between wafer stage WST (movable unit) and stator unit 60 in the Y-axis direction. It is not necessary, and wafer stage WST can be accurately moved to a desired position in the Y-axis direction.

  In this case, movement of stator unit 60 in the Y-axis direction does not directly affect wafer stage WST. Thereby, driving in the Y-axis direction of wafer stage WST does not become a vibration factor of wafer stage WST, and the position control accuracy of wafer stage WST can be maintained high during driving in the Y-axis direction.

  Wafer stage WST is driven in the X-axis direction along stator unit 60 in a state of being guided by guide surface 44a by a driving force generated by electromagnetic interaction between mover unit and stator unit 60. Therefore, vibration does not occur in wafer stage WST during this driving. Further, even if the reaction force due to this driving is transmitted to the second surface plates 46A and 46B supporting the Y-axis stators 64A and 64B via the stator unit 60, this vibration is transmitted to the first surface plate 44. Will never be done.

  Therefore, according to stage device 20, the vibration of each part due to the reaction force generated by driving wafer stage WST hardly causes deterioration of the position controllability of wafer stage WST, and high-accuracy position of wafer stage WST is achieved. Control can be realized.

  Further, according to the stage device 20, the stator unit 60 is arranged on the Y axis fine movement stator 61A extending in the X axis direction, and on one side and the other side of the Y axis direction centering on the Y axis fine movement stator 61A. The mover unit includes a pair of X-axis stators 61B and 61C extending in the X-axis direction, and the mover unit drives the wafer stage WST minutely in the Y-axis direction by electromagnetic interaction with the Y-axis fine movement stator 61A. A pair of electromagnetic forces that individually generate electromagnetic force between the Y-axis fine-moving movable element 76A that generates force and the pair of X-axis stators 61B and 61C to generate driving force for driving the wafer stage WST in the X-axis direction. X-axis movers 76B and 76C. That is, Y-axis fine motor 75A that finely drives wafer stage WST in the Y-axis direction, and X-axis linear motors 75B and 75C disposed around one side and the other side in the Y-axis direction with Y-axis fine motor 75A as the center. Therefore, by making the driving force of the X-axis linear motors 75B and 75C the same, it becomes possible to apply the driving force in the vicinity of the center of gravity of the stage, and the driving force of the X-axis linear motors 75B and 75C. Can be driven about the center of gravity.

  Further, according to the stage apparatus 20 according to the present embodiment, the Y-axis linear motors 66A and 66B are a pair of moving coil types in which the movers 64A and 64B are composed of armature units and the stators 64A and 64B are composed of magnetic pole units. Therefore, the mover side can be reduced in weight and the stator side can be increased in weight. In this case, the stroke when the stator functions as a counter mass can be reduced, and the apparatus can be miniaturized. In this embodiment, since the moving coil type Y-axis linear motors 66A and 66B are employed, two wafer stages are provided, and the stators of the Y-axis linear motors of the two wafer stages are made common. Thus, a twin wafer stage type wafer stage apparatus having two wafer stages can be realized relatively easily.

  The second surface plates 46A and 46B also serve as the bases of the Y-axis stators 62A and 62B. The Y-axis stators 62A and 62B have a frictional force between the second surface plates 46A and 46B. In a substantially zero state, relative movement at least in the Y-axis direction is allowed. Therefore, when the wafer stage WST is driven in the Y-axis direction, the reaction force generated in the Y-axis stators 62A and 62B when the Y-axis movable elements 64A and 64B are driven in the Y-axis direction integrally with the stator unit 60. Thus, the Y-axis stators 62A and 62B move in the Y-axis direction in accordance with the momentum conservation law. As a result, the reaction force is almost completely canceled and the occurrence of vibration is prevented. In this case, since the center of gravity does not move, there is no occurrence of uneven load.

  Further, according to the stage apparatus 20 according to the present embodiment, the stator unit 60 is allowed to move relative to the X-axis direction while the frictional force between the wafer stage WST and the guide surface 44a is substantially zero. Therefore, when the wafer stage WST is driven in the X-axis direction, the stator unit 60 moves in the X-axis direction according to the momentum conservation law due to the reaction force of the drive force, and the reaction force is canceled and the reaction force It is possible to prevent the occurrence of vibration due to the above. Further, the second surface plate 46B is movable with respect to the floor surface F, and the reaction force generated in the stator unit 60 when the wafer stage WST (X-axis movable elements 76B and 76C) is driven in the X-axis direction is Gas static pressure bearings 151 a and 151 b that transmit to the second surface plate 46 </ b> B are provided in the stator unit 60. For this reason, the reaction force of wafer stage WST (X-axis movers 76B and 76C) is canceled by the movement of stator unit 60, second surface plate 46B, and the like. In this case, since the mass of the second surface plate 46B and the like is large, it is possible to shorten the moving distance as much as possible.

  Further, according to the stage apparatus 20 according to the present embodiment, the positions of the Y-axis stators 62A and 62B in the Y-axis direction can be returned to a predetermined reference position by the above-described two position adjustment mechanisms 52A and 52B. For this reason, it is not necessary to increase the movement stroke of the Y-axis stators 62A and 62B, and the size can be reduced accordingly. Further, since the position adjusting devices 52A and 52B use a part of the Y-axis stators 62A and 62B as movers, it is not necessary to provide a magnetic pole unit (or armature unit) separately from the Y-axis linear motor.

  Furthermore, according to the stage apparatus 20, it is possible to prevent the occurrence of rotation of the second surface plate 46B due to the reaction force when the wafer stage WST is driven by the canceling mechanism 78 described above.

  Further, according to the exposure apparatus 10 of the present embodiment, the position controllability of the wafer stage WST can be improved by the stage apparatus 20, so that the pattern of the reticle R can be accurately formed on the wafer W held on the wafer stage WST. It becomes possible to transfer.

  Further, according to the exposure apparatus 10, since the stage apparatus 20 adopts a coarse / fine movement type configuration in the scanning direction, the synchronization accuracy between the reticle stage RST and the wafer stage WST at the time of scanning exposure can be improved. In this respect as well, it is possible to improve the exposure accuracy (such as the overlay accuracy between the reticle pattern and the wafer).

  In the above-described embodiment, two second surface plates are provided corresponding to the Y-axis stator. However, the present invention is not limited to this, and there may be one second surface plate. In this case, for example, a frame-shaped surface plate surrounding the first surface plate 44 can be adopted as the second surface plate.

  In the above-described embodiment, one of the two second surface plates 46A and 46B is levitated and supported on the floor surface, and the one second surface plate 46B is counter-massed in the X-axis direction. However, the present invention is not limited to this, and any of the two second surface plates 46A and 46B may be configured to be levitated and supported on the floor surface F. In this case, a configuration in which the two second surface plates 46A and 46B are connected by a predetermined connecting member and the respective surface plates move by the same amount may be employed. For example, the two second surface plates 46A and 46B are connected by a predetermined connecting member or integrated into a frame-shaped surface plate surrounding the first surface plate 44, and the surface plate floats on the floor F. It may be configured so that it can be supported and moved in the X-axis direction and the Y-axis direction and θz rotation. As a result, the second surface plate can function as a counter mass for the X-axis direction and the θz direction. A drive device for adjusting the position of the second surface plate in the X-axis direction and the position of the Y-axis direction and removing the θz rotation may be provided. As this driving device, the same configuration as the position adjusting mechanisms 52A and 52B, the voice coil motor 80, the canceling mechanism 78, etc. can be used. Furthermore, the first surface plate 44 and the second surface plates 46A and 46B can be integrated to function as a counter mass for X-axis direction, Y-axis direction, and θz rotation.

  Further, the second surface plates 46A and 46B are connected by a predetermined connecting member or integrated to form a frame-shaped member surrounding the first surface plate 44, and the Y-axis linear motors 66A and 66B are connected to the frame-shaped member. It is good also as a structure which fixes axial stator (magnetic pole unit) 62A, 62B. The frame-like member is floated and supported on the floor surface F so as to be able to move in the X-axis direction and the Y-axis direction and rotate θz, and a counter for rotating in the X-axis direction, Y-axis direction, and θz It may function as a mass. Also in this case, as described above, a driving device for adjusting the position of the frame member in the X-axis direction and the position in the Y-axis direction and removing the θz rotation may be provided. Further, the frame member and the first surface plate 44 are integrated so that the reaction force is transmitted to the first surface plate 44, and the first surface plate 44 is countered for rotating in the X-axis direction, the Y-axis direction, and the θz. It is also possible to function as a mass.

  The canceling mechanism 78 described in the above embodiment is an example, and in the stage device of the present invention, it is provided on a specific surface plate (second surface plate 46B in the above embodiment), and a stage (mover unit). Various configurations can be adopted as the configuration of the canceling mechanism that cancels the rotational moment generated in the specific surface plate due to the action of the reaction force generated when driving in the X-axis direction.

  That is, for example, a configuration as shown in FIG. 9 can be employed (hereinafter referred to as a first modification). The stage device 20 ′ according to the first modification shown in FIG. 9 is configured in substantially the same manner as the stage device 20 described above, but is provided with a canceling mechanism BM instead of the canceling mechanism 78. It has the characteristics.

  The canceling mechanism BM includes a guide 181 provided at the −X side end of the second surface plate 46B and having a Y axis direction as a longitudinal direction, and a balance mass 182 engaged with the guide 181. Yes. The balance mass 182 can be driven in the Y-axis direction along the guide 181 by a drive mechanism (not shown).

  The balance mass 182 is driven through the drive mechanism by the main controller 50 in accordance with the position of the wafer stage WST in the Y-axis direction, and a first reaction force generated when the wafer stage WST is driven in the X-axis direction. Control is performed so that the center of gravity of the system including the second surface plate 46B and the canceling mechanism BM is positioned in the vicinity of the transmission portion to the 2 surface plate 46B. That is, as shown in FIG. 10A, when wafer stage WST is positioned near one side in the Y-axis direction (+ Y side end), balance mass 182 is controlled to be positioned at the + Y side end. As shown in FIG. 10B, when wafer stage WST is positioned near the other side in the Y-axis direction (−Y side end), control is performed so that balance mass 182 is also positioned at the −Y side end. Is done.

  As described above, according to the stage apparatus 20 ′ according to the first modification, the reaction force accompanying the X-axis direction driving of the wafer stage WST is always the second regardless of the position (Y-axis direction position) of the wafer stage WST. Since the torque is transmitted to the vicinity of the center of gravity of the surface plate 46B, no torque component is generated on the second surface plate 46B, or even if it is generated, it can be suppressed to a small amount.

  Note that the mass of the balance mass 182 constituting the canceling mechanism BM is set to a value that allows the torque component generated in the second surface plate 46B to be estimated and canceled, and the drive amount of the balance mass 182 It shall be adjusted according to the mass of the mass 182.

  In addition, a stage apparatus 20 ″ according to a second modification provided with two actuators (reaction motors) 80A and 80B as shown in FIG. The stage device 20 ″ according to the second modification may include a canceling mechanism that cancels the torque component of the second surface plate 46B due to the reaction force generated when the wafer stage WST is driven. The second surface plate 46B includes two actuators (reaction motors) 80A and 80B arranged at a predetermined interval in the Y-axis direction on the + X side.

  As the one actuator (reaction motor) 80A, for example, a movable element 81A protruding near the −Y side end of the + X side surface of the second surface plate 46B, and the electromagnetic mutual between the movable element 81A A voice coil motor including a stator 82A that generates a driving force in the X-axis direction by action can be used. In this case, the stator 82A is supported at a predetermined height from the floor surface F by the support member 83A.

  As the other actuator (reaction motor) 80B, similar to the actuator (reaction motor) 80A, the stator 82B supported by the support member 83B and the vicinity of the + Y side end of the + X side surface of the second surface plate 46B. A voice coil motor including the projecting movable element 81B can be used.

  According to the stage apparatus 20 ″ according to the second modification, the wafer stage WST is moved by adjusting the balance of the forces in the X-axis direction applied from the two actuators 80A, 80B to the second surface plates 46A, 46B. Accordingly, the torque component generated in the second surface plate 46B can be canceled almost completely.

  The reaction force acting on the support members 83A and 83B by driving these two actuators 80A and 80B may be canceled using a counter mass with three degrees of freedom (not shown) as necessary. Further, the function of the voice coil motor 80 may be used in combination with the two actuators 80A and 80B. That is, not only the two actuators 80A and 80B are used for canceling the torque component generated in the second surface plate 46B, but the second surface plate 46B and the stator unit 60 are brought to a predetermined reference position or in the vicinity thereof as described above. It may be used for movement.

  Furthermore, a stage device 120 of the third modification as shown in FIG. 12 may be employed in place of the stage device 20 described above. The stage device 120 of the third modified example is characterized in that a canceling mechanism is constituted by two reaction motors 115A and 115B arranged on the second surface plate 46B.

  As shown in FIG. 12, one reaction motor 115 </ b> A has a guide 114 fixed in the vicinity of the −Y end of the second surface plate 46 </ b> B with the X-axis direction as a longitudinal direction, and slides along the guide 114. A possible stator portion 112 and a movable element 113 provided inside the stator portion 112 are provided.

  The stator portion 112 includes a pair of masses 111A and 111B provided at a predetermined interval in the Z-axis direction, and a plurality of permanent magnets provided on surfaces where these masses 111A and 111B face each other. And a stator unit (not shown). In this case, the lower mass 111B is not in contact with the guide 114 and the second surface plate 46B via an air bearing (not shown) or the like.

  The movable element 113 includes an armature unit including a plurality of armature coils therein, and is inserted between the masses 111A and 111B. That is, the mover 113 is driven in the X-axis direction inside the stator portion 112 by electromagnetic interaction between the current supplied to the armature coil of the mover 113 and the magnetic field formed by the stator unit. It has come to be.

  That is, according to the reaction motor 115A configured as described above, when the mover 113 is driven in the + X direction, for example, the reaction force generated by the drive acts on the stator part 112, and the stator part 112 is moved to the mover 113. It moves in the direction opposite to the driving direction (−X direction). Further, a reaction force in the + X direction due to the movement of the stator portion 112 acts on the second surface plate 46B. Accordingly, a force in the + X direction acts on the second surface plate 46B. Thus, according to the reaction motor 115A, a force in the same direction as the driving direction of the mover 113 can be applied to the second surface plate 46B.

  The other reaction motor 115B is configured similarly to the above-described reaction motor 115A.

  Therefore, according to the stage device 120 of the third modified example, the balance of the reaction force transmitted from the two reaction motors 115A and 115B arranged on the second surface plate 46B to the second surface plate 46B is adjusted. Thus, it is possible to cancel the torque component resulting from the position and movement of wafer stage WST acting on second surface plate 46B. In this case, the masses and generated thrusts of the masses 111A and 111B of the stator portion 112 constituting the reaction motors 115A and 115B are based on the Y-axis direction position of the wafer stage WST and the torque component generated on the second surface plate 46B. By estimating, it is possible to cancel the torque component almost completely.

  The two reaction motors (115A, 115B) are provided on the second surface plate 46B. However, the present invention is not limited to this, and only one reaction motor is provided as in the canceling mechanism 78 of the above embodiment. It is also good.

  In the above-described embodiment, a part of the Y-axis linear motor is also used as the mover of the position adjustment mechanism. However, the present invention is not limited to this. Of course.

  In the above embodiment, the voice coil motor is used as the position adjusting mechanism for returning the second surface plate to the predetermined position, but it is needless to say that another driving mechanism such as a linear motor may be used.

  In the above embodiment, a moving magnet type linear motor is used for the X-axis linear motor and a moving coil type linear motor is used for the Y-axis linear motor. However, the present invention is not limited to this. Alternatively, both of the linear motors may be moving coil type linear motors, or both may be moving magnet type linear motors. The X-axis linear motor may be a moving coil type linear motor, and the Y-axis linear motor may be a moving magnet type linear motor.

  In the above embodiment, the first drive mechanism is constituted by two X-axis linear motors and one Y-axis fine movement motor. However, wafer stage WST is moved in the first axis direction (for example, the X-axis direction). The second axis direction (for example, the Y-axis direction) orthogonal to the first axis and the first axis orthogonal to the first axis and the second axis in a plane parallel to the moving surface of the wafer stage WST are driven with a predetermined stroke. The configuration is not limited to the configuration of the above embodiment as long as it is a drive mechanism that finely drives around three axes (for example, the Z axis).

  In the above embodiment, the case where the Y-axis stator, the X-axis stator, and the second surface plate have a function as a counter mass has been described. However, the present invention is not limited to this, and each unit functions as a counter mass. It does not have to have.

  In the above embodiment, wafer stage WST is levitated and supported by a static gas bearing with respect to guide surface 44a of first surface plate 44, and stator unit 60 has first surface 146a of second surface plates 46A and 46B, Although the case where levitation support is performed with respect to 146c by the hydrostatic bearing has been described, the present invention is not limited thereto, and magnetic levitation or a mechanical guide may be employed.

  In the above embodiment, the case where the present invention is applied to a scanning stepper has been described. However, the present invention is not limited to this, and the present invention can also be applied to a static exposure type exposure apparatus such as a step-and-repeat stepper.

  In the above embodiment, the case where the stage apparatus of the present invention is applied to a stage apparatus that holds a wafer of an exposure apparatus has been described. However, the present invention is not limited to this, and a precision machine other than the exposure apparatus is used. The stage apparatus of the present invention can be suitably applied to the above.

  An illumination optical system and projection optical system composed of a plurality of lenses are incorporated into the exposure apparatus body for optical adjustment, and a reticle stage and wafer stage made up of a number of mechanical parts are attached to the exposure apparatus body to provide wiring and piping. , And further performing general adjustment (electrical adjustment, operation check, etc.), the exposure apparatus of the above embodiment can be manufactured. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  The present invention is not limited to an exposure apparatus for manufacturing a semiconductor, but is used for manufacturing a display including a liquid crystal display element. An exposure apparatus for transferring a device pattern onto a glass plate and a device used for manufacturing a thin film magnetic head. The present invention can also be applied to an exposure apparatus for transferring a pattern onto a ceramic wafer, an exposure apparatus used for manufacturing an image pickup device (CCD or the like), a micromachine, an organic EL, a DNA chip, and the like. Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates or silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern. Here, in an exposure apparatus using DUV (far ultraviolet) light, VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used. As a reticle substrate, quartz glass, fluorine-doped quartz glass, meteorite, Magnesium fluoride or quartz is used. Further, in a proximity type X-ray exposure apparatus or an electron beam exposure apparatus, a transmission mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate.

<Device manufacturing method>
Next, an embodiment of a device manufacturing method using the above-described exposure apparatus in a lithography process will be described.

  FIG. 13 shows a flowchart of a manufacturing example of a device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc.). As shown in FIG. 13, first, in step 201 (design step), device function / performance design (for example, circuit design of a semiconductor device) is performed, and pattern design for realizing the function is performed. Subsequently, in step 202 (mask manufacturing step), a mask on which the designed circuit pattern is formed is manufactured. On the other hand, in step 203 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

  Next, in step 204 (wafer processing step), using the mask and wafer prepared in steps 201 to 203, an actual circuit or the like is formed on the wafer by lithography or the like as will be described later. Next, in step 205 (device assembly step), device assembly is performed using the wafer processed in step 204. Step 205 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary.

  Finally, in step 206 (inspection step), inspections such as an operation confirmation test and durability test of the device created in step 205 are performed. After these steps, the device is completed and shipped.

  FIG. 14 shows a detailed flow example of step 204 in the semiconductor device. In FIG. 14, in step 211 (oxidation step), the surface of the wafer is oxidized. In step 212 (CVD step), an insulating film is formed on the wafer surface. In step 213 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step 214 (ion implantation step), ions are implanted into the wafer. Each of the above-described steps 211 to 214 constitutes a pre-processing process at each stage of wafer processing, and is selected and executed according to a necessary process at each stage.

  At each stage of the wafer process, when the above pre-process is completed, the post-process is executed as follows. In this post-processing process, first, in step 215 (resist formation step), a photosensitive agent is applied to the wafer. Subsequently, in step 216 (exposure step), the circuit pattern of the mask is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step 217 (development step), the exposed wafer is developed, and in step 218 (etching step), the exposed member other than the portion where the resist remains is removed by etching. In step 219 (resist removal step), the resist that has become unnecessary after the etching is removed.

  By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer.

  If the device manufacturing method of this embodiment described above is used, the exposure apparatus of the above embodiment is used in the exposure step (step 216), so that the reticle pattern can be accurately transferred onto the wafer. As a result, the yield of highly integrated microdevices can be improved, and the productivity can be improved.

  As described above, the stage apparatus of the present invention is suitable for moving a stage on which an object is placed in a two-dimensional plane. The exposure apparatus of the present invention is suitable for transferring a pattern formed on a mask onto a photosensitive object. The device manufacturing method of the present invention is suitable for producing highly integrated microdevices.

Claims (26)

A stage on which the object is placed;
The stage is driven with a predetermined stroke in the first axis direction by electromagnetic interaction between the mover unit provided on the stage and the mover unit, and within a plane parallel to the moving surface of the stage. A first drive mechanism having a stator unit extending in the first axis direction that finely drives around a second axis direction orthogonal to the first axis and a third axis orthogonal to the first axis and the second axis. When;
A pair of first movers provided respectively at one end and the other end of the stator unit in the first axial direction and corresponding first moveable by electromagnetic interaction between the first movers. A second drive mechanism having a pair of first stators that generate a driving force for driving the stator unit in the second axial direction integrally with a child;
A first surface plate on which a guide surface for guiding the stage is formed;
The first surface plate is separated from the first surface plate in vibration, and a support surface for supporting the stator unit with respect to the third axial direction is formed, and at least one second constant surface supporting each of the pair of first stators. A stage device comprising: a board; The stage apparatus according to claim 1, wherein
The stator unit and the mover unit are configured to allow the change in the relative position of the first surface plate and the second surface plate in the third axis direction during scanning of the stage. A stage apparatus characterized in that an axial interval is set. The stage apparatus according to claim 1, wherein
The stator unit extends in the first axial direction disposed on one side and the other side of the second axial direction with the second stator extending in the first axial direction and the second stator as a center. A pair of third stators,
The mover unit includes a second mover that generates a driving force for minutely driving the stage in the second axis direction by electromagnetic interaction with the second stator, and the pair of third stators. A stage apparatus comprising: a pair of third movers that individually perform electromagnetic interaction between each other to generate a driving force for driving the stage in the first axis direction. The stage apparatus according to claim 1, wherein
The stage device includes a stage main body provided with the mover unit, and a table that holds the object on the stage main body and can be micro-driven at least in the third axis direction. The stage apparatus according to claim 1, wherein
The second drive mechanism is constituted by a pair of moving coil type linear motors in which each first mover is composed of an armature unit and each first stator is composed of a magnetic pole unit. Stage device. The stage apparatus according to claim 1, wherein
A first bearing mechanism provided on the stage so as to face the guide surface and supporting the stage in a non-contact manner with respect to the guide surface;
A stage device further comprising: a second bearing mechanism provided on the stator unit so as to face the support surface of the second surface plate and supporting the stator unit in a non-contact manner with respect to the support surface. The stage apparatus according to claim 1, wherein
Each of the first stators is allowed to move relative to at least the second axial direction in a state where the friction force between the first stator and the second surface plate is substantially zero. The stage apparatus according to claim 7, wherein
A stage device further comprising two position adjusting mechanisms for adjusting the position of each first stator in the second axial direction. The stage apparatus according to claim 8, wherein
The second drive mechanism includes a pair of moving coil linear motors each having a magnetic pole unit as a stator;
In each of the position adjusting mechanisms, a part of the magnetic pole unit is a mover. The stage apparatus according to claim 1, wherein
The stage unit is characterized in that relative movement at least in the first axial direction is allowed in a state in which a frictional force between the stage and the guide surface is substantially zero. The stage apparatus according to claim 10, wherein
The second surface plate is provided in a pair corresponding to the pair of first stators, and at least one specific surface plate of the pair of second surface plates is movable with respect to the floor surface,
A stage device further comprising a transmission mechanism for transmitting a reaction force generated when the mover unit is driven in the first axial direction to the specific surface plate via the stator unit. The stage apparatus according to claim 11, wherein
A stage device further provided with a canceling mechanism that is provided on the specific surface plate and cancels a rotational moment generated on the specific surface plate due to the action of the reaction force. The stage apparatus according to claim 12, wherein
The canceling mechanism is driven by an electromagnetic interaction between a stator fixed on the specific surface plate and the stator, and generates a reaction force in a direction to cancel the rotation of the specific surface plate due to the rotational moment. A stage apparatus comprising: a movable element that generates the stage. The stage device according to claim 13,
The canceling mechanism drives the mover in a predetermined direction by a predetermined amount according to the position of the first mover in the second axis direction and the drive amount of the stage in the first axis direction. A stage device characterized by the above. A stage on which the object is placed;
The stage is driven with a predetermined stroke in the first axis direction by electromagnetic interaction between the mover unit provided on the stage and the mover unit, and in a plane parallel to the moving surface of the stage. A first drive mechanism having a stator unit extending in the first axis direction that finely drives around a second axis direction orthogonal to the first axis and a third axis orthogonal to the first axis and the second axis. When;
A pair of first movers provided respectively at one end and the other end of the stator unit in the first axial direction and corresponding first moveable by electromagnetic interaction between the first movers. A second drive mechanism having a pair of first stators for generating a driving force for driving the stator unit in the second axial direction integrally with a child;
Each of the first stators is supported in a state in which movement in at least the second axial direction is allowed. The stage apparatus according to claim 15,
The stage unit is characterized in that relative movement in at least the first axial direction is allowed with respect to the stage in a state in which friction force between the stator units is substantially zero. The stage apparatus according to claim 15,
A stage apparatus further comprising a first position adjusting mechanism for adjusting a position of at least one of the first stators in the first axial direction. The stage apparatus according to claim 15,
A stage device further comprising a second position adjusting mechanism for adjusting the position of each first stator in the second axial direction. The stage apparatus according to claim 15,
At least one of the first stators is supported so as to be movable in the first axial direction by a reaction force generated when the stator unit is driven in the first axial direction. The stage device according to claim 19,
A stage device further comprising a canceling mechanism that cancels a rotational moment generated in at least one of the first stators due to the reaction force. The stage device according to claim 19,
A first surface plate supporting the stage;
A second surface plate that supports each of the pair of first stators and at least one of which is movable with respect to the floor surface;
A stage device further comprising: a transmission mechanism that transmits a reaction force generated when the mover unit is driven in the first axial direction to the at least one second surface plate via the stator unit. The stage apparatus according to claim 21, wherein
A stage device further comprising a canceling mechanism that cancels a rotational moment generated in the at least one second surface plate due to the action of the reaction force. The stage apparatus according to claim 22,
The offset mechanism includes a stator fixed on the at least one second surface plate;
A stage driven by electromagnetic interaction with the stator and generating a reaction force in a direction to cancel the rotation of the at least one second surface plate due to the rotational moment. apparatus. An exposure apparatus for transferring a pattern formed on a mask onto a photosensitive object,
24. An exposure apparatus comprising the stage apparatus according to claim 1, wherein the photosensitive object is placed on the stage as the object. The exposure apparatus according to claim 24, wherein
A projection optical system for projecting the pattern onto the photosensitive object;
A mask stage on which the mask is placed;
An exposure apparatus further comprising: a synchronous movement device that synchronizes the mask stage and the stage and moves relative to the projection optical system in the second axis direction. A device manufacturing method including a lithography process,
25. A device manufacturing method, wherein exposure is performed using the exposure apparatus according to claim 24 in the lithography process.

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