JP2006168280A5 - - Google Patents

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Publication number
JP2006168280A5
JP2006168280A5 JP2004366716A JP2004366716A JP2006168280A5 JP 2006168280 A5 JP2006168280 A5 JP 2006168280A5 JP 2004366716 A JP2004366716 A JP 2004366716A JP 2004366716 A JP2004366716 A JP 2004366716A JP 2006168280 A5 JP2006168280 A5 JP 2006168280A5
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JP
Japan
Prior art keywords
resin
mold
cavity
surface temperature
injection molding
Prior art date
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Granted
Application number
JP2004366716A
Other languages
English (en)
Japanese (ja)
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JP2006168280A (ja
JP4716484B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2004366716A external-priority patent/JP4716484B2/ja
Priority to JP2004366716A priority Critical patent/JP4716484B2/ja
Priority to KR1020077013522A priority patent/KR100886992B1/ko
Priority to PCT/JP2005/023077 priority patent/WO2006064885A1/ja
Priority to CNB2005800434866A priority patent/CN100535908C/zh
Priority to TW094144960A priority patent/TW200626344A/zh
Publication of JP2006168280A publication Critical patent/JP2006168280A/ja
Publication of JP2006168280A5 publication Critical patent/JP2006168280A5/ja
Publication of JP4716484B2 publication Critical patent/JP4716484B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2004366716A 2004-12-17 2004-12-17 射出成形シミュレーション装置及び射出成形シミュレーション方法 Active JP4716484B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004366716A JP4716484B2 (ja) 2004-12-17 2004-12-17 射出成形シミュレーション装置及び射出成形シミュレーション方法
KR1020077013522A KR100886992B1 (ko) 2004-12-17 2005-12-15 사출 성형 시뮬레이션 장치 및 방법과, 사출 성형 시뮬레이션 프로그램을 기억한 기록 매체
PCT/JP2005/023077 WO2006064885A1 (ja) 2004-12-17 2005-12-15 射出成形シミュレーション装置及び射出成形シミュレーション方法
CNB2005800434866A CN100535908C (zh) 2004-12-17 2005-12-15 注塑成形模拟装置以及注塑成形模拟方法
TW094144960A TW200626344A (en) 2004-12-17 2005-12-16 Simulation device for injection molding and simulation method for injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004366716A JP4716484B2 (ja) 2004-12-17 2004-12-17 射出成形シミュレーション装置及び射出成形シミュレーション方法

Publications (3)

Publication Number Publication Date
JP2006168280A JP2006168280A (ja) 2006-06-29
JP2006168280A5 true JP2006168280A5 (ko) 2008-02-21
JP4716484B2 JP4716484B2 (ja) 2011-07-06

Family

ID=36587940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004366716A Active JP4716484B2 (ja) 2004-12-17 2004-12-17 射出成形シミュレーション装置及び射出成形シミュレーション方法

Country Status (5)

Country Link
JP (1) JP4716484B2 (ko)
KR (1) KR100886992B1 (ko)
CN (1) CN100535908C (ko)
TW (1) TW200626344A (ko)
WO (1) WO2006064885A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5349859B2 (ja) * 2008-07-31 2013-11-20 キヤノン株式会社 成形品形状の予測方法、成形品の製造方法、成形品形状の予測プログラムとその記憶媒体
KR101052263B1 (ko) * 2008-12-26 2011-07-27 주식회사 포스코 열간프레스성형 금형의 설계방법
US8682620B2 (en) 2010-11-19 2014-03-25 The Procter And Gamble Company Method for designing extrusion dies
CN102974703B (zh) * 2012-11-29 2015-03-18 机械科学研究总院先进制造技术研究中心 一种模拟模具冷却系统的实验装置
TWI571374B (zh) * 2014-01-14 2017-02-21 中原大學 智能化射出成型系統及其方法
TWI571375B (zh) * 2014-01-14 2017-02-21 中原大學 智能化射出成型系統及其方法
FR3017473B1 (fr) * 2014-02-12 2016-03-04 Faurecia Bloc Avant Estimation d'une grandeur relative a un procede de fabrication d'une piece par injection de matiere
US9216532B2 (en) * 2014-02-14 2015-12-22 GM Global Technology Operations LLC Injection mold assembly
CN105374267A (zh) * 2015-12-09 2016-03-02 天津天堰科技股份有限公司 婴幼儿囟门模拟装置
KR101868131B1 (ko) * 2016-09-23 2018-06-18 주식회사 서연이화 도어트림 사출 성형 프로세스 최적화방법
CN112140413B (zh) * 2020-09-02 2022-04-08 金发科技股份有限公司 一种塑料制件开模收缩率的预测方法及系统
JP2022052082A (ja) * 2020-09-23 2022-04-04 株式会社日立製作所 射出成形システムおよび射出成形機の設定支援方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2540233B2 (ja) * 1990-08-21 1996-10-02 積水化学工業株式会社 金型の統合解析システム
JPH10278085A (ja) * 1997-04-08 1998-10-20 Canon Inc 射出成形プロセスにおける温度履歴予測装置及び方法
JPH10278089A (ja) * 1997-04-10 1998-10-20 Canon Inc 射出成形プロセスのシミュレーション方法及びその装置
JP2000289076A (ja) * 1999-04-02 2000-10-17 Plamedia Research Corp 樹脂成形シミュレーション方法
JP4330404B2 (ja) * 2002-08-27 2009-09-16 東レエンジニアリング株式会社 成形品の設計支援装置、設計支援方法およびソフトウェア

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