JP2006168280A5 - - Google Patents
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- JP2006168280A5 JP2006168280A5 JP2004366716A JP2004366716A JP2006168280A5 JP 2006168280 A5 JP2006168280 A5 JP 2006168280A5 JP 2004366716 A JP2004366716 A JP 2004366716A JP 2004366716 A JP2004366716 A JP 2004366716A JP 2006168280 A5 JP2006168280 A5 JP 2006168280A5
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- resin
- mold
- cavity
- surface temperature
- injection molding
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- 239000011347 resin Substances 0.000 claims 72
- 229920005989 resin Polymers 0.000 claims 72
- 238000004088 simulation Methods 0.000 claims 35
- 238000001746 injection moulding Methods 0.000 claims 26
- 238000001816 cooling Methods 0.000 claims 20
- 238000010438 heat treatment Methods 0.000 claims 20
- 238000000034 method Methods 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 2
Claims (34)
前記金型形状と前記加熱条件と前記冷却条件とに基づいて、前記キャビティの表面温度を算出する金型シミュレーション部と、
前記キャビティに射出充填される樹脂の性質を収集する樹脂条件収集部と、
前記樹脂の性質と前記キャビティ表面温度とに基づいて、前記樹脂が前記キャビティに射出されたときの樹脂の挙動を算出し、
前記樹脂の挙動に基づいてキャビティに射出された樹脂から成形される成形品の性状を算出する樹脂シミュレーション部
とを具備する射出成形シミュレーション装置。 A mold condition collecting unit for collecting a mold shape of a mold in which a cavity is formed, a heating condition for heating the mold, and a cooling condition for cooling the mold;
A mold simulation unit that calculates the surface temperature of the cavity based on the mold shape, the heating condition, and the cooling condition;
A resin condition collection unit for collecting the properties of the resin injected and filled into the cavity;
Based on the properties of the resin and the cavity surface temperature, calculate the behavior of the resin when the resin is injected into the cavity,
An injection molding simulation apparatus comprising: a resin simulation unit that calculates a property of a molded product molded from the resin injected into the cavity based on the behavior of the resin.
前記金型シミュレーション部は、前記樹脂の挙動に更に基づいて前記キャビティ表面温度を算出する
射出成形シミュレーション装置。 In claim 1,
The mold simulation unit calculates the cavity surface temperature further based on the behavior of the resin.
前記金型シミュレーション部は、前記樹脂の挙動とは独立して前記キャビティ表面温度を算出する
射出成形シミュレーション装置。 In claim 1,
The mold simulation unit calculates the cavity surface temperature independently of the behavior of the resin.
前記金型シミュレーション部は、樹脂の全量が、特定の時刻に、一瞬に充填されると樹脂充填工程をモデル化し、前記キャビティ表面温度を算出する
射出成形シミュレーション装置。 In claim 1,
An injection molding simulation device that models a resin filling process and calculates the cavity surface temperature when the entire amount of resin is filled instantaneously at a specific time.
前記金型シミュレーション部は、射出充填される樹脂の全量を複数に分割し、分割した量の各々が、それぞれ特定の時刻に、一瞬に充填されると樹脂充填工程をモデル化し、前記キャビティ表面温度を算出する
射出成形シミュレーション装置。 The mold simulation unit according to claim 1, wherein the mold simulation unit divides the total amount of the resin to be injected and filled into a plurality of parts, and each of the divided amounts is modeled as a resin filling process when being instantaneously filled at a specific time, An injection molding simulation apparatus for calculating the cavity surface temperature.
前記金型シミュレーション部は、前記キャビティの表面が変形する変形量を更に算出し、
前記樹脂シミュレーション部は、前記キャビティ表面の変形量に更に基づいて前記成形品性状を算出する
射出成形シミュレーション装置。 In any one of Claims 1-5,
The mold simulation unit further calculates a deformation amount by which the surface of the cavity is deformed,
The said resin simulation part calculates the said molded article property further based on the deformation amount of the said cavity surface Injection molding simulation apparatus.
前記樹脂シミュレーション部は、前記樹脂から前記キャビティ表面に加わる圧力分布を更に算出し、
前記金型シミュレーション部は、前記圧力分布に更に基づいて前記変形量を算出する
射出成形シミュレーション装置。 In claim 6,
The resin simulation unit further calculates a pressure distribution applied to the cavity surface from the resin,
The mold simulation unit calculates an amount of deformation based further on the pressure distribution.
前記金型形状と前記加熱条件と前記冷却条件とに基づいて、前記キャビティの表面温度を算出するステップと、
前記キャビティに射出充填される樹脂の性質を収集するステップと、
前記樹脂の性質と前記キャビティ表面温度とに基づいて、前記樹脂が前記キャビティに射出されたときの樹脂の挙動を算出し、
前記樹脂の挙動に基づいてキャビティに射出された樹脂から成形される成形品の性状を算出するステップ
とを具備する射出成形シミュレーションプログラム。 Collecting a mold shape of a mold in which a cavity is formed, a heating condition for heating the mold, and a cooling condition for cooling the mold;
Calculating a surface temperature of the cavity based on the mold shape, the heating condition, and the cooling condition;
Collecting the properties of the resin injected into the cavity;
Based on the properties of the resin and the cavity surface temperature, calculate the behavior of the resin when the resin is injected into the cavity,
An injection molding simulation program comprising: calculating properties of a molded product molded from the resin injected into the cavity based on the behavior of the resin.
前記キャビティ表面温度は、前記樹脂の挙動に更に基づいて算出される
射出成形シミュレーションプログラム。 In claim 8,
The cavity surface temperature is calculated further based on the behavior of the resin.
前記キャビティ表面温度は、前記樹脂の挙動に独立して算出される
射出成形シミュレーションプログラム。 In claim 8,
The cavity surface temperature is calculated independently of the behavior of the resin.
前記キャビティ表面温度は、樹脂の全量が、特定の時刻に、一瞬に充填されると樹脂充填工程をモデル化し、算出される
射出成形シミュレーションプログラム。 In claim 8,
The cavity surface temperature is calculated by modeling a resin filling process when the entire amount of resin is filled instantaneously at a specific time. An injection molding simulation program.
前記キャビティ表面温度は、射出充填される樹脂の全量を複数に分割し、分割した量の各々が、それぞれ特定の時刻に、一瞬に充填されると樹脂充填工程をモデル化し、算出される
射出成形シミュレーションプログラム。 9. The cavity surface temperature according to claim 8, wherein the total amount of resin to be injected and filled is divided into a plurality of parts, and each of the divided amounts is calculated by modeling a resin filling process when each is filled instantaneously at a specific time. An injection molding simulation program.
前記キャビティ表面が変形する変形量を算出するステップを更に具備し、
前記成形品形状は、前記変形量に更に基づいて算出される
射出成形シミュレーションプログラム。 In any one of Claims 8-12,
A step of calculating a deformation amount by which the cavity surface is deformed;
An injection molding simulation program, wherein the molded product shape is further calculated based on the deformation amount.
前記樹脂から前記キャビティ表面に加わる圧力分布を算出するステップを更に具備し、
前記変形量は、前記圧力分布に更に基づいて算出される
射出成形シミュレーションプログラム。 In claim 13,
Further comprising calculating a pressure distribution applied to the cavity surface from the resin;
The deformation amount is calculated further based on the pressure distribution.
前記金型形状と前記加熱条件と前記冷却条件とに基づいて、前記キャビティの表面温度を算出するステップと、
前記金型に射出充填される樹脂の性質を収集するステップと、
前記樹脂の性質と前記キャビティ表面温度とに基づいて、前記樹脂が前記キャビティに射出されたときの樹脂の挙動を算出し、
前記樹脂の挙動に基づいて、キャビティに射出された樹脂から成形される成形品の性状を算出するステップ
とを具備する射出成形シミュレーション方法。 Collecting a mold shape of a mold in which a cavity is formed, a heating condition for heating the mold, and a cooling condition for cooling the mold;
Calculating a surface temperature of the cavity based on the mold shape, the heating condition, and the cooling condition;
Collecting the properties of the resin injected and filled into the mold;
Based on the properties of the resin and the cavity surface temperature, calculate the behavior of the resin when the resin is injected into the cavity,
Calculating the properties of a molded product molded from the resin injected into the cavity based on the behavior of the resin.
前記キャビティ表面温度は、前記樹脂の挙動に更に基づいて算出される
射出成形シミュレーション方法。 In claim 15,
The cavity surface temperature is calculated further based on the behavior of the resin.
前記キャビティ表面温度は、前記樹脂の挙動に独立して算出される
射出成形シミュレーション方法。 In claim 15,
The cavity surface temperature is calculated independently of the behavior of the resin.
前記キャビティ表面温度は、樹脂の全量が、特定の時刻に、一瞬に充填されると樹脂充填工程をモデル化し、算出される
射出成形シミュレーション方法。 In claim 15,
The cavity surface temperature is calculated by modeling a resin filling process when the entire amount of resin is filled instantaneously at a specific time. Injection molding simulation method.
前記キャビティ表面温度は、射出充填される樹脂の全量を複数に分割し、分割した量の各々が、それぞれ特定の時刻に、一瞬に充填されると樹脂充填工程をモデル化し、算出される
射出成形シミュレーション方法。 16. The cavity surface temperature according to claim 15, wherein the total amount of resin to be injected and filled is divided into a plurality of parts, and each of the divided quantities is instantaneously filled at a specific time, modeling the resin filling process. An injection molding simulation method.
前記キャビティ表面が変形する変形量を算出するステップを更に具備し、
前記成形品形状は、前記変形量に更に基づいて算出される
射出成形シミュレーション方法。 In any one of Claims 15-19,
A step of calculating a deformation amount by which the cavity surface is deformed;
An injection molding simulation method, wherein the molded product shape is further calculated based on the deformation amount.
前記樹脂から前記キャビティ表面に加わる圧力分布を算出するステップを更に具備し、
前記変形量は、前記圧力分布に更に基づいて算出される
射出成形シミュレーション方法。 In claim 20,
Further comprising calculating a pressure distribution applied to the cavity surface from the resin;
The deformation amount is calculated further based on the pressure distribution.
前記成形品形状が不適切であるときに、前記金型形状を変更するステップと、
前記成形品形状が適切であるときに、前記金型形状を満足する本物の金型を製造するステップ
とを具備する金型製造方法。 Executing the injection molding simulation method according to any one of claims 15 to 21;
Changing the shape of the mold when the shape of the molded product is inappropriate;
A mold manufacturing method comprising: manufacturing a genuine mold that satisfies the mold shape when the shape of the molded product is appropriate.
前記成形品形状が不適切であるときに、前記加熱条件と前記冷却条件とを変更するステップと、
前記成形品形状が適切であるときに、前記金型形状を満足する本物の金型を用いて前記加熱条件と前記冷却条件とを満足するように射出成形するステップ
とを具備する射出成形方法。 Executing the injection molding simulation method according to any one of claims 15 to 21;
When the shape of the molded product is inappropriate, changing the heating condition and the cooling condition;
An injection molding method comprising: performing injection molding so as to satisfy the heating condition and the cooling condition using a real mold satisfying the mold shape when the shape of the molded product is appropriate.
前記金型形状と前記加熱条件と前記冷却条件とに基づいて、前記キャビティの非定常なキャビティ表面温度を算出する金型シミュレーション部と、 A mold simulation unit that calculates an unsteady cavity surface temperature of the cavity based on the mold shape, the heating condition, and the cooling condition;
前記キャビティに射出充填される樹脂の性質を収集する樹脂条件収集部と、 A resin condition collection unit for collecting the properties of the resin injected and filled into the cavity;
前記樹脂の性質と前記キャビティの非定常なキャビティ表面温度とに基づいて、前記樹脂が前記キャビティに射出されたときの樹脂の挙動を算出し、 Based on the properties of the resin and the unsteady cavity surface temperature of the cavity, calculate the behavior of the resin when the resin is injected into the cavity,
前記樹脂の挙動に基づいてキャビティに射出された樹脂から成形される成形品の性状を算出する樹脂シミュレーション部とA resin simulation unit for calculating the properties of a molded product molded from the resin injected into the cavity based on the behavior of the resin;
を具備する射出成形シミュレーション装置。 An injection molding simulation apparatus comprising:
前記金型シミュレーション部は、前記樹脂の挙動に更に基づいて前記キャビティ表面温度を算出する The mold simulation unit calculates the cavity surface temperature further based on the behavior of the resin.
射出成形シミュレーション装置。 Injection molding simulation device.
前記金型シミュレーション部は、前記樹脂の挙動とは独立して前記キャビティ表面温度を算出する The mold simulation unit calculates the cavity surface temperature independently of the behavior of the resin.
射出成形シミュレーション装置。 Injection molding simulation device.
前記金型シミュレーション部は、前記キャビティの表面が変形する変形量を更に算出し、 The mold simulation unit further calculates a deformation amount by which the surface of the cavity is deformed,
前記樹脂シミュレーション部は、前記キャビティ表面の変形量に基づいて前記成形品性状を算出する The resin simulation unit calculates the properties of the molded product based on the deformation amount of the cavity surface.
射出成形シミュレーション装置。 Injection molding simulation device.
前記樹脂シミュレーション部は、前記樹脂から前記キャビティ表面に加わる圧力分布を更に算出し、 The resin simulation unit further calculates a pressure distribution applied to the cavity surface from the resin,
前記金型シミュレーション部は、前記圧力分布に更に基づいて前記変形量を算出する The mold simulation unit calculates the deformation amount further based on the pressure distribution.
射出成形シミュレーション装置。 Injection molding simulation device.
前記金型形状と前記加熱条件と前記冷却条件とに基づいて、前記キャビティの非定常な表面温度を算出するステップと、 Calculating an unsteady surface temperature of the cavity based on the mold shape, the heating condition, and the cooling condition;
前記キャビティに射出充填される樹脂の性質を収集するステップと、 Collecting the properties of the resin injected into the cavity;
前記樹脂の性質と前記キャビティの非定常なキャビティ表面温度とに基づいて、前記樹脂が前記キャビティに射出されたときの樹脂の挙動を算出し、 Based on the properties of the resin and the unsteady cavity surface temperature of the cavity, calculate the behavior of the resin when the resin is injected into the cavity,
前記樹脂の挙動に基づいてキャビティに射出された樹脂から成形される成形品の性状を算出するステップとCalculating the properties of a molded product molded from the resin injected into the cavity based on the behavior of the resin;
を具備する射出成形シミュレーションプログラム。 An injection molding simulation program comprising:
前記キャビティ表面温度は、前記樹脂の挙動に更に基づいて算出される The cavity surface temperature is calculated further based on the behavior of the resin.
射出成形シミュレーションプログラム。 Injection molding simulation program.
前記キャビティ表面温度は、前記樹脂の挙動に独立して算出される The cavity surface temperature is calculated independently of the behavior of the resin.
射出成形シミュレーションプログラム。 Injection molding simulation program.
前記金型形状と前記加熱条件と前記冷却条件とに基づいて、前記キャビティの非定常な表面温度を算出するステップと、 Calculating an unsteady surface temperature of the cavity based on the mold shape, the heating condition, and the cooling condition;
前記金型に射出充填される樹脂の性質を収集するステップと、 Collecting the properties of the resin injected and filled into the mold;
前記樹脂の性質と前記キャビティの非定常なキャビティ表面温度とに基づいて、前記樹脂が前記キャビティに射出されたときの樹脂の挙動を算出し、 Based on the properties of the resin and the unsteady cavity surface temperature of the cavity, calculate the behavior of the resin when the resin is injected into the cavity,
前記樹脂の挙動に基づいて、キャビティに射出された樹脂から成形される成形品の性状を算出するステップとCalculating the properties of a molded product molded from the resin injected into the cavity based on the behavior of the resin;
を具備する射出成形シミュレーション方法。 An injection molding simulation method comprising:
前記キャビティ表面温度は、前記樹脂の挙動に更に基づいて算出される The cavity surface temperature is calculated further based on the behavior of the resin.
射出成形シミュレーション方法。 Injection molding simulation method.
前記キャビティ表面温度は、前記樹脂の挙動に独立して算出される The cavity surface temperature is calculated independently of the behavior of the resin.
射出成形シミュレーション方法。 Injection molding simulation method.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004366716A JP4716484B2 (en) | 2004-12-17 | 2004-12-17 | Injection molding simulation apparatus and injection molding simulation method |
KR1020077013522A KR100886992B1 (en) | 2004-12-17 | 2005-12-15 | Injection molding simulation apparatus and method of injection molding simulation |
PCT/JP2005/023077 WO2006064885A1 (en) | 2004-12-17 | 2005-12-15 | Injection molding simulation apparatus and method of injection molding simulation |
CNB2005800434866A CN100535908C (en) | 2004-12-17 | 2005-12-15 | Injection molding simulation apparatus and method of injection molding simulation |
TW094144960A TW200626344A (en) | 2004-12-17 | 2005-12-16 | Simulation device for injection molding and simulation method for injection molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2004366716A JP4716484B2 (en) | 2004-12-17 | 2004-12-17 | Injection molding simulation apparatus and injection molding simulation method |
Publications (3)
Publication Number | Publication Date |
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JP2006168280A JP2006168280A (en) | 2006-06-29 |
JP2006168280A5 true JP2006168280A5 (en) | 2008-02-21 |
JP4716484B2 JP4716484B2 (en) | 2011-07-06 |
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JP2004366716A Active JP4716484B2 (en) | 2004-12-17 | 2004-12-17 | Injection molding simulation apparatus and injection molding simulation method |
Country Status (5)
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JP (1) | JP4716484B2 (en) |
KR (1) | KR100886992B1 (en) |
CN (1) | CN100535908C (en) |
TW (1) | TW200626344A (en) |
WO (1) | WO2006064885A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5349859B2 (en) * | 2008-07-31 | 2013-11-20 | キヤノン株式会社 | Molded product shape prediction method, molded product manufacturing method, molded product shape prediction program and storage medium thereof |
KR101052263B1 (en) * | 2008-12-26 | 2011-07-27 | 주식회사 포스코 | Design Method of Hot Press Mold |
US8682620B2 (en) | 2010-11-19 | 2014-03-25 | The Procter And Gamble Company | Method for designing extrusion dies |
CN102974703B (en) * | 2012-11-29 | 2015-03-18 | 机械科学研究总院先进制造技术研究中心 | Experimental apparatus for simulating cooling system of mold |
TWI571374B (en) * | 2014-01-14 | 2017-02-21 | 中原大學 | System of intelligence injection molding and method thereof |
TWI571375B (en) * | 2014-01-14 | 2017-02-21 | 中原大學 | System of intelligence injection molding and method thereof |
FR3017473B1 (en) * | 2014-02-12 | 2016-03-04 | Faurecia Bloc Avant | ESTIMATION OF A SIZE RELATING TO A PROCESS FOR MANUFACTURING A PIECE BY INJECTING MATERIAL |
US9216532B2 (en) * | 2014-02-14 | 2015-12-22 | GM Global Technology Operations LLC | Injection mold assembly |
CN105374267A (en) * | 2015-12-09 | 2016-03-02 | 天津天堰科技股份有限公司 | Infant's fontanel simulating device |
KR101868131B1 (en) * | 2016-09-23 | 2018-06-18 | 주식회사 서연이화 | Method of optimizing door trim injection molding processing |
CN112140413B (en) * | 2020-09-02 | 2022-04-08 | 金发科技股份有限公司 | Method and system for predicting die sinking shrinkage rate of plastic part |
JP2022052082A (en) * | 2020-09-23 | 2022-04-04 | 株式会社日立製作所 | Injection molding system and support method for setting injection molding machine |
Family Cites Families (5)
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JP2540233B2 (en) * | 1990-08-21 | 1996-10-02 | 積水化学工業株式会社 | Integrated mold analysis system |
JPH10278085A (en) * | 1997-04-08 | 1998-10-20 | Canon Inc | Device and method for estimating temperature history in injection molding process |
JPH10278089A (en) * | 1997-04-10 | 1998-10-20 | Canon Inc | Method and device for simulation of injection molding process |
JP2000289076A (en) * | 1999-04-02 | 2000-10-17 | Plamedia Research Corp | Method for simulating resin molding |
JP4330404B2 (en) * | 2002-08-27 | 2009-09-16 | 東レエンジニアリング株式会社 | Molded product design support apparatus, design support method, and software |
-
2004
- 2004-12-17 JP JP2004366716A patent/JP4716484B2/en active Active
-
2005
- 2005-12-15 WO PCT/JP2005/023077 patent/WO2006064885A1/en not_active Application Discontinuation
- 2005-12-15 CN CNB2005800434866A patent/CN100535908C/en active Active
- 2005-12-15 KR KR1020077013522A patent/KR100886992B1/en active IP Right Grant
- 2005-12-16 TW TW094144960A patent/TW200626344A/en unknown
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