JP2006150206A - Functional membrane forming apparatus and functional membrane forming method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a functional membrane forming apparatus which forms a predetermined membrane each having uniform thickness on a plurality of substrates with high production efficiency. <P>SOLUTION: The functional membrane forming apparatus conducts a treatment to impart a wetting property in a surface treatment apparatus 102 on each surface of the substrates placed on a pallet which is carried by a belt conveyor BC driven by a drive device 114 in accordance with a signal from a controlling device 112. Next, an orientation membrane material is applied on each of a plurality of substrates in a film solution applicator 104 and the time from a point to initiate the application of the orientation material to the substrate is measured. Next, the pallet that places the substrate applied by an orientation membrane material in a predetermined time from a point to initiate the application of the orientation membrane material is carried to a drying device 106 via the belt conveyor BC. In the drying device 106, the temporary drying of the orientation membrane material which has been applied on the substrate is conducted. The substrate is calcined in a calcining device 108 to form the orientation membrane. Then, the orientation membrane is subjected to a rubbing treatment in a rubbing device 110. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a functional film forming apparatus and a functional film forming method for forming a functional film on a substrate.

  Conventionally, functional films, such as alignment films of liquid crystal display devices, are formed by applying a material (alignment film material) that uniformly forms an alignment film on a substrate and drying the applied alignment film material. ing. Here, since the film unevenness may occur when forming the alignment film and the like, and the film thickness of the alignment film may become non-uniform, various apparatuses and methods for preventing the film unevenness have been proposed. Yes.

  For example, after the alignment film material is applied on the substrate, before the applied alignment film material is dried, for example, when the alignment film material is naturally dried during transport of the substrate, the thickness of the alignment film formed is A drying apparatus for preventing non-uniformity is disclosed in Patent Document 1. According to the drying apparatus described in Patent Document 1, after the substrate is held on the stage and the alignment film material is applied, an airtight space is formed by covering the stage with the substrate held thereon with a drying cover, The substrate is dried by reducing the pressure in the hermetic space.

  Also, a cleaning machine that cleans the substrate, a UV irradiation device that performs processing to improve the hydrophilicity of the substrate (for example, processing that irradiates the substrate with ultraviolet rays), a droplet discharge device that applies alignment film material to the substrate, and a substrate drying Patent Document 2 discloses a manufacturing apparatus in which a drying furnace and a rubbing apparatus for rubbing an alignment film formed on a substrate are continuously arranged as one forming line.

JP 2003-262464 A JP 2003-75795 A

  By the way, when a functional film is formed on a large substrate, for example, a large substrate of 370 × 470 mm or more, the above-described drying apparatus described in Patent Document 1 and the manufacturing apparatus described in Patent Document 2 are effective. However, there is a problem that it is not suitable for processing on a small substrate. For example, when a predetermined film (for example, an alignment film) is formed on a small substrate of about 15 × 25 to 30 mm, in the above-described drying apparatus described in Patent Document 1, alignment is performed for each substrate. Since processing such as application of the film material and drying of the applied alignment film material is performed, production efficiency cannot be improved.

  On the other hand, when a plurality of small substrates are processed together, a film-forming solution containing a material for forming a predetermined film, for example, an alignment film material is applied to the first substrate among the plurality of substrates. A predetermined time is required from application to the last substrate. Therefore, during the process of applying the alignment film material to each of the plurality of substrates, the substrate on which the alignment film material is first applied is naturally dried, and the thickness of the formed alignment film is not good. May be uniform.

  An object of the present invention is to provide a functional film forming apparatus and a functional film forming method capable of forming a predetermined film having a uniform film thickness on each of a plurality of substrates with high production efficiency. .

  A functional film forming apparatus according to the present invention includes a film forming solution applying apparatus that applies a film forming solution for forming a predetermined film on a substrate, and a film forming solution that is applied to each of the substrates by combining a plurality of the substrates. In a functional film forming apparatus, comprising: a drying device for drying; and a transport device that transports the substrate coated with the film forming solution to the drying device in the film forming solution coating device. Among the substrates, the substrate is first coated with the film-forming solution, and includes time management means for managing the time from the start of applying the film-forming solution, and the transfer device includes the time The substrate is transported to the drying device within a predetermined time managed by a management means.

  According to this functional film forming apparatus, the time from the start of applying the film forming solution to the substrate on which the film forming solution is first applied among the plurality of substrates to be dried by the drying apparatus is managed, The substrate on which the film-forming solution has been applied within a predetermined time is conveyed to a drying device. That is, before the natural drying proceeds to the extent that drying unevenness occurs on a plurality of substrates to be dried by a drying apparatus, for example, a first substrate on which a film forming solution is first applied among small substrates, the film forming solution A plurality of small substrates coated with can be collectively conveyed to a drying apparatus. Therefore, by controlling the time during which the film forming solution is applied, a high-quality functional film having a uniform film thickness can be efficiently formed with high accuracy.

  In the functional film forming apparatus according to the present invention, the predetermined time includes the kind of the film forming solution applied to the substrate, and the temperature, humidity and at least in the processing chamber in which the film forming solution applying apparatus is installed. It is preset based on any one of the atmospheric pressures.

  According to this functional film forming apparatus, the predetermined time is set based on the type of the film forming solution and at least one of temperature, humidity, and atmospheric pressure in the processing chamber. Therefore, an appropriate predetermined time can be set based on the type of the functional film to be formed and the environment in the processing chamber in which the functional film forming apparatus is installed.

  The functional film forming apparatus according to the present invention is characterized in that the film forming solution coating apparatus is an ink jet type droplet discharge apparatus. According to this functional film forming apparatus, the film forming solution is applied onto the substrate by the ink jet type droplet discharge apparatus. That is, since the film forming solution can be applied quickly and accurately on the substrate, the productivity in the functional film forming apparatus can be appropriately improved.

  Further, the functional film forming apparatus according to the present invention is characterized in that the film forming solution applying apparatus arranges the plurality of substrates and applies the film forming solution. According to this functional film forming apparatus, for example, a plurality of small substrates can be arranged on a pallet and a film forming solution can be efficiently applied, so that productivity in the functional film forming apparatus is appropriately improved. Can be made.

  Further, the functional film forming method according to the present invention includes a film forming solution applying step for applying a film forming solution for forming a predetermined film on a substrate, and the film forming solution for the substrate in the film forming solution applying step. A time management process for managing the time from the start of coating, and a transport process for transporting the film-forming solution applied to the substrate within a predetermined time managed in the time management process to a drying device And a drying step of drying the film-forming solution applied to the substrate transported by the transporting step.

  In the functional film forming method according to the present invention, the plurality of substrates are dried together in the drying step, and the film forming solution is first applied among the substrates to be dried in the time management step. A time period from the start of application of the film forming solution to the substrate is managed.

  According to these functional film forming methods, the film forming solution is applied to the substrate coated with the film forming solution within a predetermined time, for example, the substrate to be dried in the drying apparatus, to the substrate coated with the film forming solution first. The time from the start of application is controlled, and a plurality of film-forming solutions are applied before natural drying proceeds to the extent that drying unevenness occurs on the first substrate on which the film-forming solution is first applied. The substrates are collectively transported to the drying device. Therefore, by controlling the time during which the film forming solution is applied, a high-quality functional film having a uniform film thickness can be efficiently formed with high accuracy.

  In the functional film forming method according to the present invention, the predetermined time includes the kind of the film forming solution applied to the substrate, and at least the temperature, humidity, and pressure in the processing chamber in which the film forming solution is applied to the substrate. It is set based on any one of these.

  According to this functional film forming method, the predetermined time is set based on the type of the film forming solution and at least one of temperature, humidity, and atmospheric pressure in the processing chamber. Therefore, an appropriate predetermined time can be set based on the type of the functional film to be formed and the environment in the processing chamber in which the functional film is formed.

  The functional film forming method according to the present invention is characterized in that the film forming solution applying step includes a step of applying the film forming solution to the substrate using an ink jet type droplet discharge device. According to this functional film forming method, an ink jet type droplet discharge device is used as a film forming solution coating device. Therefore, the film forming solution can be applied quickly and accurately to each of the plurality of substrates, and the film forming solution can be efficiently applied to each of the plurality of substrates. Can be formed.

  A functional film forming apparatus according to an embodiment of the present invention will be described below with reference to the drawings. In the following, a case where an alignment film of a liquid crystal display device is formed in the functional film forming apparatus according to the embodiment of the present invention will be described as an example.

  FIG. 1 is a diagram showing an example of a functional film forming apparatus (functional film forming line) according to an embodiment of the present invention. As shown in FIG. 1, a functional film forming line 100 includes a surface treatment apparatus 102, a film forming solution coating apparatus 104, a drying apparatus 106, a baking apparatus 108, a rubbing apparatus 110, a belt conveyor BC connecting each apparatus, and a belt conveyor. A driving device 114 that drives BC and a control device 112 that controls the entire functional film forming line 100 are configured. Further, the surface treatment device 102, the film forming solution coating device 104, the drying device 106, the baking device 108, and the rubbing device 110 are arranged in a line at a predetermined interval along the belt conveyor BC. The control device 112 is connected to the surface treatment device 102, the film forming solution coating device 104, the drying device 106, the baking device 108, the rubbing device 110, and the driving device 114. The driving device 114 drives the belt conveyor BC based on a control signal from the control device 112, and treats the substrate to be processed as a surface processing device 102, a film forming solution coating device 104, a drying device 106, a baking device 108, and a rubbing device 110. Transport to. In the surface treatment apparatus 102, a treatment for imparting wettability (lyophilicity) to the surface of the substrate is performed, and in the film formation solution coating apparatus 104, a film formation solution for forming a predetermined film on the substrate, that is, A process of applying an alignment film material for forming the alignment film is performed, and the drying apparatus 106 performs a process of drying the applied alignment film material. Further, the baking apparatus 108 performs a process for baking the dried alignment film material, and the rubbing apparatus 110 performs a rubbing process for the formed alignment film. In the functional film forming line 100, an ink jet type droplet discharge device is used as the film forming solution applying device 104.

  FIG. 2 is a diagram schematically showing the configuration of an ink jet type droplet discharge device 104 used as a droplet discharge device according to an embodiment of the present invention. The droplet discharge device 104 includes a base 31, a pallet moving unit 32, a head moving unit 33, a droplet discharge head 34, a liquid supply unit 35, a control device 40, and the like. As shown in FIG. 2, the base 31 is provided with a pallet moving means 32 for moving the pallet 50 on which a plurality of substrates P are placed, and a head moving means 33 for moving the droplet discharge head 34.

  As shown in FIG. 2, the pallet moving means 32 has a guide rail 36 disposed on the base 31 along the Y-axis direction. The pallet moving means 32 is configured to move the slider 37 along the guide rail 36 by, for example, a linear motor (not shown). A stage 39 that holds a pallet 50 on which a plurality of substrates P are placed is fixed on the slider 37. The stage 39 has a known suction holding means (not shown), and the suction holding means is operated to suck and hold the pallet 50 on which the plurality of substrates P are placed on the stage 39. The pallet 50 on which the plurality of substrates P are placed is accurately positioned and held at a predetermined position on the stage 39 by, for example, positioning pins (not shown) of the stage 39. 2 shows a case where the pallet 50 on which a plurality of substrates P are placed is held at a predetermined position on the stage 39, but one substrate of a predetermined size is held on the stage 39. You may be made to do.

  The head moving means 33 includes a pair of mounts 33a and 33a standing on the rear side of the base 31, and a travel path 33b provided on the mounts 33a and 33a. The travel path 33b is arranged in the X-axis direction. That is, they are arranged along a direction perpendicular to the Y-axis direction, which is the moving direction of the pallet 50 in the pallet moving means 32 described above. The travel path 33b is formed by a holding plate 33c passed between the gantry 33a and 33a and a pair of guide rails 33d and 33d provided on the holding plate 33c. The length of the guide rails 33d and 33d is as follows. A carriage 42 on which the droplet discharge head 34 is mounted is movably held in the direction. The carriage 42 is configured to run on the guide rails 33d and 33d by the operation of a linear motor (not shown) or the like, thereby moving the droplet discharge head 34 in the X-axis direction. The carriage 42 is movable in the length direction of the guide rails 33d, 33d, that is, in the X-axis direction, for example, in units of 1 μm. Such movement is controlled by the control device 40.

  The droplet discharge head 34 is rotatably attached to the carriage 42 via an attachment portion 43. The mounting portion 43 is provided with a motor 44. The droplet discharge head 34 has a support shaft (not shown) connected to the motor 44, and the droplet discharge head 34 can rotate in the circumferential direction. Yes. Further, the motor 44 is also connected to the control device 40, and thereby the rotation of the droplet discharge head 34 in the circumferential direction is controlled by the control device 40.

  The droplet discharge head 34 has a substantially rectangular bottom shape, and is arranged in a rectangular shape with nozzles N (nozzle holes 18) aligned vertically and horizontally as shown in FIG. In addition, each nozzle N (nozzle hole 18) is provided with a piezoelectric element (not shown) independently, and its discharge operation and the like are performed independently.

  The liquid supply means 35 includes a liquid supply source (tank) 45 that supplies the alignment film material to the droplet discharge head 34 and a liquid supply tube 46 that supplies the liquid from the liquid supply source 45 to the droplet discharge head 34. It is configured. The control device 40 is configured by a computer or the like. The position information of the droplet discharge head 34, that is, the position (X coordinate) of the droplet discharge head 34 on the guide rails 33d and 33d and the position of each nozzle at that time. (X coordinate) is detected, and the detected position is stored. Further, based on the position of each nozzle stored in the control device 40, control is performed to cause each nozzle to perform a normal discharge operation or the like.

  Further, in the film forming solution applying apparatus 104, the time from the start of applying the alignment film material to the substrate P on the pallet 50 held on the stage 39 is determined by the control device (time management means) 40. It is managed. That is, the alignment film material applied to the substrate P is not allowed to become non-uniform even if it is allowed to stand for a predetermined time and then naturally dried after being applied. It is known that the film thickness becomes non-uniform when natural drying proceeds.

  Here, in the film forming solution coating apparatus 104, the alignment film material is applied to each of a plurality of substrates P placed on the pallet 50, for example, small substrates P having a size of about 15 × 30 mm. The Accordingly, all of the substrates placed on the pallet 50 within a predetermined time from the start of the application of the alignment film material to the first substrate P among the plurality of substrates placed on the pallet 50. It is necessary to apply an alignment film material to the substrate P. In addition, within a predetermined time from the start of the application of the alignment film material to the first substrate P among the plurality of substrates placed on the first pallet 50, When the alignment film material is applied to all of the substrates P placed on the substrate P, the first pallet 50 and the second pallet 50 are transported to the drying device 106 together. An alignment film can be efficiently formed by simultaneously performing the drying process on the substrates P respectively placed on the two pallets 50 in the drying device 106. Therefore, the control device 40 manages the time from the start of the application of the alignment film material to the first substrate P among the plurality of substrates placed on the pallet 50, thereby providing a predetermined time. The substrate P on which the alignment film material is applied is conveyed to the drying device 106.

  FIG. 4 is a diagram illustrating an example of a pallet on which a substrate to be processed is placed. On the pallet 50, as shown in FIG. 4, a plurality of substrates P, for example, a substrate P having a size of about 15 × 30 mm, is arranged in a total of 30 pieces, 6 in the vertical direction and 5 in the horizontal direction. Yes. Between each board | substrate P, it is about 1-2 mm in the vertical direction, and is about 10-20 mm in the horizontal direction. In addition, a recess for placing each substrate P is formed on the pallet 50, and by placing the substrate P in the recess, the substrate P is placed without shifting the position on the pallet 50. The The depth of the concave portion in which the substrate P is disposed is about the thickness of the substrate minus 0.1 mm. For example, if the thickness of the substrate is 0.3 mm, the depth of the concave portion is 0.2 mm. Is 0.7 mm, the depth of the recess is 0.6 mm. The pallet 50 is formed of a conductor such as aluminum. Note that the number of substrates P placed on the pallet 50 is determined based on the size of the substrate P, the processing capability of the film forming solution coating apparatus 104, and the like.

  Here, for example, an alignment film material in which a solid polyimide is dissolved in a solvent such as γ-butyl lactone, butyl cellosolve and N-methylpyrrolidone is applied to a 15 × 30 mm substrate, It is assumed that the substrate is left in a processing room (for example, a room where a functional film forming line is installed) under a temperature of -25 degrees, a humidity of 40-60%, and a normal atmospheric pressure. In this case, it has been confirmed in advance by experiments or the like that an alignment film having a uniform thickness can be obtained even if it is left for 4 minutes to less than 5 minutes, for example, about 4 minutes 30 seconds. Accordingly, in the film forming solution coating apparatus 104, 4 minutes 30 seconds is set in advance as the predetermined time, and 4 minutes 30 from the time when the application of the alignment film material to the substrate P placed on the pallet 50 is started. The substrate P on which the alignment film material is applied in a second, that is, the pallet 50 on which the substrate P is placed is delivered to the belt conveyor BC. Then, the pallet 50 delivered to the belt conveyor BC is conveyed to the drying device 106. For example, when the application of the alignment film material to all the substrates P placed on each of the three pallets 50 is completed within 4 minutes and 30 seconds, the three pallets 50 are dried by the belt conveyor BC. It is conveyed to the device 106.

  Hereinafter, processing performed on the substrate P in each apparatus configuring the functional film forming line 100 will be described with reference to the drawings. First, the surface treatment apparatus 102 performs a process of imparting wettability (lyophilicity) to the surface of the substrate, for example, the substrate P on which the segment electrodes are formed (step S10, see the flowchart of FIG. 5). That is, the pallet 50 conveyed by the belt conveyor BC is taken into the surface treatment apparatus 102 and a process for imparting wettability to the substrate P is performed. For example, when a plasma processing apparatus is used as the surface processing apparatus 102, a pallet 50 on which a plurality of substrates P are placed is inserted between the electrodes, and the electrode and pallet disposed above the pallet 50 By generating a plasma by discharging between the substrate 50 and the substrate P, the substrate P placed on the pallet 50 is subjected to plasma treatment to impart wettability. For example, when a corona generator is used as the surface treatment device 102, the substrate P is passed by passing the space in the corona generator in which corona discharge is performed through the pallet 50 on which the substrate P is placed. The substrate P may be subjected to atmospheric pressure plasma treatment to impart wettability. Note that the pallet 50 on which the substrate P that has been subjected to a process for imparting wettability is placed is transported to the film forming solution coating apparatus 104 by the belt conveyor BC.

  Next, in the film formation solution coating apparatus 104, an alignment film material for forming an alignment film is applied to the substrate P (step S11). That is, the pallet 50 conveyed from the surface treatment apparatus 102 via the belt conveyor BC is held on the stage 39 and taken into the film forming solution coating apparatus 104. In the film-forming solution coating apparatus 104, a droplet discharge head based on the control of the alignment film material obtained by dissolving the material for forming the alignment film accommodated in the liquid supply source 45 in a predetermined solvent is controlled by the control device 40. It is discharged onto the surface of the substrate P via 34 and applied to each of the substrates P placed on the pallet 50.

  FIG. 6 is a view for explaining the process of applying the alignment film material to each of the substrates P placed on the pallet 50. In the film-forming solution coating apparatus 104, the alignment film material is sequentially applied to each substrate P as shown by arrows in FIG. At this time, the control device 40 of the film formation solution coating apparatus 104 measures the time from the start of the application of the alignment film material to the substrate P arranged on the upper left side of the pallet 50 in FIG. Is done.

  Here, for example, a predetermined time of 4 minutes 30 seconds is preset in the film forming solution coating apparatus 104, and the time required for applying the alignment film material to one substrate P is about 3 seconds. Assume that 30 substrates P are placed as shown in FIGS. In this case, the time required for applying the alignment film material to all the substrates P placed on one pallet 50 is 90 seconds, that is, 1 minute 30 seconds. Therefore, the alignment film material can be applied to each of the substrates P placed on each of the three pallets 50 within 4 minutes and 30 seconds. Therefore, in the film formation solution coating apparatus 104, the pallet 50 on which the substrate P coated with the alignment film material is placed within 4 minutes 30 seconds set as the predetermined time is delivered to the belt conveyor BC. Then, the delivered pallet 50 is conveyed to the drying device 106 by the belt conveyor BC.

  Next, the drying device 106 performs a process of drying the alignment film material applied to the surface of the substrate P (step S12). That is, the pallet 50 conveyed to the drying device 106 by the belt conveyor BC is taken. Here, for example, when a plurality of pallets 50 are conveyed, each pallet 50 is taken into the drying device 106. And in the drying apparatus 106, the some board | substrate P mounted on each pallet 50 is temporarily dried at 60-100 degreeC, for example. In addition, after the applied alignment film material is temporarily dried, the pallets 50 on which the plurality of substrates P are placed are respectively transferred to the belt conveyor BC and conveyed to the baking apparatus 108 by the belt conveyor BC.

  Next, a process of baking the alignment film material that has been temporarily dried is performed (step S13). That is, the pallet 50 conveyed to the baking apparatus 108 by the belt conveyor BC is taken into the baking apparatus 108, and the plurality of substrates P placed on the pallet 50 are baked at 180 to 250 ° C., for example. In addition, after baking is performed and the alignment film is formed, the pallets 50 on which the plurality of substrates P are placed are respectively transferred to the belt conveyor BC and conveyed to the rubbing device 110 by the belt conveyor BC.

  Next, a process of rubbing the alignment film formed on the substrate is performed (step S14). That is, each pallet 50 conveyed to the rubbing device 110 by the belt conveyor BC is taken into the rubbing device 110, and the alignment film formed on the substrate P placed on each pallet 50 is, for example, a cloth. A rubbing process is performed by rubbing using. After the rubbing process is performed on the alignment film, the pallets 50 on which the plurality of substrates P are placed are respectively transferred to the belt conveyor BC, and are stored in a substrate storage cassette (not shown) or the like by the belt conveyor BC. Further, the substrate P accommodated in a substrate accommodation cassette or the like (not shown) is bonded to another substrate on which a color filter, a black matrix, an overcoat film, a common electrode, and an alignment film are formed in an assembly apparatus (not shown). A liquid crystal display device is manufactured by injecting liquid crystal between the substrate P and another substrate.

  According to the functional film forming apparatus according to the embodiment of the present invention, the time from the start of the application of the alignment film material to the substrate is managed in the film forming solution applying apparatus. That is, by managing the time during which the alignment film material is applied, the alignment film material is applied within a predetermined time from the start of the application of the alignment film material to the first substrate of the plurality of substrates. The substrates can be transported together to the drying apparatus. Therefore, the drying process can be simultaneously performed on the substrate on which the alignment film material is applied within a predetermined time from the start of the application of the alignment film material to the first substrate. Therefore, an alignment film can be efficiently formed on a small substrate, and productivity when forming the alignment film can be appropriately improved.

  Further, according to the functional film forming apparatus according to the embodiment of the present invention, for example, an alignment film material in which a solid polyimide is dissolved in a solvent such as γ-butyl lactone, butyl cellosolve, and N-methylpyrrolidone. When the coated substrate is left in a processing chamber having a predetermined temperature, humidity, and pressure, 4 minutes 30 seconds, which is confirmed in advance by experiments, is set as the predetermined time. That is, the predetermined time can be set based on the type of the film forming solution, the composition of the film forming solution (for example, the type and composition of the solvent), and the environment (temperature, humidity, and pressure) in the processing chamber. Therefore, since a time during which a film with a uniform film thickness can be reliably formed is set as the predetermined time, a film with a uniform film thickness can be formed with high accuracy.

  Moreover, according to the functional film forming apparatus which concerns on embodiment of this invention, the pallet which mounted the board | substrate with which the film-forming solution was apply | coated within predetermined time is conveyed to the drying apparatus. Therefore, a functional film having a uniform film thickness with high accuracy can be formed on a large number of small substrates, and a functional film can be formed on a small substrate with high production efficiency.

  In the functional film forming apparatus according to the above-described embodiment, the case where the alignment film of the liquid crystal display device is formed has been described as an example. You may make it use for. For example, you may make it use in formation processes, such as a color filter, overcoat, organic EL, and a semiconductor element.

  In the functional film forming apparatus according to the above-described embodiment, the film forming solution is applied to the plurality of substrates placed on the plate in the film forming solution applying apparatus. A single substrate having a size may be held and a film forming solution may be applied to the substrate. In this case, for example, the time from the start of applying the film forming solution to the substrate on which the film forming solution is first applied among the plurality of substrates to be dried by the drying apparatus is managed. And you may make it dry the board | substrate with which the film-forming solution was apply | coated at predetermined time to a drying apparatus collectively.

It is a figure which shows an example of the functional film formation line which concerns on embodiment. It is a figure which shows the outline of a structure of the droplet discharge apparatus which concerns on embodiment. It is the schematic of the nozzle which concerns on embodiment. It is a figure which shows an example of the board | substrate mounted on the pallet which concerns on embodiment. 6 is a flowchart illustrating a process for manufacturing the liquid crystal display device according to the embodiment. It is a figure for demonstrating the process which apply | coats the alignment film material which concerns on embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 50 ... Pallet, 100 ... Functional film formation line, 102 ... Surface treatment apparatus, 104 ... Deposition solution coating apparatus, 106 ... Drying apparatus, 108 ... Baking apparatus, 110 ... Rubbing apparatus, 112 ... Control apparatus, 114 ... Drive apparatus , P: substrate.

Claims (8)

A film forming solution applying apparatus for applying a film forming solution for forming a predetermined film on the substrate;
A drying apparatus for drying the film-forming solution applied to each of the substrates by collecting a plurality of the substrates;
In the functional film forming apparatus, comprising: a transporting device that transports the substrate coated with the film forming solution to the drying device in the film forming solution coating device;
Time management means for managing the time from the start of applying the film forming solution to the substrate on which the film forming solution is first applied among the plurality of substrates to be dried by the drying apparatus. ,
The functional film forming apparatus, wherein the transport device transports the substrate to the drying device within a predetermined time managed by the time management means.   The predetermined time is set in advance based on the type of the film forming solution applied to the substrate and at least one of the temperature, humidity, and pressure in the processing chamber in which the film forming solution applying apparatus is installed. The functional film forming apparatus according to claim 1, wherein:   The functional film forming apparatus according to claim 1, wherein the film forming solution coating apparatus is an ink jet type droplet discharge apparatus.   4. The functional film forming apparatus according to claim 1, wherein the film forming solution coating apparatus applies a plurality of the substrates to form the film forming solution. 5. A film forming solution applying step of applying a film forming solution for forming a predetermined film on the substrate;
A time management step of managing a time from the start of application of the film formation solution to the substrate in the film formation solution application step;
A transporting step for transporting the film-forming solution applied to the substrate within a predetermined time managed in the time management step to a drying device;
And a drying step of drying the film-forming solution applied to the substrate transported in the transporting step. In the drying step, the plurality of substrates are dried together,
6. The time management step includes managing a time from the start of applying the film forming solution to the substrate on which the film forming solution is first applied among the substrates to be dried. The functional film formation method of description. The predetermined time is
It is set based on any one of the kind of film-forming solution applied to the substrate and at least the temperature, humidity, and atmospheric pressure in the processing chamber in which the film-forming solution is applied to the substrate. The functional film formation method of Claim 5 or Claim 6. In the film forming solution application step,
The functional film forming method according to claim 5, further comprising a step of applying the film forming solution to the substrate using an ink jet type droplet discharge device.

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