JP2006147621A - Photosensitive paste and method of manufacturing member for display panel using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosensitive paste which allows the manufacture of an electromagnetic shield plate having sufficient visibility, that is, having a degree of black and an electromagnetic shielding capability, by a rational process. <P>SOLUTION: The photosensitive paste consists of inorganic powder and a photosensitive organic component. The inorganic powder at least contains nickel-iron alloy powder and glass powder. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a photosensitive paste having electromagnetic wave shielding properties.

  The electromagnetic wave shielding plate is widely used as a front filter attached to a display, for example, in order to block electromagnetic waves leaking from the display. In addition to the function of blocking electromagnetic waves, the electromagnetic wave shield plate used as the front plate of the display is required not to lower the visibility of the display screen of the display. As such an electromagnetic wave shielding plate, for example, an electromagnetic wave shielding plate in which an etching sheet obtained by etching a metal foil in a mesh shape is bonded to a transparent substrate is used. There was a problem that required this process. In addition, in order to improve visibility, a surface treatment process for blackening such as chrome plating is required on the lattice-like metal surface, and there is a problem that a complicated process is required. As a method for solving this problem, there has been proposed a method for producing an electromagnetic wave shielding plate by performing intaglio offset printing using an ink containing black pigment and metal particles by intaglio offset printing, followed by firing. (Patent Document 1). However, since the black pigment has a high resistance value, when a black pigment for obtaining sufficient blackness is added, the resistance value of the obtained conductive layer becomes high, and in order to ensure a sufficient electromagnetic wave shielding function, it is wet. There is a problem that a metal layer must be formed on the surface by plating, which complicates the process.

To solve this complicated process, a black layer is formed using a photosensitive glass paste containing glass powder and black pigment, and a metal layer is formed using a photosensitive paste containing metal powder. However, these methods did not provide sufficient electromagnetic shielding properties. Examples of the photosensitive paste used for these include conductive metal fine particles, an organic component containing a photosensitive compound, and a photosensitive paste containing glass frit (Patent Document 2).
JP 2002-271086 A (pages 1 to 14) JP-A-9-304923 (Claim 3)

  Therefore, in view of the above-described conventional technology, the present invention provides a photosensitive paste capable of manufacturing an electromagnetic wave shielding plate having sufficient visibility, that is, blackness and an electromagnetic wave shielding function, by a more rational process. With the goal.

  That is, the present invention is a photosensitive paste characterized in that it is a paste comprising an inorganic powder and a photosensitive organic component, and the inorganic powder includes at least a nickel-iron alloy powder and glass. Moreover, it is a manufacturing method of the member for display panels manufactured from the said photosensitive paste.

  According to the present invention, it is possible to provide a photosensitive paste capable of producing an electromagnetic wave shielding plate with excellent visibility by a simple process.

  The photosensitive paste in the present invention is a photosensitive paste comprising an inorganic powder and a photosensitive organic component, and the inorganic powder includes at least a nickel-iron alloy powder and a glass powder.

As the nickel-iron-based alloy powder, a powder obtained by a known gas atomizing method, mechanical pulverization method, vapor phase reduction method or the like can be used.
The nickel-iron-based alloy powder preferably has a composition within the following range in order to exhibit high magnetic permeability and an effective electromagnetic wave shielding function.
Nickel: 55-90% by mass
Iron: 10-45% by mass
Preferably, the composition is in the range of nickel: 65 to 85% by mass and iron: 15 to 35% by mass. If this composition range is exceeded, the initial magnetic permeability is lowered and the electromagnetic shielding properties are lowered.

Furthermore, nickel-iron-molybdenum-based alloy powder having better electromagnetic shielding properties may be used. The preferred range of the nickel-iron-molybdenum alloy powder is the following composition.
Nickel: 55-90% by mass
Iron: 10-45% by mass
Molybdenum: 0.5 to 15% by mass
Preferably, the composition is in the range of nickel: 65 to 85 mass%, iron: 15 to 35 mass%, and molybdenum: 1 to 10 mass%.

  Components other than nickel, iron and molybdenum are not particularly limited, but may contain Co, Cr, Cu, Mn and the like in order to improve electrical characteristics.

  As the glass powder, it is preferable to use a glass powder having a softening temperature of 800 ° C. or lower, preferably 350 to 750 ° C. Glass having a softening temperature of 350 ° C. or lower has low chemical stability, and if the softening temperature is 750 ° C. or higher, it is difficult to sufficiently soften the substrate. Any glass powder having the above softening temperature can be used without particular limitation, but is preferably amorphous glass. When crystalline glass is used, cracks and the like are likely to occur on the film surface after firing, and the insulating properties and electrical characteristics may be lowered.

  In view of the reaction with the nickel-iron alloy powder, a borosilicate glass powder containing at least one element selected from the group consisting of lead, bismuth and zinc is preferably used. In view of the environment, glass powders containing bismuth oxide or zinc oxide as the main component are preferable. Furthermore, when glass powder containing an alkali metal is used, the substrate may be warped by an ion exchange reaction with the substrate glass during firing, so the alkali metal content may be 10% by mass or less. preferable.

  The center particle diameter of the nickel-iron-based alloy powder and glass powder is preferably in the range of 0.1 to 5 μm, and the maximum particle diameter is preferably 10 μm or less. A powder having a center particle diameter of less than 0.1 μm is difficult to disperse well in the photosensitive paste, and a powder having a particle diameter exceeding 5 μm is not preferable because the flatness of the film and the shape of the pattern deteriorate after firing. More preferably, the maximum particle diameter is 8 μm or less within the range of 0.5 to 3 μm.

  The central particle size and the maximum particle size can be obtained from a volume reference distribution such as a Coulter counter method, a photon correlation method and a laser diffraction method.

  In the photosensitive paste of the present invention, the mass ratio of the nickel-iron alloy powder and the glass powder is preferably in the range of 20:80 to 80:20. Originally, in order to satisfy the electrical characteristics obtained by sintering the nickel-iron-based alloy powder, the firing temperature needs to be relatively high, but depending on the application, firing may not be possible. For example, when glass is used for the substrate, the firing temperature is limited. Therefore, when the mass ratio of the nickel-iron alloy powder and the glass powder is within the range of 20:80 to 80:20, the firing temperature can be fired at a relatively low temperature, and the desired physical properties can be obtained. . More preferably, it exists in the range of 30: 70-80: 20, More preferably, it exists in the range of 40: 60-80: 20. If this range is exceeded and the amount of nickel-iron alloy powder increases, the denseness of the layer becomes poor and the desired physical properties are difficult to obtain. On the other hand, when the glass powder is increased, the denseness of the layer is improved, but the initial permeability is lowered and the electromagnetic wave shielding property is lowered.

  In addition, the photosensitive paste of the present invention may contain inorganic powder other than the above nickel-iron alloy powder and glass powder. For example, when forming a black layer, the addition of a black pigment can contribute to an improvement in contrast when used as a front plate of a display. As the black pigment, a pigment made of an inorganic oxide containing an oxide such as cobalt, nickel, copper, iron, manganese, chromium, and ruthenium can be used. Although an oxide of each element alone can be used, it is also effective to use a spinel compound composed of three or more elements. In particular, during the process of heating to 400 to 700 ° C., Co—Cr—Fe, Co—Mn—Fe, Co—Cu—Mn, Co—Ni—Mn, Co—Ni—Cr—Mn, Co— By using a spinel compound containing a Co element such as Ni—Cu—Mn, it is possible to prevent discoloration at a high temperature. The black pigment is preferably a pigment having a center particle diameter of 0.01 to 1.5 μm. When the thickness is 0.01 μm or less, aggregation tends to occur and blackness tends to be uneven. Further, when the thickness exceeds 1.5 μm, there is a problem that the blackness tends to be lowered. By setting the thickness to 0.01 μm to 1.5 μm, a light shielding layer with uniform and sufficient blackness can be formed. Carbon particles can be used as the black pigment. By using carbon particles having a center particle diameter of 1 μm or less, a black layer having excellent blackness can be formed. When passing through a heating step of 400 ° C. or higher, it is preferable to use heat resistant carbon. In order to obtain sufficient blackness, the addition amount of these black pigments can improve blackness with a small amount, and sufficient contrast can be obtained when used in a display. The addition amount of the black pigment is usually in the range of 0.1% by mass to 10% by mass although it depends on the type of the black pigment.

  The photosensitive organic component contained in the photosensitive paste of the present invention is a photosensitive organic component in the photosensitive paste (a portion obtained by removing inorganic components from the paste), and is contained in an amount of 5 to 50% by mass in the paste. It is preferable.

  The photosensitive organic component contained in the photosensitive paste of the present invention is usually at least one selected from a reactive monomer, a reactive oligomer, and a reactive polymer, and a binder polymer and a photopolymerization initiator used as necessary. , Photoacid generator, photobase generator, sensitizer, sensitizer, UV absorber, organic dye, dispersant, plasticizer, thickener, organic solvent, acid, base, antisettling agent, polymerization prohibition It is comprised from additive components, such as an agent. Here, the reactivity in the reactive monomer, reactive oligomer and reactive polymer means that when the photosensitive paste is irradiated with actinic rays, the reactive monomer, reactive oligomer and reactive polymer are photocrosslinked, It means the property that the chemical structure changes through reactions such as polymerization, photodepolymerization, and photo-modification.

  The polymer used as the organic component of the present invention preferably has a carboxyl group. By having a carboxyl group, the developability in an alkaline aqueous solution can be improved. Polymers having a carboxyl group include, for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid or their anhydrides and other carboxyl group-containing monomers and methacrylic acid esters, acrylic acid esters, It can be obtained by selecting monomers such as styrene, acrylonitrile, vinyl acetate, 2-hydroxyacrylate and copolymerizing using an initiator such as azobisisobutyronitrile.

  As the polymer having a carboxyl group, a copolymer having (meth) acrylic acid ester and (meth) acrylic acid as a copolymerization component is preferably used since the thermal decomposition temperature during firing is low. In particular, a styrene / methyl methacrylate / methacrylic acid copolymer is preferably used.

  The resin acid value of the copolymer having a carboxyl group is preferably 50 to 150 mgKOH / g. When the acid value exceeds 150 mgKOH / g, the allowable development width becomes narrow. On the other hand, when the acid value is less than 50 mgKOH / g, the solubility of the unexposed portion in the developer is lowered. When the developer concentration is increased, the exposed portion is peeled off and it becomes difficult to obtain a high-definition pattern.

  Furthermore, by adding a photoreactive group to the side chain or molecular end of the polymer or oligomer, it can be used as a photosensitive polymer or photosensitive oligomer, and the sensitivity and pattern accuracy of the photosensitive paste can be improved. . As an example of a method for introducing an ethylenically unsaturated bond into a side chain which is an example of a photoreactive group, an ethylenically unsaturated group having a glycidyl group or an isocyanate group with respect to a mercapto group, amino group, hydroxyl group or carboxyl group in the polymer. There is a method in which a compound and a carboxylic acid such as acrylic acid chloride, methacrylic acid chloride or allyl chloride, and maleic acid are reacted.

  Examples of the ethylenically unsaturated compound having a glycidyl group include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, glycidyl ethyl acrylate, crotonyl glycidyl ether, crotonic acid glycidyl ether, and isocrotonic acid glycidyl ether.

  Examples of the ethylenically unsaturated compound having an isocyanate group include (meth) acryloyl isocyanate and (meth) acryloylethyl isocyanate. In addition, the ethylenically unsaturated compound having a glycidyl group or an isocyanate group, acrylic acid chloride, methacrylic acid chloride or allyl chloride is 0.05 to 1 molar equivalent with respect to a mercapto group, amino group, hydroxyl group or carboxyl group in the polymer. It is preferable to react.

  Preparation of an amine compound having an ethylenically unsaturated bond may be carried out by reacting glycidyl (meth) acrylate, (meth) acrylic acid chloride, (meth) acrylic anhydride, etc. having an ethylenically unsaturated bond with an amino compound. . A plurality of ethylenically unsaturated group-containing compounds may be mixed and used.

  The photopolymerization initiator used in the present invention is selected from those generating radical species. As photopolymerization initiators, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropane- 1-one, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexyl-phenylketone, 1-phenyl-1,2-propanedione-2- (o-ethoxy) Carbonyl) oxime, 2-methyl- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, Benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl Ether, benzoin isobutyl ether, benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4,4-dichlorobenzophenone, hydroxybenzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, alkylated benzophenone, 3,3 ' , 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, 4-benzoyl-N, N-dimethyl-N- [2- (1-oxo-2-propenyloxy) ethyl] benzenemethananium bromide, (4-Benzoylbenzyl) trimethylammonium chloride, 2-hydroxy-3- (4-benzoylphenoxy) -N, N, N-trimethyl-1-propenaminium chloride monohydrate, 2-isopropylthioxanthone, 2,4- Dimethyl Oxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 2-hydroxy-3- (3,4-dimethyl-9-oxo-9H-thioxanthen-2-yloxy) -N, N, N-trimethyl- 1-propanaminium chloride, 2,4,6-trimethylbenzoylphenylphosphine oxide, 2,2′-bis (o-chlorophenyl) -4,5,4 ′, 5′-tetraphenyl-1,2-bi Imidazole, 10-butyl-2-chloroacridone, 2-ethylanthraquinone, benzyl, 9,10-phenanthrenequinone, camphorquinone, methylphenylglyoxyester, η5-cyclopentadienyl-η6-cumenyl-iron (1 +)-hexafluorophosphate (1-), diphenyl sulfide derivative, bis ( η5-2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium, 4,4-bis (dimethylamino) benzophenone, 4 , 4-bis (diethylamino) benzophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 4-benzoyl-4-methylphenylketone, dibenzylketone, fluorenone, 2,3-diethoxyacetophenone, 2,2-dimethoxy 2-phenyl-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyldichloroacetophenone, benzylmethoxyethyl acetal, anthraquinone, 2-t-butylanthraquinone, 2-aminoanthraquinone, β- Chloranthraquino , Anthrone, benzanthrone, dibenzsuberone, methyleneanthrone, 4-azidobenzalacetophenone, 2,6-bis (p-azidobenzylidene) cyclohexane, 2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2- Phenyl-1,2-butadion-2- (o-methoxycarbonyl) oxime, 1,3-diphenylpropanetrione-2- (o-ethoxycarbonyl) oxime, N-phenylglycine, tetrabutylammonium (+1) n-butyl Triphenylborate (1-), naphthalenesulfonyl chloride, quinolinesulfonyl chloride, N-phenylthioacridone, 4,4-azobisisobutyronitrile, benzthiazole disulfide, triphenylphosphine, carbon tetrabromide, Examples include combinations of photoreducing dyes such as tribromophenyl sulfone, benzoyl peroxide and eosin, and methylene blue with reducing agents such as ascorbic acid and triethanolamine.

  1 type (s) or 2 or more types can be used for a photoinitiator. A photoinitiator is added in 0.05-10 mass% with respect to the photosensitive organic component, More preferably, it is 0.1-10 mass%. If the amount of the photopolymerization initiator is too small, the photosensitivity will be poor, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed area may be small.

  A sensitizer can be used together with a photopolymerization initiator to improve sensitivity and to expand the effective wavelength range for the reaction.

  Specific examples of the sensitizer include 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone, 2,6-bis ( 4-dimethylaminobenzal) cyclohexanone, 2,6-bis (4-dimethylaminobenzal) -4-methylcyclohexanone, Michler's ketone, 4,4-bis (diethylamino) benzophenone, 4,4-bis (dimethylamino) chalcone 4,4-bis (diethylamino) chalcone, p-dimethylaminocinnamylidene indanone, p-dimethylaminobenzylidene indanone, 2- (p-dimethylaminophenylvinylene) isonaphthothiazole, 1,3-bis (4 -Dimethylaminophenylvinylene) Isonaphtho Sol, 1,3-bis (4-dimethylaminobenzal) acetone, 1,3-carbonylbis (4-diethylaminobenzal) acetone, 3,3-carbonylbis (7-diethylaminocoumarin), triethanolamine, methyl Diethanolamine, triisopropanolamine, N-phenyl-N-ethylethanolamine, N-phenylethanolamine, N-tolyldiethanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl dimethylaminobenzoate, diethylamino Isoamyl benzoate, (2-dimethylamino) ethyl benzoate, ethyl 4-dimethylaminobenzoate (n-butoxy), 2-ethylhexyl 4-dimethylaminobenzoate, 3-phenyl-5-benzoylthiotetrazo Le, and a 1-phenyl-5-ethoxycarbonyl-thiotetrazole the like.

  One or more sensitizers can be used. When adding a sensitizer to the photosensitive paste of this invention, the addition amount is 0.05-10 mass% normally with respect to the photosensitive organic component, More preferably, it is 0.1-10 mass%. If the amount of the sensitizer is too small, the effect of improving the photosensitivity is not exhibited, and if the amount of the sensitizer is too large, the residual ratio of the exposed portion may be reduced.

  Moreover, in the photosensitive paste of this invention, since the nickel-iron type alloy powder is contained, the photosensitive paste is exhibiting black. Therefore, the exposure light is absorbed, a large amount of exposure is required, and practical sensitivity is difficult to obtain. Moreover, the tolerance with respect to a developing solution is also weak, and when a developing time becomes long, it may peel from a board | substrate. Therefore, as the photopolymerization initiator and / or sensitizer in the present invention, those having an absorption coefficient of 1,000 (1 / mol · cm) or more at a wavelength of 365 nm can be preferably used. More preferably, the extinction coefficient is 2,000 (1 / mol · cm) or more. By using a photopolymerization initiator and / or a sensitizer with a wavelength of 365 nm and an extinction coefficient of 1,000 (1 / mol · cm) or more, practical sensitivity can be obtained and resistance to the developer is improved. , Can widen the process margin.

The extinction coefficient can be measured and calculated as follows.
(1) A photopolymerization initiator and / or a sensitizer is weighed and completely dissolved in γ-butyrolactone.
(2) After weighing, dilute using a 10 ml volumetric flask.
(3) The absorption intensity of the diluted solution in the region of 265 nm to 600 nm is measured in units of 0.5 nm with a UV-3101PC type self-recording spectrophotometer (cell 10 mm) manufactured by Shimadzu Corporation.
(4) If the absorbance determined in (3) exceeds 0.7, dilute to an appropriate concentration and measure the absorption spectrum.
(5) Repeat dilution and measurement until the measured maximum absorbance is 0.7 or less.
(6) The extinction coefficient (1 / mol · cm) per unit concentration at 365 nm is calculated from the obtained spectrum of each concentration using the Lambert-Beer equation.

Absorption coefficient = absorbance / (molar concentration × d) (where d represents the cell length)
Specific examples of photopolymerization initiators and / or sensitizers having an absorption coefficient of 1,000 (1 / mol · cm) or more at a wavelength of 365 nm include 2,2-dimethoxy-1,2-diphenylethane-1 -One, 2-methyl- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, 2-methylthioxanthone, 2-chlorothioxanthone, 2 -Isopropylthioxanthone, 2-laurylthioxanthone, 3-chlorothioxanthone, 2,4-dimethylthioxa , 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 4,4-bis (diethylamino) benzophenone, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (dipropylamino) benzophenone, 4 , 4-bis (piperidine) benzophenone, 2-phenyl-1,2-butadion-2- (o-methoxycarbonyl) oxime, 1-phenylpropanedione-2- (o-ethoxycarbonyl) oxime, 1,3-diphenyl Examples include propanetrione-2- (o-ethoxycarbonyl) oxime.

  Furthermore, since the photosensitive organic component contains a compound having an absorption maximum in a wavelength region exceeding 400 nm and a bis (alkylamino) benzophenone or thioxanthone derivative, the curing of the bottom of the pattern can be promoted, thereby increasing the development time. However, the pattern does not peel from the substrate, and the process margin can be widened. Moreover, processing with a thick film is possible, and electromagnetic wave shielding properties can be improved.

  Specific examples of the compound having an absorption maximum in a wavelength region exceeding 400 nm include 1-chloro-N-methylacridone, 2-chloro-N-methylacridone, 3-chloro-N-methylacridone, 2- Chloro-N-butylacridone, 2-chloro-N-methylacridone, 3-chloro-N-benzylacridone, 4-chloro-N-methylacridone, 2,3-dichloro-N-methylacridone, Examples include, but are not limited to, 2,6-dichloro-N-butylacridone, N-benzylacridone, N-butylacridone, N-ethylacridone, and other acridone derivatives.

  In particular, in the photosensitive paste containing the nickel-iron-based alloy powder of the present invention and glass powder, N— is a combination of a compound having an absorption maximum in a wavelength region exceeding 400 nm and a bis (alkylamino) benzophenone or thioxanthone derivative. A combination of butylacridone and 4,4-bis (diethylamino) benzophenone or N-butylacridone and 2,4-diethylthioxanthone is preferred. These combinations enable the formation of a fine pattern with a thick film, so that the line width of the mesh pattern of the electromagnetic wave shielding plate can be reduced.

  In the photosensitive paste of the present invention, it is also effective to add an ultraviolet absorber. In the photosensitive paste of the present invention, soft magnetic powders and glass powders having different properties are used as inorganic powders. Therefore, the exposure light is largely scattered inside the photosensitive paste film, and the pattern tends to easily spread. By adding the ultraviolet absorber, the scattered light inside the photosensitive paste due to the exposure light is absorbed, the scattered light is weakened, and a sharp pattern can be obtained. Examples of the ultraviolet absorber include benzophenone compounds, cyanoacrylate compounds, salicylic acid compounds, benzotriazole compounds, indole compounds, inorganic fine-particle metal oxides, and the like. Among these, benzophenone compounds, cyanoacrylate compounds, benzotriazole compounds, and indole compounds are particularly effective. Specific examples thereof include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2,2′-dihydroxy-4-methoxybenzophenone, 2,2′-dihydroxy-4,4′-dimethoxybenzophenone, 2,2′-dihydroxy-4,4′-dimethoxy-5-sulfobenzophenone, 2-hydroxy-4-methoxy-2′-carboxybenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone trihydrate, 2 -Hydroxy-4-n-octoxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4 -(2-hydroxy-3-methyl (Chryloxy) propoxybenzophenone, 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-t-butylphenyl) benzotriazole, 2- (2 '-Hydroxy-3'-t-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3', 5'-di-t-butylphenyl) -5-chlorobenzo Triazole, 2- (2′-hydroxy-4′-n-octoxyphenyl) benzotriazole, 2-ethylhexyl-2-cyano-3,3-diphenyl acrylate, 2-ethyl-2-cyano-3,3-diphenyl BONASORB UA-3901 (made by Orient Chemical Co., Ltd.) and BONASORB are acrylate and indole-based absorbents A-3902 (manufactured by Orient Chemical Industries, Ltd.), but such SOM-2-0008 (manufactured by Orient Chemical Co., Ltd.) without limitation. Furthermore, a methacryl group or the like may be introduced into the skeleton of these ultraviolet absorbers and used as a reaction type. In the present invention, one or more of these can be used.

  The addition amount of a ultraviolet absorber is 0.001-10 mass% in a photosensitive paste, More preferably, it is the range of 0.005-5 mass%. Beyond these ranges, the transmission limit wavelength and the wavelength gradient width change, so that the ability to absorb scattered light is insufficient, the transmittance of exposure light is lowered, and the sensitivity of the photosensitive paste is lowered.

  It is also effective to use organic dyes as ultraviolet absorbers. When using an organic dye, in addition to the effect of absorbing scattered light inside the photosensitive paste and weakening the scattered light, the dye is added and colored to improve visibility, and the part where the paste remains during development And the removed part can be easily distinguished. Although it does not specifically limit as organic dye, The thing which does not remain in the insulating film after baking is preferable. Specifically, anthraquinone dyes, indigoid dyes, phthalocyanine dyes, carbonium dyes, quinoneimine dyes, methine dyes, quinoline dyes, nitro dyes, nitroso dyes, benzoquinone dyes, naphthoquinone dyes, phthalimides A dye, perinone dye or the like can be used. In particular, it is preferable to select a carbonium-based dye such as basic blue that absorbs light having wavelengths in the vicinity of the h-line and i-line, for example, because the effects of the present invention are more easily exhibited. The amount of the organic dye added is preferably 0.001 to 1% by mass.

  Furthermore, it is also effective to add a polymerization inhibitor in the photosensitive paste of the present invention. By adding a polymerization inhibitor, the polymerization inhibitor captures radicals and a photoreaction occurs suddenly at an exposure amount that cannot be suppressed by the polymerization inhibitor, thereby increasing the solubility and insoluble contrast in the developer. Can do.

  Specifically, hydroquinone, phenothiazine, pt-butylcatechol, 2,5-dibutylhydroquinone, mono-t-butylhydroquinone, 2,5-di-t-amylhydroquinone, N-phenylnaphthylamine, 2,6- Examples thereof include, but are not limited to, di-t-butyl-p-methylphenol, chloranil, hydroquinone monomethyl ether, and pyrogallol. In the present invention, one or more of these can be used.

  The addition amount of a polymerization inhibitor is 0.1-30 mass% in a photosensitive paste, More preferably, it is the range of 0.5-20 mass%. If it is less than these ranges, the contrast of dissolution and insolubility in the developer is small, and if this range is exceeded, the sensitivity of the photosensitive paste decreases, requiring a large amount of exposure, and the degree of polymerization does not increase and the pattern shape Cannot be maintained.

  In the present invention, the pattern shape can be controlled by controlling the ultraviolet absorber and the polymerization inhibitor.

  An organic solvent is used to adjust the viscosity at the time of applying the photosensitive paste to the substrate according to the application method. Examples of the organic solvent used at this time include methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, Bromobenzoic acid, chlorobenzoic acid, etc., diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, 2-methyl-2,4-pentanediol, 3-methyl-1,5-pentanediol, 2-ethyl- 1,3-hexanediol, terpineol, 3-methyl-3-methoxybutanol, texanol, benzyl alcohol, Propylene glycol monoethyl ether, tripropylene glycol monomethyl ether, the organic solvent mixture containing one or more of propylene glycol monomethyl ether acetate and they can be used.

  The photosensitive paste of the present invention is prepared by preparing various components so as to have a predetermined composition, and then pre-dispersing with a mixer such as a planetary mixer, and then uniformly preparing with a dispersing and kneading means using a disperser such as a three-roller. To do.

  Next, the manufacturing method of the member for display panels using the photosensitive paste of this invention is demonstrated.

(substrate)
If the board | substrate used for the electromagnetic wave shielding board for display panels is a transparent thing which can be arrange | positioned in the front surface of a display, it can be especially used without a restriction | limiting. A glass substrate, a resin substrate, a film, or the like can be used. As the resin substrate, a known transparent resin substrate such as an acrylic plate or a polycarbonate substrate having a thickness of 0.5 to 3 mm can be used. As the film, a polyethylene terephthalate film or a polycarbonate film can be used.

  Among these, it is most preferable to use a glass substrate from the viewpoint of cost and high degree of freedom of processing. As thickness of the glass substrate to be used, it is about 0.7-5 mm normally, Preferably it is the range of about 1.0-3.5 mm. If the thickness is less than 0.7 mm, it tends to break during handling and use, and if the thickness exceeds 5 mm, it becomes too heavy and the total weight during handling and when the display is mounted is unfavorable. In addition, the glass substrate is preferably tempered from the viewpoint of preventing breakage during handling and use, and from the viewpoint of the tempering process, a glass substrate having a thickness of 1.5 mm or more is preferable.

  The glass substrate may be strengthened before or after pattern formation. That is, after a glass substrate is tempered, a pattern may be formed on the tempered glass, or after a pattern is formed on ordinary glass, the patterned glass may be tempered. The glass strengthening treatment is a treatment for increasing the strength by imparting a compressive strain to the surface of the glass, and is divided into a heat strengthening treatment and a chemical strengthening treatment according to a method for imparting a compressive strain to the surface. Since glass breaks from the surface by a tensile force, the strength can be increased if the surface is preliminarily compressed. The heat strengthening treatment is performed by heating the glass sheet to the vicinity of its softening point, and then rapidly cooling the glass surface with an air jet to form a compressive stress layer on the glass surface. When strengthening is performed after the pattern is formed, after heating to near the softening point in a heating furnace having a continuous or stepwise heating chamber, an air jet is blown perpendicularly on both sides of the glass substrate from a group of air nozzles. This is done by quenching.

  The glass substrate may be colored with metal ions, metal colloids, non-metallic elements, and the like. The glass substrate can be colored by a known method. Coloring is often performed for the purpose of improving the visibility of the display.

(Metal layer)
A method of forming a transparent conductive layer or a mesh or stripe-shaped metal layer is formed on such a substrate to ensure electromagnetic wave shielding properties. However, it is difficult to make the sheet resistance value 1Ω or less with the transparent conductive layer alone, and when the transparent conductive layer is formed thick in order to reduce the resistance value, the light transmittance is lowered and the display is visually recognized. There is a problem that productivity is lowered and a long vacuum process is required, and productivity is significantly lowered. Therefore, it is preferable to use silver that can easily reduce the resistance value as a mesh-like metal layer, particularly as a material of the metal layer, on the substrate.

  The metal layer may contain metals such as nickel and aluminum in addition to silver. However, it is important to reduce the resistance value by setting the silver content in the metal component to 50% by mass or more. When the silver content is 50% by mass or less, the resistance value tends to increase. By forming the metal layer in a mesh shape or a stripe shape, light can be transmitted from the openings of the mesh or stripe.

  In order to obtain sufficient electromagnetic wave shielding performance, the resistance value of the conductive layer needs to be 1 Ω · cm or less, preferably 0.1 Ω · cm or less. For this purpose, it is desirable that the line width of the metal layer formed in a mesh or stripe shape is 5 to 30 μm. If the line width of the mesh or stripe is smaller than 5 μm, pattern defects are likely to occur, and if it exceeds 30 μm, there is a problem that the light transmittance decreases. Moreover, 0.5-15 micrometers is preferable and, as for the thickness of a metal layer, More preferably, it is 1-10 micrometers. If it is thinner than 0.5 μm, the resistance value becomes high and the electromagnetic wave shielding performance is insufficient. On the other hand, if it is thicker than 15 μm, there is a problem that the formation process of the mesh or stripe becomes complicated and the material cost increases, and a transparency treatment process for preventing a decrease in visibility due to reflection on the side surface of the pattern. There is a problem that is needed.

  Further, when the formation pitch of the mesh or stripe becomes coarse, the display characteristics may be deteriorated due to the moire phenomenon. For example, when it is used on the front surface of the PDP, the repeated formation pitch needs to be ½ or less of the pixel pitch. is there. That is, since a normal PDP is formed with 0.7 to 1 mm square pixels, it is preferable to form the mesh or stripe with a pitch of 0.1 to 0.5 mm.

(Black layer)
In order to form the black layer, the photosensitive paste of the present invention can be used. As with the metal layer, a separate stripe or mesh black layer is formed, that is, a black layer is formed on the metal layer to suppress reflection, thereby improving contrast and improving electromagnetic wave shielding performance. be able to.

  The thickness of the black layer is influenced by the blackness of the black layer, but is preferably 0.5 to 10 μm. In order to obtain sufficient blackness, a thickness of 0.5 μm or more is necessary, and it is preferable that the material cost is 10 μm or less.

(Transparent conductive layer)
As a method for improving the light transmittance while reducing the resistance value to improve the electromagnetic wave shielding performance, there is a method using a substrate in which a transparent conductive layer is formed on the substrate surface. That is, by using a glass substrate on which a transparent conductive layer made of ITO or tin oxide is formed on the surface of the glass substrate, electromagnetic wave shielding properties can be improved. These transparent conductive layers can be formed on the substrate by sputtering or CVD (Chemical Vapor Deposition).

  As a transparent conductive layer, ITO has an advantage that resistance can be reduced as compared with tin oxide. However, when glass is used as a substrate, tin oxide not using expensive indium is superior in cost. Also, in terms of combination with the metal layer, the problem of yellowing due to the reaction between silver / glass when silver is formed on the glass substrate is advantageous in that it can be suppressed by a dense tin oxide film.

(Manufacturing method of electromagnetic shielding plate)
As a method for producing an electromagnetic wave shielding plate, a necessary pattern is formed using a paste containing silver on a substrate, a metal layer is formed by firing, and then the photosensitive paste of the present invention is used. After forming the pattern, a black layer is formed by firing. In addition, baking of a metal layer and a black layer can also be performed at once. As a pattern forming method of the metal layer, a known method can be used. Pattern printing methods such as offset printing and screen printing may be used. However, offset printing is difficult to increase the formation thickness, and screen printing has a problem that it is difficult to reduce the line width to 30 μm or less. . Therefore, a preferred method is a photosensitive paste method. The photosensitive paste method is a method of forming a pattern by a photolithography method using a paste containing a photosensitive organic component and an inorganic component.

  As an example of the forming method, a photosensitive metal paste containing a metal powder and a photosensitive organic component is applied and dried on a substrate, and further, the photosensitive paste of the present invention is applied and dried on the substrate to form a film. A pattern is formed by exposing and developing through a photomask corresponding to the mesh pattern. When a glass substrate is used as the substrate, it can be heated to 400 to 700 ° C. to burn out the organic components in the black layer / metal layer, thereby forming a layer with higher blackness and lower resistance. When the firing temperature is less than 400 ° C., the organic matter in the pattern is not sufficiently reduced, so that the adhesion between the metal layer and the glass substrate becomes insufficient. On the other hand, if the firing temperature exceeds 700 ° C., the glass substrate itself may be deformed.

  In order to sufficiently adhere the metal layer, the remaining amount of organic matter in the pattern is preferably 10% by mass or less of the weight before firing, and more preferably 5% by mass or less. Is more preferable. What is necessary is just to adjust baking time so that a residual organic substance may reduce to a preferable range within a preferable temperature range. Moreover, when using the tempered glass as the glass substrate on which the pattern is formed, it is necessary to set the firing conditions lower than the strain point of the glass so that the glass is not tempered. For this purpose, firing is preferably performed at a temperature 30 ° C. or more lower than the strain point of the glass, more preferably 50 ° C. or more, particularly 100 ° C. or more. On the other hand, when baking is performed after forming a pattern on ordinary glass, the glass substrate can be strengthened simultaneously by baking at a temperature close to the softening point of the glass substrate and then rapidly cooling. Specifically, for example, after heating at 600 to 700 ° C. for about several tens of seconds to several tens of minutes, the pattern is fired and the substrate is tempered simultaneously by blowing air and quenching. The strengthening treatment conditions are appropriately determined depending on the thickness of the glass substrate and the necessary degree of strengthening.

  In order to create an optical filter for display using an electromagnetic wave shield plate, it is necessary to provide an antireflection function and a transmittance control function. As a method for imparting an antireflection function, there is a method in which an antireflection coating having a low refractive index is applied to a processed substrate and heated. Moreover, the electromagnetic wave shielding board which has an antireflection function is producible by sticking the film which has an antireflection function to this electromagnetic wave shielding board. Furthermore, a color correction film for controlling the wavelength of transmitted light, a film that cuts infrared rays or ultraviolet rays, and a film having a function of cutting neon light when used for a plasma display can be pasted. Can create multi-function optical filters. By adding an appropriate metal ion to the glass substrate itself, it is possible to impart near infrared absorption performance. Examples include antifouling films that prevent contaminants such as fingerprints from adhering to the surface. The electromagnetic wave shielding plate thus obtained can be suitably used as a front filter for display, for example, a front filter for a plasma display panel or the like.

(Layer structure)
The layer structure of the electromagnetic wave shielding plate includes substrate / black layer / metal layer, substrate / metal layer / black layer, substrate / black layer / metal layer / black layer, and a transparent conductive layer as the substrate. A substrate formed in the above can be used. When a glass substrate is used as the substrate, it can be widely handled by changing the type and order of pastes to be applied.

EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited by these Examples. In addition, the electromagnetic wave shielding board obtained by each Example and the comparative example measured line | wire width, pattern shape, and surface resistance by the following (1) and (2), and also for the following (3) The electromagnetic wave shielding property was evaluated. Furthermore, the extinction coefficients of the photopolymerization initiator and sensitizer used for the photosensitive paste were obtained from (4), and the center particle size and the maximum particle size of the inorganic powder were obtained from (5).
(1) Line width, pattern shape The pattern shape was observed using the real surface view (VE-7800) by Keyence Corporation, and the width | variety of a pattern top part was measured.
(2) Surface resistance Using a surface resistance measuring instrument “Loresta” manufactured by Mitsubishi Chemical Corporation, the surface resistance was measured by the four-end needle method.
(3) Electromagnetic wave shielding property A square sample having a side of 100 mm was cut out from the electromagnetic wave shielding plate, and measured using an EMI shield measuring device (MA8602B) manufactured by Anritsu Corporation in accordance with the KEC (Kansai Electronics Industry Promotion Center) method.
(4) Molecular extinction coefficient It calculated | required with the following procedure.
a. The photopolymerization initiator and / or sensitizer is weighed and completely dissolved in γ-butyllactone.
b. After weighing, dilute using a 10 ml volumetric flask.
c. The absorption intensity in the region of 265 nm to 600 nm of the diluted solution is measured in units of 0.5 nm with a UV-3101PC type self-recording spectrophotometer (cell 10 mm) manufactured by Shimadzu Corporation.
d. When the absorbance determined in c exceeds 0.7, dilution is performed to an appropriate concentration and an absorption spectrum is measured.
e. The dilution and measurement are repeated until the measured maximum absorbance is 0.7 or less.
f. The extinction coefficient (1 / mol · cm) per unit concentration at 365 nm is calculated from the obtained spectrum of each concentration by the Lambert-Beer equation.
Absorption coefficient = absorbance / (molar concentration × d) (where d represents the cell length)
(5) The particle size of the inorganic powder was measured by dispersing a sample amount of 1 g in purified water with ultrasonic waves for 1.5 minutes using a microtrac particle size distribution meter HRA9320-X100. The particle refractive index was changed depending on the kind of the inorganic powder, and the solvent refractive index was 1.33. The measurement was performed 3 times, and the average value was obtained.
(Examples 1-20)
A glass of bismuth oxide, silicon oxide, boron oxide, zirconium oxide, zinc oxide, aluminum oxide is pulverized on soda glass (manufactured by Nippon Sheet Glass Co., Ltd.) having a size of 970 mm × 580 mm and a thickness of 3 mm. 3% by mass of glass powder, 6% by mass of photosensitive acrylic polymer (APX-716 manufactured by Toray Industries, Inc.), 3% by mass of dipentaerythritol hexaacrylate, 1% by mass of 1-hydroxycyclohexyl phenyl ketone, and Ag powder having an average particle diameter of 2 μm A photosensitive silver paste composed of 74% by mass of Mining Co., Ltd. and 13% by mass of an organic solvent (diethylene glycol monobutyl ether acetate) was applied over the entire surface using a Microtec screen printer and a 380 mesh screen plate, and hot air produced by Tabai. Dry at 100 ° C for 30 minutes using a dryer .

  Next, the photosensitive paste having the composition shown in Table 2 was applied to the entire surface using a Microtec screen printer and a 380 mesh screen plate, and dried at 100 ° C. for 30 minutes using a hot air dryer manufactured by Tabai. . The substrate thus obtained was exposed through a photomask in which openings were formed in a mesh shape having a line interval of 300 μm and a line width of 20 μm. As the exposure machine, a Dainippon Screen exposure machine (light source: 2 kW super high pressure mercury lamp) was used. After the exposure, a pattern was obtained by developing with a 0.5 mass% 2-aminoethanol aqueous solution in a shower for 2 minutes. Then, this glass substrate with a lattice pattern was fired at 700 ° C. for 5 minutes using a roller hearth firing furnace manufactured by Koyo Thermotech Co., Ltd., and then rapidly cooled by blowing air. By this treatment, the pattern was firmly adhered to the base material, and the base glass became tempered glass to produce an electromagnetic wave shield plate.

  The materials used are shown in Table 2. In Table 2, the upper part is the material, and the lower part is the blending ratio (parts by weight).

A to G: The nickel-iron alloy powder prepared by the vapor phase reduction method was adjusted so that the mass ratio of pure nickel and pure iron was as shown in Table 1, and was classified into a classifier (TC- manufactured by Nisshin Engineering Co., Ltd.). 25IIIC), a nickel-iron alloy powder having a center particle diameter of 1.2 μm and a maximum particle diameter of 4.8 μm was used.
H: Glass powder with a softening point of 490 ° C. and a center particle diameter of 1 μm made of bismuth oxide (Bi ₂ O ₃ ), silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), and zinc oxide (ZnO) I: cobalt oxide (Co ₃ O ₄ , center particle diameter 0.1 μm, manufactured by Mitsui Mining & Smelting Co., Ltd.)
J: Photosensitive acrylic polymer having an acid value of 85 and a weight average molecular weight of 32,000 (APX-716 manufactured by Toray Industries, Inc.)
K: Propylene oxide modified trimethylolpropane triacrylate (Daiichi Kogyo Seiyaku Co., Ltd.)
L: 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 (molecular extinction coefficient: 3,200, manufactured by Ciba Specialty Chemicals)
M: 2-methyl- [4- (methylthio) phenyl] -2-morpholinopropan-1-one (molecular extinction coefficient: 280, manufactured by Ciba Specialty Chemicals)
N: 1-hydroxycyclohexyl phenyl ketone (molecular extinction coefficient: 20, manufactured by Ciba Specialty Chemicals)
O: 2,4-diethylthioxanthone (molecular extinction coefficient: 5,100, manufactured by Nippon Kayaku Co., Ltd.)
P: 4,4-bis (diethylamino) benzophenone (molecular extinction coefficient: 37,000, manufactured by Tokyo Chemical Industry Co., Ltd.)
Q: N-butylacridone (maximum absorption wavelength 402 nm, manufactured by Tokyo Chemical Industry Co., Ltd.)
R: Basic Blue 26 (manufactured by Tokyo Chemical Industry Co., Ltd.)
S: p-methoxyphenol (manufactured by Tokyo Chemical Industry Co., Ltd.)
T: Diethylene glycol monobutyl ether acetate (manufactured by Kyowa Hakko Kogyo Co., Ltd.)
The results obtained using the photosensitive paste having the composition shown in Table 2 are shown in Table 3. In Examples 1 to 11, 17, and 18, exposure was possible with sufficiently practical sensitivity, and the line width and pattern shape of the pattern were good. In Examples 12, 15, and 16, a large amount of exposure was required, and the bottom of the pattern shape was thin, which was slightly poor, but pattern formation was possible. In Examples 13 and 14 in which the photosensitive organic component contains a compound having an absorption maximum in a wavelength region exceeding 400 nm and bis (alkylamino) benzophenone or a thioxanthone derivative, the sensitivity and the pattern shape were good. In particular, since a mask having a line width of 20 μm was used, a line width of 20 μm was obtained after development, and a line width of 15 μm was obtained by firing shrinkage.

  Next, Table 3 shows the evaluation results of the obtained electromagnetic wave shielding plate.

Further, a functional film (manufactured by Sumitomo Osaka Cement Co., Ltd.) having an antireflection function, a color correction function, and a neon cut function is bonded to the electromagnetic wave shield plate produced in Examples 1 to 18, and a front filter is created. When the visibility was evaluated by a haze feeling, it was good. In Examples 5, 6, 17, and 18, the electromagnetic wave shielding properties were slightly lower than those in the other examples.
(Comparative Example 1)
A mesh pattern having a pitch of 300 μm and a line width of 20 μm was formed on a polyester film having a size of 970 mm × 580 mm by using an intaglio offset printing method and a silver paste containing 1% by weight of carbon black. Then, it heated to 150 degreeC, the copper plating layer was formed so that it might become a thickness of 3 micrometers by electrolytic plating, the electromagnetic wave seed film was produced, and it bonded together to the glass substrate.
On top of that, a functional film (manufactured by Sumitomo Osaka Cement Co., Ltd.) that has an antireflection function, a color correction function, and a neon cut function was laminated to create a front filter, and the visibility was evaluated based on the haze feeling of the screen. Met. However, since a plating process is essential, an extra process is necessary.
(Comparative Example 2)
After laminating a copper foil with a thickness of 13 μm on a polyester film with a size of 970 mm × 580 mm, a dry film resist is laminated, and after development with a photomask having an opening with a pitch of 300 μm and a line width of 20 μm, development, etching, and resist stripping steps are performed. Then, an electromagnetic wave shielding film was produced and bonded to a glass substrate. On top of that, a functional film (manufactured by Sumitomo Osaka Cement Co., Ltd.) having an antireflection function, a color correction function, and a neon cut function was laminated to produce a front filter, and the visibility was evaluated based on the haze feeling of the screen. The feeling was strong and the visibility was poor.

Claims (11)

A photosensitive paste comprising an inorganic powder and a photosensitive organic component, wherein the inorganic powder includes at least a nickel-iron alloy powder and a glass powder. The photosensitive paste according to claim 1, wherein the nickel-iron-based alloy powder has a composition within the following range.
Nickel: 55-90% by mass
Iron: 10-45% by mass The photosensitive paste according to claim 2, wherein the nickel-iron-based alloy powder has a composition within the following range.
Nickel: 55-90% by mass
Iron: 10-45% by mass
Molybdenum: 0.5 to 15% by mass 4. The photosensitivity according to claim 1, wherein the central particle diameter of the nickel-iron alloy powder and the glass powder is in the range of 0.1 to 5 [mu] m, and the maximum particle diameter is 10 [mu] m or less. paste. The photosensitive paste according to any one of claims 1 to 4, wherein the softening temperature of the glass powder is within a range of 350 to 750 ° C. The photosensitive paste according to any one of claims 1 to 5, wherein a mass ratio of the nickel-iron alloy powder and the glass powder is in a range of 20:80 to 80:20. The photosensitive organic component contains a photopolymerization initiator and / or a sensitizer having a wavelength of 365 nm and a molecular extinction coefficient of 1,000 (1 / mol · cm) or more. The photosensitive paste of crab. The photosensitive paste according to claim 7, wherein the photosensitive organic component contains a compound having an absorption maximum in a wavelength region exceeding 400 nm and a bis (alkylamino) benzophenone or thioxanthone derivative. The photosensitive paste according to claim 8, wherein the photosensitive organic component comprises N-butylacridone and 4,4-bis (diethylamino) benzophenone or N-butylacridone and 2,4-diethylthioxanthone. The photosensitive paste in any one of Claims 1-9 used for electromagnetic wave shield layer formation. A method for producing a display panel member comprising a step of applying a photosensitive paste onto a substrate and drying the display panel member, wherein the photosensitive paste according to claim 10 is used as the photosensitive paste. Manufacturing method.