JP2006133713A - Light guide plate pattern processing method and machine - Google Patents
Light guide plate pattern processing method and machine Download PDFInfo
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- JP2006133713A JP2006133713A JP2004364566A JP2004364566A JP2006133713A JP 2006133713 A JP2006133713 A JP 2006133713A JP 2004364566 A JP2004364566 A JP 2004364566A JP 2004364566 A JP2004364566 A JP 2004364566A JP 2006133713 A JP2006133713 A JP 2006133713A
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- pattern
- light guide
- guide plate
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- shape
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0065—Manufacturing aspects; Material aspects
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0036—2-D arrangement of prisms, protrusions, indentations or roughened surfaces
Abstract
Description
本発明は、打撃方式による導光板のパターン加工方法及びその装置に係り、特に、チップを用いて加工面を直接打撃して様々な形のパターンを短時間に効率よく製造できるようにした、導光板のパターン加工方法及びその装置に関する。 The present invention relates to a pattern processing method and an apparatus for a light guide plate by a striking method, and in particular, a guide that can be used to efficiently produce various patterns in a short time by directly striking a processed surface using a chip. The present invention relates to an optical plate pattern processing method and apparatus.
一般に知られているパターン実現方式としては、次のものが挙げられる。 Examples of generally known pattern realization methods include the following.
1)導光板を射出するための金型のコアに所望のパターン形状にエッチングを行ってコアを完成するエッチング方式。 1) An etching method in which a core of a mold for emitting a light guide plate is etched into a desired pattern shape to complete the core.
2)メッキ処理の施された薄い金属板にパターンの形状を刻み込み、これを金型に付着させて射出するスタンパー(stamper)方式。 2) A stamper method in which a pattern shape is engraved on a thin metal plate that has been plated, and this is attached to a mold for injection.
3)ダイアモンド工具を用いて導光板の表面にV字状のグループパターンを作る切削方式。 3) A cutting method that creates a V-shaped group pattern on the surface of the light guide plate using a diamond tool.
4)導光板の表面にレーザを発射してパターンを刻み込むレーザ方式。 4) A laser method in which a laser is emitted on the surface of a light guide plate to engrave a pattern.
ところが、エッチング方式は、均一なエッチング深さ及び形状の制御に限界があり、射出後にパターンの修正及び補完を行うためには多くの時間がかかるという問題点があった。スタンパー方式は、コアの材質が軟らかくてスタンパーの寿命が短く、スタンパーの取り扱いに特別な注意が必要であり、スタンバーが高価なので生産コストが増加するうえ、射出後にパターンの修正及び補完を行うためには多くの時間がかかるという問題点があった。 However, the etching method has a limit in controlling the uniform etching depth and shape, and there is a problem that it takes a lot of time to correct and complement the pattern after injection. The stamper method uses a soft core material, shortens the life of the stamper, requires special care in handling the stamper, increases the production cost due to the expensive stamper, and corrects and complements the pattern after injection. Had the problem of taking a lot of time.
また、ダイアモンド工具を用いた切削方式は、不良率が高く、取り扱いが難しくて生産性が低下するという問題点があった。レーザ加工方式は、生産コストが高く、高熱によって製品に変形が発生することにより、生産性及び収率が低下するという問題点があった。 In addition, the cutting method using a diamond tool has a problem that the defect rate is high, the handling is difficult, and the productivity is lowered. The laser processing method has a problem that the production cost is high and the productivity and the yield are reduced due to the deformation of the product due to high heat.
そこで、本発明の目的は、チップを用いて加工面を直接打撃して様々な形と大きさのパターンに導光板を短時間に効率よく製造できるようにした、導光板のパターン加工方法及びその装置を提供することにある。 Therefore, an object of the present invention is to provide a pattern processing method for a light guide plate, which can efficiently manufacture a light guide plate in various shapes and sizes in a short time by directly hitting a processing surface using a chip and its To provide an apparatus.
上記目的は、設計されたパターンの位置、パターンのサイズデータ及びこれらに対応する打撃力データをダイアモンドチップ付き打撃装置に入力して加工面を打撃することにより、パターンを形成する段階と、加工面をマイクロスコープで確認し、異常があれば、加工面を研磨機で押し出し、加工条件を調節した後再加工する段階とを含む、打撃方式による導光板のパターン加工方法と、これに用いられる様々な形のチップを有する加工装置によって達成される。 The object is to input a designed pattern position, pattern size data and corresponding striking force data to a striking device with a diamond tip and strike the work surface to form a pattern, If there is an abnormality, the processing surface is extruded with a polishing machine, the processing conditions are adjusted, and the reworking step is included. This is achieved by a processing apparatus having a chip having a different shape.
本発明は、チップを用いて、精密に研削加工により鏡面処理された加工面に、設計されたパターンに対してデータ化された打撃力で打撃を加え、光効率に優れたパターンを短時間に加工できるようにすることにより、次の効果を持たせる。 The present invention uses a chip to strike a processed surface that has been precisely mirror-finished by grinding with a striking force that has been converted into data on a designed pattern, so that a pattern with excellent light efficiency can be obtained in a short time. By enabling processing, the following effects are provided.
1)チップを用いてコアの加工面を直接打撃するため、パターンの加工面がほぼ鏡面に近い粗度を有するように加工され、乱反射を最大限抑制し、損失を減少させて最上の光効率を得ることができる。 1) Since the core processing surface is directly struck using a chip, the processing surface of the pattern is processed so as to have a roughness close to that of a mirror surface, suppressing irregular reflection to the maximum, reducing loss, and achieving the highest light efficiency. Can be obtained.
2)打撃を加えるチップの形状に応じて様々な形状とサイズのパターンを加工することができるため、それだけ様々な形のパターン設計を試みることができる。 2) Since patterns of various shapes and sizes can be processed according to the shape of the chip to be hit, various pattern designs can be attempted accordingly.
3)熱処理された高強度の導光板または射出コアにパターンを直接加工することにより、耐久性が向上し、これによる生産コストも大幅節減される。 3) By directly processing the pattern on the heat-treated high-strength light guide plate or injection core, the durability is improved and the production cost is also greatly reduced.
4)同一のチップで、既に入力されたデータを用いて打撃を加えることにより、常時同一のパターンを加工することができ、加工工数が少なくて加工時間を短縮することができる。 4) With the same chip, the same pattern can always be processed by hitting using already input data, and the processing time can be reduced and the processing time can be shortened.
5)打撃力を調節するだけでパターンの深さ、サイズ、密度を容易に調節することができるため、設計とシミュレーションによる結果に最も近接した導光板を短時間に製作することができる。 5) Since the depth, size and density of the pattern can be easily adjusted simply by adjusting the striking force, the light guide plate closest to the result of the design and simulation can be manufactured in a short time.
以下、本発明の好適な実施例を添付図面に基づいて詳細に説明する。図1は本発明の導光板のパターン加工方法を説明するための流れ図である。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a flowchart for explaining a pattern processing method of a light guide plate according to the present invention.
本発明は、設計されたパターンの位置、パターンのサイズデータ及びこれに対応する打撃力データをチップ付き打撃装置に入力して加工面を打撃することにより、パターンを形成する段階と、加工面をマイクロスコープで確認し、異常があれば、加工面を研磨機で押し出し、加工条件を調節した後再加工する段階とからなる導光板のパターン加工方法に関するものである。 The present invention includes a step of forming a pattern by inputting a designed pattern position, pattern size data, and corresponding hitting force data into a hitting device with a chip and hitting the processing surface, and a processing surface. The present invention relates to a pattern processing method for a light guide plate, which includes a step of confirming with a microscope and, if there is an abnormality, extruding a processed surface with a polishing machine, adjusting a processing condition, and reprocessing.
加工面を打撃する打撃装置のチップの材質としては、単結晶のダイアモンドまたは超軽合金を使用する。 A single crystal diamond or a super light alloy is used as the material of the tip of the hitting device that hits the machined surface.
導光板にパターンが陽刻で形成される方式では、チップが打撃する加工面は射出コアであり、導光板にパターンが陰刻で形成される方式では、チップが打撃する加工面は導光板自体である。 In the method in which the pattern is formed on the light guide plate by the engraving, the processing surface on which the chip is struck is the injection core, and in the method in which the pattern is formed on the light guide plate by the inscription, the processing surface on which the chip is struck is the light guide plate itself. .
導光板と射出コアは、熱処理された高強度のStavax材質のものを使用し、導光板または射出コアの加工面は、乱反射を最大限抑制し、損失を減少させて最上の光効率を得るために、形状精度(PV)が2μm以下となるように鏡面処理する。 The light guide plate and the injection core are made of heat-treated high-strength Stavax material, and the processed surface of the light guide plate or the injection core suppresses irregular reflection as much as possible to reduce loss and obtain the best light efficiency. Then, the mirror surface treatment is performed so that the shape accuracy (PV) is 2 μm or less.
加工面の精度は導光板の輝度及び均一度と直結している。加工面を研磨加工して鏡面化することは、究極的に、設計されたパターンに最も近い製品が得られるようにする基本的な条件になる。 The accuracy of the processed surface is directly related to the brightness and uniformity of the light guide plate. Polishing the processed surface to make a mirror surface is ultimately a basic condition for obtaining a product closest to the designed pattern.
図2は本発明の導光板のパターン加工装置に装着されるチップの打撃力によるパターンの加工深さを示す図である。図2に示すように、チップの打撃力と加工深さは比例し、打撃加工装置は、チップの打撃力に対応する加工深さ、パターンのサイズに対するデータを有する。 FIG. 2 is a view showing a pattern processing depth by a striking force of a chip mounted on the light guide plate pattern processing apparatus of the present invention. As shown in FIG. 2, the hitting force of the chip is proportional to the processing depth, and the hitting processing apparatus has data on the processing depth and the pattern size corresponding to the hitting force of the chip.
図3は図2のようにチップの形状がV字状を成しても、角度によってパターンのサイズが異なる状態を示す図、図4はチップの形状が円形、菱形、五角形、六角形など様々な形で構成された状態を示す図である。 3 shows a state in which the size of the pattern varies depending on the angle even if the shape of the chip is V-shaped as in FIG. 2, and FIG. 4 shows various shapes such as a circle, rhombus, pentagon, and hexagon. It is a figure which shows the state comprised in various forms.
このようにチップを変えるだけで様々な形状のパターンを実現することができるということは、加工条件のためにパターンの形状が円形、菱形に制限されてパターンの設計に影響を及ぼす従来の方法とは異なり、本発明はパターンの設計時にパターンの形状に制限を受けないということである。 The fact that patterns of various shapes can be realized just by changing the chip in this way means that the pattern shape is limited to a circle or rhombus due to processing conditions, and this has an influence on the pattern design. In contrast, the present invention is not limited by the shape of the pattern when designing the pattern.
チップの先端が球形の場合にも、曲率を変えるだけで、パターンの加工深さやサイズが異なるパターンを実現することができる。 Even when the tip of the tip is spherical, it is possible to realize patterns with different processing depths and sizes by simply changing the curvature.
このように、本発明は、チップを変えるたけで様々な形のパターンを設計し試みることができるようにすることで、最適の光効率を有する導光板の製作に大きく寄与することができるものと期待される。 As described above, the present invention can greatly contribute to the manufacture of a light guide plate having an optimal light efficiency by allowing various patterns to be designed and tried simply by changing the chip. Be expected.
本発明は、設計されたパターンの光効率が、マイクロスコープによる確認結果、期待に及ばない場合、加工面を研磨機で押し出して鏡面処理した後、打撃装置の打撃力を調節しあるいはチップの角度、打撃間隔などを調節することにより、パターンの深さ、サイズ及び密度の調節を簡便に行うことができるため、設計とシミュレーションによる結果に最も近接した導光板を短時間に製作することができる。 In the present invention, when the light efficiency of the designed pattern is not as expected as a result of confirmation by a microscope, the processed surface is extruded with a polishing machine and mirror-finished, and then the impact force of the impact device is adjusted or the angle of the tip Since the depth, size and density of the pattern can be easily adjusted by adjusting the hitting interval and the like, the light guide plate closest to the result of the design and simulation can be manufactured in a short time.
また、本発明は、既に入力されたパターンデータ及びチップの打撃力データによって同一の条件下でパターンが加工されるため、常時同一のパターンを加工することができ、本出願人が実施してみた結果、2.0″の小型コアの場合、1時間以内にパターン作業を完了することができた。 In the present invention, since the pattern is processed under the same conditions based on the already input pattern data and the hitting force data of the chip, the same pattern can be processed at all times. As a result, in the case of a 2.0 ″ small core, the pattern work could be completed within one hour.
下記の表は、同様のデザインで設計されたパターンをエッチング方式と本発明の打撃方式で製作したコアで導光板を射出して測定した光特性比較表である。 The table below is a comparison table of optical characteristics measured by injecting a light guide plate with a core produced by etching and a striking method according to the present invention for a pattern designed with the same design.
比較例1)
比較例2)
前記比較例1、2から確認されるように、本発明の打撃方式は、従来のエッチング方式と比較するとき、均一度において8〜10%の向上した結果を得ることができる。
Comparative Example 1)
Comparative Example 2)
As can be seen from Comparative Examples 1 and 2, the hitting method of the present invention can obtain an 8 to 10% improvement in uniformity when compared with the conventional etching method.
以上、本発明を好適な実施例に限定して説明したが、これに限定されるのではなく、本発明の技術的思想から逸脱しない範囲内で様々な変形実施が可能であるのは勿論のことである。 Although the present invention has been described by limiting it to a preferred embodiment, the present invention is not limited thereto, and various modifications can be made without departing from the technical idea of the present invention. That is.
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KR1020040088531A KR100680569B1 (en) | 2004-11-02 | 2004-11-02 | Pattern processing method of light guide plate |
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WO2015067386A1 (en) * | 2013-11-06 | 2015-05-14 | The Swatch Group Research And Development Ltd | Method for manufacturing a light guide to light a display device, and light guide thus obtained |
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JP4021009B2 (en) | 1997-08-07 | 2007-12-12 | 日本電産コパル株式会社 | Method for manufacturing light guide member |
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JP2003195057A (en) | 2001-12-25 | 2003-07-09 | Towa Corp | Light guide plate forming method and light guide plate |
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WO2015067386A1 (en) * | 2013-11-06 | 2015-05-14 | The Swatch Group Research And Development Ltd | Method for manufacturing a light guide to light a display device, and light guide thus obtained |
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KR20060039956A (en) | 2006-05-10 |
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