JP2007030095A - Method for manufacturing diamond tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for easily manufacturing at a low cost, even a highly accurate diamond cutting edge for ultra-precision machining, in particular, of a diamond tool having a diamond tip formed with a cutting edge. <P>SOLUTION: The cutting edge is formed by forming cutting face and second flank in diamond, and the method includes: polishing the cutting face and second flank to mirror surfaces; machining an intersecting ridge of the cutting face and the second flank and the surrounding by focused ion beam; and forming a first flank. The machining is facilitated by making the polished cutting face as a plane and making the polished second flank by combining a plurality of planes. The polishing is performed so that a PV value is 3 to 300 nm in at least the surrounding of the cutting edge of the cutting face. The polishing is performed so that a PV value of a partial plane of the second flank constituted of a plurality of planes is 3 to 500 nm. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a diamond tool having a cutting edge formed on a diamond tip, and more particularly to an optical sheet for a display device such as a television screen or a mobile phone, or a mold for forming an optical element such as a light guide plate. The present invention relates to a method for manufacturing a diamond tool for precision machining.

Conventionally, for the optical surface processing of molds for optical elements such as optical disk pickup objective lenses and optical sheets, single-crystal diamond R cutting tools having an arcuate cutting edge at the tip are used. In order to obtain a high-precision optical surface only by cutting, a circular arc having a radius of about 0.05 μm to 2.5 μm is used. As a specific example of this R bite, there is a cutting edge whose arc part width is 0.8 μm, apex angle is 30 °, relief angle of the first flank is 11 °, and relief angle of the second flank is 45 °. A diamond tool is mentioned (for example, refer to Patent Document 1).
In addition, as a diamond cutting tool having a general shape cutting blade with a complicated cutting edge, there is a diamond cutting tool processed using a laser in the ultraviolet region for processing the cutting blade. This diamond tool is capable of obtaining a highly accurate cutting edge by using a laser whose wavelength is in the ultraviolet range, even if the cutting edge ridge is a complex shape consisting of a combination of straight lines and curves. (For example, see Patent Document 2).
These diamond tools require a cutting edge that can be machined with high precision, but as a method for manufacturing such diamond tools, the flank face is fed in a direction different from the polishing direction. By polishing the rake face in a state where the rake face is not fed in a direction different from the polishing direction and applying a blade, the edge of the cutting edge of the boundary line between the flank face and the rake face is applied. There is a method for producing a diamond tool having a cutting edge having a waviness in a shape projected in the cutting direction without a waviness and a shape projected in a direction perpendicular to the cutting direction (for example, see Patent Document 3).
Furthermore, a method of processing a three-dimensional fine shape in diamond with high accuracy using a focused ion beam has been proposed (see, for example, Patent Document 4).
JP 2003-62707 A (paragraph number 0055, FIG. 3) Japanese Patent Laid-Open No. 2003-25118 (paragraph number 0019, FIG. 1-3) JP-A-5-192805 JP-A-2005-14028

  However, even when cutting is performed by the method described in Patent Document 3, chipping is likely to occur during processing when the size of the tip of the cutting blade becomes fine, and it is easy to obtain a cutting blade that can perform high-precision processing. There is a problem that is not. Further, in the processing method using the focused ion beam described in Patent Document 4, since it is no-load processing, processing that forms a fine cutting edge is possible, but processing using the focused ion beam requires a long time for processing. Therefore, there is a problem that it is not realistic in terms of productivity and cost. In view of the above, the present invention provides a method for manufacturing a diamond tool that can easily form a high-precision diamond cutting edge capable of ultra-precise cutting at low cost.

  The method for producing a diamond tool according to the present invention is such that the rough shape of the cutting edge is formed in advance by grinding and polishing, the rake face and flank face forming the periphery of the cutting edge are processed into a mirror surface, and then the formation of the cutting edge is focused ion. This is done with a beam.

A first feature of the diamond tool manufacturing method of the present invention is a diamond tool manufacturing method in which a cutting edge is formed on a diamond tip,
Forming a rake face and a second flank face on the diamond;
Polishing the rake face and the second flank face into a mirror surface;
Forming a first flank by processing the ridge and the flank of the rake face and the periphery thereof with a focused ion beam.

  In the method for manufacturing a diamond tool according to the present invention, first, a rake face and a second flank face are formed on a diamond tip to form a shape around the cutting edge. The second flank is not limited to a single surface, but includes a combination of a plurality of flat surfaces and curved surfaces, and these surfaces and the rake surface form a shape around the cutting edge. The rake face and the second flank face are polished to a mirror surface, and the first flank face is formed by removing the crossed ridge where the rake face and the second flank face intersect with each other by a focused ion beam. Is done. Processing with a focused ion beam can be processed in almost the same way regardless of the crystal orientation of the diamond, and can be processed to a level of accuracy that is not problematic for use as a tool for ultra-precision processing. be able to. Therefore, it is possible to set the rake face and the second flank face in a direction in which polishing is easy, and to set the cutting edge in a direction with high wear resistance.

  The second feature is that the polished rake face is a flat surface, and the polished second flank face is a surface obtained by combining a plurality of flat surfaces.

  The rake face and the second flank are polished on the mirror surface as described above, but the rake face is a plane from the viewpoint of ease of processing, and the second flank is a plane combining a plurality of planes. Is preferred.

  A third feature is that, of the polished rake face, at least the PV value around the cutting edge is 3 to 300 nm.

  The fourth feature is that the polished second flank has a PV value of 3 to 500 nm on at least a part of the plurality of planes.

  Since the intersection ridge between the rake face and the second flank formed as described above and the periphery thereof are processed by a focused ion beam, a first flank is newly formed. Therefore, the rake face and the first flank are formed. The crossing ridge with is the cutting edge. Therefore, the second flank does not become a surface that forms the cutting edge, but it is necessary to finish at least the surface around the cutting edge including the rake face as a mirror surface. This is necessary for forming the cutting edge in a short time while minimizing the processing by the focused ion beam. The accuracy of the surface processed by the polishing process is such that at least a portion around the cutting edge, more preferably a region within 0.5 mm from the cutting edge, has a PV value of 3 to 300 nm and a plurality of second flank surfaces are included in the rake face. Polishing is performed so that the PV value of at least some of the planes is 3 to 500 nm. Of the second flank surfaces composed of a plurality of planes, a surface having such surface accuracy is necessary for a portion where the first flank surface is formed by the focused ion beam and the cutting blade is provided.

  A fifth feature is that the focused ion beam is irradiated at an angle that intersects the polished rake face and is smaller than the clearance angle of the polished second flank face. .

  The angle of irradiation of the focused ion beam is performed in such a direction that it intersects with the rake face and is smaller than the relief angle of the polished second flank. By doing so, the clearance angle of the first flank can be made smaller than the clearance angle of the second flank, and the amount of processing by the focused ion beam for forming the first flank is small. I'll do it. The focused ion beam is preferably irradiated from the second flank side toward the rake face side. In this way, the cutting edge portion does not sag and a very sharp cutting edge is formed.

  A sixth feature is that the width of the first flank is 60 μm or less.

  The width of the first flank formed as described above is set to 60 μm or less. The larger this width, the longer the processing time with the focused ion beam. Moreover, because the ultra-precision machining tool is finely processed, the elastic recovery phenomenon of the workpiece due to the burnishing action cannot be ignored, and if this width increases, the cutting resistance may increase due to contact with the workpiece. The thickness is preferably 60 μm or less.

  In the diamond tool manufacturing method of the present invention, the rake face and the flank face are formed in advance by grinding and polishing, and only the periphery of the cutting edge is processed by the focused ion beam. In addition to being obtained, the amount of processing with the focused ion beam becomes very small, and it becomes possible to manufacture in a short time. In addition, since the processing of the focused ion beam does not depend on the crystal orientation, the tool can be designed taking into account only the crystal orientation of the surface to be polished and the cutting edge, thereby improving the freedom of tool design and improving the service life. It becomes possible to make it a tool.

  The manufacturing method of the diamond tool of this invention is demonstrated based on drawing. FIGS. 1A to 1D are schematic views for explaining a manufacturing process of a diamond tool of the present invention, and FIGS. 1B and 1D are partially enlarged views of a cutting edge tip. The diamond tip 2 is formed by grinding a rough diamond into a plate shape and joined to the shank 3 by brazing or the like. The shank 3 is made of cemented carbide or the like, and a notch is provided at the tip for joining the diamond tip 2. The diamond tip 2 is bonded to the shank 3 and then processed into a predetermined shape by grinding as shown in FIG. As a result of this processing, the shape of the cutting edge becomes a shape provided with a rake face 4 and second flank faces 6a and 6b as shown in FIG. 1 (b). Next, these faces are lapped and raked. At least the periphery of the cutting edge of the surface 4 is polished so that the PV value is 3 to 300 nm, and the second flank surfaces 6a and 6b are polished so that the PV value is 3 to 500 nm. After the polishing is completed, the diamond tool 1 is attached to the focused ion beam apparatus, and the focused ion beam 8 is irradiated to the tip of the cutting edge. The focused ion beam 8 is irradiated in a direction intersecting with the rake face 4 and irradiated at an angle smaller than the clearance angle of the second flank 6. In this way, the intersection ridge between the rake face 4 and the second flank faces 6a and 6b and its periphery are removed. By performing this processing, as shown in FIG. 1 (d), a first flank 5 is formed, and an R-shaped cutting edge 7 is formed at the intersection of the rake face 4 and the first flank 5. It is formed.

  According to the above manufacturing method, a diamond tool was manufactured and a cutting test was performed. After preparing a single crystal diamond ore having a size of about 3 mm and determining the crystal orientation, the upper surface that becomes the rake face 4 and the lower surface that becomes the joint surface with the shank 3 are machined into a flat surface by grinding. Diamond tip 2 was obtained. The diamond chip 2 processed into a plate shape was joined to the tip of a cemented carbide shank 3 prepared in advance by brazing. A notch is provided at the tip of the shank 3, and the diamond tip 2 is joined to the notch. Thereafter, the upper surface of the diamond tip 2 was lapped to finish the PV value to 10 nm. Next, in order to form the second flank 6 on the diamond tip 2, the second flank 6 a and 6 b are formed by grinding and lapping is performed, and the second flank 6 a has a PV value. 20 nm and the 2nd flank 6b finished PV value to 50 nm. The clearance angle of the second flank 6a is 18 °, and the clearance angle of the second flank 6b is 24 °. By this processing, the tip side of the diamond tip 2 is formed by three planes of the rake face 4 and the second flank faces 6a and 6b. In this state, the diamond tool 1 is used as a focused ion beam apparatus. The first flank 5 was formed on and around the intersection ridge between the rake face 4 and the second flank 6 by attaching and irradiating a focused ion beam, and the cutting edge 7 was formed. The irradiation direction of the focused ion beam was substantially perpendicular to the rake face 4, and the beam angle was adjusted so that the relief angle of the first relief face 5 was 7 °. By this processing, the first flank 5 has a PV value of 10 nm and has polishing marks in a direction substantially perpendicular to the rake face 4.

  Using the diamond tool 1 manufactured as described above, cutting of oxygen-free copper was performed. The machining is to form a groove having a depth of 10 μm by fly cutting, and the cutting conditions are a cutting speed of 565 m / min, a tool cutting of 5 μm, and a feed of 40 mm / min.

  As a result of conducting a cutting test under the above conditions, it was found that the diamond tool of the present invention had a good shape transfer of 100 nm, and that the diamond tool of the present invention can perform high-precision processing. In addition, since the strength of the blade edge was increased and chipping was less likely to occur, the life was improved, and interference with the workpiece did not occur.

  The method for manufacturing a diamond tool of the present invention can be used for manufacturing a diamond tool having a cutting blade having a complicated shape in addition to a diamond tool having a uniform cutting edge having a straight or curved shape.

It is a figure which shows the outline | summary for demonstrating the manufacturing method of the diamond tool of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Diamond tool 2 Diamond tip 3 Shank 4 Rake face 5 First flank 6 Second flank 7 Cutting edge 8 Focused ion beam

Claims (6)

A diamond tool manufacturing method in which a cutting edge is formed on a diamond tip,
Forming a rake face and a second flank face on the diamond;
Polishing the rake face and the second flank face into a mirror surface;
A method of manufacturing a diamond tool, including a step of forming a first flank by processing a ridge surface and a second flank at an intersection ridge and its periphery with a focused ion beam.   The diamond tool manufacturing method according to claim 1, wherein the polished rake face is a flat surface, and the polished second flank face is a surface obtained by combining a plurality of flat surfaces.   3. The method for manufacturing a diamond tool according to claim 1, wherein at least the PV value around the cutting edge of the polished rake face is 3 to 300 nm.   3. The method for manufacturing a diamond tool according to claim 2, wherein the polished second flank has a PV value of at least a part of the plurality of planes of 3 to 500 nm.   The irradiation angle of the focused ion beam is irradiated at an angle that intersects with the polished rake face and is smaller than the relief angle of the polished second flank face. The manufacturing method of the diamond tool of description.   The method for manufacturing a diamond tool according to any one of claims 1 to 5, wherein a width of the first flank is 60 m or less.

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