CN106425349A - Micro-display etch cutting tool manufacture method - Google Patents
Micro-display etch cutting tool manufacture method Download PDFInfo
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- CN106425349A CN106425349A CN201610637691.5A CN201610637691A CN106425349A CN 106425349 A CN106425349 A CN 106425349A CN 201610637691 A CN201610637691 A CN 201610637691A CN 106425349 A CN106425349 A CN 106425349A
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- China
- Prior art keywords
- micro
- aobvious
- cutlery
- etch cut
- etch
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- ing And Chemical Polishing (AREA)
Abstract
A micro-display etch cutting tool manufacture method comprises the following steps: using a micro-display etch cutting device to primarily process a micro-display etch cutting tool; using a turning or polishing mode to remove a nanometer level amorphous modification layer; using the micro-display etch cutting device to milling and refine according to regulated specifications, thus forming a rear tool face and a side tool face of the micro-display etch cutting tool, and forming the micro-display etch cutting tool.
Description
Technical field
The invention belongs to micro- cut technical field, particularly to a kind of manufacture method of micro- aobvious etch cut cutlery.
Background technology
With the development of China's microelectronics industry, most accurate device and specific apparatus be required for micro- cut technology, micro- aobvious erosion
Cut device exposure technique and its application technology also will be raised to new level.Micro- technology of cutting has extraordinary collimation,
The numerical aperture of micro- aobvious etch cut device projecting lens only has 0.001, and its depth of focus is up to 100 μm that is to say, that silicon chip surface is any
Rise and fall within 100 μm, the resolving power of ion beam is basically unchanged.And the depth of focus of optical exposure only has 1～2 μm, can clearly show
Go out the bargraphs that micro- aobvious etch cut device projection exposure obtains, when lines cross over the relief fabric of silicon chip surface, its live width is not appointed
What changes.Another advantage of micro- aobvious etch cut device projection exposure is to penetrate depth by controlling what ion energy can control ion
Degree, thus control the exposure depth of resist.Micro- micro- aobvious etch cut cutlery cutting technology manufacture can be used for answering of special delicate fields
Miscellaneous micro-nano structure and the processing and manufacturing of device, most probably in nanoscale cutting.Micro- aobvious etch cut device has emphatically in semicon industry
Act on, Ultra-precision Turning will obtain high accuracy, except supporting precision machine tool, high score detecting instrument corresponding environment bar
Beyond part, must also possess the micro- aobvious etch cut cutlery of high accuracy.Radius of edge directly affects working angles, therefore, reduces radius of edge,
The extruding force to metal for the cutter can be reduced, be favorably improved the stability of working angles, improve workpiece quality and prolongation cutlery makes
Use the life-span.
Therefore, designer of the present invention carries out primary processing first with micro- aobvious etch cut device to cutter, then adopts turning
Or finishing method removes the amorphous layer in the primary processing of micro- aobvious etch cut device, recycle the micro- aobvious etch cut sword of micro- aobvious etch cut device of refining
The radius of edge of tool, rounded cutting edge radius is smaller than 15nm.The method has high precision, repeatability is strong, be applied to multiple materials
The features such as material and the shape of tool.
Content of the invention：
It is an object of the invention to provide a kind of manufacture method of micro- aobvious etch cut cutlery, this technical scheme overcomes existing side
The defect of method complicated processing cutter profile, reaches nanoscale radius of edge, is refined into a kind of micro- aobvious etch cut cutlery.
The present invention adopts the following technical scheme that：
A kind of manufacture method of micro- aobvious etch cut cutlery, is realized by following steps：
A. using micro- aobvious etch cut device, micro- aobvious etch cut cutlery blank is carried out with primary processing, form cutlery rake face；
B. turning or finishing method is utilized to remove the nanoscale amorphous modified layer that cutlery rake face produces, to cutlery rake face
Implement refinement treatment；
C. the micro- aobvious etch cut cutlery after rake face refinement treatment is put in micro- aobvious etch cut device, according to set specification, profit
With micro- aobvious etch cut device milling refine, it is refined into rear knife face and the side knife surface of micro- aobvious etch cut cutlery, thus reaching micro- aobvious etch cut sword
The manufacture of tool.
The present invention preferably scheme is that above-mentioned micro- aobvious etch cut device is 15～60KeV, 10～30nA；Above-mentioned is micro- aobvious
Micro- aobvious etch cut device employed in etch cut device Milling Process is set as 5～20KeV, 2～8nA.
For a kind of manufacture method of micro- aobvious etch cut cutlery proposed by the present invention, this case designer is first with micro- aobvious etch cut
Device carries out primary processing to cutter, then removes the amorphous in the primary processing of micro- aobvious etch cut device using turning or finishing method
Layer, recycles the radius of edge of the micro- aobvious etch cut cutlery of micro- aobvious etch cut device of refining, and rounded cutting edge radius is smaller than 20nm.The method
There is high precision, repeatability is strong, be applied to the features such as multiple material and cutlery shape.
Brief description
Fig. 1 is the schematic diagram of the micro- aobvious etch cut cutlery of the present invention.
Symbol description：
A. cutlery,
B. the amorphous layer that primary cutting is formed,
C. the cutlery after micro- aobvious etch cut device of refining is processed.
Described above is only the general introduction of technical solution of the present invention, in order to be able to better understand the technological means of the present invention, and
Can be practiced according to the content of description, and be to allow the above and other objects, features and advantages of the present invention can be brighter
Aobvious understandable, below especially exemplified by preferred embodiment, describe in detail as follows.
Specific embodiment：
For further illustrating that the present invention is to reach technological means and effect that predetermined goal of the invention is taken, referring to
Accompanying drawing, and combine preferred embodiment, to according to a kind of manufacture method of micro- aobvious etch cut cutlery proposed by the present invention, it is embodied as
Mode, feature etc., after describing in detail such as.
Embodiment：
A kind of manufacture method of micro- aobvious etch cut cutlery proposed by the present invention, is processed to various including car, milling, plane etc.
Miniature cutlery.The material of above-mentioned min-cutter can be the superhard materials such as polycrystalline diamond, hard alloy.
A kind of manufacture method of micro- aobvious etch cut cutlery proposed by the present invention：First with micro- aobvious etch cut device, cutter is carried out
Primary processing, removes the amorphous layer in the primary processing of micro- aobvious etch cut device using turning or finishing method then, recycles micro- aobvious
The radius of edge of the micro- aobvious etch cut cutlery of etch cut device of refining, rounded cutting edge radius is smaller than 20nm.The method have high precision, can
Repeatability is strong, be applied to the features such as multiple material and cutlery shape.
Above-mentioned micro- aobvious etch cut device, can adopt beryllium ion, gallium ion；Then take the processing method of polishing；Then real
Apply refinement treatment.
The above, be only presently preferred embodiments of the present invention, not the present invention is made with any pro forma restriction, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any is familiar with this professional technology people
Member, in the range of without departing from technical solution of the present invention, when the technology contents of available the disclosure above make a little change or modification
For the Equivalent embodiments of equivalent variations, as long as being the content without departing from technical solution of the present invention, the technical spirit of the foundation present invention
Any simple modification, equivalent variations and the modification that above example is made, all still falls within the range of technical solution of the present invention.
Claims (1)
1. a kind of manufacture method of micro- aobvious etch cut cutlery it is characterised in that：A. utilize micro- aobvious etch cut device to micro- aobvious etch cut cutlery
Blank carries out primary processing, forms cutlery rake face；B. turning or finishing method is utilized to remove the nanometer that cutlery rake face produces
Level amorphous modified layer, implements refinement treatment to cutlery rake face；C. the micro- aobvious etch cut cutlery after rake face refinement treatment is put into
In micro- aobvious etch cut device, according to set specification, using micro- aobvious etch cut device milling refine, it is refined into the rear knife of micro- aobvious etch cut cutlery
Face and side knife surface, thus reach the manufacture of micro- aobvious etch cut cutlery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610637691.5A CN106425349A (en) | 2016-08-07 | 2016-08-07 | Micro-display etch cutting tool manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610637691.5A CN106425349A (en) | 2016-08-07 | 2016-08-07 | Micro-display etch cutting tool manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106425349A true CN106425349A (en) | 2017-02-22 |
Family
ID=58184566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610637691.5A Pending CN106425349A (en) | 2016-08-07 | 2016-08-07 | Micro-display etch cutting tool manufacture method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007030095A (en) * | 2005-07-27 | 2007-02-08 | Allied Material Corp | Method for manufacturing diamond tool |
| CN102029448A (en) * | 2010-10-28 | 2011-04-27 | 北京理工大学 | Electric spark shaping and processing method of microminiature cutter |
| CN102101641A (en) * | 2010-11-26 | 2011-06-22 | 天津大学 | Method for accessorily obtaining minitype cutter with high-accuracy cutting edge by utilizing film coating technology |
| CN103084814A (en) * | 2013-01-18 | 2013-05-08 | 天津大学 | Manufacturing method of sharp cutting edge micro cutting tool |
| CN103526160A (en) * | 2012-07-04 | 2014-01-22 | 日本航空电子工业株式会社 | Method of processing ridge of cutting edge and instrument with processed ridge of cutting edge |
-
2016
- 2016-08-07 CN CN201610637691.5A patent/CN106425349A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007030095A (en) * | 2005-07-27 | 2007-02-08 | Allied Material Corp | Method for manufacturing diamond tool |
| CN102029448A (en) * | 2010-10-28 | 2011-04-27 | 北京理工大学 | Electric spark shaping and processing method of microminiature cutter |
| CN102101641A (en) * | 2010-11-26 | 2011-06-22 | 天津大学 | Method for accessorily obtaining minitype cutter with high-accuracy cutting edge by utilizing film coating technology |
| CN103526160A (en) * | 2012-07-04 | 2014-01-22 | 日本航空电子工业株式会社 | Method of processing ridge of cutting edge and instrument with processed ridge of cutting edge |
| CN103084814A (en) * | 2013-01-18 | 2013-05-08 | 天津大学 | Manufacturing method of sharp cutting edge micro cutting tool |
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Application publication date: 20170222 |
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