CN102101641A - Method for accessorily obtaining minitype cutter with high-accuracy cutting edge by utilizing film coating technology - Google Patents
Method for accessorily obtaining minitype cutter with high-accuracy cutting edge by utilizing film coating technology Download PDFInfo
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- CN102101641A CN102101641A CN2010105628610A CN201010562861A CN102101641A CN 102101641 A CN102101641 A CN 102101641A CN 2010105628610 A CN2010105628610 A CN 2010105628610A CN 201010562861 A CN201010562861 A CN 201010562861A CN 102101641 A CN102101641 A CN 102101641A
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Abstract
The invention relates to a method for accessorily obtaining a minitype cutter with a high-accuracy cutting edge by utilizing a film coating technology, belonging to the technical field of machining and manufacture of complex micro-nano structures and devices. The method comprises the following steps of: carrying out rough machining on a minitype cutter blank by utilizing focused ion beams in a focused ion beam vacuum sample chamber to obtain the rake face of the minitype cutter; finishing and polishing the rake face by utilizing a focused ion beam milling method; carrying out film coating treatment on the machined rake face of the minitype cutter; placing the minitype cutter with a film coated into the focused ion beam vacuum sample chamber, and machining the flank face and the lateral face of the minitype cutter according to the requirements for shape and dimension of the cutting edge by utilizing focused ion beam milling. The method has high accuracy and repeatability and is suitable for multiple materials and different cutter shapes.
Description
Technical field
The present invention relates to a kind of auxiliary method that obtains to reduce the min-cutter radius of edge of coating technique of utilizing, little cutter of this method processing can be used for the complicated micro-nano structure in the Super-Precision ﹠ Minuteness Processing field and the processing and manufacturing of device, also can be used in the mechanism research application of nanoscale cutting.
Background technology
For the ultra precision cutting processing technology, obtain the high accuracy of part shape size and the ultra-smooth of finished surface, except must having ultraprecise lathe, high-resolution detecting instrument and overstable processing environment condition, also must possess the high-precision micro cutter that carries out machining.In the ultra precision cutting process, the stress state in cutter sword proparea is very complicated, and stress is concentrated and to be caused in the metal dislocation to concentrate, and causes metal to produce plastic deformation and slip apart, part metal becomes smear metal and flows out along rake face, another part metal through after the knife face pressing stay machined surface.Because two parts movement of metallic direction difference must make the preceding metal of cutting edge roundness be extended state, under the direct effect of blade, metal produces slip apart.And the cutting edge roundness radius is more little, and stress is concentrated more, and it is easy more to be out of shape, and cutting force is more little, and machined surface quality is good more.Radius of edge has considerable influence to working angles, simultaneously cutting force, cutting temperature and chip deformation coefficient is all had in various degree influence.Therefore, reduce radius of edge, can reduce the extruding force of cutter to metal, the metal deformation degree is reduced, the flow harden that slows down metal helps to improve the stability of working angles, improves machined surface quality and prolongs cutter life.
Domestic research to the cutter grinding technology is started late, and can't stablize the technical indicator that reaches high precision cutting tools.As at the tool sharpening process aspect, can only be to about the 100nm with the rounded cutting edge radius sharpening of straight line blade diamond cutter.
The present invention proposes a kind ofly to reduce the new method of little cutting edge roundness radius based on coating technique, and rounded cutting edge radius can be compared with other conventional methods less than 20nm, the method have the precision height, repeatable strong, be applicable to advantages such as the multiple material and the shape of tool.
Summary of the invention:
Technology of the present invention is dealt with problems and is: overcome traditional diamond-making technique and be difficult to the nanoscale radius of edge of realization and the shortcoming of complex cutting tool profile processing, propose a kind of assisting based on coating technique cutter is carried out to type processing, obtain the new method of keen edge cutter.The present invention adopts following technical scheme:
A kind of auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique of utilizing, realize by following steps:
(1) indoor in the FIB vacuum sample, utilize FIB that little cutter blank is carried out roughing, process the cutter rake face;
(2) utilize the FIB method for milling that the rake face refine is polished;
(3) rake face to the little cutter after the processing carries out coating film treatment;
(4) it is indoor to put the little cutter behind the plated film into the FIB vacuum sample, according to blade shape and dimensional requirement, utilizes the FIB Milling Process to go out the back knife face and the side knife surface of little cutter.
As preferred implementation, the described FIB of step (1) is the FIB of 5~50KeV, 10~30nA; The FIB that the described FIB method for milling of step (2) is adopted is 1~10nA FIB; The film thickness of step (3) coating film treatment is less than 100 microns, and the kind of film is diamond-film-like, amorphous tetrahedron carbon film; The FIB that is adopted in the FIB Milling Process described in the step (4) is 1~5nA FIB; In the step (4) rake face of plated film is carried out the side knife surface and the back knife face processing of cutter back to ion beam direction.
The present invention adopts and in advance min-cutter is carried out coating film treatment, utilize method dressing cutting edges such as FIB milling then, plated film strengthens handles generation probability such as microcosmic tipping, burr when having effectively reduced acquisition Tool in Cutting sword, thereby can obtain to have the sharp cutter of nano level arc radius cutting edge.The method precision height that the present invention proposes, repeatable strong, be applicable to the multiple material and the different shape of tools.
Description of drawings
Cutting edge roundness schematic diagram before Fig. 1 plated film.
Cutting edge roundness schematic diagram behind Fig. 2 plated film.
Description of reference numerals is as follows:
The bigger radius of edge of 1 uncoated rake face, 2 cutter hubs 3
The less radius of edge of rake face 22 cutter hubs 23 behind 21 plated films
The direction of 24 FIB retrofits
The specific embodiment
The new method of the reduction radius of edge based on coating technique of the present invention can be used for various min-cutters such as processing comprises car, mills, brill, mill, plane.The material of min-cutter can be typical cutter materials such as single-crystal diamond, polycrystalline diamond, cubic boron nitride, carbide alloy and high-speed steel.Mainly comprise the following steps: at first indoorly, utilize the big beam focusing ion beam of high-energy that the min-cutter blank is carried out roughing, process the cutter rake face in the FIB vacuum sample.FIB can be that typical cases such as gallium ion, beryllium ion, ar-ion beam use ion beam; Secondly, utilize the FIB milling, reduce the rake face roughness, realize smooth rake face preparation rake face refine polishing; Little cutter after will processing is then put filming equipment into coating film treatment is carried out on surfaces such as its rake face, and the thickness of cutting edge plated film layer is less than 100 microns usually; Plated film of the present invention and coating technique can comprise: the diamond-film-like of plasma enhanced chemical vapor deposition method (DLC), filtered cathodic vacuum arc legal system are equipped with the various plated films close with diamond hardness of preparations such as amorphous tetrahedral carbon (ta-C) film, magnetron sputtering plating, hot vapour deposition method; It is indoor to put the little cutter behind the plated film into the FIB vacuum sample again, according to requirements such as blade shape and sizes, the rake face of plated film is carried out the side knife surface and the back knife face FIB Milling Process of cutter back to ion beam direction, by last FIB refine, the plated film layer can effectively strengthen cutter rake face rigidity, reduce the probability of cutting edge microcosmic tipping, realize the min-cutter preparation of high accuracy cutting edge.
Below in conjunction with implementing grain the present invention is further described.
Referring to Fig. 1 and Fig. 2, at first little cutter blank 2 to be processed is installed on FIB/ESEM (FIB/SEM) double-beam system example platform.Utilize the big line 10~30nA of high-energy 5~50KeV FIB that the min-cutter blank is carried out roughing, at first process cutter rake face 1 according to desired location; Then utilize the milling of 1~10nA FIB to rake face 1 refine polishing, realize smooth rake face preparation, make rake face not have vestiges such as obvious milling groove;
Min-cutter with processing takes out the sample room then, it is carried out surface such as rake face 1 and carries out coating film treatment, adopts the filtered cathodic vacuum arc legal system to be equipped with amorphous tetrahedral carbon (ta-C) film, and coating film thickness reaches 1.5 microns.Cutter behind the plated film 22 is reinstalled on the FIB processing platform.The position of cutter blank end is adjusted to the operating distance 19.5mm of ion beam, specimen rotating holder then, make plated film min-cutter rake face 21 back to FIB direction 4, the side knife surface of process tool and back knife face, tool clearance and angle, rear flank are 7~12 degree.Use the milling of 1~5nA FIB at last, obtain cutting edge 23 arc radius 23 and be the preparation of 5-20nm min-cutter.
Claims (6)
1. one kind is utilized the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique, realizes by following steps:
(1) indoor in the FIB vacuum sample, utilize FIB that little cutter blank is carried out roughing, process the cutter rake face;
(2) utilize the FIB method for milling that the rake face refine is polished;
(3) rake face to the little cutter after the processing carries out coating film treatment;
(4) it is indoor to put the little cutter behind the plated film into the FIB vacuum sample, according to blade shape and dimensional requirement, utilizes the FIB Milling Process to go out the back knife face and the side knife surface of little cutter.
2. the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique of utilizing according to claim 1 is characterized in that the described FIB of step (1) is the FIB of 5~50KeV, 10~30nA.
3. the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique of utilizing according to claim 1 is characterized in that the FIB that the described FIB method for milling of step (2) is adopted is 1~10nA FIB.
4. the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique of utilizing according to claim 1 is characterized in that the film thickness of step (3) coating film treatment is less than 100 microns, and the kind of film is diamond-film-like, amorphous tetrahedron carbon film.
5. the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique of utilizing according to claim 1 is characterized in that the FIB that is adopted in the FIB Milling Process described in the step (4) is 1~5nA FIB.
6. the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique of utilizing according to claim 1 is characterized in that, in the step (4) rake face of plated film is carried out the side knife surface and the back knife face processing of cutter back to ion beam direction.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103084814A (en) * | 2013-01-18 | 2013-05-08 | 天津大学 | Manufacturing method of sharp cutting edge micro cutting tool |
CN105855821A (en) * | 2016-05-18 | 2016-08-17 | 燕山大学 | Precise machining method for nanometer twin crystal cubic boron nitride micro turning tool |
CN106425349A (en) * | 2016-08-07 | 2017-02-22 | 张春辉 | Micro-display etch cutting tool manufacture method |
CN109514057A (en) * | 2018-12-28 | 2019-03-26 | 天津商业大学 | A kind of controllable dressing method of diamond cutter based on focused ion beam processing |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007163160A (en) * | 2005-12-09 | 2007-06-28 | Semiconductor Energy Lab Co Ltd | Focused ion beam processing method, and preparation method of transmission electron microscope sample using it |
CN101543901A (en) * | 2009-02-27 | 2009-09-30 | 天津大学 | Method for preparing micro cutter based on focused ion beam technology |
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2010
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007163160A (en) * | 2005-12-09 | 2007-06-28 | Semiconductor Energy Lab Co Ltd | Focused ion beam processing method, and preparation method of transmission electron microscope sample using it |
CN101543901A (en) * | 2009-02-27 | 2009-09-30 | 天津大学 | Method for preparing micro cutter based on focused ion beam technology |
Non-Patent Citations (1)
Title |
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张少婧等: "基于聚焦离子束铣削技术的微刀具制备", 《天津大学学报》, vol. 43, no. 5, 31 May 2010 (2010-05-31), pages 469 - 472 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103084814A (en) * | 2013-01-18 | 2013-05-08 | 天津大学 | Manufacturing method of sharp cutting edge micro cutting tool |
CN105855821A (en) * | 2016-05-18 | 2016-08-17 | 燕山大学 | Precise machining method for nanometer twin crystal cubic boron nitride micro turning tool |
CN106425349A (en) * | 2016-08-07 | 2017-02-22 | 张春辉 | Micro-display etch cutting tool manufacture method |
CN109514057A (en) * | 2018-12-28 | 2019-03-26 | 天津商业大学 | A kind of controllable dressing method of diamond cutter based on focused ion beam processing |
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