CN102101641B - Method for accessorily obtaining minitype cutter with high-accuracy cutting edge by utilizing film coating technology - Google Patents
Method for accessorily obtaining minitype cutter with high-accuracy cutting edge by utilizing film coating technology Download PDFInfo
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- CN102101641B CN102101641B CN201010562861.0A CN201010562861A CN102101641B CN 102101641 B CN102101641 B CN 102101641B CN 201010562861 A CN201010562861 A CN 201010562861A CN 102101641 B CN102101641 B CN 102101641B
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Abstract
The invention relates to a method for accessorily obtaining a minitype cutter with a high-accuracy cutting edge by utilizing a film coating technology, belonging to the technical field of machining and manufacture of complex micro-nano structures and devices. The method comprises the following steps of: carrying out rough machining on a minitype cutter blank by utilizing focused ion beams in a focused ion beam vacuum sample chamber to obtain the rake face of the minitype cutter; finishing and polishing the rake face by utilizing a focused ion beam milling method; carrying out film coating treatment on the machined rake face of the minitype cutter; placing the minitype cutter with a film coated into the focused ion beam vacuum sample chamber, and machining the flank face and the lateral face of the minitype cutter according to the requirements for shape and dimension of the cutting edge by utilizing focused ion beam milling. The method has high accuracy and repeatability and is suitable for multiple materials and different cutter shapes.
Description
Technical field
The present invention relates to a kind of auxiliary method that reduces min-cutter radius of edge that obtains of coating technique of utilizing, micro-cutter of the method processing can be used for complicated micro-nano structure in Super-Precision & Minuteness Processing field and the processing and manufacturing of device, during the mechanism research that also can be used for nanoscale cutting is applied.
Background technology
For Ultra-precision machining technique, obtain the high accuracy of part shape size and the ultra-smooth of finished surface, except must having ultraprecise lathe, high-resolution detecting instrument and overstable processing environment condition, also must possess the high-precision micro cutter that carries out machining.In ultra precision cutting process, the stress state in cutter sword proparea is very complicated, and stress is concentrated and caused metal Dislocations to concentrate, and causes metal to produce plastic deformation and slip apart, part metal becomes smear metal and flows out along rake face, another part metal through after knife face pressing stay machined surface.Because two parts movement of metallic direction is different, must make the front metal of cutting edge roundness be extended state, under the direct effect of blade, metal produces slip apart.And tool edge radius is less, stress is more concentrated, and it is easier to be out of shape, and cutting force is less, and machined surface quality is better.Radius of edge has considerable influence to working angles, cutting force, cutting temperature and chip deformation coefficient is had to impact in various degree simultaneously.Therefore, reduce radius of edge, can reduce the extruding force of cutter to metal, the deformation extent of metal is reduced, slow down the flow harden of metal, contribute to improve the stability of working angles, improve machined surface quality and tool life.
The domestic research to cutter grinding technology is started late, and can't stablize the technical indicator that reaches high precision cutting tools.As at tool sharpening process aspect, can only be by the rounded cutting edge radius sharpening of straight line blade diamond cutter to 100nm left and right.
The present invention proposes a kind of new method that reduces micro-tool edge radius based on coating technique, and rounded cutting edge radius can be less than 20nm, compare with other conventional methods, the method have precision high, repeatable strong, be applicable to the advantages such as multiple material and the shape of tool.
Summary of the invention:
Technology of the present invention is dealt with problems and is: overcome nanoscale radius of edge that traditional diamond-making technique be difficult to realize and the shortcoming of complex cutting tool contour machining, propose a kind ofly based on coating technique is auxiliary, cutter to be carried out to processing and forming, obtain the new method of keen edge cutter.The present invention adopts following technical scheme:
Utilize the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique, by following steps, realize:
(1) indoor in FIB vacuum sample, utilize FIB to carry out roughing to micro-cutter blank, process cutter rake face;
(2) utilize FIB method for milling to rake face refine polishing;
(3) rake face of the micro-cutter after processing is carried out to coating film treatment;
(4) put the micro-cutter after plated film into FIB vacuum sample indoor, according to blade shape and dimensional requirement, utilize FIB Milling Process to go out rear knife face and the side knife surface of micro-cutter.
As preferred embodiment, the described FIB of step (1) is the FIB of 5～50KeV, 10～30nA; The FIB that the described FIB method for milling of step (2) adopts is 1～10nA FIB; The film thickness of step (3) coating film treatment is less than 100 microns, and the kind of film is diamond-film-like, amorphous tetrahedron carbon film; The FIB adopting in FIB Milling Process described in step (4) is 1～5nA FIB; In step (4), the rake face of plated film is carried out to side knife surface and the processing of rear knife face of cutter back to ion beam direction.
The present invention adopts and in advance min-cutter is carried out to coating film treatment, then utilize the method dressing cutting edges such as FIB milling, plated film enhancing is processed microcosmic tipping, burr etc. while having effectively reduced acquisition Tool in Cutting sword and is generated probability, thereby can obtain the sharp cutter with nano level arc radius cutting edge.Method precision that the present invention proposes is high, repeatable strong, be applicable to multiple material and the different shape of tool.
Accompanying drawing explanation
Cutting edge roundness schematic diagram before Fig. 1 plated film.
Cutting edge roundness schematic diagram after Fig. 2 plated film.
Description of reference numerals is as follows:
The larger radius of edge of 1 uncoated rake face 2 cutter hub 3
The less radius of edge of rake face 22 cutter hub 23 after 21 plated films
The direction of 24 FIB retrofits
The specific embodiment
The new method of the reduction radius of edge based on coating technique of the present invention, can comprise the various min-cutters such as car, milling, brill, mill, plane for processing.The material of min-cutter can be the typical cutter materials such as single-crystal diamond, polycrystalline diamond, cubic boron nitride, carbide alloy and high-speed steel.Mainly comprise the following steps: first indoorly in FIB vacuum sample, utilize the large beam focusing ion beam of high-energy to carry out roughing to min-cutter blank, process cutter rake face.FIB can be typical case's application ion beams such as gallium ion, beryllium ion, ar-ion beam; Secondly, utilize FIB milling to rake face refine polishing, reduce rake face roughness, realize smooth rake face preparation; Then put the micro-cutter after processing into filming equipment coating film treatment is carried out in the surfaces such as its rake face, the thickness of cutting edge film plating layer is less than 100 microns conventionally; Plated film of the present invention and coating technique can comprise: the various plated films close with diamond hardness that the diamond-film-like of plasma enhanced chemical vapor deposition method (DLC), filtered cathodic vacuum arc legal system are prepared for amorphous tetrahedral carbon (ta-C) film, magnetron sputtering plating, hot vapour deposition method etc.; Put the micro-cutter after plated film into FIB vacuum sample more indoor, according to requirements such as blade shape and sizes, the rake face of plated film is carried out to side knife surface and the rear knife face FIB Milling Process of cutter back to ion beam direction, by last FIB refine, film plating layer can effectively strengthen cutter rake face rigidity, reduce the probability of cutting edge microcosmic tipping, realize the min-cutter preparation of high accuracy cutting edge.
Below in conjunction with implementing grain, the present invention is further described.
Referring to Fig. 1 and Fig. 2, first micro-cutter blank 2 to be processed is arranged on FIB/ESEM (FIB/SEM) double-beam system example platform.Utilize the large line 10～30nA of high-energy 5～50KeV FIB to carry out roughing to min-cutter blank, according to desired location, first process cutter rake face 1; Then utilize the milling of 1～10nA FIB to rake face 1 refine polishing, realize smooth rake face preparation, make rake face without vestiges such as obvious milling grooves;
Then the min-cutter of processing is taken out to sample room, it is carried out to the surfaces such as rake face 1 and carry out coating film treatment, adopt filtered cathodic vacuum arc legal system for amorphous tetrahedral carbon (ta-C) film, coating film thickness reaches 1.5 microns.Cutter after plated film 22 is reinstalled on FIB processing platform.The position of cutter blank end is adjusted to the operating distance 19.5mm of ion beam, then specimen rotating holder, make plated film min-cutter rake face 21 back to FIB direction 4, the side knife surface of process tool and rear knife face, tool clearance and angle, rear flank are 7～12 degree.Finally use the milling of 1～5nA FIB, obtain cutting edge 23 arc radius 23 for the preparation of 5-20nm min-cutter.
Claims (5)
1. utilize the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique, by following steps, realize:
(1) indoor in FIB vacuum sample, utilize FIB to carry out roughing to micro-cutter blank, process cutter rake face;
(2) utilize FIB method for milling to rake face refine polishing;
(3) rake face of the micro-cutter after processing is carried out to coating film treatment, the kind of film is diamond-film-like or amorphous tetrahedron carbon film;
(4) put the micro-cutter after plated film into FIB vacuum sample indoor, make the rake face of plated film back to ion beam direction, according to blade shape and dimensional requirement, utilize FIB Milling Process to go out rear knife face and the side knife surface of micro-cutter.
2. the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique of utilizing according to claim 1, is characterized in that, the described FIB of step (1) is the FIB of 5～50KeV, 10～30nA.
3. the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique of utilizing according to claim 1, is characterized in that, the FIB that the described FIB method for milling of step (2) adopts is 1～10nA FIB.
4. the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique of utilizing according to claim 1, is characterized in that, the film thickness of step (3) coating film treatment is less than 100 microns.
5. the auxiliary method that obtains high accuracy cutting edge min-cutter of coating technique of utilizing according to claim 1, is characterized in that, the FIB adopting in the FIB Milling Process described in step (4) is 1～5nA FIB.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010562861.0A CN102101641B (en) | 2010-11-26 | 2010-11-26 | Method for accessorily obtaining minitype cutter with high-accuracy cutting edge by utilizing film coating technology |
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| CN201010562861.0A CN102101641B (en) | 2010-11-26 | 2010-11-26 | Method for accessorily obtaining minitype cutter with high-accuracy cutting edge by utilizing film coating technology |
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| CN102101641B true CN102101641B (en) | 2014-03-12 |
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| CN103084814A (en) * | 2013-01-18 | 2013-05-08 | 天津大学 | Manufacturing method of sharp cutting edge micro cutting tool |
| CN105855821A (en) * | 2016-05-18 | 2016-08-17 | 燕山大学 | Precise machining method for nanometer twin crystal cubic boron nitride micro turning tool |
| CN106425349A (en) * | 2016-08-07 | 2017-02-22 | 张春辉 | Micro-display etch cutting tool manufacture method |
| CN109514057A (en) * | 2018-12-28 | 2019-03-26 | 天津商业大学 | A kind of controllable dressing method of diamond cutter based on focused ion beam processing |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101543901A (en) * | 2009-02-27 | 2009-09-30 | 天津大学 | Method for preparing micro cutter based on focused ion beam technology |
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| JP4801432B2 (en) * | 2005-12-09 | 2011-10-26 | 株式会社半導体エネルギー研究所 | Focused ion beam processing method and transmission electron microscope sample preparation method using the same |
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| CN101543901A (en) * | 2009-02-27 | 2009-09-30 | 天津大学 | Method for preparing micro cutter based on focused ion beam technology |
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| Title |
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| JP特开2007-163160A 2007.06.28 |
| 基于聚焦离子束铣削技术的微刀具制备;张少婧等;《天津大学学报》;20100531;第43卷(第5期);第469-472页 * |
| 张少婧等.基于聚焦离子束铣削技术的微刀具制备.《天津大学学报》.2010,第43卷(第5期),第469-472页. |
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