CN110587218A - Mark removing method of laser mark removing system - Google Patents
Mark removing method of laser mark removing system Download PDFInfo
- Publication number
- CN110587218A CN110587218A CN201810605346.2A CN201810605346A CN110587218A CN 110587218 A CN110587218 A CN 110587218A CN 201810605346 A CN201810605346 A CN 201810605346A CN 110587218 A CN110587218 A CN 110587218A
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- Prior art keywords
- laser
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P6/00—Restoring or reconditioning objects
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a trace removing method of a laser trace removing system, which comprises the following steps: a. a repair pattern determining step, b, a surface cleaning step, c, a filling step, d, a laser repairing step and e, a terminating step; according to the invention, by adopting the working procedure of manufacturing the laser repairing pattern data, pattern shape data and recess area size data around the recess position are extracted to manufacture the laser repairing pattern data, and finally the recess position of the workpiece is repaired; after the laser mark removing system is used for treatment, the laser mark removing system can be reused, the service life of the laser mark removing system is prolonged, the production quality is guaranteed, the production cost of an enterprise is saved, waste is reduced, and the laser mark removing system is used for repairing quickly and efficiently.
Description
Technical Field
The invention relates to a laser technology, in particular to a mark removing method of a laser mark removing system.
Background
Laser is another important invention of human beings after nuclear power, computers and semiconductors in 20 th century, and is called as "fastest knife", "best-line ruler" and "brightest light". The atoms are excited by the radiated light, hence the name "laser".
When the surface of the workpiece is sunken, a user usually directly eliminates the workpiece as waste and orders the workpiece again; there are also some businesses that continue to use defective workpieces. The former method increases the production cost of enterprises, affects the production and efficiency of enterprises and causes the waste of workpieces; the latter method sacrifices product quality, increases production cost, and reduces production efficiency.
Laser surface treatment is a method of improving the surface properties of a workpiece by subjecting the surface of the workpiece to design and laser modification treatments. The laser beam is used to heat workpiece fast and locally to realize local fast heating or fast cooling, and the workpiece may be treated in atmosphere, vacuum and other environment. By changing the laser parameters, different surface treatment process problems can be solved.
Disclosure of Invention
The present invention is directed to a method for removing scratches of a laser scribing system, so as to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme:
a method for removing marks of a laser mark removing system comprises the following steps: a. the method comprises the following specific steps of a repair pattern determining step, a surface cleaning step, a filling and leveling step, a laser repairing step and an ending step, wherein the specific method comprises the following steps: step a: for damaged workpieces to be repaired with pits, extracting pattern morphology data around the pit positions by using a plate-making professional dot measuring instrument, and measuring area size data of the pit positions at the same time; then according to the extracted shape data, pattern data which are similar to the shape area and are not damaged are extracted from the laser workpiece to be repaired, and the pattern data are made into image data through laser drawing in a computer; thirdly, cutting out an image with the same size from the manufactured image data according to the measured specific area size of the concave position, manufacturing laser repair pattern data, and storing the laser repair pattern data for later use; step b: the whole wear-resistant chromium layer on the surface of the workpiece to be repaired is dissolved and removed through anodic electrolysis, so that the copper pattern layer is exposed on the workpiece to be repaired; step c: coating a compact non-conductive protective layer on the workpiece subjected to the abrasion-resistant layer stripping treatment, not coating the sunken area, carrying out copper plating filling on the area, and filling the sunken area on the surface of the workpiece in a copper deposition manner; step d: c, after the workpiece is subjected to filling and leveling treatment, fine grinding and polishing are carried out, so that the leveling tolerance between the surface of the filling and leveling area and the pattern layer of the workpiece is within +/-2 mu m, and the surface is smooth and flat after the protective layer is stripped; processing the laser repair pattern data manufactured in the step a to the workpiece defect area which is filled and processed in the step four through a laser mark removing system 10, wherein the surface of the manufactured pattern is natural and uniform and has no repair mark; step e: and carrying out hard chromium plating treatment on the workpiece subjected to pattern repair to ensure that the surface of the workpiece meets the requirement of wear resistance.
As a preferred embodiment of the present invention: the laser mark removing system used in the step d comprises a laser source, a beam expanding lens, a light source adjusting assembly, a scanning galvanometer and a focusing lens; the light-emitting frequency of the laser source is 20-100 KHz, wherein the wavelength of the laser beam is 9200-10640 nm, the power of the laser beam is 30-150W, and the diameter of the laser beam is about 0.8-1.2 mm; the beam expander is positioned on the light path of the laser beam, and the diameter of the laser beam passing through the beam expander is larger than that of the laser beam passing through the beam expander; the beam expanding lens is positioned between the laser source and the light source adjusting assembly, the light source adjusting assembly is positioned on a light path of the laser beam, and the light source strip assembly comprises a shaping lens and a diaphragm; the shaping mirror is arranged beside the beam expanding mirror and used for adjusting the shape of the light beam, the diaphragm is arranged on one side of the shaping mirror, which is far away from the beam expanding mirror, and the size and the shape of the diaphragm are matched with those of the first shaped light beam.
Compared with the prior art, the invention has the beneficial effects that: the working procedure of manufacturing the laser repairing pattern data is adopted, the pattern shape data and the recess area size data around the recess position are extracted to manufacture the laser repairing pattern data, and finally the recess position of the workpiece is repaired; after the laser mark removing system is used for treatment, the laser mark removing system can be reused, the service life of the laser mark removing system is prolonged, the production quality is guaranteed, the production cost of an enterprise is saved, waste is reduced, and the laser mark removing system is used for repairing quickly and efficiently.
Drawings
FIG. 1 is a schematic diagram of a laser ablation system according to the present invention.
In the figure, 10-laser mark removing system, 20-workpiece, 22-processing surface, 100-laser source, 200-beam expanding lens, 300-light source adjusting component, 310-shaping lens, 320-diaphragm, 400-scanning galvanometer, 500-focusing lens, L1-laser beam, L2-first shaping beam, L3-second shaping beam and L4-mark removing beam.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, in an embodiment of the present invention, a method for removing a mark of a laser mark removing system includes the following steps: a. the method comprises the following specific steps of a repair pattern determining step, a surface cleaning step, a filling and leveling step, a laser repairing step and an ending step, wherein the specific method comprises the following steps:
step a: for damaged workpieces to be repaired with pits, extracting pattern morphology data around the pit positions by using a plate-making professional dot measuring instrument, and measuring area size data of the pit positions at the same time; then according to the extracted shape data, pattern data which are similar to the shape area and are not damaged are extracted from the laser workpiece to be repaired, and the pattern data are made into image data through laser drawing in a computer; thirdly, cutting out an image with the same size from the manufactured image data according to the measured specific area size of the concave position, manufacturing laser repair pattern data, and storing the laser repair pattern data for later use;
step b: the whole wear-resistant chromium layer on the surface of the workpiece to be repaired is dissolved and removed through anodic electrolysis, so that the copper pattern layer is exposed on the workpiece to be repaired;
step c: coating a compact non-conductive protective layer on the workpiece subjected to the abrasion-resistant layer stripping treatment, not coating the sunken area, carrying out copper plating filling on the area, and filling the sunken area on the surface of the workpiece in a copper deposition manner;
step d: c, after the workpiece is subjected to filling and leveling treatment, fine grinding and polishing are carried out, so that the leveling tolerance between the surface of the filling and leveling area and the pattern layer of the workpiece is within +/-2 mu m, and the surface is smooth and flat after the protective layer is stripped; processing the laser repair pattern data manufactured in the step a to the workpiece defect area which is filled and processed in the step four through a laser mark removing system 10, wherein the surface of the manufactured pattern is natural and uniform and has no repair mark;
in this embodiment, the laser mark removing system 10 is used for performing a mark removing operation on the processing surface 22 of the workpiece 20, and the laser mark removing system 10 includes a laser source 100, a beam expander 200, a light source adjusting assembly 300, a scanning galvanometer 400, and a focusing lens 500; the light emitting frequency of the laser source 100 is 20-100 kHz, wherein the wavelength of the laser beam L1 is 9200-10640 nm, the power of the laser beam L1 is 30-150W, and the diameter of the laser beam L1 is about 0.8-1.2 mm; the beam expander 200 is located on the light path of the laser beam L1 and is used for increasing the diameter of the laser beam L1, and the diameter D2 of the laser beam L1 passing through the beam expander 200 is larger than the diameter D1 of the laser beam L1 before passing through the beam expander 200; the beam expander 200 is located between the laser source 100 and the light source adjusting assembly 300, and the light source adjusting assembly 300 is located on the light path of the laser beam L1, the light source bar assembly 300 includes a shaping mirror 310 and a diaphragm 320; the shaping mirror 310 is located beside the beam expander 200 and used for adjusting the shape of the light beam L1, the diaphragm 320 is located on one side of the shaping mirror 310 away from the beam expander 200, the size and the shape of the diaphragm 320 are matched with those of the first shaped light beam L2, and the diaphragm 320 is used for filtering the outer edge area of the first shaped light beam L2 so that the first shaped light beam L2 is changed into a second shaped light beam L3; the first shaped light beam L2 becomes the second shaped light beam L3 after passing through the diaphragm 320, and becomes the mark removing light beam L4 after passing through the focusing lens 500; step d is completed by the removal beam L4;
step e: and carrying out hard chromium plating treatment on the workpiece subjected to pattern repair to ensure that the surface of the workpiece meets the wear-resistant requirement and the hardness of the chromium layer is HV 950.
The working principle of the invention is as follows: the working procedure of manufacturing the laser repairing pattern data is adopted, the pattern shape data and the recess area size data around the recess position are extracted to manufacture the laser repairing pattern data, and finally the recess position of the workpiece is repaired; after the laser mark removing system is used for treatment, the laser mark removing system can be reused, the service life of the laser mark removing system is prolonged, the production quality is guaranteed, the production cost of an enterprise is saved, waste is reduced, and the laser mark removing system is used for repairing quickly and efficiently.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (2)
1. A method for removing marks of a laser mark removing system is characterized by comprising the following steps: a. the method comprises the following specific steps of a repair pattern determining step, a surface cleaning step, a filling and leveling step, a laser repairing step and an ending step, wherein the specific method comprises the following steps: step a: for damaged workpieces to be repaired with pits, extracting pattern morphology data around the pit positions by using a plate-making professional dot measuring instrument, and measuring area size data of the pit positions at the same time; then according to the extracted shape data, pattern data which are similar to the shape area and are not damaged are extracted from the laser workpiece to be repaired, and the pattern data are made into image data through laser drawing in a computer; thirdly, cutting out an image with the same size from the manufactured image data according to the measured specific area size of the concave position, manufacturing laser repair pattern data, and storing the laser repair pattern data for later use; step b: the whole wear-resistant chromium layer on the surface of the workpiece to be repaired is dissolved and removed through anodic electrolysis, so that the copper pattern layer is exposed on the workpiece to be repaired; step c: coating a compact non-conductive protective layer on the workpiece subjected to the abrasion-resistant layer stripping treatment, not coating the sunken area, carrying out copper plating filling on the area, and filling the sunken area on the surface of the workpiece in a copper deposition manner; step d: c, after the workpiece is subjected to filling and leveling treatment, fine grinding and polishing are carried out, so that the leveling tolerance between the surface of the filling and leveling area and the pattern layer of the workpiece is within +/-2 mu m, and the surface is smooth and flat after the protective layer is stripped; processing the laser repair pattern data manufactured in the step a to the workpiece defect area which is filled and processed in the step four through a laser mark removing system 10, wherein the surface of the manufactured pattern is natural and uniform and has no repair mark; step e: and carrying out hard chromium plating treatment on the workpiece subjected to pattern repair to ensure that the surface of the workpiece meets the requirement of wear resistance.
2. The method of claim 1, wherein the laser ablation system used in step d comprises a laser source, a beam expander, a light source adjustment assembly, a scanning galvanometer, and a focusing lens; the light-emitting frequency of the laser source is 20-100 KHz, wherein the wavelength of the laser beam is 9200-10640 nm, the power of the laser beam is 30-150W, and the diameter of the laser beam is about 0.8-1.2 mm; the beam expander is positioned on the light path of the laser beam, and the diameter of the laser beam passing through the beam expander is larger than that of the laser beam passing through the beam expander; the beam expanding lens is positioned between the laser source and the light source adjusting assembly, the light source adjusting assembly is positioned on a light path of the laser beam, and the light source strip assembly comprises a shaping lens and a diaphragm; the shaping mirror is arranged beside the beam expanding mirror and used for adjusting the shape of the light beam, the diaphragm is arranged on one side of the shaping mirror, which is far away from the beam expanding mirror, and the size and the shape of the diaphragm are matched with those of the first shaped light beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810605346.2A CN110587218A (en) | 2018-06-13 | 2018-06-13 | Mark removing method of laser mark removing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810605346.2A CN110587218A (en) | 2018-06-13 | 2018-06-13 | Mark removing method of laser mark removing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110587218A true CN110587218A (en) | 2019-12-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810605346.2A Withdrawn CN110587218A (en) | 2018-06-13 | 2018-06-13 | Mark removing method of laser mark removing system |
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| Country | Link |
|---|---|
| CN (1) | CN110587218A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114406479A (en) * | 2022-01-17 | 2022-04-29 | 苏州迈为科技股份有限公司 | Processing device and method of display panel, controller and storage medium |
-
2018
- 2018-06-13 CN CN201810605346.2A patent/CN110587218A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114406479A (en) * | 2022-01-17 | 2022-04-29 | 苏州迈为科技股份有限公司 | Processing device and method of display panel, controller and storage medium |
| CN114406479B (en) * | 2022-01-17 | 2024-05-03 | 迈为技术(珠海)有限公司 | Display panel processing device and method, controller and storage medium |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20191220 |
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| WW01 | Invention patent application withdrawn after publication |