CN107336090B - The method of saw blade secondary use - Google Patents
The method of saw blade secondary use Download PDFInfo
- Publication number
- CN107336090B CN107336090B CN201610286632.8A CN201610286632A CN107336090B CN 107336090 B CN107336090 B CN 107336090B CN 201610286632 A CN201610286632 A CN 201610286632A CN 107336090 B CN107336090 B CN 107336090B
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- CN
- China
- Prior art keywords
- blade
- knife hub
- saw blade
- saw
- secondary use
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/36—Alkaline compositions for etching aluminium or alloys thereof
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to a kind of methods of saw blade secondary use, the saw blade includes the knife hub of blade and the fixed blade, the position that blade exposes knife hub is blade, the length that blade stretches out knife hub is less than specified value, the method of the saw blade secondary use is the following steps are included: 1) knife hub is polished, it will be close to most of material polishing removal on the knife hub of blade, and retain fraction material to avoid damage blade；2) blade is polished, and blade is all polished off；3) knife hub corrodes, and is removed the material retained on knife hub in step 1) completely by corroding, and exposes blade and forms new blade, and the overhang of new blade is made to meet specified value；4) blade polishes, and is processed by shot blasting to blade；5) blade cleans.The present invention makes the blade overhang of saw blade meet specified value, to meet the minimum requirements for allowing to process, so that saw blade be enable to obtain secondary use, reduces production cost by carrying out a series of processing to saw blade.
Description
Technical field
The present invention relates to the wafer cutting in semiconductor packaging, specifically a kind of sides of saw blade secondary use
Method.
Background technique
Scribing machine is the equipment that wafer is cut into independent circuit unit for semiconductor integrated circuit package line.
Saw blade is the dedicated blade of scribing machine.
When Wafer Dicing, by the pressure and friction of disk, saw blade blade is caused inwardly to wear, so that the half of saw blade
Diameter (i.e. blade overhang) gradually becomes smaller.Either original saw blade still used saw blade, works as scribing
When the blade overhang of knife is insufficient for the minimum requirements for allowing to process, it may not be usable for producing.
For the situation of saw blade blade overhang deficiency, old saw blade is usually scrapped, saw blade is directly more renewed.But
Be, due to Wafer Dicing knife generally can only foreign procurement, higher cost, old saw blade overhang is insufficient directly scrap if, make
At the wasting of resources, production cost is increased.
Summary of the invention
The present invention is directed to above-mentioned at least one technical problem referred to, provides a kind of method of saw blade secondary use, should
Method can make saw blade obtain secondary use, to reduce production cost.
Technical solution according to the invention: a kind of method of saw blade secondary use, the saw blade include blade and consolidate
The knife hub of the fixed blade, the position that blade exposes knife hub is blade, and the length that blade stretches out knife hub is less than specified value, described stroke
The method of piece knife secondary use the following steps are included:
1) knife hub polish, will be close on the knife hub of blade most of material polishing removal, and retain fraction material with
Avoid damage to blade；
2) blade is polished, and blade is all polished off；
3) knife hub corrodes, and is removed the material retained on knife hub in step 1) completely by corroding, and exposes blade and is formed newly
Blade, and the overhang of new blade is made to meet specified value；
4) blade polishes, and is processed by shot blasting to blade；
5) blade cleans.
Further, the material of the knife hub is aluminium, uses the sodium hydroxide that concentration is 60~100g/L molten in step 3)
Liquid is corroded.
Further, the material of the blade is diadust, is polished in step 4) using diamond-impregnated wheel.
Further, the material of the knife hub is aluminium.
Further, the material of the blade is diadust.
The technical effects of the invention are that: the present invention makes the blade of saw blade by carrying out a series of processing to saw blade
Overhang meets specified value, to meet the minimum requirements for allowing to process, so that saw blade be enable to obtain secondary use, reduces production
Cost.
Detailed description of the invention
Fig. 1 is flow chart of the invention.
Fig. 2 is the structural schematic diagram of old saw blade.
Fig. 3 is the schematic diagram of knife hub polishing.
Fig. 4 is the schematic diagram of blade polishing.
Fig. 5 is the schematic diagram of knife hub corrosion.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
The present invention is a kind of method of saw blade secondary use.In the present embodiment, it is directed to used old
Saw blade, the overhang of the old stroke of blade are insufficient for allowing the minimum requirements processed, the old saw blade as shown in Fig. 2, its
Knife hub 2 including blade 1 and fixed blade 1, the material of knife hub 2 are aluminium, and the material of blade 1 is diadust.Blade 1 exposes
The position of knife hub 2 is blade, and the length (i.e. blade overhang) that blade stretches out knife hub 2 is less than specified value, cannot directly use again.
Referring to Fig. 1, the method for above-mentioned saw blade secondary use the following steps are included:
1) knife hub is polished, and will be close to the polishing removal of most of material 3 on the knife hub 2 of blade, and retain fraction material
To avoid damage blade 1；Most of material 3 of removal is more at least over 50%, and as far as possible, only retains one layer of very thin material
Material, to reduce the etching extent in later step.After the polishing of knife hub as shown in Figure 3；
2) blade is polished, and the blade of original old saw blade is all polished off；After blade polishing as shown in Figure 4；
3) knife hub corrodes, will be in step 1) by the method for corrosion using the sodium hydroxide solution that concentration is 60~100g/L
The material removal retained on knife hub 2 is clean, exposes blade and forms blade, and the overhang of new blade is made to meet specified value；Knife
After hub corrosion mill as shown in Figure 5；
4) blade polishes, and is processed by shot blasting new blade material using diamond-impregnated wheel, accords with new edge quality
It closes and requires；
5) blade cleans, the impurity such as removal dust.
After the completion of cleaning, it is secondary do over again after blade reach processing request as new saw blade.
The present invention makes full use of the material and structure of old saw blade pristine blade, is repaired by secondary do over again to knife-blade
Reason, makes old saw blade restore the same overhang of new saw blade, makes old saw blade can be with secondary use, to reach identical scribing
Inexpensive purpose under quality.
In other embodiments, it is also possible to other unqualified saw blades, other unqualified saw blades, which refer to, to be not used
, and blade overhang is insufficient for the minimum requirements for allowing to process.
The description with certain particularity detailed enough has been carried out to the present invention above.Ordinary skill in fields
Personnel are it should be understood that the description in embodiment is only exemplary, before without departing from true spirit and scope of the present invention
Put make it is all change all should belong to protection scope of the present invention.Scope of the present invention is by the power
What sharp claim was defined, rather than limited by the foregoing description in embodiment.
Claims (2)
1. a kind of method of saw blade secondary use, the saw blade includes the knife hub of blade and the fixed blade, blade dew
The position of knife hub is blade out, and the length that blade stretches out knife hub is less than specified value, it is characterized in that: the material of the knife hub is aluminium,
The material of the blade is diadust；The method of the saw blade secondary use the following steps are included:
1) knife hub polish, will be close on the knife hub of blade most of material polishing removal, and retain fraction material to avoid
Damage blade；Most of material of removal is at least over 50%；
2) blade is polished, and blade is all polished off；
3) knife hub corrodes, and is corroded using the sodium hydroxide solution that concentration is 60~100g/L, will be in step 1) by corrosion
The material removal retained on knife hub is clean, exposes blade and forms new blade, and the overhang of new blade is made to meet specified value；
4) blade polishes, and is processed by shot blasting to blade；
5) blade cleans.
2. the method for saw blade secondary use described in accordance with the claim 1, it is characterized in that: using diamond-impregnated wheel in step 4)
It is polished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610286632.8A CN107336090B (en) | 2016-05-03 | 2016-05-03 | The method of saw blade secondary use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610286632.8A CN107336090B (en) | 2016-05-03 | 2016-05-03 | The method of saw blade secondary use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107336090A CN107336090A (en) | 2017-11-10 |
| CN107336090B true CN107336090B (en) | 2019-06-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610286632.8A Active CN107336090B (en) | 2016-05-03 | 2016-05-03 | The method of saw blade secondary use |
Country Status (1)
| Country | Link |
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| CN (1) | CN107336090B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108581865A (en) * | 2018-03-30 | 2018-09-28 | 郑州磨料磨具磨削研究所有限公司 | A kind of blade exposure method of hub type plating superthin diamond cutting blade |
| CN108411355B (en) * | 2018-03-30 | 2020-04-03 | 郑州磨料磨具磨削研究所有限公司 | Blade edging method for hub-type electroplated ultrathin diamond cutting blade |
| CN110303387B (en) * | 2019-07-11 | 2021-02-26 | 苏州速菲特农林工具有限公司 | Polishing process of scissor blade |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201432139Y (en) * | 2009-05-08 | 2010-03-31 | 尖点科技股份有限公司 | Milling cutter structure improvement |
| DE202011107695U1 (en) * | 2011-11-09 | 2012-01-24 | Stefan Stegschuster | Device for sharpening tool cutting edges |
| CN103447787A (en) * | 2012-05-31 | 2013-12-18 | 创国兴业有限公司 | manufacturing method of milling cutter |
-
2016
- 2016-05-03 CN CN201610286632.8A patent/CN107336090B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201432139Y (en) * | 2009-05-08 | 2010-03-31 | 尖点科技股份有限公司 | Milling cutter structure improvement |
| DE202011107695U1 (en) * | 2011-11-09 | 2012-01-24 | Stefan Stegschuster | Device for sharpening tool cutting edges |
| CN103447787A (en) * | 2012-05-31 | 2013-12-18 | 创国兴业有限公司 | manufacturing method of milling cutter |
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| Publication number | Publication date |
|---|---|
| CN107336090A (en) | 2017-11-10 |
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