JP2006108654A5 - - Google Patents

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Publication number
JP2006108654A5
JP2006108654A5 JP2005260169A JP2005260169A JP2006108654A5 JP 2006108654 A5 JP2006108654 A5 JP 2006108654A5 JP 2005260169 A JP2005260169 A JP 2005260169A JP 2005260169 A JP2005260169 A JP 2005260169A JP 2006108654 A5 JP2006108654 A5 JP 2006108654A5
Authority
JP
Japan
Prior art keywords
chip
insulating film
electrode
wiring
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005260169A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006108654A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005260169A priority Critical patent/JP2006108654A/ja
Priority claimed from JP2005260169A external-priority patent/JP2006108654A/ja
Publication of JP2006108654A publication Critical patent/JP2006108654A/ja
Publication of JP2006108654A5 publication Critical patent/JP2006108654A5/ja
Withdrawn legal-status Critical Current

Links

JP2005260169A 2004-09-09 2005-09-08 無線チップ Withdrawn JP2006108654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005260169A JP2006108654A (ja) 2004-09-09 2005-09-08 無線チップ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004263111 2004-09-09
JP2005260169A JP2006108654A (ja) 2004-09-09 2005-09-08 無線チップ

Publications (2)

Publication Number Publication Date
JP2006108654A JP2006108654A (ja) 2006-04-20
JP2006108654A5 true JP2006108654A5 (enExample) 2008-10-16

Family

ID=36377950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005260169A Withdrawn JP2006108654A (ja) 2004-09-09 2005-09-08 無線チップ

Country Status (1)

Country Link
JP (1) JP2006108654A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101611643B1 (ko) * 2008-10-01 2016-04-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101770976B1 (ko) 2009-12-11 2017-08-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US9252493B2 (en) * 2011-05-17 2016-02-02 Gemalto Sa Wire capacitor, in particular for a radio frequency circuit, and device comprising said wire capacitor
CN103137557B (zh) * 2013-02-05 2015-02-18 深圳市华星光电技术有限公司 阵列基板、显示装置及阵列基板的制造方法
US11043730B2 (en) * 2018-05-14 2021-06-22 Mediatek Inc. Fan-out package structure with integrated antenna

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3499255B2 (ja) * 1993-05-21 2004-02-23 株式会社半導体エネルギー研究所 複合集積回路部品の作製方法
JP2789293B2 (ja) * 1993-07-14 1998-08-20 株式会社半導体エネルギー研究所 半導体装置作製方法
JP3744293B2 (ja) * 2000-01-11 2006-02-08 セイコーエプソン株式会社 電気光学装置の製造方法及び電気光学装置
JP3939504B2 (ja) * 2001-04-17 2007-07-04 カシオ計算機株式会社 半導体装置並びにその製造方法および実装構造
JP4393859B2 (ja) * 2002-12-27 2010-01-06 株式会社半導体エネルギー研究所 記録媒体の作製方法

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