JP2006108312A - 気相成長装置 - Google Patents
気相成長装置 Download PDFInfo
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- JP2006108312A JP2006108312A JP2004291713A JP2004291713A JP2006108312A JP 2006108312 A JP2006108312 A JP 2006108312A JP 2004291713 A JP2004291713 A JP 2004291713A JP 2004291713 A JP2004291713 A JP 2004291713A JP 2006108312 A JP2006108312 A JP 2006108312A
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- 239000000758 substrate Substances 0.000 claims abstract description 87
- 238000006243 chemical reaction Methods 0.000 claims abstract description 48
- 238000001947 vapour-phase growth Methods 0.000 claims abstract description 24
- 238000005192 partition Methods 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims description 23
- 230000005855 radiation Effects 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000002994 raw material Substances 0.000 abstract description 7
- 239000007789 gas Substances 0.000 description 85
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 15
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 12
- 239000002826 coolant Substances 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 238000005979 thermal decomposition reaction Methods 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 229910021529 ammonia Inorganic materials 0.000 description 6
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 150000002431 hydrogen Chemical class 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 150000002902 organometallic compounds Chemical class 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000003779 heat-resistant material Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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Abstract
【解決手段】 円盤状の基板保持台11と、該基板保持台に対向配置されて基板保持台との間に偏平円筒状の反応室13を形成する隔壁12と、該隔壁の中央部に設けられたガス導入部15と、前記反応室の外周に設けられたガス導出部16と、前記基板保持台の同一円周上に配設された複数の基板保持部19と、該基板保持部に保持した基板18を加熱するヒーター21とを備えた気相成長装置において、前記基板保持台の中央部に前記基板保持部の反応室内面よりも反応室外側方向に窪ませた凹部25を形成する。
【選択図】 図1
Description
Claims (4)
- 円盤状の基板保持台と、該基板保持台に対向配置されて基板保持台との間に偏平円筒状の反応室を形成する隔壁と、該隔壁の中央部に設けられたガス導入部と、前記反応室の外周に設けられたガス導出部と、前記基板保持台の同一円周上に配設された複数の基板保持部と、該基板保持部に保持した基板を加熱する加熱手段とを備えた気相成長装置において、前記ガス導入部に対向する基板保持台の中央部に、前記基板保持部の反応室内面よりも反応室外側方向に窪ませた凹部を形成したことを特徴とする気相成長装置。
- 前記凹部を形成した部分の外周に、輻射防止部材及び低熱伝導部材の少なくともいずれか一方の部材を有する断熱部を設けたことを特徴とする請求項1記載の気相成長装置。
- 前記ガス導入部は、反応室の軸線を中心とした多重管構造を有し、該多重管の反応室内の先端部に、該多重管により区画されたガス導入経路を通ってそれぞれ導入されるガスを反応室の外周方向に向けてガイドするための外縁が円形のガイド板を設けるとともに、該ガイド板を前記凹部内に配置したことを特徴とする請求項1又は2記載の気相成長装置。
- 前記凹部の反応室外部側に、該凹部の反応室内側面を冷却する冷却手段が設けられていることを特徴とする請求項1乃至3のいずれか1項記載の気相成長装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2004291713A JP4542860B2 (ja) | 2004-10-04 | 2004-10-04 | 気相成長装置 |
Applications Claiming Priority (1)
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JP2004291713A JP4542860B2 (ja) | 2004-10-04 | 2004-10-04 | 気相成長装置 |
Publications (2)
Publication Number | Publication Date |
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JP2006108312A true JP2006108312A (ja) | 2006-04-20 |
JP4542860B2 JP4542860B2 (ja) | 2010-09-15 |
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JP2004291713A Expired - Lifetime JP4542860B2 (ja) | 2004-10-04 | 2004-10-04 | 気相成長装置 |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008050221A (ja) * | 2006-08-25 | 2008-03-06 | Denki Kagaku Kogyo Kk | 窒化ホウ素焼結体、その製造方法及び用途 |
JP2008196031A (ja) * | 2007-02-15 | 2008-08-28 | Taiyo Nippon Sanso Corp | 気相成長装置 |
JP2009032785A (ja) * | 2007-07-25 | 2009-02-12 | Sharp Corp | 気相成長装置、及び半導体素子の製造方法 |
JP2009517541A (ja) * | 2005-11-25 | 2009-04-30 | アイクストロン、アーゲー | ガス入口部品を有するcvd反応装置 |
JP2009270170A (ja) * | 2008-05-09 | 2009-11-19 | Taiyo Nippon Sanso Corp | 気相成長方法 |
JP2009275255A (ja) * | 2008-05-14 | 2009-11-26 | Taiyo Nippon Sanso Corp | 気相成長装置 |
JP2012513669A (ja) * | 2008-12-23 | 2012-06-14 | アイクストロン、エスイー | 円筒状のガス入口部品を有するmocvd反応装置 |
JP2012520578A (ja) * | 2009-03-16 | 2012-09-06 | アイクストロン、エスイー | 異なる位置において異なるように熱消散エレメントと結び付くカバープレートを備えるmocvd反応炉 |
JP2012256937A (ja) * | 2012-09-14 | 2012-12-27 | Taiyo Nippon Sanso Corp | 気相成長装置及び方法 |
US9748113B2 (en) | 2015-07-30 | 2017-08-29 | Veeco Intruments Inc. | Method and apparatus for controlled dopant incorporation and activation in a chemical vapor deposition system |
CN110983299A (zh) * | 2019-12-04 | 2020-04-10 | 江苏实为半导体科技有限公司 | 一种mocvd反应腔用加热板 |
DE102021103245A1 (de) | 2021-02-11 | 2022-08-11 | Aixtron Se | CVD-Reaktor mit einem in einer Vorlaufzone ansteigenden Prozesskammerboden |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06267855A (ja) * | 1993-03-16 | 1994-09-22 | Tokuyama Ceramics Kk | 気相成長膜の製造装置 |
JPH07235501A (ja) * | 1994-02-25 | 1995-09-05 | Stanley Electric Co Ltd | 結晶成長装置 |
JP2003518199A (ja) * | 1999-12-22 | 2003-06-03 | アイクストロン、アーゲー | 化学気相成膜反応室及びそのための処理室 |
JP2004207687A (ja) * | 2002-12-10 | 2004-07-22 | Sharp Corp | 半導体製造装置とそれを用いた半導体製造方法 |
-
2004
- 2004-10-04 JP JP2004291713A patent/JP4542860B2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06267855A (ja) * | 1993-03-16 | 1994-09-22 | Tokuyama Ceramics Kk | 気相成長膜の製造装置 |
JPH07235501A (ja) * | 1994-02-25 | 1995-09-05 | Stanley Electric Co Ltd | 結晶成長装置 |
JP2003518199A (ja) * | 1999-12-22 | 2003-06-03 | アイクストロン、アーゲー | 化学気相成膜反応室及びそのための処理室 |
JP2004207687A (ja) * | 2002-12-10 | 2004-07-22 | Sharp Corp | 半導体製造装置とそれを用いた半導体製造方法 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009517541A (ja) * | 2005-11-25 | 2009-04-30 | アイクストロン、アーゲー | ガス入口部品を有するcvd反応装置 |
JP2008050221A (ja) * | 2006-08-25 | 2008-03-06 | Denki Kagaku Kogyo Kk | 窒化ホウ素焼結体、その製造方法及び用途 |
JP2008196031A (ja) * | 2007-02-15 | 2008-08-28 | Taiyo Nippon Sanso Corp | 気相成長装置 |
JP2009032785A (ja) * | 2007-07-25 | 2009-02-12 | Sharp Corp | 気相成長装置、及び半導体素子の製造方法 |
JP2009270170A (ja) * | 2008-05-09 | 2009-11-19 | Taiyo Nippon Sanso Corp | 気相成長方法 |
JP2009275255A (ja) * | 2008-05-14 | 2009-11-26 | Taiyo Nippon Sanso Corp | 気相成長装置 |
JP2012513669A (ja) * | 2008-12-23 | 2012-06-14 | アイクストロン、エスイー | 円筒状のガス入口部品を有するmocvd反応装置 |
JP2012520578A (ja) * | 2009-03-16 | 2012-09-06 | アイクストロン、エスイー | 異なる位置において異なるように熱消散エレメントと結び付くカバープレートを備えるmocvd反応炉 |
JP2012256937A (ja) * | 2012-09-14 | 2012-12-27 | Taiyo Nippon Sanso Corp | 気相成長装置及び方法 |
US9748113B2 (en) | 2015-07-30 | 2017-08-29 | Veeco Intruments Inc. | Method and apparatus for controlled dopant incorporation and activation in a chemical vapor deposition system |
CN110983299A (zh) * | 2019-12-04 | 2020-04-10 | 江苏实为半导体科技有限公司 | 一种mocvd反应腔用加热板 |
CN110983299B (zh) * | 2019-12-04 | 2024-05-14 | 江苏实为半导体科技有限公司 | 一种mocvd反应腔用加热板 |
DE102021103245A1 (de) | 2021-02-11 | 2022-08-11 | Aixtron Se | CVD-Reaktor mit einem in einer Vorlaufzone ansteigenden Prozesskammerboden |
US20240102164A1 (en) * | 2021-02-11 | 2024-03-28 | Aixtron Se | Cvd reactor comprising a process chamber floor rising in a feeder zone |
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Publication number | Publication date |
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JP4542860B2 (ja) | 2010-09-15 |
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