JP2006093602A - 発光素子 - Google Patents

発光素子 Download PDF

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Publication number
JP2006093602A
JP2006093602A JP2004280020A JP2004280020A JP2006093602A JP 2006093602 A JP2006093602 A JP 2006093602A JP 2004280020 A JP2004280020 A JP 2004280020A JP 2004280020 A JP2004280020 A JP 2004280020A JP 2006093602 A JP2006093602 A JP 2006093602A
Authority
JP
Japan
Prior art keywords
light emitting
light
refractive index
emitting device
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004280020A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006093602A5 (enExample
Inventor
Yoshinobu Suehiro
好伸 末広
Naoki Nakajo
直樹 中條
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2004280020A priority Critical patent/JP2006093602A/ja
Priority to US11/145,167 priority patent/US7560294B2/en
Publication of JP2006093602A publication Critical patent/JP2006093602A/ja
Publication of JP2006093602A5 publication Critical patent/JP2006093602A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2004280020A 2004-06-07 2004-09-27 発光素子 Withdrawn JP2006093602A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004280020A JP2006093602A (ja) 2004-09-27 2004-09-27 発光素子
US11/145,167 US7560294B2 (en) 2004-06-07 2005-06-06 Light emitting element and method of making same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004280020A JP2006093602A (ja) 2004-09-27 2004-09-27 発光素子

Publications (2)

Publication Number Publication Date
JP2006093602A true JP2006093602A (ja) 2006-04-06
JP2006093602A5 JP2006093602A5 (enExample) 2007-03-15

Family

ID=36234254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004280020A Withdrawn JP2006093602A (ja) 2004-06-07 2004-09-27 発光素子

Country Status (1)

Country Link
JP (1) JP2006093602A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010539715A (ja) * 2007-09-21 2010-12-16 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 放射放出コンポーネント
JP2011142079A (ja) * 2010-01-06 2011-07-21 Lg Innotek Co Ltd バックライトユニット及びこれを用いたディスプレイ装置
JP2013135017A (ja) * 2011-12-26 2013-07-08 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物半導体発光素子
JP2015514312A (ja) * 2012-03-19 2015-05-18 コーニンクレッカ フィリップス エヌ ヴェ シリコン基板上に成長される発光デバイス

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010539715A (ja) * 2007-09-21 2010-12-16 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 放射放出コンポーネント
US8373186B2 (en) 2007-09-21 2013-02-12 Osram Opto Semiconductors Gmbh Radiation-emitting component
KR101460388B1 (ko) 2007-09-21 2014-11-10 오스람 옵토 세미컨덕터스 게엠베하 복사 방출 소자
US8963181B2 (en) 2007-09-21 2015-02-24 Osram Opto Semiconductors Gmbh Radiation-emitting component
JP2011142079A (ja) * 2010-01-06 2011-07-21 Lg Innotek Co Ltd バックライトユニット及びこれを用いたディスプレイ装置
US8382305B2 (en) 2010-01-06 2013-02-26 Lg Innotek Co., Ltd. Backlight unit and display device using the same
JP2013135017A (ja) * 2011-12-26 2013-07-08 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物半導体発光素子
JP2015514312A (ja) * 2012-03-19 2015-05-18 コーニンクレッカ フィリップス エヌ ヴェ シリコン基板上に成長される発光デバイス
CN110246941A (zh) * 2012-03-19 2019-09-17 亮锐控股有限公司 在硅衬底上生长的发光器件

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