JP2006088266A - Non-contact sucking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact sucking device, not only surely sucking and holding a ring-shaped work, but also preventing suction failure, and deformation and breakage of a thin work. <P>SOLUTION: A porous body 8 is provided on the suction side flat surface 2b of a chuck body 2, and an inlet 21 to a negative pressure chamber 22 is provided extending over the whole of the periphery thereof. The compressed air is jetted from an air jet surface 8b of the porous body 8 to apply the floating force to a sucked face of a semiconductor chip. Simultaneously the air in the periphery of the inlet 21 is sucked to apply the sucking force to the outer peripheral part side of the chip. When the sucking force is applied on the outer peripheral part side of the chip, the outer peripheral part side serves as a sucked part, so that the chip can be surely sucked and held. Further, since the inlet 21 is disposed extending over the whole periphery of the air jet surface 8b, the sucking force is not concentrated on one point, thereby preventing sucking failure, and deformation and breakage of a thin chip. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a non-contact adsorption device that adsorbs a workpiece in a non-contact state, and specifically relates to a non-contact adsorption device suitable for use in mounting and transporting a micro workpiece such as a semiconductor chip.

  In order to process and transport parts (workpieces) such as semiconductor chips and small lenses, a suction device that sucks and holds the workpieces by suction is used. In order to avoid damaging the surface of the workpiece, the suction device does not allow the workpiece surface to be directly contacted with the suction surface of the suction device, but allows the workpiece to be suctioned in a non-contact state. There is an adsorption device. For example, the non-contact adsorption device 31 shown in Patent Document 1 is configured as follows. That is, as shown in FIG. 4, the chuck body 32 is formed with a concave surface 33 forming a substantially conical space on the workpiece suction side, and the concave surface 33 is sucked at the apex portion of the cone (the central portion of the concave surface 33). A passage 34 is open. For this reason, by making the inside of the suction passage 34 have a negative pressure, the substantially conical space connected to the suction passage 34 also has a negative pressure. Thereby, the work 35 is adsorbed in the space of the non-contact adsorbing device 31. And since the said space is formed so as to form a substantially conical space by the concave surface 33, the work 35 having a rectangular longitudinal section is in contact with only the four corners of the surface, and the plane portion that dislikes scratches is It becomes a non-contact state. 4 is a cross-sectional view showing a cross section of the workpiece 35 along a diagonal line.

  As described above, the non-contact suction device 31 of Patent Document 1 enables non-contact suction of the workpiece, but has the following problems. That is, in recent years, it has been required to adsorb a workpiece having a ring shape and a hole in the central portion in a non-contact state. However, in the conventional suction device 31 described above, since the suction passage 34 is opened at the central portion of the concave surface 33, the suction force is highest at the central portion. Then, when a ring-shaped workpiece having a hole larger than the opening of the suction passage 34 is to be sucked, a hole is formed in a portion where the strongest suction force acts, and there is no suction target portion. Does not work sufficiently, making it difficult to adsorb.

  In addition, the adsorption device 31 of Patent Document 1 has the following problems. That is, since the suction force concentrates at one place, that is, the center of the place where the work is attracted, if the action point of the suction force on the work surface deviates from the center of the work surface, the action of the suction force is biased. As a result, the work is not held and sucked in the horizontal state placed on the mounting table, but is sucked in a vertical orientation (see the work 36 in FIG. 3), is sucked in a tilted state, etc. Adsorption failure occurs.

Furthermore, when the suction force is concentrated at one location, there is a problem that a thin workpiece is deformed or broken at the concentrated location.
JP 2000-77436 A

  The main object of the present invention is to provide a non-contact suction device that can not only reliably hold a ring-shaped workpiece by suction but also simultaneously prevent the suction failure and prevent deformation and breakage of a thin workpiece.

  Hereinafter, effective means and the like for solving the above-described problems will be described with reference to actions, effects, and more specific means as required. In the following, in order to facilitate understanding, the corresponding configuration in the embodiment of the invention is appropriately shown in parentheses, but is not limited to the specific configuration shown in parentheses.

  Means 1. Provided on the work suction side of the main body (chuck main body 2) are a gas ejection part (air ejection surface 8b) and a suction part (introduction port 21) arranged at a plurality of locations or around the circumference of the gas ejection part, The suction force generated when the gas around the suction portion is sucked and the levitation force generated when the pressurized gas is jetted from the gas jetting portion are simultaneously applied to the work (semiconductor chip W), so A non-contact suction device (non-contact chuck) configured to suck and hold a workpiece in a contact state.

  According to the means 1, the workpiece simultaneously receives the suction force generated when the gas around the suction portion is sucked and the levitation force generated when the pressurized gas is ejected from the gas ejection portion, so that the workpiece does not move against the gas ejection portion. Adsorbed and held in contact. At this time, the levitation force acts on the attracted surface of the work facing the gas ejection part. And since the attraction | suction part is arrange | positioned in the circumference | surroundings of a gas ejection part over multiple places or the circumference | surroundings, attraction | suction force acts on the outer peripheral part side of a workpiece | work. For this reason, even if the workpiece has a ring shape and has a hole in the center, the suction force acts on the outer peripheral side of the workpiece, so that the workpiece can be sucked and held with certainty. it can. In addition, the workpiece | work which does not make ring shape can also be adsorb | sucked in a non-contact state similarly.

  Further, the suction force does not concentrate on one place but acts on several or the entire outer peripheral portion of the workpiece. That is, the suction force acting on the workpiece is distributed at the outer periphery of the workpiece. As a result, it is possible to prevent a suction failure such that the work is sucked in a vertical direction toward the concentrated portion of the suction force or sucked in a tilted state. Further, the dispersion of the suction force can prevent deformation and breakage even with a thin workpiece.

  In addition, when a plurality of suction parts are provided, it is preferable that the respective suction parts are provided evenly. This is because the suction force can be applied evenly to the outer peripheral side of the workpiece. Thus, it is more preferable to provide a suction part over the whole circumference | surroundings of a gas ejection part from a viewpoint of making a suction force act equally.

  Mean 2. The workpiece suction side of the main body is provided with a wall surface (inner surface forming the suction hole 20) that faces the side surface of the workpiece when the workpiece is sucked, and the wall surface is in contact with the wall surface of the workpiece However, the non-contact adsorption apparatus according to the means 1, wherein the non-contact adsorption apparatus is disposed at a position where a suction force and a floating force act on the workpiece.

  According to the means 2, even if the workpiece is laterally displaced due to the suction device tilting or the like while the workpiece is sucked, the side surface of the workpiece comes into contact with the wall surface provided on the main body. Even in the contact state, the suction force and the levitation force are applied to the workpiece, so that the non-contact suction holding state is maintained. Thereby, even if it will be in the situation where a workpiece | work will slip | deviate laterally, it can prevent that a workpiece | work slips off from an adsorption | suction apparatus.

  In addition, the structure which faces a wall surface in several places of a workpiece | work side surface, or the structure which faces the whole workpiece | work side surface is preferable, and the latter structure is more preferable among these. This is because the direction that can prevent the workpiece from sliding down is not specified.

  Means 3. A suction space (in the suction hole 20 and the cylindrical body 26) for sucking and holding the work is defined in the front of the gas ejection portion, and the gas in the suction space is sucked by the suction portion. The non-contact adsorption | suction apparatus of the means 1 or 2 to do.

  According to the means 3, a part of the region extending beyond the gas ejection part is partitioned as an adsorption space. And since the gas in this adsorption space is attracted | sucked by the attraction | suction part, the negative pressure degree in the space increases compared with the case where the circumference | surroundings of an attraction | suction part are completely open | released without partitioning adsorption space. By this. The work suction effect is enhanced.

  In addition, the structure which partitions off adsorption space by the said wall surface facing the side surface of a workpiece | work is preferable. In this case, if the wall surface is provided, the suction space is naturally partitioned, and the configuration can be simplified.

  Means 4. 4. The non-contact suction device according to any one of means 1 to 3, wherein the suction part is disposed on a side of a workpiece in an suction state.

  According to the means 4, the suction part can be arranged closer to the side surface of the workpiece. Thereby, the attraction | suction force with respect to a workpiece | work can be made to act stronger.

Means 5. A gas ejection portion (air ejection surface 8b) provided on the workpiece adsorption side end surface (adsorption side plane 2b) of the main body (chuck body 2);
It is attached to the workpiece suction side of the main body, covers the suction side end surface around the gas ejection part so that an internal space is formed between the end surface, and an adsorption hole is formed at a position facing the gas ejection part With a cap,
The internal space is set as a negative pressure chamber, and a gap (introduction port 21) communicating from the suction hole to the negative pressure chamber is set as a suction portion, and a suction force generated when sucking a gas around the suction portion, and a gas ejection portion The levitation force generated when jetting pressurized gas from the nozzle is simultaneously applied to the workpiece (semiconductor chip W), and the workpiece is sucked and held in the suction hole in a non-contact state with respect to the gas jetting portion. Non-contact adsorption device (non-contact chuck) characterized by.

  According to the means 5, the workpiece simultaneously receives the suction force generated when sucking the gas around the suction portion and the levitation force generated when the pressurized gas is ejected from the gas ejection portion, and does not contact the gas ejection portion. In the state of adsorption. And since the negative pressure chamber and the suction part which is an inlet_port | entrance to the negative pressure chamber are arrange | positioned over the circumference | surroundings of a gas ejection part, a suction force acts on the whole outer peripheral side of a workpiece | work equally. For this reason, compared to the case where suction force is applied to several locations on the outer peripheral side, it is possible to more securely attract and hold a ring-shaped workpiece in the suction hole, and it is also possible to prevent suction failure and prevent deformation and breakage of thin workpieces. It will be certain.

  Further, even if the workpiece is laterally displaced due to the suction device tilting in a state where the workpiece is sucked, the side surface of the workpiece comes into contact with the inner surface forming the suction hole. Thereby, even if it will be in the situation where a workpiece | work will slip | deviate laterally, it can prevent that a workpiece | work slips off from an adsorption | suction apparatus. Further, the gas in the partitioned space called the suction hole is sucked by the suction part around the gas ejection part. By sucking the gas in the space thus partitioned, the degree of negative pressure in the space is increased as compared to the case where the periphery of the suction part is completely opened without partitioning the space. Thereby, the suction effect of a workpiece | work is heightened.

  In addition, by simply attaching a cap to the work suction side of the main body, a configuration in which a negative pressure chamber and a suction portion that is an inlet to the negative pressure chamber are arranged over the entire periphery of the gas ejection portion, and a suction space (suction hole 20). Since the formation and the installation of the wall surface facing the workpiece side surface (the inner surface forming the suction hole 20) can be performed at a time, the suction device having these configurations can be easily manufactured.

  Means 6. The non-contact adsorption apparatus according to means 5, wherein the adsorption hole is formed in the same shape as the planar shape of the gas ejection part.

  According to the means 6, since the adsorption hole is formed in the same shape as the planar shape of the gas ejection part, the pressurized gas ejected from the gas ejection part is almost once introduced into the adsorption hole. If the suction hole is formed smaller than the gas ejection part, the pressurized gas is directly introduced into the negative pressure chamber and the negative pressure in the negative pressure chamber, and hence the suction force, is weakened, but this can be prevented. Further, even if the workpiece is smaller than the gas ejection portion, a suction portion that is an inlet that leads from the suction hole to the negative pressure chamber is disposed in the vicinity of the outer peripheral portion, so that a suction force can be reliably applied to the workpiece. .

  Mean 7 The non-conducting means according to any one of means 1 to 6, wherein a porous body to which a pressurized gas is supplied is provided on the workpiece suction side of the main body, and the gas ejection surface of the porous body is used as the gas ejection section. Contact adsorption device.

  According to the means 7, since the porous body having a large number of fine holes is used as the gas ejection portion, the pressurized gas can be ejected uniformly from the gas ejection surface of the porous body. Thereby, a levitation force can be applied uniformly to the surface to be attracted of the workpiece, and the adsorption holding of the workpiece can be stabilized.

  Hereinafter, an embodiment embodying the invention will be described with reference to FIGS. 1 and 2. In the present embodiment, a non-contact chuck that is attached to a workpiece transfer device and sucks the workpiece in a non-contact state is embodied. FIG. 1 is a longitudinal sectional view of a non-contact chuck, and FIG. 2 is an enlarged sectional view of a main part of FIG.

  As shown in FIG. 1, the non-contact chuck 1 includes a chuck main body 2 as a main body formed of a metal such as stainless steel, and a mounting projection 3 is provided on the upper surface 2a of the chuck main body 2. . The mounting protrusion 3 is formed with mounting means such as a male screw on the outer periphery thereof. By this attachment means, the non-contact chuck 1 is attached to a portion to be attached of a conveying device (not shown). An air supply port 5 of an air supply passage 4 formed in the chuck body 2 is provided on the upper surface of the mounting projection 3. The air supply port 5 is supplied with compressed air in a state where the non-contact chuck 1 is attached to the conveying device.

  An accommodation recess 7 that forms a disk-like space is formed on the lower surface of the chuck body 2, that is, substantially at the center of the suction side plane 2 b as the suction side end surface. A disc-shaped porous body 8 is accommodated in the accommodating recess 7 so as to protrude from the adsorption side plane 2b, and is fixed in that state. The porous body 8 is made of a sintered fluororesin such as a sintered trifluoride resin or a sintered tetrafluoride resin, and has a large number of fine holes.

  A flow groove 9 is formed on the upper side of the porous body 8, and a part of the upper surface 8 a of the porous body 8 is exposed in the flow groove 9. A discharge port 6 of the air supply passage 4 is provided on the inner surface forming the flow groove 9. For this reason, the compressed air supplied to the air supply port 5 flows into the flow groove 9 through the air supply passage 4, and further, the lower surface (air ejection surface) of the porous body 8 through the micropores of the porous body 8. ) It will be ejected from 8b. A gas ejection portion is constituted by the air ejection surface 8 b of the porous body 8. In FIG. 1, the flow of the compressed air is schematically shown by arrows. A seal layer (not shown) is formed on the outer periphery of the porous body 8 to prevent the compressed air from flowing out from the outer peripheral surface protruding from the adsorption side plane 2b.

  The chuck body 2 is provided with a suction port 11 on its side surface. A suction passage 12 communicating with the suction port 11 is formed in the chuck body 2, and a suction port 13 of the suction passage 12 is provided on the suction side plane 2 b around the porous body 8. In the present embodiment, only one suction passage 12 or suction port 13 is provided. Thereby, the air existing around the suction port 13 is sucked through the suction passage 12. FIG. 1 schematically shows how the air is sucked by arrows.

  Further, the chuck body 2 is provided with a cap 16 so as to cover the suction side plane 2b around the porous body 8. The cap 16 includes a flat bottom surface portion 17 and an outer peripheral wall portion 18 erected on the outer peripheral portion of the bottom surface portion 17, and the longitudinal section thereof is formed in a U shape as shown in FIGS. 1 and 2. Has been. The cap 16 is attached to the chuck body 2 by fixing the outer peripheral wall portion 18 to the step 19 provided on the outer peripheral side of the suction side plane 2b by press fitting, bonding, or other appropriate means. In this attached state, the bottom surface portion 17 is disposed below the air ejection surface 8 b of the porous body 8. Further, a suction hole 20 having a circular shape having the same diameter as the planar shape of the porous body 8 is formed in the bottom surface portion 17 at a substantially central portion thereof. With this configuration, in a state where the cap 16 is attached to the chuck body 2, the air ejection surface 8 b of the porous body 8 provided at the substantially central portion of the suction side plane 2 b is exposed through the suction hole 20. Further, a gap 21 is formed between the outer peripheral edge of the air ejection surface 8 b and the inner opening edge of the suction hole 20, and a space 22 is formed between the suction side plane 2 b and the inner surface of the cap 16. Since the suction port 13 formed in the suction side plane 2 b opens toward the space 22, the air in the space 22 is sucked through the suction port 13 and the suction passage 12. Therefore, the space 22 is a negative pressure chamber 22, and the gap 21 is an inlet 21 to the negative pressure chamber 22. The introduction port 21 constitutes a suction part. A sealing process is performed between the outer peripheral wall portion 18 of the cap 16 and the step 19 to which the outer peripheral wall portion 18 is fixed, and air flows into the negative pressure chamber 22 through the attachment portion of the outer peripheral wall portion 18 and is negatively charged. The pressure is prevented from decreasing.

  Next, the operation of the non-contact chuck 1 configured as described above will be described. The workpiece attracted by the non-contact chuck 1 is a thin semiconductor chip W having a ring shape.

  The non-contact chuck 1 is attached to a transport device (not shown) using the mounting projection 3 and moves together with the transport device. In the attached state, when compressed air is supplied to the air supply port 5, the compressed air flows through the air supply passage 4 and flows into the flow groove 9, and further, the porous body 8 passes through the micropores of the porous body 8. 8 is ejected from the entire air ejection surface 8b. On the other hand, when a negative pressure is applied to the suction port 11, the negative pressure chamber 22 is set to a negative pressure via the suction passage 12. Thereby, air near the inlet 21 is sucked into the negative pressure chamber 22. Then, by adjusting the pressure generated on the air ejection surface 8b and the negative pressure generated on the introduction port 21 of the negative pressure chamber 22, the suction hole 20 below the air ejection surface 8b and further below A negative pressure region F as shown in FIG. 1 is generated. The strength of the negative pressure in the negative pressure region F, that is, the strength of the suction force is the highest in the vicinity of the opening edge of the suction hole 20, and becomes weaker toward the center. This is because the inlet 21 for generating a negative pressure exists at the inner opening edge of the suction hole 20.

  With the non-contact chuck 1 in such a state, the transport device starts from above the semiconductor chip W mounted on the mounting table in the previous process in order to transport the semiconductor chip W that has completed the previous process to the subsequent process. The non-contact chuck 1 is brought closer to the chip W. When the non-contact chuck 1 approaches the semiconductor chip W and enters the negative pressure region F, a suction force acts on the chip W, and the chip W is sucked into the suction hole 20 of the non-contact chuck 1. At this time, since a pressure (levitation force) is generated on the air ejection surface 8b of the porous body 8, the pressure acts on the suction surface (upper surface) of the chip W facing the air ejection surface 8b. . At the same time, the suction force when air is sucked into the negative pressure chamber 22 from the inlet 21 acts on the chip W.

  Here, the action of the suction force will be briefly described. The introduction port 21 for generating the suction force exists over the entire periphery of the air ejection surface 8b. For this reason, the suction force acts on the outer peripheral side of the semiconductor chip W. Even in the ring-shaped semiconductor chip W, the outer peripheral portion thereof becomes a portion to be sucked, and therefore, if a suction force acts on the semiconductor chip W, the suction force can be reliably applied to the chip W.

  In this way, the ring-shaped semiconductor chip W has a pressure force applied to the surface to be attracted and a suction force acting on the outer peripheral side at the same time, so that as shown in FIG. On the other hand, it is adsorbed and held in a non-contact state. In FIG. 2, the gap between the air ejection surface 8b and the semiconductor chip W is exaggerated for convenience of explanation. However, when actually used, a gap in units of microns is ensured by harmony between the applied pressure and the suction force. FIG. 2 shows a state in which the semiconductor chip W is adsorbed and held at the substantially central portion of the air ejection surface 2b of the porous body 8, but it is not necessarily adsorbed and held in such a state. Absent. There is a case where the semiconductor chip W is sucked toward the introduction port 21 and is sucked and held in a state where the side surface of the chip W is in contact with the inner surface forming the suction hole 20.

  As described above, after the semiconductor chip W is attracted to the non-contact chuck 1, the transport device is driven to transport the chip W to the subsequent process, and supply of compressed air and negative pressure are performed at the mounting position in the subsequent process. When the action is stopped, the semiconductor chip W is placed at the placement position.

  According to the embodiment described above in detail, the following excellent effects are obtained.

  According to the present embodiment, the semiconductor chip W receives the suction force generated when sucking the gas around the inlet 21 and the levitation force generated when the compressed air is jetted from the air jetting surface 8b at the same time. It is sucked and held in a non-contact state with respect to the surface 8b. At this time, the levitation force acts on the attracted surface (upper surface) of the chip W facing the air ejection surface 8b. And since the inlet 21 exists over the whole circumference | surroundings of the air ejection surface 8b, the attraction | suction force is heightened substantially uniformly over the perimeter by the outer peripheral part side of the chip | tip W. FIG. For this reason, as shown in FIG. 2, even if the semiconductor chip W has a ring shape and a hole is formed in the center portion, the suction force acts reliably as long as the suction force acts on the outer peripheral side of the chip W. Thus, the chip W can be sucked and held.

  In the present embodiment, the suction force acting on the semiconductor chip W acts on the entire outer peripheral portion side of the chip W, and does not concentrate on one place. That is, the suction force acting on the semiconductor chip W is dispersed on the outer peripheral side of the chip W. As a result, it is possible to prevent a suction failure such that the semiconductor chip W is sucked in a vertical direction toward the concentrated portion of the suction force or sucked in a tilted state. Further, the dispersion of the suction force can prevent deformation and breakage even when a thin tip is used as a workpiece.

  While the semiconductor chip W is being transported by the transport device, the non-contact chuck 1 is not always maintained in a horizontal state but may be tilted. When the non-contact chuck 1 is tilted, the chip W held by suction causes a lateral shift to the valley side. In this embodiment, in such a case, the chip W comes into contact with the inner surface that forms the suction hole 20. Even in this contact state, suction force and levitation force are simultaneously applied to the chip W. For this reason, the chip W can be prevented from slipping off from the non-contact chuck 1. Further, since the inner surface forming the suction hole 20 faces the entire side surface of the chip W, the effect of preventing the chip W from slipping can be obtained without specifying the inclined direction.

  In the present embodiment, the suction hole 20 is provided below the air ejection surface 8 b, and the air in the suction hole 20 is sucked at the introduction port 21. As described above, the air in the space defined by the inner surface forming the suction hole 20 is sucked, so that the negative pressure in the space (suction hole 20) is such that the periphery of the inlet 21 is the cap 16. It is higher than the fully opened state. Thereby, the suction effect of the semiconductor chip W is enhanced.

  In the present embodiment, the cap 16 having the suction hole 20 is provided, and the suction portion is not the suction port 13 of the suction passage 12 but the introduction port 21 disposed on the side of the suction-held semiconductor chip W. Yes. For this reason, a suction location will be arrange | positioned in the position closer to the side surface of the chip | tip W, and the suction | attraction force with respect to the chip | tip W can be made to act more strongly.

  In the present embodiment, since compressed air is ejected from the air ejection surface 8 b of the porous body 8, the compressed air can be uniformly ejected onto the surface to be adsorbed of the semiconductor chip W. Thereby, a levitation force can be applied uniformly to the attracted surface of the chip W, and the non-contact state can be maintained more stably.

  In the present embodiment, only by attaching the cap 16 to the chuck body 2, the negative pressure chamber 22 and the introduction port 21 that is an inlet to the negative pressure chamber 22 are arranged over the entire periphery of the air ejection surface 8 b. The formation of the adsorption space (adsorption hole 20) and the installation of the wall surface (the inner surface forming the adsorption hole 20) facing the side surface of the semiconductor chip W in the adsorption state can be performed at once. For this reason, the non-contact chuck | zipper 1 provided with those structures can be manufactured easily.

  In the present embodiment, the suction holes 20 are formed in a circular shape having the same diameter as the planar shape of the porous body 8, so that the compressed air ejected from the air ejection surface 8 b is almost once introduced into the suction holes 20. . If the suction hole 20 is formed smaller than the planar shape of the porous body 8, the compressed air is directly introduced into the negative pressure chamber 22, and the negative pressure in the negative pressure chamber 22 and thus the suction force is weakened. Can be prevented. Moreover, even if the semiconductor chip W is smaller than the air ejection surface 8b, the introduction port 21 is disposed in the vicinity of the outer peripheral portion thereof, so that a suction force can be reliably applied to the chip W.

  The embodiment is not limited to the above contents, and may be implemented as follows, for example.

  In the embodiment described above, the negative pressure chamber 22 is formed by the bottom surface portion 17 of the cap 16 separately from the suction hole 20 which is the suction space. However, the negative pressure chamber is similar to the non-contact chuck 25 shown in FIG. A configuration in which 22 is omitted may be adopted. The difference from the non-contact chuck 1 will be mainly described. In the non-contact chuck 25, a plurality of suction ports 13 are uniformly arranged around the porous body 8 on the suction side plane 2b of the chuck body 2. A cylindrical body 26 is provided instead of the cap 16. For this reason, the air in the cylinder 26 is sucked by the plurality of suction ports 13. Even in such a configuration, since a suction force is applied on the outer peripheral side of the semiconductor chip W, the semiconductor chip W having a ring shape can be reliably sucked and held as in the above-described embodiment.

  In addition, according to the non-contact type chuck 25, the same effect as the above-described embodiment can be obtained. That is, the suction force acts at a plurality of locations on the outer peripheral side of the semiconductor chip W and does not concentrate on a single location. Therefore, the suction failure is prevented, and when a thin chip is used as a workpiece, its deformation or breakage occurs. It can also be prevented. Further, even if the non-contact chuck 25 is inclined and the semiconductor chip W is laterally displaced to the valley side, the chip W comes into contact with the inner surface of the cylindrical body 26, so that the chip W can be prevented from slipping down. Furthermore, since the air in the space defined by the cylindrical body 26 is sucked, the negative pressure in the space is higher than that in the state where the periphery of the inlet 21 is completely open without the cylindrical body 26. Thereby, the suction effect of the chip W is enhanced.

  In the above embodiment, the porous body 8 is provided so as to protrude from the suction side plane 2b. However, the porous body 8 may be provided so that the air ejection surface 8b thereof is flush with the suction side plane 2b. Further, as the planar shape of the accommodating recess 7 and the porous body 8, any shape other than a circle such as a square shape can be selected, and it may be formed in an annular shape. However, it is preferable that both shapes are common to each other. Further, the porous body 8 can be configured by sintering a metal material such as sintered copper or sintered stainless steel, a synthetic resin material such as a sintered nylon resin or a sintered polyacetal resin, a sintered carbon, It can also be composed of sintered ceramics. In addition, it is good also as a structure which provided many orifices instead of the porous body 8. FIG.

  In the above embodiment, since the inner surface of the suction hole 20 is the wall surface with which the side surface of the semiconductor chip W abuts, the wall surface facing the side surface is provided over the entire side surface of the chip W. In FIG. 3, it is also possible to form a notch at some locations of the cylindrical body 26 and to provide a plurality of wall surfaces.

  In the above embodiment, only one suction passage 12 and suction port 13 are provided, but a plurality of suction passages 12 and suction ports 13 may be provided. Moreover, in the said embodiment, although compressed air (air) was mentioned as an example as pressurized gas ejected from the air ejection surface 8b, you may use other gas, such as nitrogen other than air.

  In the above-described embodiment, a thin semiconductor chip W having a ring shape is taken as an example of the workpiece, but other surfaces such as a semiconductor chip that does not have a ring shape, a small lens, and the like are in direct contact with the suction surface. It may be a part that dislikes.

The longitudinal cross-sectional view which shows a non-contact chuck | zipper. The principal part expanded sectional view of FIG. 1 which shows the state which adsorb | sucked the semiconductor chip. The longitudinal cross-sectional view which shows the non-contact chuck of another example. Sectional drawing which shows the conventional non-contact adsorption | suction apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,25 ... Non-contact chuck | zipper as a non-contact adsorption | suction apparatus, 2 ... Chuck main body as a main body, 2b ... Adsorption side plane as a workpiece | work adsorption | suction side end surface, 8 ... Porous body, 8b ... Air ejection surface as a gas ejection part , 16 ... cap, 20 ... suction hole, 21 ... introduction port as suction part, 22 ... negative pressure chamber, W ... semiconductor chip as work.

Claims (7)

  Provided on the work suction side of the main body is a gas ejection part and a suction part arranged around the gas ejection part at a plurality of locations or around the entire circumference, and suction force generated when sucking the gas around the suction part, and gas Non-contact adsorption is characterized in that the workpiece is adsorbed and held in a non-contact state with respect to the gas ejection portion by simultaneously acting on the workpiece with the levitation force generated when pressurized gas is ejected from the ejection portion. apparatus.   On the workpiece suction side of the main body, a wall surface that faces the side surface of the workpiece when the workpiece is sucked is provided, and even if the wall surface is in contact with the side surface of the workpiece, suction force and levitation force are applied to the workpiece. The non-contact adsorption apparatus according to claim 1, wherein the non-contact adsorption apparatus is disposed at a position where the pressure acts.   3. The non-removal device according to claim 1, wherein an adsorption space for adsorbing and holding a work is defined in front of the gas ejection portion, and the gas in the adsorption space is sucked by the suction portion. Contact adsorption device.   The non-contact suction device according to any one of claims 1 to 3, wherein the suction unit is disposed on a side of a workpiece in an suction state. A gas ejection part provided on the work suction side end face of the main body,
It is attached to the workpiece suction side of the main body, covers the suction side end surface around the gas ejection part so that an internal space is formed between the end surface, and an adsorption hole is formed at a position facing the gas ejection part With a cap,
The internal space is set as a negative pressure chamber, and a gap communicating from the suction hole to the negative pressure chamber is set as a suction portion. The suction force generated when sucking the gas around the suction portion and the pressurized gas from the gas ejection portion A non-contact suction apparatus configured to cause a floating force generated when jetting is applied to a work at the same time so that the work is sucked and held in the suction hole in a non-contact state with respect to the gas ejection section.   The non-contact adsorption apparatus according to claim 5, wherein the adsorption hole is formed in the same shape as a planar shape of the gas ejection part.   The porous body to which pressurized gas is supplied is provided on the work suction side of the main body, and the gas ejection surface of the porous body is used as the gas ejection section. Non-contact adsorption device.

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