JP2006086202A - Dicing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dicing device which is capable of eliminating a residual contaminant effectively. <P>SOLUTION: The dicing device 10 is provided with a jet member 60 which is disposed on the lower part of the side face of the spindle 22 and supplies washwater to a work W. This allows the washwater to be supplied to the work W effectively when a contaminant A remains on the work W to be closer to the spindle 22 side than a blade 21. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a dicing apparatus, and more particularly, to a dicing apparatus that reduces contamination remaining on the upper surface of a workpiece.

  A dicing apparatus that divides a work such as a wafer on which a semiconductor device or an electronic component is formed into individual chips includes at least a blade that is rotated at high speed by a spindle, a work table on which the work is placed, a work table and a blade X, Y, Z, and θ moving axes that change the relative positions of the workpieces are provided, and the workpieces are grooved and cut by the operations of these moving axes.

In this processing, contaminants such as grinding scraps (referred to as contamination or contamination) are generated from the workpiece. Therefore, the dicing device is provided beside the processing portion to remove the contamination, and the cleaning water is directed toward the cutting point. Various injection members such as a nozzle for injecting the liquid are attached (for example, see Patent Document 1).
JP 2002-224929 A

  By the way, the contamination generated when machining the workpiece remains in the periphery of the machining portion. However, depending on the machining method and the type of workpiece, there may be a large amount of contamination on the workpiece surface on the spindle side from the blade. However, in such a case, since the cleaning member sprays cleaning water toward the cutting point only from the lateral direction of the blade, the workpiece surface on the spindle side from the blade. The cleaning water is not sprayed on the top, and it is not possible to remove the contaminants remaining in that part. For this reason, there is a problem that contamination remains in the workpiece after machining and the machining quality is lowered.

  The present invention has been made for such a problem, and an object of the present invention is to provide a dicing apparatus capable of effectively removing contaminants remaining on the work surface on the spindle side of the blade in the dicing apparatus. And

  In order to achieve the above object, the present invention includes a blade that is rotated at a high speed by a spindle and a work table on which a work is placed to perform relative movement with the blade. In the dicing apparatus that performs groove processing and cutting of the workpiece by the blade, an injection member that is disposed on the lower side surface of the spindle and supplies cleaning water toward the workpiece is provided.

  According to the first aspect of the present invention, it is possible to effectively supply cleaning water to a workpiece in which contamination remains on the spindle side from the blade.

  According to a second aspect of the present invention, in the first aspect of the present invention, the cleaning water sprayed from the spray member pushes contaminants such as grinding dust remaining on the work surface closer to the spindle than the blade to the blade side. It is characterized by that.

  According to the second aspect of the present invention, the contamination remaining on the workpiece surface on the spindle side from the blade is pushed away to the blade side, so that the contamination is removed by the cleaning water sprayed near the cutting point from the blade lateral direction. Therefore, it is possible to reduce residual contamination on the work surface.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the spray member is provided with a plurality of cleaning water spray ports.

  According to the invention of claim 3, since the cleaning water can be sprayed over a wide range on the work surface on the spindle side from the blade, the remaining contamination can be effectively removed.

  According to a fourth aspect of the invention, in the third aspect of the invention, the plurality of injection ports are provided in parallel to the blade.

  According to the fourth aspect of the present invention, since the cleaning water can be sprayed uniformly onto the work surface, it is possible to effectively remove the remaining contamination.

  According to a fifth aspect of the present invention, in the first, second, third, or fourth aspect of the invention, the injection member is provided with a position adjusting mechanism for adjusting an injection position.

  According to the fifth aspect of the present invention, since the spray position on the work surface on which the cleaning water is sprayed can be changed, the cleaning water can be effectively supplied to the place where the contamination remains. Become.

  As described above, according to the dicing apparatus of the present invention, it is possible to effectively remove the contamination remaining on the workpiece surface on the spindle side from the blade, so that the residual contamination is suppressed and the machining quality is improved. Is possible.

  Preferred embodiments of a dicing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. In each figure, the same number or symbol is attached to the same member.

  First, the configuration of the dicing apparatus will be described. FIG. 1 is a perspective view showing the appearance of a dicing apparatus according to the present invention. As shown in FIG. 1, the dicing apparatus 10 includes a processing unit 20, an operation / display unit 11, an imaging unit 12, a monitor television 13, an indicator lamp 14, a controller 15, and the like.

  In the processing unit 20, a blade, which is a rotary blade, is attached to the tip of a spindle supported by an air bearing built in a high frequency motor, and is rotated at a high speed of 30,000 rpm to 60,000 rpm, and infeed in the Z direction in the figure. And index feed in the Y direction are performed. The work table on which the work to be processed is placed is rotated by θ and is ground and fed in the X direction.

  As the blade for processing the workpiece, an electrodeposition blade in which diamond abrasive grains or CBN abrasive grains are electrodeposited with nickel, a metal resin bond blade bonded with a resin mixed with metal powder, or the like is used. Also, the dimensions of the blade are variously selected depending on the processing content, but when dicing an ordinary semiconductor wafer, a blade having a diameter of about 50 mm and a thickness of about 30 μm is used.

  The image pickup means 12 for picking up an image of the surface of the work or picking up a flaw on the upper surface of the work table includes a microscope and a CCD camera, and the picked-up image is displayed on the monitor television 13. The operation / display unit 11 incorporates a switch and a display device for performing each operation of the dicing apparatus 10.

  The indicator lamp 14 displays an operation end and an abnormality alarm during the operation of the dicing apparatus 10, and is provided at a high position so that it can be recognized even from a distant position. The controller 15 that controls the operation of each unit of the dicing apparatus 10 includes a CPU, a memory, an input / output circuit unit, various control circuit units, and the like, and is incorporated in the frame of the dicing apparatus 10.

  Next, main parts of the dicing apparatus according to the present invention will be described with reference to FIGS.

  2 is a side view of the processing unit 20, FIG. 3 is a plan view of the processing unit 20, and FIG. 4 is a front view of the spindle 22. As described above, the dicing apparatus 10 has the spindle 22 with a built-in high-frequency motor with a blade 21 attached to the tip. The blade 21 is fixed to the rotating shaft 24 of the spindle 22 by a flange 23 and is moved relative to the work table 31.

  A block 62 and a nozzle 61 are attached to the side surface of the spindle 22 as the injection member 60. In the present embodiment, the nozzle 61 is a pipe that is partially bent into an L shape. As shown in FIG. 4, the cleaning water injection ports 61 </ b> A, 61 </ b> A. A plurality of lines are formed in parallel and obliquely downward.

  A tube 64 is attached to the block 62 via a joint 63, and cleaning water is supplied from the tube 64. The supplied cleaning water is supplied to the nozzle 61 through the block 62 and is sprayed from the cleaning water spray ports 61A, 61A.

  In addition, a long hole 71A and an adjustment screw 71B are attached to the block 62 as the position adjusting mechanism 70, and this makes it possible to adjust the injection position by moving the position of the nozzle 61 back and forth.

  With these configurations, in the present invention, it is possible to effectively remove the contaminants remaining on the workpiece surface on the spindle 22 side of the blade 21 (near part A in FIG. 2 or FIG. 3) to the blade 21 side. Reduces residue and improves processing quality.

  In the embodiment according to the present invention, the shape of the nozzle is a pipe formed by bending a part thereof into an L shape. However, the nozzle may be formed by arranging a plurality of small injection members side by side.

  Next, the operation of the dicing apparatus 10 according to the present invention configured as described above will be described. First, the work table 31 is moved in the X direction to the vicinity of the bottom of the imaging means 12 shown in FIG. 1, and the work W is sucked and placed on the work table 31 at that position. After the suction placement, the imaging means 12 is used to observe the reference mark on the workpiece W, the peripheral edge of the workpiece W, and the like, and the processing position is adjusted.

  When the processing position adjustment is completed and the processing operation is started, supply of cutting water and cleaning water from a nozzle (not shown) provided near the blade 21 from the lateral direction of the blade toward the cutting point starts, and the cleaning water is also supplied from the nozzle 61. Begins to spray. Then, the work W is sent in the X direction together with the work table 31, and the first line is processed.

  In addition, since contamination occurs during processing, the contamination remaining on the surface of the workpiece W is removed with the cleaning water sprayed from the nozzle. In the present invention, contamination remaining on the workpiece surface (near part A in FIG. 2 or FIG. 3) on the spindle 22 side from the blade 21 is removed by the nozzle 61. As a result, it is possible to remove the contamination remaining in the vicinity of the portion A, which is difficult to remove with a nozzle that injects cleaning water to the vicinity of the cutting point only from the lateral direction of the blade, thereby reducing the residual contamination and improving the machining quality.

  When the processing for one line is completed, the blade 21 is indexed in the Y direction together with the spindle 22 to perform processing for the second line. When this process is repeated and the machining of all lines in one direction of the workpiece W is completed, the work table 31 rotates and changes the angle in the next machining direction. The two processing directions are generally only two directions, that is, the direction in which the processing is first performed and the direction orthogonal to 90 degrees.

  Similarly, the processing is performed for each line in that direction, and when the processing of the lines in all necessary directions is completed, the processing operation is completed by performing cleaning, drying, and the like. The above is the flow of the workpiece W processed by the dicing apparatus 10.

  As described above, according to the present invention, it becomes possible to effectively supply cleaning water to a workpiece in which contamination remains on the spindle side from the blade, and the remaining of contamination is suppressed, so that the machining quality is improved. It becomes possible to improve

The perspective view showing the dicing device appearance concerning an embodiment of the invention The side view showing the process part of the dicing apparatus which concerns on embodiment of this invention The top view showing the process part of the dicing apparatus which concerns on embodiment of this invention Front view of spindle

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Dicing apparatus 15 ... Controller 21 ... Blade 22 ... Spindle 31 ... Work table 60 ... Injection member 61 ... Nozzle 61A ... Washing water injection port 62 ... Block 70 ... Position adjustment mechanism 71A ... Slot 71B ... Adjustment screw A ... Contamination residual Part W ... Work

Claims (5)

In a dicing apparatus that has a blade that is rotated at high speed by a spindle and a work table that places a workpiece and moves relative to the blade, and performs groove processing and cutting of the workpiece by the blade,
A dicing apparatus, characterized in that an injection member is provided on the lower side surface of the spindle and supplies cleaning water toward the workpiece.   The dicing apparatus according to claim 1, wherein the cleaning water sprayed from the spraying member pushes contaminants such as grinding scraps remaining on the work surface closer to the spindle than the blade to the blade side.   The dicing apparatus according to claim 1, wherein the injection member is provided with a plurality of cleaning water injection ports.   The dicing apparatus according to claim 3, wherein the plurality of injection ports are provided in parallel to the blade.   The dicing apparatus according to any one of claims 1, 2, 3, and 4, wherein the injection member is provided with a position adjustment mechanism for adjusting an injection position.

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