JP2004288962A - Method for dicing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for dicing which can easily remove a burr generated at the corner of the intersection position of respective grooves when the grooves are formed in the square-like states of a Go board on a workpiece made of a soft metal or a material containing the soft metal and which can discharge the burrs from the grooves. <P>SOLUTION: Channel 1 working for forming the grooves G1 in a first direction on the workpiece W is performed by a rotating dicing blade, and then channel 2 working for forming the grooves G2 in a second direction perpendicular to the first direction is performed. Then, the burrs B, B generated at the intersection corners of the grooves G1 of the first direction, and the grooves G2 of the second direction are inserted into the grooves G1 of the first direction and are removed while a working liquid is supplied again to the rotating dicing blade. Thus, the burrs B, B in the grooves are easily removed during a series of automatic operations, and are discharged from the grooves. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method of grooving and cutting a work, and more particularly to a dicing method of grooving a wafer-like work such as a semiconductor device or an electronic component or dividing the wafer-like work into individual chips. It is.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in order to divide a wafer having a semiconductor device, electronic components, and the like formed on its surface into individual chips, a dicing apparatus that cuts a wafer by cutting a wafer with a grinding groove using a thin grindstone called a dicing blade has been used. .
[0003]
As a dicing blade for dicing a wafer such as a semiconductor device or an electronic component, an electroformed blade in which diamond abrasive grains are electrodeposited with Ni is generally used. The dicing blade was rotated at a high speed of 30,000 to 60,000 rpm to cut into the wafer, and the wafer was completely cut (full cut) or incompletely cut (half cut or semi-full cut). Half cut is a method of cutting about half the thickness of the wafer, and semi-full cut is the case where a ground groove is formed while leaving a thickness of about 10 μm.
[0004]
Normally, when dividing a wafer into a large number of chips, a large number of grooves are formed in one direction of the wafer, and then a large number of grooves are formed in the other direction, and the wafer is cut like a grid.
[0005]
However, in the case where the wafer as the workpiece is a soft metal or a material containing a soft metal, when the above-described groove in one direction is formed and then the groove in the other direction is processed, the position of the intersection of the grooves in both directions is determined. Burrs, burrs, or burrs (hereinafter collectively referred to as burrs) occur at the corners. The burrs at the corners are generated in a shape that has entered (escaped) the first one-way groove.
[0006]
Conventionally, in drilling in metal working, when a hole penetrates, a burr generated on the side of the hole, when the hole penetrates the surface of the workpiece, an operator uses a knife-shaped tool called a susapper to exit the hole. Burrs were removed by chamfering or chamfering the outlet of the hole with a drill having a larger diameter than the drill used for drilling.
[0007]
In addition, burrs generated on the penetration side when the hole penetrates into the inside of the large-diameter hole that has been processed earlier have been removed by rotating and inserting a deburring tool such as a drill into the large-diameter hole. (For example, refer to Patent Document 1).
[0008]
Both of these deburring operations were manually performed by an operator or manually performed by an operator.
[0009]
[Patent Document 1]
JP 2000-254846 A
[Problems to be solved by the invention]
However, in dicing for dividing a wafer into individual chips, it is necessary to remove fine burrs generated in a large number of narrow grooves having a width of 100 μm or less. However, it was not possible to cope with the deburring work by manual work of the user or mechanical work by the manual operation of the operator.
[0011]
Further, burrs generated at the corners of the intersections of the above-mentioned grooves are formed at the four corners of the chip, and if each of the divided chips is manually deburred, an enormous amount of burrs will occur. It required man-hours and could not be put to practical use.
[0012]
The present invention has been made in view of such circumstances, and when grooving a work made of a soft metal or a material containing a soft metal in a grid pattern, burrs generated at corners of intersection points of the grooves are formed. It is an object of the present invention to provide a dicing method that can be easily removed and discharged from a groove.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a dicing method for grooving or cutting a work with a rotating blade while supplying a working liquid, wherein a channel 1 processing for forming a groove in a first direction in the work. A step of forming a groove in the workpiece in a second direction orthogonal to the first direction, a channel 2 processing step, and the rotation in the groove in the first direction formed in the channel 1 processing step again by the rotation And a channel 1 insertion step for inserting a blade to be inserted. The channel 1 insertion step is performed while the processing fluid is supplied, and the channel 1 insertion step is performed in the first direction generated during the channel 2 processing step. The method is characterized in that burrs at intersections between the groove and the groove in the second direction are removed, and the inside of the groove in the first direction is cleaned.
[0014]
According to the present invention, a channel 1 processing for forming a groove in a first direction is performed on a workpiece with a rotating blade, and then a channel 2 processing for forming a groove in a second direction orthogonal to the first direction is performed. The burr generated at the intersection of the groove in the first direction and the groove in the second direction is removed by inserting the rotating blade into the groove in the first direction while supplying the processing liquid again. So that they are easily removed in a series of automatic operations and ejected from the grooves.
[0015]
Further, the present invention is characterized in that in the above method, the feed speed of the blade in the channel 1 insertion step is equal to or higher than the feed rate of the blade in the channel 1 processing step or the channel 2 processing step.
[0016]
According to the present invention, since the feed speed of the blade in the channel 1 insertion process is set to be equal to or higher than the feed speed of the blade in the groove forming process, it is possible to reduce a decrease in throughput for deburring.
[0017]
Further, the present invention is characterized in that in the above method, the feed speed of the blade in the channel 1 insertion step is lower than the feed speed of the blade in the channel 1 processing step or the channel 2 processing step.
[0018]
According to this further invention, since the feed speed of the blade in the channel 1 insertion process is set lower than the feed speed of the blade in the groove forming process, burrs are surely removed and the cleaning effect is high.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of a dicing method according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same members are given the same numbers or symbols.
[0020]
FIG. 1 is an external perspective view of a dicing apparatus used in the dicing method according to the present invention. The dicing apparatus 10 includes a processing unit 20, an operation / display unit 11, an imaging unit 12, a monitor television 13, a controller 15, a display tower 14, and the like.
[0021]
The processing part 20 is a part that performs groove processing and cutting processing on the work. The operation / display unit 11 is provided with switches and display means for operating each part of the dicing apparatus 10. The imaging unit 12 is a part for imaging the surface of the work in order to evaluate the alignment and the processing state of the work, and includes a microscope 12A, a lighting device, a CCD camera and the like. The captured image is displayed on the monitor television 13.
[0022]
The controller 15 controls each operation of the dicing apparatus 10 and includes a microprocessor, a memory, an input / output circuit, and the like, and is stored inside a mount of the dicing apparatus 10. The display tower 14 is for displaying the operation of the dicing apparatus 10, during standby, an abnormality warning, and the like, and is mounted at a high position so that the operator can recognize the dicing apparatus 10 from a distance.
[0023]
As shown in the perspective view of FIG. 2, a dicing blade (blade) 21 for performing groove processing and cutting processing of a workpiece is attached to an air bearing spindle 22 having a built-in high-frequency motor in the processing section 20, and has a speed of 30,000 rpm to 60,000 rpm. It is rotated at a high speed, and is index-fed by a feed mechanism (not shown) in the Y direction orthogonal to the arrow X direction in the figure.
[0024]
The dicing blade 21 has a thin disk shape, and is a metal bond blade in which fine diamond abrasive grains or CBN abrasive grains are bonded with metal (in particular, an electroformed blade electroplated with Ni is often used), or a resin bond bonded with resin. A blade having a diameter of about 55 mm to 100 mm and a thickness of about 15 μm to about 100 μm is used.
[0025]
The dicing blade 21 is surrounded by a flange cover (not shown) having an open front side and a lower side, and grinding water (working fluid) is supplied to a processing point from a grinding nozzle (not shown) provided on the flange cover.
[0026]
The work table 23 on which the work is mounted by suction is rotated by θ by a θ table (not shown), and is ground and fed by a drive mechanism (not shown) in the arrow X direction in the figure. Further, an oil pan 29 for receiving waste water of grinding water or washing water is fixed to the machine base, and bellows 27 are provided between the oil pan 29 and a table cover 28 surrounding the work table 23, The central portion of the oil pan 29 is covered.
[0027]
As shown in FIG. 2, a water curtain forming nozzle 24 for spraying curtain-like cleaning water onto the work W is provided at a position near the cutting stroke end of the work table 23 and intermediate between the work processing position and the microscope position. An air curtain forming nozzle 25 for injecting curtain-shaped air to shield the mist from the microscope 12A side is held by the mounting blocks 26, 26, and is provided horizontally at right angles to the XX direction. .
[0028]
As described above, the processing unit 20 uses a large amount of cutting water and cleaning water to generate water splashes and mist. 40 is provided so as to cover the processing unit 20.
[0029]
Next, a dicing method of the present invention using the above-described dicing apparatus 10 will be described. FIG. 3 is a conceptual diagram of the dicing method of the present invention. First, as indicated by an arrow in FIG. 3A, a channel 1 (hereinafter referred to as a channel 1) for forming a groove G1 in a first direction (horizontal direction in the figure) while supplying a processing liquid by a dicing blade 21 rotating on a work W. (Described as CH1).
[0030]
Next, as shown by an arrow in FIG. 3B, a groove G2 in a second direction (vertical direction in the figure) orthogonal to the first direction is formed while supplying the processing liquid by the dicing blade 21 which also rotates. Channel 2 (hereinafter referred to as CH2) processing step. At this time, since the work W is a soft material, burrs B are generated at corners of the processed work W when the groove G2 in the second direction crosses the groove G1 in the first direction. The burrs B are formed so as to be pushed out into the grooves G1 in the first direction, as shown in the enlarged view of FIG.
[0031]
Next, as shown by an arrow in FIG. 3C, a CH1 insertion step of passing the dicing blade 21 rotating in the groove G1 in the first direction formed in the CH1 processing step is performed. At this time, the processing is performed while the processing liquid is supplied to the processing point. As a result, as shown in the enlarged view of FIG. 3C, the burrs B generated at the respective corners of the work W are shaved off and washed away from the grooves G1 in the first direction.
[0032]
In FIG. 3, the illustration of the dicing blade 21 is omitted. Further, the dicing blade 21 is described to be rotated by 90 ° in the CH2 processing step and the CH1 insertion step after the CH1 processing step, but the work W may be rotated by 90 °.
[0033]
FIG. 4 is a flowchart when the present invention is implemented in the fully automatic operation of the dicing apparatus 10. The work W placed on the work table 23 of the dicing apparatus 10 is first picked up by the image pickup unit 12 to take an image of the surface pattern, and is subjected to CH2 alignment by an alignment device (not shown), and is positioned in the θ direction and the Y direction. (Step S10). Next, the work table 23 is rotated by 90 ° (step S11), and alignment of CH1 orthogonal to CH2 is performed (step S12).
[0034]
Next, the CH1 processing step is performed by the dicing blade 21 rotating while supplying the processing liquid, and when the groove G1 is processed in all the lines in one direction (step S13), the work table 23 is rotated 90 ° in the return direction. Then, in the CH2 processing step, grooves G2 are formed in all the orthogonal lines (step S15).
[0035]
At this time, as shown in FIG. 3, burrs B, B, and B are provided at the respective intersections of the grooves G2, G2,... Processed in the CH2 processing step and the grooves G1, G1,. ... has occurred.
[0036]
Here, the work table 23 is again rotated by 90 ° (step S16), and a CH1 insertion step is performed in which the dicing blade 21 that rotates while supplying the processing liquid in each groove G1 processed in the CH1 processing step is passed. The burrs B, B,... Formed at the corners of the intersections of the grooves G1 and G2 in both directions are removed and washed away (step S17).
[0037]
In this manner, the CH2 alignment → CH1 alignment → CH1 processing step → CH2 processing step → CH1 insertion step are automatically and continuously performed, and the groove processing, deburring processing, and cleaning are performed in a series of fully automatic operations. Performed in
[0038]
The relative moving speed between the dicing blade 21 and the work W in the CH1 insertion step is equal to or higher than the relative moving speed between the dicing blade 21 and the work W in the CH1 processing step or the CH2 processing step. Thus, the time required for deburring and cleaning can be reduced, and the decrease in throughput can be further reduced. Further, by making the relative moving speed between the dicing blade 21 and the work W slower in the CH1 processing step or the CH2 processing step, even burrs that are difficult to remove can be reliably removed and discharged from the groove G1. . As the relative moving speed between the dicing blade 21 and the work W in the CH1 insertion step, the highest moving speed is appropriately selected according to the material of the work W.
[0039]
Although the work W has been described as a soft material in the above-described embodiment, the work W is not limited to the soft material, and a case where a film of the soft material is formed on the surface of the work W, or a case where the soft material is laminated inside the laminated work. The present invention is extremely effective for a work W as described above.
[0040]
Also, generally, the cutting and feeding direction of the work W when the work W is first placed on the work table 23 is referred to as CH1, and the direction orthogonal thereto is referred to as CH2. In the description above, for the sake of explanation, the direction of processing first is referred to as CH1, and the direction orthogonal thereto is referred to as CH2.
[0041]
Further, the above-described CH1 processing step, CH2 processing step, and CH1 insertion step are performed by relative movement between the work W and the dicing blade 21, and the present invention does not limit the moving method. Therefore, the dicing blade 21 may be moved with the work W fixed, the work W may be moved with the dicing blade 21 fixed, or both the work W and the dicing blade 2 may be moved.
[0042]
【The invention's effect】
As described above, according to the dicing method of the present invention, when performing groove processing or cutting processing on a work made of a soft material or a material containing a soft material, a groove in the first direction is formed on the work with a rotating dicing blade. When forming and then forming a groove in a second direction orthogonal to the first direction, burrs generated at the corner of the intersection of the groove in the first direction and the groove in the second direction are rotated dicing. Since the blade is removed by inserting the blade into the groove in the first direction while supplying the processing liquid again, burrs generated at each corner at the intersection of the grooves in both directions are easily removed in a series of automatic operations. , Is discharged from the groove.
[Brief description of the drawings]
FIG. 1 is an external view of a dicing apparatus used in a dicing method according to an embodiment of the present invention. FIG. 2 is a perspective view showing a processing portion of the dicing apparatus. FIG. 3 describes an embodiment of a dicing method according to the present invention. FIG. 4 is a flowchart illustrating an embodiment of a dicing method according to the present invention.
Reference numeral 10: dicing device, 21: dicing blade (blade), 23: work table, B: burr, G1: groove in the first direction, G2: groove in the second direction, W: work

Claims (3)

In the dicing method of grooving and cutting the work with the rotating blade while supplying the working fluid,
A channel 1 processing step of forming a groove in a first direction in the work;
A channel 2 processing step of forming a groove in the work in a second direction orthogonal to the first direction;
A channel 1 insertion step of inserting the rotating blade again in the groove in the first direction formed in the channel 1 processing step,
The channel 1 insertion step is performed while the processing fluid is supplied,
The channel 1 insertion step removes burrs at intersections between the grooves in the first direction and the grooves in the second direction generated during the processing step of the channel 2, and removes burrs in the grooves in the first direction. A dicing method, comprising washing the substrate. The dicing method according to claim 1, wherein a feed speed of the blade in the channel 1 insertion step is equal to or higher than a feed rate of the blade in the channel 1 processing step or the channel 2 processing step. 2. The dicing method according to claim 1, wherein a feed speed of the blade in the channel 1 insertion step is lower than a feed rate of the blade in the channel 1 processing step or the channel 2 processing step. 3.

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