JP2005222990A - Cutting device and cutting method - Google Patents

Cutting device and cutting method Download PDF

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JP2005222990A
JP2005222990A JP2004026543A JP2004026543A JP2005222990A JP 2005222990 A JP2005222990 A JP 2005222990A JP 2004026543 A JP2004026543 A JP 2004026543A JP 2004026543 A JP2004026543 A JP 2004026543A JP 2005222990 A JP2005222990 A JP 2005222990A
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cutting
workpiece
spindle
water supply
cleaning water
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JP4481668B2 (en
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Naoko Yamamoto
直子 山本
Maki Sakai
真樹 坂井
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To eliminate cutting water containing contamination remaining between the lower surface of a spindle housing and an object to be machined, without interrupting the cutting of the object to be machined. <P>SOLUTION: A cutting device 10 comprises a spindle unit 21 having a rotary spindle 24, a spindle housing 26 for rotatably supporting the rotary spindle, and a motor 23 for rotating and driving the rotary spindle; a cutting blade 22 mounted on the tip of the rotary spindle; and a cutting water supply nozzle 28 for jetting out cutting water 70 near the machining point of the cutting blade. The cutting device 10 cuts the object to be machined by the cutting blade, while supplying cutting water to the object 12 to be machined by the cutting water supply nozzle. Further, a washing water supply port 60a, for supplying washing water, between the lower surface of the spindle housing and the object to be machined, is provided to the lower surface of the spindle unit. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は,切削装置および切削方法に関し,さらに詳細には,被加工物に対して切削水を供給しながら,切削ブレードによって被加工物の切削を行なう切削装置および切削方法に関する。   The present invention relates to a cutting apparatus and a cutting method, and more particularly to a cutting apparatus and a cutting method for cutting a workpiece with a cutting blade while supplying cutting water to the workpiece.

半導体や電子部品などの被加工物を切削ブレードによって精密に切削する装置として,ダイシング装置と呼ばれる切削装置が知られている。ところで,ダイシング装置では,切削ブレードによって被加工物を切削するため,切削屑(いわゆるコンタミ)が発生する。かかるコンタミを被加工物の表面から排除する方法として,例えば,特許文献1には,切削水を加工点付近や切削ブレードの周囲に噴出させて,コンタミを押し流す方法が開示されている。かかる方法により,切削ブレードの近傍に存在するコンタミを排除することができる。 2. Description of the Related Art A cutting device called a dicing device is known as a device that precisely cuts workpieces such as semiconductors and electronic components with a cutting blade. By the way, in a dicing apparatus, since a workpiece is cut by a cutting blade, cutting waste (so-called contamination) is generated. As a method for removing such contamination from the surface of the workpiece, for example, Patent Document 1 discloses a method of ejecting cutting water near a processing point or around a cutting blade to flush out the contamination. By this method, contamination existing in the vicinity of the cutting blade can be eliminated.

ところが,上記特許文献1に記載の方法では,切削ブレードの近傍から排除されたコンタミを含んだ切削水がスピンドルハウジングの下面と被加工物との間に流れ込み,そのまま滞留してしまう,という問題があった。即ち,図4に示すように,スピンドルハウジング126の下面と被加工物112との隙間は非常に狭く形成されるため(例えば0.5mm〜5mm程度),一旦,その隙間に入り込んだ切削水180は,その表面張力によってスピンドルハウジング126の下面から移動することができない。このため,スピンドルハウジング126の下面においては,コンタミが被加工物に付着し易い状態となっていた。 However, the method described in Patent Document 1 has a problem that the cutting water including the contamination excluded from the vicinity of the cutting blade flows between the lower surface of the spindle housing and the workpiece and stays as it is. there were. That is, as shown in FIG. 4, since the gap between the lower surface of the spindle housing 126 and the workpiece 112 is formed very narrow (for example, about 0.5 mm to 5 mm), the cutting water 180 once entering the gap is formed. Cannot move from the lower surface of the spindle housing 126 due to its surface tension. For this reason, on the lower surface of the spindle housing 126, the contamination easily adheres to the workpiece.

かかる問題に対して,従来のダイシング装置においては,被加工物を切断した後に,被加工物の全体を洗浄し,スピンドルハウジングの下面と被加工物との間に滞留しているコンタミを含んだ切削水を排除する方法が採られていた。このため,スピンドルハウジングの下面と被加工物との間にコンタミを含んだ切削水が滞留して,コンタミが被加工物に付着し易い状態となっていた場合であっても,被加工物上に存在するコンタミは排除されるので,大きな問題とはならなかった。 In order to deal with such a problem, the conventional dicing apparatus cleans the entire workpiece after cutting the workpiece, and includes contamination that remains between the lower surface of the spindle housing and the workpiece. A method of removing cutting water has been adopted. For this reason, even if the cutting water containing contaminants stays between the lower surface of the spindle housing and the workpiece, the contaminants are likely to adhere to the workpiece. Contamination that is present in the area was eliminated, so it was not a big problem.

特開平5−29453号公報JP-A-5-29453

しかしながら,近年において,化合物半導体ウェハや電子部品などが被加工物として使用されるようになると,上記従来の洗浄方法では,被加工物の表面からコンタミを十分に排除できない場合があることが認識された。特に,例えばCMOSイメージセンサやCCDなどの撮像素子を被加工物とした場合には,被加工物の表面上に大きな凹凸が存在し,さらに材質的にもコンタミが付着し易い物質が使用されているので,一旦,コンタミが被加工物に付着してしまうと,被加工物上に存在するコンタミを容易に排除することができないものとなった。 However, in recent years, when compound semiconductor wafers and electronic parts are used as workpieces, it has been recognized that the above conventional cleaning methods may not sufficiently remove contamination from the surface of the workpiece. It was. In particular, when an imaging device such as a CMOS image sensor or CCD is used as a workpiece, there is a large unevenness on the surface of the workpiece, and a material that is easily contaminated with materials is used. Therefore, once the contamination adheres to the work piece, the contamination existing on the work piece cannot be easily eliminated.

このようなことから,従来には問題とならなかった被加工物上に存在するコンタミを含んだ切削水が,被加工物にコンタミを付着させる機会を増加させることに繋がることが,新たな問題として取り上げられるようになった。このため,コンタミを含んだ切削水がスピンドルハウジングの下面と被加工物との間に滞留させないようにする方法を開発することが新たな課題として提供された。このとき,スピンドルをZ軸方向に上昇させて,その都度,被加工物を洗浄する方法も考えられるが,このような方法では,被加工物の切削工程中において,被加工物の切削を頻繁に中断しなければならないため,著しく生産効率を低下させてしまうことになる。 For this reason, it is a new problem that cutting water containing contamination that has not been a problem in the past will lead to an increased chance of adhesion of contamination to the workpiece. It came to be taken up as. For this reason, it has been provided as a new problem to develop a method for preventing cutting water containing contaminants from staying between the lower surface of the spindle housing and the workpiece. At this time, it is conceivable to raise the spindle in the Z-axis direction and clean the workpiece each time. However, in such a method, the workpiece is frequently cut during the cutting process of the workpiece. Therefore, production efficiency will be significantly reduced.

したがって,本発明の目的は,被加工物の切削を中断させることなく,スピンドルハウジングの下面と被加工物との間に滞留しているコンタミを含んだ切削水を排除することが可能な新規かつ改良された切削装置及び切削方法を提供することにある。 Accordingly, an object of the present invention is to provide a novel and capable of eliminating cutting water containing contaminants staying between the lower surface of the spindle housing and the workpiece without interrupting the cutting of the workpiece. It is an object of the present invention to provide an improved cutting apparatus and cutting method.

上記課題を解決するため,本発明の第1の観点においては,回転スピンドルと,前記回転スピンドルを回転可能に支持するスピンドルハウジングと,前記回転スピンドルを回転駆動するモータ部とを備えたスピンドルユニットと,前記回転スピンドルの先端部に取り付けられた切削ブレードと,前記切削ブレードの加工点付近に切削水を噴出する切削水供給ノズルとを備え,被加工物に前記切削水供給ノズルで切削水を供給しながら,前記切削ブレードによって前記被加工物の切削を行なう切削装置において,さらに,前記スピンドルユニットの下面には,前記スピンドルハウジングの下面と前記被加工物との間に洗浄水を供給するための洗浄水供給口が設けられている,ことを特徴とする切削装置が提供される。   In order to solve the above-described problems, in a first aspect of the present invention, a spindle unit including a rotary spindle, a spindle housing that rotatably supports the rotary spindle, and a motor unit that rotationally drives the rotary spindle; , A cutting blade attached to the tip of the rotating spindle, and a cutting water supply nozzle that ejects cutting water near the processing point of the cutting blade, and supplies the cutting water to the workpiece with the cutting water supply nozzle However, in the cutting apparatus for cutting the workpiece by the cutting blade, the cleaning unit further supplies cleaning water to the lower surface of the spindle unit between the lower surface of the spindle housing and the workpiece. There is provided a cutting device provided with a cleaning water supply port.

上記記載の発明では,被加工物の切削を中断することなく,スピンドルハウジングの下面と被加工物との間に滞留しているコンタミを含んだ切削水を排除できるので,コンタミが被加工物に付着する機会が減少される。特に,例えばCMOSイメージセンサ,あるいはCCDなどの撮像素子などのスピンドルハウジングの下面と被加工物との間にコンタミを含んだ切削水が滞留しやすいものを被加工物とした場合には,コンタミの付着による不良品の発生をより効果的に減少させることができるので,製品歩留まりが向上する。   In the above-described invention, the cutting water containing the contamination staying between the lower surface of the spindle housing and the workpiece can be eliminated without interrupting the cutting of the workpiece. The opportunity to adhere is reduced. In particular, if the workpiece is such that a cutting water containing contamination is easily retained between the lower surface of the spindle housing, such as a CMOS image sensor or an image sensor such as a CCD, and the workpiece, Since the generation of defective products due to adhesion can be reduced more effectively, the product yield is improved.

また,洗浄水を供給する洗浄水供給手段と,前記洗浄水供給手段から供給された洗浄水を前記スピンドルハウジングの内部に導く配管とを有し,前記配管に供給された洗浄水が前記洗浄水供給口から噴出される,如く構成すれば,スピンドル自体の大きさを変えることないので,省スペース化を図ることができる。 Further, the cleaning water supply means for supplying the cleaning water, and a pipe for guiding the cleaning water supplied from the cleaning water supply means to the inside of the spindle housing, the cleaning water supplied to the pipe is the cleaning water. If it is configured so that it is ejected from the supply port, the size of the spindle itself is not changed, so that space can be saved.

また,前記洗浄水供給口は,複数からなる,如く構成すれば,広範囲にわたって,効果的にコンタミを含む切削水を排除することができる。 Further, if the cleaning water supply port is configured to have a plurality, the cutting water containing contamination can be effectively eliminated over a wide range.

また,前記洗浄水供給口は,液体と気体からなる2流体を噴出可能な2流体ノズルである,如く構成すれば,液体(例えば切削水)と気体(例えば空気)とが混合されて,2流体ノズルから噴射されるので,被加工物表面の洗浄効果が増大する。 Further, if the cleaning water supply port is configured as a two-fluid nozzle capable of ejecting two fluids consisting of a liquid and a gas, the liquid (for example, cutting water) and the gas (for example, air) are mixed, and 2 Since it is ejected from the fluid nozzle, the cleaning effect of the workpiece surface is increased.

上記課題を解決するため,本発明の第2の観点においては,被加工物に対して切削水を供給しながら,切削ブレードによって前記被加工物の切削を行なう切削方法において,前記切削ブレードがその先端部に取り付けられたスピンドルユニットの下面と被加工物との間に,直接的に洗浄水を供給する,ことを特徴とする切削方法が提供される。 In order to solve the above problems, in a second aspect of the present invention, in a cutting method of cutting the workpiece with a cutting blade while supplying cutting water to the workpiece, the cutting blade There is provided a cutting method characterized in that cleaning water is directly supplied between a lower surface of a spindle unit attached to a tip portion and a workpiece.

上記記載の発明では,被加工物の切削を中断することなく,スピンドルハウジングの下面と被加工物との間に滞留しているコンタミを含んだ切削水を排除できるので,コンタミが被加工物に付着する機会が減少される。特に,例えばCMOSイメージセンサ,あるいはCCDなどの撮像素子などのようなスピンドルハウジングの下面と被加工物との間にコンタミを含んだ切削水が滞留しやすいものを被加工物とした場合には,コンタミの付着による不良品の発生をより効果的に減少させることができるので,製品歩留まりが向上する。   In the above-described invention, the cutting water containing the contamination staying between the lower surface of the spindle housing and the workpiece can be eliminated without interrupting the cutting of the workpiece. The opportunity to adhere is reduced. In particular, when a workpiece in which cutting water containing contamination between the lower surface of the spindle housing and the workpiece, such as a CMOS image sensor or an imaging device such as a CCD, is likely to stay, is used as the workpiece. Since the generation of defective products due to contamination can be reduced more effectively, the product yield is improved.

本発明においては,被加工物の切削を中断することなく,スピンドルハウジングの下面と被加工物との間に滞留しているコンタミを含んだ切削水を排除できるので,コンタミが被加工物に付着する機会が減少される。特に,被加工物がCMOSイメージセンサ,あるいはCCDなどの撮像素子などのようなスピンドルハウジングの下面と被加工物との間にコンタミを含んだ切削水が滞留しやすい被加工物ある場合には,コンタミの付着による不良品の発生をより効果的に減少させることができるので,製品歩留まりが向上する。 In the present invention, the cutting water containing the contamination staying between the lower surface of the spindle housing and the workpiece can be eliminated without interrupting the cutting of the workpiece, so that the contamination adheres to the workpiece. The opportunity to do is reduced. In particular, when there is a workpiece in which cutting water containing contamination is likely to stay between the lower surface of the spindle housing and the workpiece such as an image sensor such as a CMOS image sensor or CCD, Since the generation of defective products due to contamination can be reduced more effectively, the product yield is improved.

以下に添付図面を参照しながら,本発明の好適な実施の形態について詳細に説明する。なお,本明細書及び図面において,実質的に同一の機能構成を有する構成要素については,同一の符号を付することにより重複説明を省略する。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

まず,図1に基づいて,第1の実施の形態にかかる切削装置10の構成について説明する。なお,図1は,第1の実施の形態にかかる切削装置10の構成を示す斜視図である。 First, based on FIG. 1, the structure of the cutting device 10 concerning 1st Embodiment is demonstrated. FIG. 1 is a perspective view showing the configuration of the cutting apparatus 10 according to the first embodiment.

本実施形態にかかる切削装置10は,図1に示すように,例えば,半導体ウェハ等の被加工物12を保持するチャックテーブル30と,チャックテーブル30に保持された被加工物12を切削する切削手段20と,切削手段20を例えばY軸およびZ軸方向に移動させる切削手段移動手段と,チャックテーブル30を例えばX軸方向に移動させるチャックテーブル移動手段と,切削加工時に切削ブレード22の加工点付近に切削水を噴出する切削水供給ノズル28とを備える。かかる切削水供給ノズル28により,切削ブレード22の加工点付近に切削水を供給しながら,切削ブレード22によって被加工物12の切削が行なわれる。 As shown in FIG. 1, the cutting device 10 according to the present embodiment includes, for example, a chuck table 30 that holds a workpiece 12 such as a semiconductor wafer, and a cutting that cuts the workpiece 12 held on the chuck table 30. Means 20, cutting means moving means for moving the cutting means 20 in, for example, the Y-axis and Z-axis directions, chuck table moving means for moving the chuck table 30 in, for example, the X-axis direction, and processing points of the cutting blade 22 during cutting A cutting water supply nozzle 28 for ejecting cutting water is provided in the vicinity. The workpiece 12 is cut by the cutting blade 22 while supplying cutting water near the processing point of the cutting blade 22 by the cutting water supply nozzle 28.

チャックテーブル30は,例えば,その上面に真空チャック機構を具備しており,被加工物12を真空吸着して保持することができる。また,チャックテーブル30は,例えば,被加工物12を保持した状態で,電動モータ(図示せず。)によって水平方向に回転することもできる。   The chuck table 30 includes, for example, a vacuum chuck mechanism on the upper surface thereof, and can hold the workpiece 12 by vacuum suction. Further, the chuck table 30 can be rotated in the horizontal direction by an electric motor (not shown) while holding the workpiece 12, for example.

このチャックテーブル30の下方には,チャックテーブル移動手段が設けられている。このチャックテーブル移動手段は,例えば,チャックテーブル30を略水平に支持するチャック支持部材32と,基台39上にX軸方向に延長するように配設され,チャックテーブル支持部材32のX軸方向の移動をガイドする一対の第1のガイドレール34と,X軸方向に延長するように配設され,チャックテーブル支持部材32の下部と係合し,第1の電動モータ38によって回転駆動される第1のボールスクリュー36とからなる。かかるチャックテーブル移動手段は,第1のボールスクリュー36を回転させてチャックテーブル支持部材32を第1のガイドレール34に沿ってX軸方向に移動させることにより,チャックテーブル30および被加工物12をX軸方向に移動させることができる。   Below the chuck table 30, chuck table moving means is provided. The chuck table moving means is, for example, disposed on the chuck support member 32 that supports the chuck table 30 substantially horizontally and on the base 39 so as to extend in the X-axis direction. And a pair of first guide rails 34 for guiding the movement of the chuck table and the X-axis direction. The first guide rail 34 engages with the lower portion of the chuck table support member 32 and is driven to rotate by the first electric motor 38. And a first ball screw 36. The chuck table moving means rotates the first ball screw 36 and moves the chuck table support member 32 along the first guide rail 34 in the X-axis direction, thereby moving the chuck table 30 and the workpiece 12 together. It can be moved in the X-axis direction.

一方,切削手段20は,例えば,上記チャックテーブル30より上方に位置するように配設されている。この切削手段20は,例えば,略リング形状を有する極薄の切削ブレード22と,Y軸方向に延長するよう配設された回転軸であって,先端部に切削ブレード22が装着され,他端部に連結された駆動手段である電動モータ23によって高速回転するスピンドル24と,このスピンドル24を回転自在に支持するスピンドルハウジング26とを備える。なお,以下では,上記電動モータ23,スピンドル24及びスピンドルハウジング26を含めてスピンドルユニット(図2中の符号21)と称する。かかる切削手段20は,スピンドル24の回転駆動力により切削ブレード22を高速回転させながら被加工物12に切り込ませることにより,被加工物12をX軸方向に切削して極薄のカーフを形成することができる。なお,本実施形態にかかる「スピンドルの軸方向」は,Y軸方向であり,切削方向であるチャックテーブル30の移動方向(X軸方向)および鉛直方向(Z軸方向)の両方向に対して垂直な方向である。   On the other hand, the cutting means 20 is disposed, for example, so as to be positioned above the chuck table 30. The cutting means 20 includes, for example, an extremely thin cutting blade 22 having a substantially ring shape, and a rotary shaft arranged to extend in the Y-axis direction. A spindle 24 that rotates at high speed by an electric motor 23 that is driving means connected to the unit, and a spindle housing 26 that rotatably supports the spindle 24 are provided. Hereinafter, the electric motor 23, the spindle 24, and the spindle housing 26 are collectively referred to as a spindle unit (reference numeral 21 in FIG. 2). The cutting means 20 forms a very thin kerf by cutting the workpiece 12 in the X-axis direction by cutting the workpiece 12 while rotating the cutting blade 22 at a high speed by the rotational driving force of the spindle 24. can do. The “axial direction of the spindle” according to the present embodiment is the Y-axis direction, and is perpendicular to both the moving direction (X-axis direction) and the vertical direction (Z-axis direction) of the chuck table 30 that are cutting directions. Direction.

本実施形態にかかるスピンドルユニット21には,従来と異なり,図2に示すように,スピンドルハウジング26の下面に,複数本の洗浄水供給口(ノズル)60a,洗浄水供給口60aに洗浄水を導く配管60bを有する洗浄水供給ユニット60が形成されている。かかる洗浄水供給ユニットの構成を図2に基づいて説明する。なお,図2(a)は,本実施形態にかかる洗浄水供給ユニットの構成を示す側面図である。図2(b)は,本実施形態にかかる洗浄水供給ユニットの構成を示す正面図である。図2(c)は,本実施形態にかかる洗浄水供給ユニットの構成を示す下面図である。 Unlike the prior art, the spindle unit 21 according to the present embodiment has a plurality of cleaning water supply ports (nozzles) 60a and cleaning water supply ports 60a on the lower surface of the spindle housing 26 as shown in FIG. A cleaning water supply unit 60 having a guiding pipe 60b is formed. The configuration of the washing water supply unit will be described with reference to FIG. FIG. 2A is a side view showing the configuration of the cleaning water supply unit according to the present embodiment. FIG.2 (b) is a front view which shows the structure of the washing water supply unit concerning this embodiment. FIG.2 (c) is a bottom view which shows the structure of the washing water supply unit concerning this embodiment.

まず,図2(a)に示すように,本実施形態にかかるスピンドルユニット21には,洗浄水供給ユニット60がスピンドルハウジング26の下面に設置されている。かかる洗浄水供給ユニット60は,被加工物12に対して(図中下方に向かって)洗浄水を噴出するための洗浄水供給口60aと,洗浄水供給口60aに洗浄水を導く配管60bとから構成される。本実施形態にかかる洗浄水供給ユニット60においては,配管60bには,複数の洗浄水供給口60aが所定の間隔で設けられている。 First, as shown in FIG. 2A, a cleaning water supply unit 60 is installed on the lower surface of the spindle housing 26 in the spindle unit 21 according to the present embodiment. The cleaning water supply unit 60 includes a cleaning water supply port 60a for ejecting cleaning water to the workpiece 12 (downward in the figure), and a pipe 60b for guiding the cleaning water to the cleaning water supply port 60a. Consists of In the cleaning water supply unit 60 according to the present embodiment, a plurality of cleaning water supply ports 60a are provided at predetermined intervals in the pipe 60b.

また,図2(b)及び図2(c)に示すように,本実施形態にかかるスピンドルユニット21に形成された洗浄水供給ユニット60においては,例えば3系統の配管60bが形成されており,各配管60bには,洗浄水供給口60aが,一定の方向性(例えば,同一方向に同一傾斜)で配置されている。かかる構成により,洗浄水70は,洗浄水供給口60aから一方向に流れを作るように被加工物12に対して噴出される。 Further, as shown in FIGS. 2B and 2C, in the cleaning water supply unit 60 formed in the spindle unit 21 according to the present embodiment, for example, three lines of piping 60b are formed, A cleaning water supply port 60a is arranged in each pipe 60b with a certain direction (for example, the same inclination in the same direction). With this configuration, the cleaning water 70 is ejected from the cleaning water supply port 60a toward the workpiece 12 so as to create a flow in one direction.

かかる構成により,洗浄水70は,洗浄水供給口60aから被加工物12に対して一定の方向性を持って直接的に噴射されるので,スピンドルハウジング26の下面と被加工物12との間に滞留したコンタミを含んだ切削水を押し流すことができる。このように,スピンドルユニット21の下面に洗浄水供給口(ノズル)60aを設けることにより,最も効率的に,コンタミを含んだ切削水を排除することができる。 With such a configuration, the cleaning water 70 is directly sprayed from the cleaning water supply port 60a directly to the workpiece 12 with a certain direction, so that the gap between the lower surface of the spindle housing 26 and the workpiece 12 is increased. The cutting water containing the contaminants staying in can be swept away. Thus, by providing the cleaning water supply port (nozzle) 60a on the lower surface of the spindle unit 21, the cutting water containing contamination can be removed most efficiently.

なお,本実施形態にかかる洗浄水として,切削水(例えば,純水)を使用することができる。また,その水圧は被加工物上に滞留しているコンタミを含んだ切削水を押し流せる程度の水圧であれば良い。但し,洗浄水の水圧や水量は,被加工物の種類,被加工物の材質,切削速度などの各種切削条件に応じて適宜設定することができる。また,本実施形態においては,洗浄水を洗浄水供給口に導く配管を,スピンドルハウジングの外側に設置した例を挙げているが,スピンドルハウジング内部の空間に設けることができる。このように構成することにより,スピンドルユニット全体の大きさは変わらないので,省スペース化が実現される。また,洗浄水を洗浄水供給口に導く配管に変えて,例えばスリット状の溝を形成することもできる。この場合には,洗浄水の水圧制御が困難となるが,洗浄水供給ユニットの加工が容易になると共に,簡易かつ容易に洗浄水を被加工物に噴射させることができる。したがって,この方法では,水圧制御があまり重要でない被加工物を切削する場合に好適である。 Note that cutting water (for example, pure water) can be used as the cleaning water according to the present embodiment. Moreover, the water pressure should just be a water pressure which can wash away the cutting water containing the contamination which has accumulated on the workpiece. However, the water pressure and amount of cleaning water can be appropriately set according to various cutting conditions such as the type of workpiece, the material of the workpiece, and the cutting speed. Further, in this embodiment, an example in which a pipe that guides the cleaning water to the cleaning water supply port is provided outside the spindle housing, but it can be provided in a space inside the spindle housing. With this configuration, the overall size of the spindle unit does not change, and space saving is realized. In addition, for example, a slit-shaped groove can be formed by replacing the cleaning water with a pipe that leads to the cleaning water supply port. In this case, although it is difficult to control the water pressure of the cleaning water, the processing of the cleaning water supply unit is facilitated, and the cleaning water can be sprayed onto the workpiece easily and easily. Therefore, this method is suitable for cutting a work piece for which water pressure control is not so important.

また,このような切削手段20の一側には,図1に示すように,例えば,切削手段移動機構が設けられている。この切削手段移動機構は,概略的には,例えば,切削手段20を吊持する吊持部40と,支持部材50および第2のガイドレール54とからなる吊持部支持手段と,第1のボールスクリュー56及び第2の電動モータ58とからなる駆動機構と,から構成されている。   Moreover, as shown in FIG. 1, for example, a cutting means moving mechanism is provided on one side of the cutting means 20. This cutting means moving mechanism generally includes, for example, a suspension part 40 that suspends the cutting means 20, a suspension part support means that includes a support member 50 and a second guide rail 54, and a first part. And a drive mechanism including a ball screw 56 and a second electric motor 58.

より詳細には,支持部材50は,例えば,略垂直に起立するように配設された門型の金属製の板状部材である。即ち,この支持部材50は,例えば,略Y軸方向に延長するよう配設された梁部51と,Z軸方向に延長するように配設され,梁部51の両端部を支持する2つの支柱部52とからなる。   More specifically, the support member 50 is, for example, a gate-shaped metal plate-like member disposed so as to stand substantially vertically. That is, the support member 50 includes, for example, a beam portion 51 disposed so as to extend substantially in the Y-axis direction and two beams that are disposed so as to extend in the Z-axis direction and support both ends of the beam portion 51. It consists of a column 52.

梁部51は,上記チャックテーブル移動手段の第1のガイドレール34の上部を横切るようにしてY軸方向前方(装置正面側)に延長している。この梁部51は,装置正面側の端部のY軸位置が,チャックテーブル30の装置正面側(Y軸方向前方側)の端部のY軸位置と例えば略同一であり,チャックテーブル30と比べて装置正面側に極端に突出してはいない。 The beam portion 51 extends forward in the Y-axis direction (on the front side of the apparatus) so as to cross the upper portion of the first guide rail 34 of the chuck table moving means. In this beam portion 51, the Y-axis position of the end portion on the front side of the apparatus is substantially the same as the Y-axis position of the end portion on the front side of the chuck table 30 (front side in the Y-axis direction), Compared to the front side of the device, it does not protrude excessively.

また,この支持部材50には,例えば,切削手段20,および吊持部40のY軸方向の移動をガイドする一対の第2のガイドレール54と,切削手段20,および吊持部40をY軸方向に移動させる駆動機構である第2の電動モータ58及び第2のボールスクリュー56と,が配設されている。この第2のボールスクリュー56は,吊持部40の被支持部材42と係合しており,第2の電動モータ58によって回転駆動される。また,支持部材50および第2のガイドレール54は,吊持部40をY軸方向に移動可能に支持することができる。かかる構成の支持部材50,第2のガイドレール54および駆動機構は,第2のボールスクリュー56を回転させて吊持部40を第2のガイドレール54に沿ってY軸方向に移動させることにより,吊持部40によって吊持された切削手段20をY軸方向に移動させ,切削ブレード22の刃先位置と被加工物12の切削ラインとを位置合わせすることができる。   The support member 50 includes, for example, a pair of second guide rails 54 that guide the movement of the cutting means 20 and the suspension part 40 in the Y-axis direction, the cutting means 20, and the suspension part 40. A second electric motor 58 and a second ball screw 56, which are drive mechanisms for moving in the axial direction, are provided. The second ball screw 56 is engaged with the supported member 42 of the suspension portion 40 and is driven to rotate by the second electric motor 58. Further, the support member 50 and the second guide rail 54 can support the suspension part 40 so as to be movable in the Y-axis direction. The support member 50, the second guide rail 54, and the drive mechanism having such a configuration are configured by rotating the second ball screw 56 and moving the suspension portion 40 along the second guide rail 54 in the Y-axis direction. The cutting means 20 suspended by the suspension part 40 can be moved in the Y-axis direction so that the cutting edge position of the cutting blade 22 and the cutting line of the workpiece 12 can be aligned.

また,吊持部40は,例えば,切削手段20を上方から吊持する機能と,切削手段20をZ軸方向に移動させる機能とを有する。より詳細には,この吊持部40は,例えば,切削手段20のスピンドルハウジング26と連結され,切削手段20を吊持する吊持部材41と,上記第2のガイドレール54によって支持される被支持部材42と,被支持部材42に配設され,吊持部材41および切削手段20のZ軸方向の移動をガイドする一対の第3のガイドレール44と,被支持部材42に配設され,切削手段20,および吊持部材41をZ軸方向に移動させる駆動機構である第3の電動モータ48及び第3のボールスクリュー46と,から構成される。   The suspension unit 40 has, for example, a function of suspending the cutting means 20 from above and a function of moving the cutting means 20 in the Z-axis direction. More specifically, the suspension portion 40 is connected to, for example, the spindle housing 26 of the cutting means 20 and is supported by a suspension member 41 that suspends the cutting means 20 and the second guide rail 54. A support member 42, a supported member 42, a pair of third guide rails 44 for guiding the movement of the suspension member 41 and the cutting means 20 in the Z-axis direction, and the supported member 42; The cutting means 20 and the third electric motor 48 and the third ball screw 46 which are drive mechanisms for moving the suspension member 41 in the Z-axis direction are configured.

吊持部材41は,例えば,切削手段20の重心を含む領域を吊持して,切削手段20のバランスを保つようにしてもよいし,或いは,切削手段20の切削ブレード22に近い部分を吊持して,吊持部分よりも切削ブレード22側のスピンドル24の撓みや振動を効果的に抑制するようにしてもよい。また,第3のボールスクリュー46は,吊持部材41と係合しており,吊持部材41を支持するとともに,第3の電動モータ48によって回転駆動されて吊持部材41をZ軸方向に移動させることができる。   The suspension member 41 may, for example, suspend a region including the center of gravity of the cutting means 20 to maintain the balance of the cutting means 20, or suspend a portion close to the cutting blade 22 of the cutting means 20. It is also possible to effectively suppress bending and vibration of the spindle 24 closer to the cutting blade 22 than the suspended portion. The third ball screw 46 is engaged with the suspension member 41, supports the suspension member 41, and is rotationally driven by the third electric motor 48 to move the suspension member 41 in the Z-axis direction. Can be moved.

かかる構成の吊持部40は,第3のボールスクリュー46を回転させて吊持部材41を第3のガイドレール44に沿ってZ軸方向に移動させることにより,切削手段20,をZ軸方向に移動させ,被加工物12に対する切削ブレード22の切り込み深さを調整することができる。   The suspension part 40 having such a configuration rotates the third ball screw 46 to move the suspension member 41 along the third guide rail 44 in the Z-axis direction, thereby moving the cutting means 20 in the Z-axis direction. The cutting depth of the cutting blade 22 relative to the workpiece 12 can be adjusted.

上記構成の切削装置10において,スピンドルユニット21の下面に形成された洗浄水供給ユニット60が被加工物12の表面上に洗浄水を供給しながら被加工物12を切削加工する状態を図3に示す。図3に示すように,本実施形態にかかる切削装置10においては,切削ブレード22が被加工物12を切削加工する際には,スピンドルユニット21の下面(即ち,スピンドルハウジング26の下面)に設けられた洗浄水供給ユニット60の洗浄水供給口60aから被加工物12に対して直接的に洗浄水70が噴射される。このとき,洗浄水供給口60aは,スピンドルハウジング26の下面と被加工物12との間に滞留したコンタミを含んだ切削水を一定方向に向かって押し流すので,滞留しているコンタミを含んだ切削水を効果的に排除することができる。   FIG. 3 shows a state in which the cleaning water supply unit 60 formed on the lower surface of the spindle unit 21 cuts the workpiece 12 while supplying cleaning water onto the surface of the workpiece 12 in the cutting apparatus 10 having the above configuration. Show. As shown in FIG. 3, in the cutting apparatus 10 according to the present embodiment, when the cutting blade 22 cuts the workpiece 12, it is provided on the lower surface of the spindle unit 21 (that is, the lower surface of the spindle housing 26). The cleaning water 70 is jetted directly to the workpiece 12 from the cleaning water supply port 60a of the cleaning water supply unit 60. At this time, the cleaning water supply port 60a pushes the cutting water containing the contaminants staying between the lower surface of the spindle housing 26 and the workpiece 12 in a certain direction, so that the cutting water containing the staying contaminants is removed. Water can be effectively eliminated.

以上,添付図面を参照しながら本発明の好適な実施形態について説明したが,本発明は係る例に限定されないことは言うまでもない。当業者であれば,特許請求の範囲に記載された範疇内において,各種の変更例または修正例に想到し得ることは明らかであり,それらについても当然に本発明の技術的範囲に属するものと了解される。   As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

例えば,上記実施形態においては,洗浄水供給口をスピンドルハウジングの下面に配置した例を挙げて説明したが,かかる例には限定されない。スピンドルハウジングの下面と被加工物との間に滞留したコンタミを含んだ切削水を排除できるのであれば,スピンドル下面以外の箇所に配置することもできる。 For example, in the above-described embodiment, the example in which the cleaning water supply port is arranged on the lower surface of the spindle housing has been described. However, the present invention is not limited to this example. If cutting water containing contaminants staying between the lower surface of the spindle housing and the workpiece can be eliminated, it can be arranged at a location other than the lower surface of the spindle.

また,上記実施形態においては,液体噴射をする洗浄水供給口(ノズル)を採用した例を挙げて説明したが,かかる例には限定されない。例えば,液体(切削水)と気体(空気)とを混合して噴射する2流体ノズルを採用することもできる。即ち,スピンドルと被加工物との距離は非常に狭いので,洗浄水供給口から高圧の洗浄水が噴出されると,スピンドルや被加工物が振動して切削加工に悪影響を及ぼす場合がある。このとき,2流体ノズルを使用することにより,液体(切削水)と気体(空気)とが混合されて比較的低い圧力で噴射されるので,スピンドルや被加工物が振動することが防止されると共に,被加工物表面の洗浄効果が増大する。 In the above-described embodiment, an example in which a cleaning water supply port (nozzle) that ejects liquid is used has been described. However, the present invention is not limited to this example. For example, a two-fluid nozzle that mixes and injects liquid (cutting water) and gas (air) can also be employed. That is, since the distance between the spindle and the workpiece is very narrow, if high-pressure cleaning water is ejected from the cleaning water supply port, the spindle and the workpiece may vibrate and adversely affect cutting. At this time, by using a two-fluid nozzle, liquid (cutting water) and gas (air) are mixed and injected at a relatively low pressure, so that the spindle and workpiece are prevented from vibrating. Along with this, the cleaning effect of the workpiece surface increases.

また,上記実施形態においては,3系統の洗浄水供給用の配管を配置した例を挙げて説明したが,かかる例には限定されない。被加工物の切削条件に応じて,1系統,2系統,あるいは4系統以上の洗浄水供給用の配管を採用することができる。なお,少ない洗浄水供給用の配管を採用すれば,洗浄水供給ユニットの加工が容易になる,という効果もある。 Moreover, in the said embodiment, although demonstrated giving the example which has arrange | positioned the piping for 3 systems of washing water supply, it is not limited to this example. Depending on the cutting conditions of the workpiece, one, two, or four or more cleaning water supply pipes can be employed. If a small number of piping for supplying cleaning water is used, the cleaning water supply unit can be easily processed.

本発明は,切削装置及び切削方法に適用可能であり,さらに詳細には,被加工物に対して切削水を供給しながら,切削ブレードによって被加工物の切削を行なう切削装置および切削方法に適用可能である。   The present invention is applicable to a cutting apparatus and a cutting method, and more specifically, to a cutting apparatus and a cutting method for cutting a workpiece with a cutting blade while supplying cutting water to the workpiece. Is possible.

図1は,第1の実施の形態にかかる切削装置の構成を示す斜視図である。FIG. 1 is a perspective view showing a configuration of a cutting apparatus according to the first embodiment. 図2(a)は,本実施形態にかかる洗浄水供給ユニットの構成を示す側面図である。図2(b)は,本実施形態にかかる洗浄水供給ユニットの構成を示す正面図である。図2(c)は,本実施形態にかかる洗浄水供給ユニットの構成を示す下面図である。Fig.2 (a) is a side view which shows the structure of the washing water supply unit concerning this embodiment. FIG.2 (b) is a front view which shows the structure of the washing water supply unit concerning this embodiment. FIG.2 (c) is a bottom view which shows the structure of the washing water supply unit concerning this embodiment. 図3は,第1の実施の形態にかかる切削ユニットがコンタミを含む切削水を排除しながら被加工物を切削する状態を示す斜視図である。FIG. 3 is a perspective view showing a state in which the cutting unit according to the first embodiment cuts the workpiece while eliminating cutting water including contamination. 従来における切削ユニットのスピンドルユニットの下面と被加工物との間にコンタミを含む切削水が滞留した状態を示す側面図である。It is a side view which shows the state in which the cutting water containing a contamination stayed between the lower surface of the spindle unit of the conventional cutting unit, and a to-be-processed object.

符号の説明Explanation of symbols

10 切削装置
12 被加工物
20 切削手段
21 スピンドルユニット
22 切削ブレード
24 スピンドル
26 スピンドルハウジング
28 切削水供給ノズル
30 チャックテーブル
40 吊持部
50 支持部材
51 梁部
52 支柱部
54 第2のガイドレール
56 第2のボールスクリュー
58 第2の電動モータ
60 洗浄液供給ユニット
60a 供給口
60b 配管
70 洗浄水
DESCRIPTION OF SYMBOLS 10 Cutting device 12 Workpiece 20 Cutting means 21 Spindle unit 22 Cutting blade 24 Spindle 26 Spindle housing 28 Cutting water supply nozzle 30 Chuck table 40 Suspension part 50 Support member 51 Beam part 52 Post part 54 Second guide rail 56 Second 2 ball screw 58 second electric motor 60 cleaning liquid supply unit 60a supply port 60b piping 70 cleaning water

Claims (5)

回転スピンドルと,前記回転スピンドルを回転可能に支持するスピンドルハウジングと,前記回転スピンドルを回転駆動するモータ部とを備えたスピンドルユニットと,前記回転スピンドルの先端部に取り付けられた切削ブレードと,前記切削ブレードの加工点付近に切削水を噴出する切削水供給ノズルとを備え,被加工物に前記切削水供給ノズルで切削水を供給しながら,前記切削ブレードによって前記被加工物の切削を行なう切削装置において,
さらに,前記スピンドルユニットの下面には,スピンドルハウジングの下面と前記被加工物との間に洗浄水を供給するための洗浄水供給口が設けられている,
ことを特徴とする切削装置。
A spindle unit comprising: a rotary spindle; a spindle housing that rotatably supports the rotary spindle; a motor unit that rotationally drives the rotary spindle; a cutting blade attached to a tip of the rotary spindle; and the cutting A cutting device that includes a cutting water supply nozzle that ejects cutting water in the vicinity of a processing point of the blade, and that cuts the workpiece with the cutting blade while supplying cutting water to the workpiece with the cutting water supply nozzle In
Furthermore, a cleaning water supply port for supplying cleaning water between the lower surface of the spindle housing and the workpiece is provided on the lower surface of the spindle unit.
The cutting device characterized by the above-mentioned.
洗浄水を供給する洗浄水供給手段と,前記洗浄水供給手段から供給された洗浄水を前記スピンドルハウジングの内部に導く配管とを有し,前記配管に供給された洗浄水が前記洗浄水供給口から噴出される,
ことを特徴とする請求項1に記載の切削装置。
Wash water supply means for supplying wash water, and a pipe for guiding the wash water supplied from the wash water supply means to the inside of the spindle housing, wherein the wash water supplied to the pipe is the wash water supply port Erupted from,
The cutting apparatus according to claim 1.
前記洗浄水供給口は,複数からなる,ことを特徴とする請求項2に記載の切削装置。 The cutting apparatus according to claim 2, wherein the cleaning water supply port includes a plurality. 前記洗浄水供給口は,液体と気体からなる2流体を噴出可能な2流体ノズルである,ことを特徴とする請求項3に記載の切削装置。 The cutting apparatus according to claim 3, wherein the cleaning water supply port is a two-fluid nozzle capable of ejecting two fluids composed of a liquid and a gas. 被加工物に対して切削水を供給しながら,切削ブレードによって前記被加工物の切削を行なう切削方法において,
その先端部に前記切削ブレードが取り付けられたスピンドルユニットの下面と被加工物との間に,直接的に洗浄水を供給する,
ことを特徴とする切削方法。
In a cutting method of cutting the workpiece with a cutting blade while supplying cutting water to the workpiece,
Supply cleaning water directly between the work piece and the lower surface of the spindle unit with the cutting blade attached to its tip.
The cutting method characterized by the above-mentioned.
JP2004026543A 2004-02-03 2004-02-03 Cutting equipment Expired - Lifetime JP4481668B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004026543A JP4481668B2 (en) 2004-02-03 2004-02-03 Cutting equipment
CN 200510007807 CN1651190A (en) 2004-02-03 2005-02-02 Cutting device and cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004026543A JP4481668B2 (en) 2004-02-03 2004-02-03 Cutting equipment

Publications (2)

Publication Number Publication Date
JP2005222990A true JP2005222990A (en) 2005-08-18
JP4481668B2 JP4481668B2 (en) 2010-06-16

Family

ID=34879146

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086202A (en) * 2004-09-14 2006-03-30 Tokyo Seimitsu Co Ltd Dicing device
KR20220048933A (en) 2020-10-13 2022-04-20 가부시기가이샤 디스코 Cutting apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014108463A (en) * 2012-11-30 2014-06-12 Disco Abrasive Syst Ltd Cutting device
JP6808267B2 (en) * 2016-06-22 2021-01-06 株式会社ディスコ Cutting method and cutting equipment
JP7028607B2 (en) * 2017-11-06 2022-03-02 株式会社ディスコ Cutting equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086202A (en) * 2004-09-14 2006-03-30 Tokyo Seimitsu Co Ltd Dicing device
JP4595458B2 (en) * 2004-09-14 2010-12-08 株式会社東京精密 Dicing machine
KR20220048933A (en) 2020-10-13 2022-04-20 가부시기가이샤 디스코 Cutting apparatus

Also Published As

Publication number Publication date
CN1651190A (en) 2005-08-10
JP4481668B2 (en) 2010-06-16

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