JP2005297039A - Laser beam machining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of cutting, efficiently with high quality, a brittle material primarily such as a ceramic substrate and a silicon substrate. <P>SOLUTION: In removing residual materials, the base board 22 rotates about 90 degrees around the rotary axis 27. With this rotation, there are also rotated an attendant base board 21, an intermediate board 20, and a holding base 19 that are fixed integrally with the base board 22. Accordingly, a suctionally fixing device 23 (24) is rotated, making the surface (f) of the holding base 19 skirt nearly perpendicularly, so that residual materials on the holding base 19 or fine dust or the like at the time of cutting drops down to a residual material receptacle 38 below. Further, with the holding base 19 rotated about 90 degrees, a holding base cleaning device 40 composed of a brush 41, an air nozzle 43 and the like goes down to the holding base 19, removing dirt including fine dust stuck to the surface (f). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a laser processing apparatus that mainly cuts a plate-shaped substrate with a laser, and more particularly to a laser processing apparatus that can perform an effective cutting method for processing a brittle material such as a ceramic substrate or a silicon substrate.

  Conventionally, a so-called slicing machine is generally used for cutting a brittle material such as a ceramic substrate or a silicon substrate. In the cutting process using such a slicing machine, for example, a ceramic substrate or silicon substrate, which is a workpiece, or another substrate is bonded to a dummy substrate with low-temperature wax, and the dummy substrate is further made into an iron-based magnetic material. Join and fix the workpiece.

  Then, the workpiece is fixed with a magnet on the table of the slicing machine, and the substrate as the workpiece on the workpiece is cut by a rotating blade. After the cutting process, the workpiece is immersed in high-temperature hot water to melt the wax, and the cut substrate is separated from the dummy substrate. Further, a process of washing the wax adhering to the surface of the cut substrate with a solvent is performed. Thus, cutting with a slicing machine is laborious and is a processing method unsuitable for automation.

  On the other hand, instead of processing with a slicing machine, a method of processing a silicon substrate, a ceramic substrate or the like with a laser is being performed. However, most are so-called laser scribing, in which shallow grooves are formed on the surface. In this processing method, processing is performed at a high energy density by narrowing the laser beam, so that chips are evaporated and only the surface of the substrate is processed. Therefore, no special consideration is required for holding the substrate to be processed. .

In contrast, an example of a laser processing apparatus that floats and cuts a large-area substrate from a substrate support is disclosed in Patent Document 1 by the present applicant. This is because the substrate is supported by a plurality of pins that are loosely fitted into holes provided in the stage so that the substrate is not bent, and only the pins directly under the laser beam are positioned at the position where the support base in contact with the lower part of the pins faces the laser beam. It is comprised so that it may leave | separate from a board | substrate by the recessed part provided in this. As a result, the substrate or the thin film on the substrate can be cut cleanly.
JP-A-7-314168

  However, in general, in such laser cutting processing, the substrate is melted and cut to a deep portion by a high-power laser beam, so there is a problem such as generation of burrs due to cutting waste, and changeover after processing is performed. Therefore, these have been obstacles to improving the quality of the cutting portion and the efficiency of the cutting processing. In view of such problems, an object of the present invention is to provide a laser processing apparatus capable of cutting a brittle material such as a ceramic substrate and a silicon substrate efficiently with high quality.

  In order to achieve the above object, in the present invention, the substrate holding surface of the holding base is made to follow the substantially vertical direction in order to drop the remaining material and processing waste from the holding base after the processing of the substrate. Further, the substrate holding surface is cleaned by rubbing the substrate holding surface with a brush or blowing air onto the substrate holding surface while the substrate holding surface is substantially along the vertical direction. Thereby, the remaining material and processing waste on the substrate holding surface can be reliably and efficiently removed.

  In addition, a hole is provided in the substrate holding surface of the holding base for sucking processing waste generated during the processing of the substrate by a suction means, and the hole is below the scanning line scanned by the laser beam when the substrate is cut. It is arranged along the scanning line so as to be on the side. Thereby, cutting waste (processing waste) generated by cutting is immediately sucked into the hole.

  In addition, holding bases are provided on the processing side for processing the substrate and the setup side for mounting a newly processed substrate, respectively, and the processing-side holding base and the setup side holding base are interchangeable. By doing so, it is possible to mount a new substrate on the setup side while processing the substrate on the processing side. Furthermore, by providing a plurality of holding bases on each of the processing side and the setup side, it is possible to hold a plurality of substrates and perform processing or setup on these simultaneously.

  In addition, the suction path for adsorbing the substrate on the holding base is configured to communicate with the base substrate always held on the laser processing apparatus main body side from the holding base via the relay base substrate. Is desirable. As a result, the base substrate can be used as a common component. Therefore, when processing substrates of different sizes, it is possible to cope by simply exchanging the upper components including the relay base substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the laser processing apparatus which can cut | disconnect mainly brittle materials, such as a ceramic substrate and a silicon substrate, with high quality efficiently can be provided.

  Specifically, since the remaining material and processing waste on the substrate holding surface can be reliably and efficiently removed, a newly processed substrate can be attached and held with high reliability. Moreover, since the cutting waste (processing waste) generated by cutting is immediately sucked into the hole of the substrate holding surface, it is possible to prevent adverse effects such as the generation of burrs due to the cutting waste, and the quality and yield of the cutting processed portion can be reduced. improves.

  Further, since a new substrate can be mounted on the setup side while processing the substrate on the processing side, efficient processing can be performed. Furthermore, by providing a plurality of holding bases on each of the processing side and the setup side, it is possible to hold a plurality of substrates and perform processing or setup on them simultaneously, which greatly contributes to shortening the processing time. it can.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram schematically illustrating a laser processing apparatus according to a first embodiment of the present invention. In the figure, a laser beam from a laser oscillation device (not shown) is guided to a laser head 1 through an optical fiber 2 and emitted below the lower end of the laser head 1. The laser head 1 has an axial shape with a sharpened lower end and a multi-stage outer peripheral portion. Assist gas is guided to the side of the laser head 1 through a tube 54. The assist gas is injected downward from the lower end of the laser head 1.

The assist gas is a gas used to remove material melted or sublimated with a laser beam. Usually, air is used as the assist gas, and nitrogen is used when oxidation of the cut surface is disliked. Examples of lasers used for processing include YAG laser, CO ₂ laser, and excimer laser.

  The laser head 1 is held by a fixture 3, and the fixture 3 is attached to one end of a head arm 4 extending in the horizontal direction. The other end of the head arm 4 is fixed to the z-axis slide plate 5. The z-axis slide plate 5 is slidably fitted to a slide shaft 8 extending in the vertical direction (z-axis direction), and is also adjacent to the slide shaft 8 and also has a drive screw 9 extending in the vertical direction. Are screwed together. The slide shaft 8 and the drive screw 9 are supported by a support substrate 6 located at the upper end and a support substrate 7 located at the lower end.

  A z-axis movement motor 10 that rotationally drives the drive screw 9 is fixed to the support substrate 6. When the z-axis movement motor 10 rotates, the drive screw 9 is driven to rotate, whereby the z-axis slide plate 5 moves up and down along the slide shaft 8. In conjunction with this, the laser head 1 also moves up and down. The support substrate 6 and the support substrate 7 are respectively fixed to the z-axis support substrate 11, and the z-axis support substrate 11 is fixed to the y-axis table 12.

  The y-axis table 12 is slidably held on the x-axis table 13 in the horizontal direction (left and right direction on the paper surface, y-axis direction), and extends in the same horizontal direction (left and right direction on the paper surface, y-axis direction). It is screwed with the existing drive screw 12a. On the other hand, the x-axis table 13 is held on the main table 14 so as to be slidable in the horizontal direction (direction perpendicular to the paper surface, x-axis direction). A drive screw that extends in the horizontal direction (perpendicular to the paper surface, x-axis direction) and is screwed to the x-axis table 13 is not shown. The main table 14 is supported by a table support base 37.

  A motor fixing plate 15 is attached to the right end surface of the x-axis table 13, and a y-axis moving motor 16 that rotates the drive screw 12 a is fixed to the motor fixing plate 15. A motor fixing plate 17 is attached to the front end surface of the main table 14, and an x-axis moving motor 18 that rotationally drives a driving screw (not shown) screwed to the x-axis table 13 is fixed to the motor fixing plate 17. ing.

  By the rotation of the x-axis movement motor 18, the y-axis movement motor 16, and the z-axis movement motor 10, the drive screw, the drive screw 12a, and the drive screw 9 that are screwed into the x-axis table 13 are rotated. The As a result, the x-axis table 13, the y-axis table 12, and the z-axis slide plate 5 move, and the laser head 1 also moves in the x, y, and z directions.

  In the present embodiment, two types of suction fixing devices 23 and 24 for vacuum-sucking and fixing the substrate P to be cut are opposed to each other with the center of the rotary table 33 interposed therebetween, and holding posts 28 are respectively mounted on the rotary table 33. It is arranged via. The suction fixing devices 23 and 24 are composed of a substantially flat holding base 19 for holding and fixing the substrate P, an intermediate substrate 20, a relay base substrate 21, and a base substrate 22 in order from the top. In FIG. 1, in the suction fixing device 23 arranged on one side, the substrate P held on the holding base 19 is cut. Further, in the suction fixing device 24 arranged on the other side, the processed substrate P is taken out, and processing setup such as mounting a newly cut substrate P is performed.

  The operations of these two suction fixing devices 23 and 24 can be performed simultaneously in parallel. That is, while the substrate P on the suction fixing device 23 is being cut by the laser beam emitted from the laser head 1, the substrate P can be set up by the suction fixing device 24. Thereby, efficient processing can be performed. A laser shading plate 26 is provided between the suction fixing device 23 and the suction fixing device 24, so that from the suction fixing device 23 side that performs cutting processing to the suction fixing device 24 side that performs setup work, Furthermore, laser beam leakage outside the laser processing apparatus is prevented. The laser shading plate 26 is fixed on a disc C provided in a bowl shape at the upper end of a column S extending upward from the center of the upper surface of the rotary table 33. Incidentally, when the base substrate 22 comes into contact with the disk C, the suction fixing device 23 and the suction fixing device 24 are positioned so as to maintain a horizontal posture.

  After the substrate P is cut on the suction fixing device 23, the rotary table 33 is rotated halfway (rotating 180 degrees) about the rotation shaft 33a extending downward from the center of the lower surface thereof, so that the suction fixing device 23 is moved to the setup side. The suction fixing device 24 moves to the processing side. That is, the positions of the suction fixing devices 23 and 24 are changed. In the suction fixing device 23 moved to the setup side, the suction holding of the substrate P is released, and the part of the substrate P that has been cut and processed is taken out manually or by a robot arm (not shown). On the other hand, in the suction fixing device 24 moved to the processing side, the newly mounted substrate P is cut.

  Now, in the suction fixing device 23 that has moved to the setup side, after the portion of the substrate P that has been cut is taken out, the remaining material after cutting remains on the outer periphery of the holding base 19. In addition, since some of them are scattered on the surface (substrate holding surface) of the holding base 19 in a broken state or as fine scraps (processed scraps) at the time of cutting, it is possible to remove the remaining material as it is. Have difficulty. Therefore, in the present embodiment, the rotating shaft 27 protruding from the side surface of the base substrate 22 is pivotally supported by the upper end portion of the holding column 28, and the base substrate 22 and consequently the suction fixing device 23 (24 is also the same) around the rotating shaft 27. Is structured to rotate about 90 degrees. As a result, the surface of the holding base 19 extends along a substantially vertical direction, and the remaining material or the like falls onto a box-shaped remaining material receiver 38 provided below.

  In this case, a cylinder 29 driven by air pressure or hydraulic pressure is provided below the base substrate 22 as an operation member of the suction fixing device. The lower end of the cylinder 29 is rotatably supported via a pin 31 by a rotation fixture 30 provided on the upper surface of the rotary table 33, and the upper end of a cylinder rod 32 associated with the cylinder 29 is provided on the lower surface of the base substrate 22. The rotation fixing bracket 39 is rotatably supported through the pin 31. The base substrate 22 rotates about the rotation shaft 27 by the expansion and contraction of the cylinder rod 32. However, the operating member is not limited to the cylinder, and may be a motor, a solenoid or the like.

  2 and 3 are diagrams schematically showing how the remaining material is removed in the laser processing apparatus of the present embodiment. As described above, when removing the remaining material, the base substrate 22 rotates about 90 degrees about the rotation shaft 27. By this rotation, the relay base substrate 21, the intermediate substrate 20, and the holding base 19 that are integrally fixed to the base substrate 22 also rotate, that is, the suction fixing device 23 (24) rotates. The surface f is along the substantially vertical direction, and the remaining material on the holding base 19 or fine scraps at the time of cutting falls to the remaining material receiver 38 below.

  In the configuration shown in FIG. 2, with the holding base 19 rotated about 90 degrees, the holding base cleaning device 40 composed of the brush 41, the air nozzle 43 and the like descends to the holding base 19, and the surface thereof. Debris such as fine dust adhered to f is removed (that is, cleaned). More specifically, the brush 41 is provided with brushes extending radially from the periphery thereof, and can be rotated by a motor 42 connected to a central shaft (not shown).

  The air nozzle 43 is provided above the brush 41 and has a function of blowing air onto the surface f of the holding base 19. As the brush 41 rotates, the surface f of the holding base 19 is rubbed and the air nozzle 43 blows air on the surface f of the holding base 19 while the holding base cleaning device 40 is lowered, The dust adhering to the entire surface f of the holding base 19 is reliably removed.

  The holding base cleaning device 40 is slidably fitted to a slide shaft 45 extending in a substantially vertical direction, and is also adjacent to the slide shaft 45 and screwed with a drive screw 46 extending in the substantially vertical direction. Match. The slide shaft 45 and the drive screw 46 are supported by a support substrate 47 located at the upper end thereof, and a motor 48 that rotationally drives the drive screw 46 is fixed to the support substrate 47. The support substrate 47 is attached to the frame side (not shown) of the laser processing apparatus. When the motor 48 rotates, the drive screw 46 is driven to rotate, whereby the holding base cleaning device 40 moves up and down along the slide shaft 45.

  In the present embodiment, the holding base cleaning device 40 moves up and down by driving the motor as described above, but a cylinder may be used instead of the motor. Further, the inclination of the suction fixing device 23 (24) is set to 90 degrees, that is, in the vertical direction, but this angle is adjusted within a range of ± α depending on the characteristics of the remaining material, and is attached to the surface f of the holding base 19. It is also possible to make it easier to remove dust such as fine dust.

  Further, in the configuration shown in FIG. 3, a plurality of air nozzles 44 are provided so as to face the surface f of the holding base 19 rotated about 90 degrees, and air is blown onto the surface f of the holding base 19, thereby Debris such as fine debris attached to the surface is removed. Reference numeral 49 denotes a support plate that extends in a substantially vertical direction and is provided with an air nozzle 44.

  4 is a plan view of the holding base 19 in the suction fixing device 23 or 24, and FIG. 5 is a longitudinal sectional view of the suction fixing device 23 or 24. In these drawings, the holding base 19 for adsorbing and holding the substrate P described above is constituted by a product holding base 50 for adsorbing a portion that becomes a product after the substrate P is cut, and the outside is a remaining material after the substrate P is cut. It is comprised with the remaining material holding | maintenance base 52 which hold | maintains the outer peripheral edge part which becomes. The product holding base 50 is fixed to the relay base substrate 21 via the product intermediate plate 51, and the remaining material holding base 52 is fixed to the relay base substrate 21 via the outer peripheral intermediate plate 53.

  The substrate P placed on the holding base 19 including the product holding base 50 and the remaining material holding base 52 is fixed by air suction (vacuum suction). The structure will be described below. A substantially lattice-shaped suction groove a0 as shown in FIG. The suction groove a0 is set to have a desired width and number so that a necessary holding force can be obtained during the cutting process.

  However, in that case, it is usually designed so that the entire suction groove a0 has a bilaterally symmetric shape, and further, if necessary, a vertically symmetric shape. Further, on the upper surface of the remaining material holding base 52, a suction groove b0 arranged in a rectangular shape as shown in FIG. 4 is provided. The suction groove b0 is set to have a width that provides a desired suction force so that a necessary holding force can be obtained during the cutting process. In addition, the surface f of the holding base 19 described above is constituted by the upper surface of the product holding base 50 and the upper surface of the remaining material holding base 52.

  When air suction is performed, in the product holding base 50, air flows into the suction path hole a1 provided at the bottom portion through the suction groove a0. The air that has flowed in is collected in the cavity 50a at the bottom of the product holding base 50, and from the suction path a2 provided in the central part of the product intermediate plate 51 to the suction path a3 provided in the central part of the relay base substrate 21, and The product is sucked by a product suction vacuum pump (not shown) through the support column S and the rotating shaft 33a through the suction path a4 provided in the center of the base substrate 22 and the tube 34 shown in FIG.

  On the other hand, in the remaining material holding base 52, air flows into the suction passage hole b1 arranged at the bottom thereof through the suction groove b0. The air that has flowed in is provided from the suction path b2 provided in the outer peripheral intermediate plate 53 below the suction groove b0 to the suction path b3 provided near one end of the relay base substrate 21 and one end of the base substrate 22. The suction path b4 and the tube 35 shown in FIG. 1 are used to suck the remaining material suction vacuum pump (not shown) through the support column S and the rotating shaft 33a.

  As described above, in this embodiment, the vacuum pump is used for air suction. However, the present invention is not limited to this. For example, the same effect can be obtained even if suction force by a dust suction device is used. In this example, separate (independent) vacuum pumps are provided for residual material adsorption and product adsorption, so that the residual material adsorption force and product adsorption force can be set arbitrarily. There are advantages you can do. In addition, when adsorption power is enough, adsorption | suction of a remaining material and adsorption | suction of a product may be performed with one vacuum pump. In addition, it is not limited to holding the substrate by suction, and may be held by, for example, clamping.

  A rectangular cutting hole c0 is formed between the product holding base 50 and the remaining material holding base 52, as indicated by hatching in FIG. As shown in FIG. 5, the laser head 1 scans immediately above the cutting hole c0 and cuts the substrate P with a laser beam. That is, the cutting hole c0 is provided along the scanning line so as to be below the scanning line scanned by the laser beam when the substrate P is cut. In the present embodiment, the cutting hole c0 is a hole communicating with the following suction path c1 over the entire range, but is not limited to this configuration. For example, the cutting hole c0 has a bottomed groove shape, It is good also as a structure which provided the suction hole connected to the following suction path c1 in several places on the bottom face.

  As described above, the substrate P is usually cut by irradiating a laser beam while spraying an assist gas. Immediately after the cutting, the assist gas and the cutting waste generated by the cutting are connected to the relay base substrate 21 from the suction path c1 below the cutting hole c0 and the suction path c2 formed between the product intermediate plate 51 and the outer peripheral intermediate plate 53. Is sucked from a suction path c4 of the base substrate 22 to a dust suction device (not shown) through a suction path c3 provided in the vicinity of one end of the base plate 22. Thereby, bad influences, such as the production | generation of the burr | flash by a cutting waste, can be prevented and the quality and yield of a cutting process part improve.

  The suction path c4 is connected to the dust suction device (not shown) through the dust suction connection port 36 shown in FIG. The dust suction connection port 36 extends from the side surface of the table support base 37 to the lower surface of the base substrate 22 and opens to the suction path c4. In this embodiment, the rotary table 33 rotates 180 degrees, so that the suction fixing devices 23 and 24 rotate from the processing side to the setup side and from the setup side to the processing side, respectively. 36 is shared for each suction fixing device.

  FIG. 6 is a longitudinal sectional view of another suction fixing device. The suction fixing device shown in the figure is for holding and cutting a substrate Pa having a smaller size than the substrate P of the suction fixing device 23 (24) shown in FIG. The suction fixing device 60 is shown in FIG. The suction fixing device 60 has the same positional relationship in the height direction as compared with the suction fixing device 23 (24), but the width direction (left-right direction of the paper surface) and the depth direction (direction perpendicular to the paper surface) are entirely. The structure is shrunk. However, in any of the suction fixing devices of FIGS. 5 and 6, the base substrate 22 has the same shape and size and can be shared.

  The correspondence between the suction fixing device 23 (24) of FIG. 5 and the suction fixing device 60 of FIG. 6 will be described. First, the suction groove b0 and the suction path hole b1, of the holding base 19 in the suction fixing device 23 (24). Further, the cutting hole c0 and the suction path c1 are positions shifted inward as the suction groove bb0 and the suction path hole bb1, and the cutting hole cc0 and the suction path cc1 of the holding base 19a in the suction fixing device 60, respectively.

  Accordingly, the suction path b2 and the suction path c2 of the intermediate substrate 20 in the suction fixing device 23 (24) are shifted inward as the suction path bb2 and the suction path cc2 of the intermediate substrate 20a in the suction fixing device 60, respectively. It has become. Further, along with this, the suction path b3 and the suction path c3 of the relay base substrate 21 in the suction fixing device 23 (24) are inward as the suction path bb3 and the suction path cc3 of the relay base substrate 21a in the suction fixing device 60, respectively. The position is shifted.

  The suction groove a0 and the suction path hole a1 of the holding base 19 in the suction fixing device 23 (24) are shifted inward as the suction groove aa0 and the suction path hole aa1 of the holding base 19a in the suction fixing device 60, respectively. Is in position. In addition, the suction path a2 of the intermediate substrate 20 and the suction path a3 of the relay base substrate 21 are reduced in the width direction and the depth direction as the suction path aa2 of the intermediate substrate 20a and the suction path aa3 of the relay base substrate 21a, respectively. It has become. In addition, the suction paths a4 and b4 of the base substrate 22 shown in FIGS. 5 and 6 can be combined into one path as long as the suction force is sufficient as described above.

  With the above configuration, the suction path b4 and the suction path c4 of the base substrate 22 can be used in common. That is, in the present embodiment, the base substrate 22 to which the piping tubes 34 and 35 are connected is left in place, and the suction for holding and fixing the substrates that are workpieces having different sizes is performed only by replacing the components on the base substrate 22. The holding device can be replaced. Thereby, it is possible to easily cope with substrates of different sizes.

  In other words, the suction path for adsorbing the substrate P by the holding base 19 passes from the holding base 19 through the intermediate substrate 20 to the laser processing apparatus main body side (specifically, the holding column). 28), the base substrate 22 is always in communication with the base substrate 22. Accordingly, since the base substrate 22 can be used as a common component, when processing the substrates P having different sizes, the upper components including the relay base substrate 21, that is, the relay base substrate 21, the intermediate substrate 20, and the holding base It is possible to cope with this by simply exchanging 19.

  FIG. 7 is a diagram schematically showing a configuration on the rotary table of the laser processing apparatus according to the present embodiment, and is represented by a plan view. This figure is the same as the arrangement configuration of the suction fixing devices 23 and 24 on the rotary table 33 shown in FIG. In the present embodiment, the upper surface of the rotary table 33 having a substantially circular shape in plan view is divided into two equal parts by the laser shading plate 26, and suction fixing devices 23 and 24 having a substantially square shape in plan view are provided in the respective regions. One holding base 19 is attached to each of the suction fixing devices.

  Each holding base 19 can hold and fix one substrate P, and a total of two substrates P can be held and fixed over the entire table. Note that the intermediate substrate 20, the relay base substrate 21, and the base substrate 22 described above are provided below the holding base 19 (not shown). It is of course possible to replace the holding base 19 with the holding base 19a described above. The same applies to the following embodiments.

  FIG. 8 is a diagram schematically illustrating the configuration on the rotary table of the laser processing apparatus according to the second embodiment, which is represented by a plan view. In the present embodiment, the upper surface of the rotary table 33 is divided into two equal parts by the laser shading plate 26, and suction fixing devices 23a and 24a each having a substantially rectangular shape in plan view are provided in each region. A sheet holding base 19 is arranged and attached. Each holding base 19 can hold and fix one substrate P, and each suction fixing device can hold and fix two substrates P for a total of four substrates P in total. With this configuration, it is possible to simultaneously process two substrates P on one of the suction fixing devices 23a and 24a, and simultaneously perform preparation of two substrates P on the other. Note that the holding bases 19 are not limited to two but may be arranged three or more in each suction fixing device.

  FIG. 9 is a diagram schematically illustrating the configuration on the rotary table of the laser processing apparatus according to the third embodiment, which is represented by a plan view. In the present embodiment, the upper surface of the rotary table 33 is divided into three equal parts by a laser shading plate 26a, and suction fixing devices 23, 24, and 25 having a substantially square shape in plan view are provided in each region. One holding base 19 is attached to each. Each holding base 19 can hold and fix one substrate P, and a total of three substrates P can be held and fixed over the entire table. With this configuration, the substrate P can be processed by one of the suction fixing devices 23, 24, and 25, and the substrate P can be set up by the other two devices. In addition, it is good also as a structure which divided the upper surface of a rotary table into 4 or more parts not only in 3 parts, and provided the adsorption | suction fixing device in each area | region.

  FIG. 10 is a diagram schematically illustrating the configuration on the rotary table of the laser processing apparatus according to the fourth embodiment, which is represented by a plan view. In this embodiment, the upper surface of the rotary table 33 is divided into three equal parts by a laser shading plate 26a, and suction fixing devices 23a, 24a, 25a having a substantially rectangular shape in plan view are provided in each region. Two holding bases 19 are arranged and attached respectively. Each holding base 19 can hold and fix one substrate P, and each suction fixing device can hold and fix two substrates, a total of six substrates P in total.

  With this configuration, one of the suction fixing devices 23a, 24a, and 25a can simultaneously process two substrates P, and the other two devices can simultaneously set up two substrates P. Note that the holding base 19 is not limited to two but may be three or more in each suction fixing device. Moreover, it is good also as a structure which divided the upper surface of a rotary table not only into 3 parts but into 4 parts or more, and provided the adsorption | suction fixing device in each area | region.

  As described above, in the present invention, the laser head is moved in the x, y, and z directions, and a plurality of suction and fixing devices are arranged on the rotary table. By enabling each work to be performed in parallel, a laser processing device with extremely high processing efficiency has been realized. Further, the laser processing apparatus of the present invention is useful not only in the cutting process shown in the embodiment but also in the drilling process, the grooving process, and other processes.

  In addition, the board | substrate holding surface said by a claim corresponds to the surface f of the holding base 19 in an Example, and the hole respond | corresponds to the cutting hole c0.

The figure which shows typically the laser processing apparatus which concerns on Example 1 of this invention. The figure which shows typically the mode of the remaining material removal in the laser processing apparatus of a present Example. The figure which shows typically the mode of the remaining material removal in the laser processing apparatus of a present Example. The top view of the holding base 19 in the adsorption fixing device 23 or 24. The longitudinal cross-sectional view of the adsorption fixing device 23 or 24. FIG. The longitudinal cross-sectional view of another adsorption fixing device. The figure which shows typically the structure on the turntable of the laser processing apparatus which concerns on a present Example. FIG. 6 is a diagram schematically illustrating a configuration on a rotary table of a laser processing apparatus according to a second embodiment. FIG. 6 is a diagram schematically illustrating a configuration on a rotary table of a laser processing apparatus according to a third embodiment. FIG. 10 is a diagram schematically illustrating a configuration on a rotary table of a laser processing apparatus according to a fourth embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser head 2 Optical fiber 3 Fixing bracket 4 Head arm 5 Z axis slide board 6,7 Support board 8 Slide axis 9 Drive screw 10 Z axis movement motor 11 Z axis column board 12 Y axis table 13 X axis table 14 Main table 15 Motor Fixed plate 16 y-axis moving motor 17 Motor fixing plate 18 x-axis moving motor 19 Holding base 20 Intermediate substrate 21 Relay base substrate 22 Base substrate 23, 24, 25 Adsorption fixing device 26 Laser shading plate 27 Rotating shaft 28 Holding column 29 Cylinder 30 Rotation Fixing Bracket 31 Pin 32 Cylinder Rod 33 Rotating Table 34, 35 Tube 36 Dust Absorption Connection Port 37 Table Support Base 38 Remaining Material Receiving 39 Rotation Fixing Bracket 40 Holding Base Cleaning Device 41 Brush 42 Motor 43, 44 Air Nos 45 slide shaft 46 the drive screw 47 supporting substrate 48 Motor 49 post plate 50 product held base 51 product intermediate plate 52 residues material holding base 53 outer circumferential intermediate plate 54 Tube 60 chucking device P substrate S strut C disc f surface

Claims (7)

In laser processing equipment that processes a substrate by irradiating a laser beam,
A holding base for holding the substrate at the time of processing the substrate is provided, and after the processing of the substrate, the substrate holding surface of the holding base to drop the remaining material and / or processing waste of the substrate from the holding base. The laser processing apparatus is characterized in that the holding base is moved so as to be substantially along the vertical direction.   2. The substrate holding surface is cleaned by rubbing the substrate holding surface with a brush in a state in which the substrate holding surface is substantially in a vertical direction after the processing of the substrate. The laser processing apparatus as described.   The substrate holding surface is cleaned by blowing air to the substrate holding surface in a state where the substrate holding surface is substantially along a vertical direction after the processing of the substrate. 2. The laser processing apparatus according to 2.   The laser according to any one of claims 1 to 3, wherein a hole for sucking processing scraps generated during processing of the substrate by a suction means is provided in a substrate holding surface of the holding base. Processing equipment.   The laser processing according to claim 4, wherein the hole is provided along the scanning line so as to be below the scanning line scanned by the laser beam when the substrate is cut. apparatus.   The holding base is provided on each of a processing side for processing a substrate and a setup side for mounting a newly processed substrate, and the holding base on the processing side and the holding base on the setup side are interchangeable. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is provided.   The laser processing apparatus according to claim 6, wherein a plurality of the holding bases are provided on each of the processing side and the setup side.

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