JP2008084887A - Dicing apparatus and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dicing apparatus and method for processing a plurality of works simultaneously with high throughput at a low cost. <P>SOLUTION: The dicing apparatus comprises a work table 2 provided with surfaces 11 and 12 for holding a work in parallel, a processing section 5 opposing the holding surface 11, a processing section 6 opposing the holding surface 12, a shaft 3 for moving the processing section 5 and the holding surface 11 relatively, and a shaft 4 for moving the processing section 6 and the holding surface 12 relatively. When the works W are suction held to the opposite sides of the work table 2 and processed, the number of works to be processed can be doubled using an apparatus having a work table of the same diameter and thereby the throughput can be enhanced. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a dicing apparatus and a dicing method for dividing a workpiece such as a wafer on which a semiconductor device or an electronic component is formed into individual chips.

  A dicing machine that performs cutting and grooving on workpieces such as wafers on which semiconductor devices and electronic components are formed is a blade that is rotated at high speed by a spindle, a work table that holds the work, and a work after dicing is cleaned. Various moving axes for changing the relative positions of the cleaning means and the blade and the workpiece are provided.

  FIG. 4 shows a conventional example of a dicing apparatus. The dicing apparatus 10 includes a high-frequency motor built-in type spindles 22 and 22 that are arranged to face each other and have a blade 21 and a wheel cover (not shown) attached to the tip, and a work table 31 that holds and holds a work W. 20, a cleaning unit 52 that spin-cleans the processed workpiece W, a load port 51 on which a cassette containing a large number of workpieces W mounted on the frame F is placed, a transport means 53 that transports the workpiece W, It comprises a controller (not shown) that controls the operation of each part.

  As shown in FIG. 5, the structure of the processing unit 20 is guided by X guides 34, 34 provided on the X base 36, and is driven by a linear motor 35 in the X direction indicated by XX in the drawing. The X table 33 is provided with a work table 31 via a rotary table 32 that rotates in the θ direction.

  On the other hand, Y tables 41 and 41 guided by Y guides 42 and 42 and driven in the Y direction indicated by YY in the figure by a stepping motor and a ball screw (not shown) are provided on the side surface of the Y base 44. . Each Y table 41 is provided with a Z table 43 that is driven in the Z direction indicated by ZZ in the drawing by driving means (not shown), and the Z table 43 is a built-in high-frequency motor with a blade 21 attached to the tip. The spindle 22 is fixed. Since the structure of the processing unit 20 is as described above, the blade 21 is index-fed in the Y direction and cut and fed in the Z direction, and the work table 31 is cut and fed in the X direction.

  Both spindles 22 are rotated at a high speed of 1,000 rpm to 80,000 rpm, and a supply nozzle (not shown) for supplying a cutting fluid for immersing the workpiece W in the cutting fluid is provided in the vicinity (for example, (See Patent Document 1).

  Further, in recent years, instead of using such a blade 21, a laser beam having a focused point inside the work W is incident on the work W, and a plurality of modified regions by multiphoton absorption are formed inside the work W. A laser dicing apparatus that expands the work W and divides the work W into individual chips T is also used for processing the work W.

  As with the dicing apparatus 10, the laser dicing apparatus includes a load port, a conveying means, a work table, and the like. As shown in FIG. 6, a laser head 41 is provided in the processing unit 20 so as to be opposed to the spindle 22. ing.

  The laser head 41 includes a laser oscillator 41A, a collimating lens 41B, a mirror 41C, a condensation lens 41D, and the like. The laser light L oscillated from the laser oscillator 41A is collimated in the horizontal direction by the collimating lens 41B. The light is reflected in the vertical direction and collected by the condensation lens 41D (see, for example, Patent Document 2).

  When the condensing point of the laser beam L is set inside the thickness direction of the workpiece W placed on the chuck table 31, the laser beam L transmitted through the surface of the workpiece W is collected as shown in FIG. Energy is concentrated at the light spot, and a modified region P such as a crack region, a melted region, a refractive index changing region or the like due to multiphoton absorption is formed in the vicinity of the condensing point inside the workpiece.

As shown in FIG. 7B, a plurality of the reforming regions P are formed side by side inside the workpiece W by moving the workpiece W in the horizontal direction. In this state, the workpiece W is naturally cleaved starting from the reforming region P, or is cleaved starting from the reforming region P by applying a slight external force. In this case, the workpiece W is easily divided into chips without causing chipping on the front and back surfaces.
JP 2002-280328 A JP 2002-192367 A

  Conventionally, in the manufacture of semiconductor devices and electronic components, mass production and cost reduction have been strongly desired due to an increase in demand. In order to meet such a demand, in the apparatuses described in Patent Document 1 and Patent Document 2, two spindles or laser heads are attached to the moving shaft so as to face each other, so that one workpiece is attached. 2 processing at a time is possible.

  However, in recent years, in order to make it possible to process a larger number of workpieces, it has been desired not only to perform a plurality of processes simultaneously on a single workpiece but also to process a plurality of workpieces simultaneously. However, in the apparatuses described in Patent Document 1 and Patent Document 2, only one workpiece can be held on the work table, and it is difficult to process a plurality of workpieces simultaneously.

  The present invention has been made with respect to such a problem, and has a high-throughput and low-cost dicing apparatus capable of processing a plurality of workpieces at the same time and having an apparatus size that is the same as that of the prior art. The object is to provide a dicing method.

  In order to achieve the above object, according to the present invention, a first holding surface that holds a workpiece and a second holding surface that holds a workpiece in the same manner as the first holding surface are parallel to each other. A work table provided on the first holding surface, facing the first holding surface, facing a first processing means for processing a work held on the first holding surface, facing the second holding surface, A second processing means for processing the workpiece held on the second holding surface; a first moving means for relatively moving the first processing means and the first holding surface; And a second moving means for relatively moving the processing means and the second holding surface.

  According to the first aspect of the present invention, the dicing apparatus is provided with the first holding surface for sucking and holding the workpiece on one surface, and the workpiece is sucked on the opposite surface in the same manner as the first holding surface. A second holding surface for holding is provided, and a work table that rotates in the θ direction is provided.

  A first processing means including a spindle having a blade attached to the tip or a laser head for processing a workpiece by laser light is attached to the first holding surface so as to face each other. Similarly, the 2nd processing means is attached to the 2nd holding surface facing.

  The first processing means and the first holding surface are relatively positioned by the θ rotation of the work table and the first moving means having the respective axes in the X, Y, and Z directions to which the first processing means is attached. Is done. Similarly, the second processing means and the second holding surface are relatively positioned by the θ rotation of the second moving means and the work table.

  As a result, the workpieces sucked and held on the first holding surface and the second holding surface are simultaneously processed by the first processing means and the second processing means, respectively. Therefore, the work is attracted and held on both surfaces of the work table, and the number of work tables can be processed with the same work table diameter without increasing the number of work tables, so that the throughput can be improved.

  According to a second aspect of the present invention, in the first aspect of the invention, the first processing means and the second processing means are each constituted by two opposing spindles each having a disk-shaped blade provided at the tip. It is characterized by having.

  According to the second aspect of the present invention, the work held by suction on the first holding surface and the work held by suction on the second holding surface are opposed to each other. Dicing is performed by blades provided on two spindles. As a result, machining can be performed with a higher throughput than with a single spindle, and two workpieces are simultaneously processed, so that the processing is performed with a higher throughput.

  According to a third aspect of the present invention, in the first aspect of the invention, the first processing means and the second processing means irradiate the workpiece with laser light to form a modified layer in the workpiece. It is characterized by being a laser head for dicing a workpiece.

  According to invention of Claim 3, the workpiece | work adsorbed-held by the 1st holding surface and the workpiece | work adsorbed-held by the 2nd holding surface are the laser head arrange | positioned facing each holding surface. Then, a modified layer is formed inside the workpiece and dicing is performed. As a result, high-quality machining that does not cause chipping or the like on the workpiece can be performed, and two workpieces are machined at the same time, so that high-throughput machining is possible.

  The invention of claim 4 is a work table in which a first holding surface for holding a workpiece and a second holding surface for holding a workpiece similarly to the first holding surface are provided in parallel. The first processing means and the first holding surface are the first processing means that processes the workpiece held on the first holding surface and facing the first holding surface. And a second processing means for processing the workpiece held on the second holding surface and facing the second holding surface. The two workpieces are simultaneously processed by moving the second processing unit and the second holding surface relatively by a second moving unit that relatively moves the second processing unit and the second holding surface. It is said.

  According to invention of Claim 4, a workpiece | work is adsorbed and hold | maintained on each holding surface of the 1st holding surface and the work table in which the 2nd holding surface was provided in the back surface. The first workpiece that is attracted and held on the work table is moved relative to the first holding surface and the second holding surface by the first moving means and the second moving means, respectively. It is processed simultaneously by the means and the second processing means.

  As a result, the work is attracted and held on both surfaces of the work table, and the number of work tables can be processed with the same work table diameter twice as many without increasing the number of work tables, thereby improving the throughput.

  As described above, according to the dicing apparatus and the dicing method of the present invention, two workpieces are attracted and held simultaneously on the work table, and the work table diameter is doubled as it is without increasing the number of work tables. As a result, the throughput can be improved and low-cost processing can be performed.

  Preferred embodiments of a dicing apparatus and a dicing method according to the present invention will be described below in detail with reference to the accompanying drawings.

  First, the dicing apparatus according to the present invention will be described. FIG. 1 is a perspective view showing a main part of a dicing apparatus according to the present invention.

  The main part of the dicing apparatus 1 processes a circular work table 2, a moving shaft 3 as a first moving means, a moving shaft 4 as a second moving means, and a work W held on the work table 2. A processing section 5 as a first processing means and a processing section 6 as a second processing means are provided.

  The worktable 2 has a holding surface 11 as a first holding surface on one surface of a cylindrical rotating shaft 13 that is rotated by a motor 14, and a second holding surface on the other surface provided in parallel. A holding surface 12 is provided.

  The work table 2 is provided so as to be movable in the X direction when the motor 14 is attached to the arm 25 of the table moving shaft 26.

  The surfaces of the holding surface 11 and the holding surface 12 are connected to a vacuum generation source (not shown), and hold the workpiece W by suction and position the workpiece W in the θ direction by rotating the rotating shaft 13 in the θ direction. The holding surface 11 and the holding surface 12 are rotatably provided in the same direction or in the opposite direction.

  The moving shaft 3 includes a linear motor or a Y moving shaft 16 driven by a motor and a ball screw, and Z moving shafts 19A and 19B attached to the Y moving shaft 16, respectively. One end of the Y movement shaft 16 is attached to the X movement shaft 15.

  The Z moving shafts 19A and 19B are respectively provided with spindles 22 and 22 which are arranged to face each other as the processing portion 5 and have a blade 21 and a wheel cover (not shown) attached to the tip.

  As a result, the spindle 22 of the processing unit 5 moves in the X, Y, and Z directions, faces the holding surface 11 of the work table 2, and rotates the holding surface 11 in the θ direction, thereby holding the processing unit 5 and the holding unit 11. Dicing processing of the workpiece W held on the holding surface 11 by relatively moving the surface 11 is performed.

  Similarly to the movement axis 3, the movement axis 4 includes a Y movement axis 17 and Z movement axes 18A and 18B attached to the Y movement axis. One end of the Y movement axis 17 is attached to the X movement axis 15. ing.

  The Z moving shafts 18A and 18B are respectively provided with spindles 22 and 22 which are disposed to face each other as the processing portion 6 and have a blade 21 and a wheel cover (not shown) attached to the tip.

  As a result, the spindle 22 of the processing unit 6 moves in the X, Y, and Z directions, faces the holding surface 12 of the work table 2, and rotates the holding surface 12 in the θ direction. The surface 12 moves relatively and the workpiece W held on the holding surface 12 is processed.

  At this time, the work W attracted and held on the holding surface 11 and the holding surface 12 can be processed simultaneously, and two workpieces W are diced at a time.

  In the present embodiment, the processing unit 5 and the processing unit 6 describe processing means for cutting the workpiece W by rotating the blade 21 at a high speed by the spindle 22, but the present invention is not limited thereto, Even if the laser head 41 shown in FIG. 6 is provided as a configuration of the part 5 and the processing part 6, it can be suitably implemented.

  In addition, the dicing apparatus 1 includes a load port 51, a conveying means 53, a controller, and the like, as in the dicing apparatus 10 shown in FIG.

  Next, the dicing method according to the present invention will be described. FIG. 2 is a side view of the main part of the dicing apparatus 1.

  In the dicing apparatus 1, first, two workpieces W are supplied to the work table 2 from the cassette provided in the load port, and are sucked and held on the holding surface 11 and the holding surface 12, respectively.

  The workpiece W held by suction is picked up by an image pickup device (not shown) and moved by the rotary shaft 13, the X moving shaft 15, the Y moving shaft 16, and the Y moving shaft 17, and is provided in the processing unit 5 and the processing unit 6. The blade 21 thus formed is aligned with the processing position on the workpiece W held by suction on the holding surface 11 and the holding surface 12.

  After completion of alignment, each spindle 22 starts rotating, cutting fluid is ejected from a wheel cover (not shown), and dicing is started. In the dicing process, first, the Z moving shafts 18A and 18B and the Z moving shafts 19A and 19B are moved in the Y direction by the Y moving shaft 16 and the Y moving shaft 17, and the blade 21 is adjusted to the starting position of the dicing process.

  Subsequently, the Z movement shafts 18A and 18B face the holding surface 12, the Z movement shafts 19A and 19B move in the Z direction toward the holding surface 11, the blade 21 cuts into the workpiece W, and the X movement shaft 15 feeds the work. Then, the workpieces W sucked and held on the holding surface 11 and the holding surface 12 are simultaneously diced.

  After the dicing process at the first position is performed, the blade 21 is index-fed by the Y moving shaft 16 and the Y moving shaft 17, and the work W is diced at the next processing position.

  When all the dicing processes are completed, the blade 21 moves away from the work table 2 and moves to the standby position. The work W on the holding surface 11 and the holding surface 12 that has been diced is conveyed from the holding surface 11 and the holding surface 12, and is stored in the cassette again through each process such as cleaning and drying in the dicing apparatus 1.

  As described above, according to the dicing apparatus and the dicing method according to the present invention, the two workpieces W are simultaneously sucked and held on the work table 2 and simultaneously processed. Thereby, without increasing the number of work tables, it becomes possible to process twice as many as the conventional work table with the same work table diameter, and it is possible to improve the throughput. Moreover, since the installation area of the apparatus does not increase, the cost required for the equipment is reduced, and low-cost processing is possible.

  In the present embodiment, the work tail 2 is provided horizontally. However, the present invention is not limited thereto, and may be provided vertically as shown in FIG. Any moving means may be used as long as it is configured to move automatically.

  Further, in the dicing apparatus 1 of the present invention, not only the Y moving shaft 16 and the Y moving shaft 17 are moved by the X moving shaft 15, but also the work table 2 is moved by the table moving shaft 26, thereby the holding surface 11. In addition, it is possible to simultaneously dice the workpieces W sucked and held on the holding surface 12.

The perspective view which showed typically the principal part of the dicing apparatus concerning this invention. The side view of the principal part of the dicing apparatus concerning this invention. The perspective view which showed another structure of the dicing apparatus. The perspective view which showed the external appearance of the conventional dicing apparatus. The perspective view which showed the structure of the movement axis | shaft of the conventional dicing apparatus. The side view which showed the process part of the laser dicing apparatus. Sectional drawing which showed the principle of the laser dicing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 10 ... Dicing apparatus, 2 ... Work table, 3, 4 ... Moving shaft, 5, 6, 20 ... Processing part, 11, 12 ... Holding surface, 13 ... Rotating shaft, 14 ... Motor, 15 ... X moving shaft, 16, 17 ... Y movement axis, 18A, 18B, 19A, 19B ... Z movement axis, 21 ... Blade, 22 ... Spindle, 31 ... Worktable, W ... Workpiece

Claims (4)

A work table in which a first holding surface for holding a workpiece and a second holding surface for holding the workpiece in the same manner as the first holding surface are provided;
First processing means for processing the workpiece held on the first holding surface, facing the first holding surface;
Second processing means for processing the workpiece held on the second holding surface, facing the second holding surface;
First moving means for relatively moving the first processing means and the first holding surface;
A dicing apparatus comprising: a second moving unit that relatively moves the second processing unit and the second holding surface.   2. The dicing according to claim 1, wherein each of the first processing means and the second processing means includes two opposing spindles each having a disk-shaped blade provided at a tip. apparatus.   The first processing means and the second processing means are laser heads that irradiate the work with laser light and form a modified layer in the work to dice the work. Item 2. The dicing apparatus according to Item 1. Holding two workpieces in parallel on a work table in which a first holding surface for holding workpieces and a second holding surface for holding workpieces in the same manner as the first holding surface are provided;
A first processing means that processes the workpiece held on the first holding surface facing the first holding surface is moved relative to the first processing means and the first holding surface. A second processing means for processing the workpiece held on the second holding surface and facing the second holding surface while being relatively moved by the first moving means. By relatively moving by means of second moving means for relatively moving the means and the second holding surface,
A dicing method characterized in that two of the held workpieces are processed simultaneously.

Images