JP2006049696A - 薄膜トランジスタの製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000010409 thin film Substances 0.000 title claims description 23
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 150000002500 ions Chemical class 0.000 claims abstract description 21
- 239000012535 impurity Substances 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 239000010408 film Substances 0.000 claims description 70
- 150000004767 nitrides Chemical class 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims description 10
- 238000009792 diffusion process Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 37
- 229920005591 polysilicon Polymers 0.000 description 37
- 238000005468 ion implantation Methods 0.000 description 28
- 239000011521 glass Substances 0.000 description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000002513 implantation Methods 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 5
- 229910052785 arsenic Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005224 laser annealing Methods 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
- H01L29/78627—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile with a significant overlap between the lightly doped drain and the gate electrode, e.g. GOLDD
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Abstract
【解決手段】 ソース・ドレイン領域形成後に透明基板裏面からレーザを照射して半導体層中の不純物イオンをゲート電極下方向へ拡散させてGOLD構造を形成する。少ない工程数でGOLD構造を形成し、左右のLDD領域における非対称性の発生を抑えて特性のばらつきを抑制することができる。
【選択図】 図1
Description
図1は、本願発明の実施の形態1に係る薄膜トランジスタの製造工程を示す概略図である。なお、以下に説明する各実施の形態で用いられる説明図において、同一又は相当部分には同一の符号を付してその説明を省略する。
また、YAG−2ω等の波長λ=370〜710nmのレーザ照射では、アモルファス状態のシリコン領域では、ポリシリコンとなったシリコン領域よりもエネルギー吸収係数が大きいので、イオン注入により結晶構造がアモルファス化することで、効果的にソース・ドレイン領域付近に熱を加えることが可能となる。なお、本実施の形態およびその他の実施の形態では基板としてガラス基板を用いているが、石英基板、プラスチック基板等、その他の透明基板を用いることも可能である。
実施の形態1では、ポリシリコン層が比較的薄く、ソース・ドレイン領域はポリシリコン層の縦断面の上面から下面に至るまでの領域に形成された。これに対し、本実施の形態では、ポリシリコン層が比較的厚く、ソース・ドレイン領域はポリシリコン層より十分に薄く形成するものである。
図2は、本願発明の実施の形態2に係る薄膜トランジスタの製造工程を示す概略図である。
また、YAG−2ωによるレーザ照射によれば、アモルファス状態のシリコン領域の方がポリシリコンとなったシリコン領域よりもエネルギー吸収係数が大きいので、イオン注入により結晶構造をアモルファス化することで、効果的にソース・ドレイン領域付近に熱を加えることが可能となる。参考文献として、特開2000−269133 図1にアモルファスとポリシリコンのレーザ吸収係数の違いが明記されている。
実施の形態1および実施の形態2では、ポリシリコン層にある一種類のイオンを注入してソース・ドレイン領域を形成した。これに対し本実施の形態では、ポリシリコン層に複数のイオン種を注入してソース・ドレイン領域を形成するものである。
図3は、本願発明の実施の形態3に係る薄膜トランジスタの製造工程を示す概略図である。
本実施の形態では、ポリシリコン層へのイオン注入の際に、斜め回転注入を行い、意図的にゲート電極の下にも不純物領域を形成するものである。
図4は、本願発明の実施の形態4に係る薄膜トランジスタの製造工程を示す概略図である。
実施の形態1および実施の形態2では、ソース・ドレイン領域の形成後、基板裏面からレーザ照射を行い、ゲート下にLDD領域を形成した。これに対し本実施の形態では、レーザ照射を基板上方から斜めに照射してレーザアニールを上部から行うものである。
図5は、本願発明の実施の形態5に係る薄膜トランジスタの製造工程を示す概略図である。
実施の形態5では、ソース・ドレイン領域後にレーザを斜めに照射してゲート下の領域にLDD領域を形成した。これに対し本実施の形態では、実施の形態5に加えて下地膜に屈折率の異なる透過性の膜を形成して、上部から照射したレーザの一部を反射させて、アニールの効果を向上させるものである。
図6は、本願発明の実施の形態6に係る薄膜トランジスタの製造工程を示す概略図である。
103 ポリシリコン層
105 ゲート絶縁膜
107 ゲート電極
109 イオン注入
111 ソース・ドレイン領域
113 レーザ照射
115 LDD領域
201 ソース・ドレイン領域
203 レーザ照射
201 LDD領域
301 複数イオン種注入
401 複数イオン種斜め回転注入
501 レーザ照射
503 LDD領域
601 窒化膜
603 酸化膜
605 LDD領域
Claims (5)
- 透明基板上に単一または複数の種類の絶縁膜を積層した下地膜を形成する工程と、前記下地膜の上に半導体層を形成する工程と、前記半導体層の上にゲート絶縁膜を形成する工程と、前記ゲート絶縁膜の上にゲート電極を形成する工程と、前記半導体層に不純物をイオン注入してソース・ドレイン領域を形成する工程と、前記透明基板裏面側からλ=370〜710nmの波長のレーザ光を照射して前記半導体層中の前記不純物イオンを前記ゲート電極下方向へ拡散させる工程とを含んでなる薄膜トランジスタの製造方法。
- 基板上に単一または複数の種類の絶縁膜を積層した下地膜を形成する工程と、前記下地膜の上に半導体層を形成する工程と、前記半導体層の上にゲート絶縁膜を形成する工程と、前記ゲート絶縁膜の上にゲート電極を形成する工程と、前記半導体層に不純物をイオン注入してソース・ドレイン領域を形成する工程と、λ=370〜710nmの波長のレーザ光を、基板を回転させながら上方から斜めに照射して前記半導体層中の前記不純物イオンを前記ゲート電極下方向へ拡散させる工程とを含んでなる薄膜トランジスタの製造方法。
- 前記下地膜を形成する工程は、前記基板上に窒化膜を形成する工程と、前記窒化膜上に酸化膜を形成する工程とを有し、前記窒化膜と前記酸化膜との屈折率の違いから前記レーザ光を前記窒化膜と前記酸化膜との界面で反射させて、薄膜トランジスタのチャネル下の領域にも前記レーザ光を照射することを特徴とする請求項2記載の薄膜トランジスタの製造方法。
- 前記半導体層に注入する前記不純物に、拡散係数の異なる複数のイオン種を用いることを特徴とする請求項1ないし請求項3記載の薄膜トランジスタの製造方法。
- 前記半導体層への前記不純物のイオン注入を、基板を回転させながら斜め方向に行うことを特徴とする請求項1ないし請求項4記載の薄膜トランジスタの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2004230825A JP2006049696A (ja) | 2004-08-06 | 2004-08-06 | 薄膜トランジスタの製造方法 |
TW094126190A TWI277215B (en) | 2004-08-06 | 2005-08-02 | Method of manufacturing thin film transistor |
US11/196,574 US7148091B2 (en) | 2004-08-06 | 2005-08-04 | Method of manufacturing thin film transistor |
KR1020050071595A KR100673564B1 (ko) | 2004-08-06 | 2005-08-05 | 박막 트랜지스터의 제조 방법 |
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JP2004230825A JP2006049696A (ja) | 2004-08-06 | 2004-08-06 | 薄膜トランジスタの製造方法 |
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US (1) | US7148091B2 (ja) |
JP (1) | JP2006049696A (ja) |
KR (1) | KR100673564B1 (ja) |
TW (1) | TWI277215B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10032922B2 (en) | 2014-11-21 | 2018-07-24 | Samsung Display Co., Ltd. | Thin-film transistor with crystallized active layer, method of manufacturing the same, and organic light-emitting display device including the same |
Citations (4)
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JPH0851207A (ja) * | 1994-08-05 | 1996-02-20 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
JPH10154813A (ja) * | 1996-11-21 | 1998-06-09 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタの製造方法および液晶表示装置 |
JPH11168221A (ja) * | 1997-10-02 | 1999-06-22 | Matsushita Electric Ind Co Ltd | トランジスタの製造方法 |
JPH11204800A (ja) * | 1997-11-14 | 1999-07-30 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタ、およびその製造方法、並びに不純物導入装置 |
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JP3293039B2 (ja) | 1991-10-28 | 2002-06-17 | カシオ計算機株式会社 | 薄膜トランジスタの製造方法 |
JP2000091591A (ja) | 1998-09-17 | 2000-03-31 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタ、薄膜トランジスタを用いたc−mosインバータ回路、及びそれらの製造方法 |
JP2000349297A (ja) | 1999-03-10 | 2000-12-15 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタ、パネル及びそれらの製造方法 |
JP2000269133A (ja) | 1999-03-16 | 2000-09-29 | Seiko Epson Corp | 薄膜半導体装置の製造方法 |
US6380044B1 (en) * | 2000-04-12 | 2002-04-30 | Ultratech Stepper, Inc. | High-speed semiconductor transistor and selective absorption process forming same |
JP4290349B2 (ja) | 2000-06-12 | 2009-07-01 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
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- 2005-08-02 TW TW094126190A patent/TWI277215B/zh not_active IP Right Cessation
- 2005-08-04 US US11/196,574 patent/US7148091B2/en not_active Expired - Fee Related
- 2005-08-05 KR KR1020050071595A patent/KR100673564B1/ko not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0851207A (ja) * | 1994-08-05 | 1996-02-20 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
JPH10154813A (ja) * | 1996-11-21 | 1998-06-09 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタの製造方法および液晶表示装置 |
JPH11168221A (ja) * | 1997-10-02 | 1999-06-22 | Matsushita Electric Ind Co Ltd | トランジスタの製造方法 |
JPH11204800A (ja) * | 1997-11-14 | 1999-07-30 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタ、およびその製造方法、並びに不純物導入装置 |
Cited By (1)
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US10032922B2 (en) | 2014-11-21 | 2018-07-24 | Samsung Display Co., Ltd. | Thin-film transistor with crystallized active layer, method of manufacturing the same, and organic light-emitting display device including the same |
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US7148091B2 (en) | 2006-12-12 |
KR100673564B1 (ko) | 2007-01-24 |
KR20060050236A (ko) | 2006-05-19 |
TWI277215B (en) | 2007-03-21 |
US20060030086A1 (en) | 2006-02-09 |
TW200635045A (en) | 2006-10-01 |
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