JP2006046255A - 内燃機関用点火装置 - Google Patents
内燃機関用点火装置 Download PDFInfo
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- JP2006046255A JP2006046255A JP2004230894A JP2004230894A JP2006046255A JP 2006046255 A JP2006046255 A JP 2006046255A JP 2004230894 A JP2004230894 A JP 2004230894A JP 2004230894 A JP2004230894 A JP 2004230894A JP 2006046255 A JP2006046255 A JP 2006046255A
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- Prior art keywords
- control circuit
- ignition
- ignition device
- signal
- gnd
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- 238000002485 combustion reaction Methods 0.000 title claims description 10
- 238000007493 shaping process Methods 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229920005591 polysilicon Polymers 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 238000004804 winding Methods 0.000 description 11
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 7
- 239000007858 starting material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
- F02P3/00—Other installations
- F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
- F02P3/04—Layout of circuits
- F02P3/055—Layout of circuits with protective means to prevent damage to the circuit, e.g. semiconductor devices or the ignition coil
- F02P3/0552—Opening or closing the primary coil circuit with semiconductor devices
- F02P3/0556—Protecting the coil when the engine is stopped
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
- F02P3/00—Other installations
- F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
- F02P3/04—Layout of circuits
- F02P3/055—Layout of circuits with protective means to prevent damage to the circuit, e.g. semiconductor devices or the ignition coil
- F02P3/0552—Opening or closing the primary coil circuit with semiconductor devices
- F02P3/0554—Opening or closing the primary coil circuit with semiconductor devices using digital techniques
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02D—CONTROLLING COMBUSTION ENGINES
- F02D41/00—Electrical control of supply of combustible mixture or its constituents
- F02D41/20—Output circuits, e.g. for controlling currents in command coils
- F02D2041/2068—Output circuits, e.g. for controlling currents in command coils characterised by the circuit design or special circuit elements
- F02D2041/2072—Bridge circuits, i.e. the load being placed in the diagonal of a bridge to be controlled in both directions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Ignition Installations For Internal Combustion Engines (AREA)
Abstract
【解決手段】 制御回路IC3における点火信号が入力される信号線に、互いにバックトゥバック接続された2つのツェナーダイオード11、12を含む保護素子10が備える。このような構成の点火装置によれば、ツェナーダイオードが有する整流作用によって流れようとする電流に対して、2つのツェナーダイオード11、12の内の一方が逆方向となるため、電流が流れない。したがって、制御回路IC3に点火信号を入力するための信号線の電位レベルが誤ったレベルになるという現象が発生することを防止することができる。
【選択図】 図1
Description
以下、本発明の一実施形態が適用された車両用の点火装置について説明する。
本発明の第2実施形態について説明する。本実施形態は、第1実施形態に対して波形整形回路8の構成の一例を示したものであり、その他に関しては第1実施形態と同様であるため、ここでは異なる部分についてのみ説明する。
(1)上記実施形態では、図2に示されるように、保護素子10、制御回路IC3およびスイッチIC2とがそれぞれ別々のチップで構成されたものについて説明した。しかしながら、これは単なる一例であり、必ずしもすべてを別々のチップで構成しなければならない訳ではない。
Claims (7)
- 点火コイル(4)に流されるコイル電流のスイッチングを行う半導体スイッチング素子(5)が備えられたスイッチIC(2)と、
前記スイッチIC(2)における前記半導体スイッチング素子(5)をON、OFF制御するための制御信号を出力する制御回路IC(3)とを備え、
前記制御回路IC(3)に対して点火信号を入力することで、該点火信号に基づいて前記制御回路IC(3)から前記半導体スイッチング素子(5)への制御信号が出力されるように構成された点火装置であって、
前記制御回路IC(3)における前記点火信号が入力される信号線とGNDとの間に、互いにバックトゥバック接続された2つのツェナーダイオード(11、12)を含む保護素子(10)が備えられていることを特徴とする内燃機関用点火装置。 - 前記保護素子(10)が前記制御回路IC(3)と共に1チップとされて一体化されていることを特徴とする請求項1に記載の内燃機関用点火装置。
- 前記保護素子(10)と前記制御回路IC(3)とが別体とされていることを特徴とする請求項1に記載の内燃機関用点火装置。
- 前記スイッチIC(2)と前記制御回路IC(3)とが共に1チップとされて一体化されていることを特徴とする請求項1ないし3のいずれか1つに記載の内燃機関用点火装置。
- 前記スイッチIC(2)と前記制御回路IC(3)とが別体とされていることを特徴とする請求項1ないし3のいずれか1つに記載の点火装置。
- 前記2つのツェナーダイオード(11、12)がポリシリコンPN接合もしくはシリコンへの不純物拡散によるPN接合によって形成されていることを特徴とする請求項1ないし5のいずれか1つに記載の内燃機関用点火装置。
- 前記制御回路IC(3)には、前記点火信号の波形整形を行うための波形整形回路(8)が備えられ、該波形整形回路(8)が前記点火信号をベース電圧として入力する第1PNPトランジスタ(20a)と、前記第1PNPトランジスタ(20a)がONしたときにはOFFされると共にOFFしたときにはONされる第2PNPトランジスタ(20b)とを備えるコンパレータ(20)によって構成されていることを特徴とする請求項1ないし6のいずれか1つに記載の内燃機関用点火装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004230894A JP4360298B2 (ja) | 2004-08-06 | 2004-08-06 | 内燃機関用点火装置 |
US11/194,581 US7131436B2 (en) | 2004-08-06 | 2005-08-02 | Engine ignition system having noise protection circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004230894A JP4360298B2 (ja) | 2004-08-06 | 2004-08-06 | 内燃機関用点火装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006046255A true JP2006046255A (ja) | 2006-02-16 |
JP4360298B2 JP4360298B2 (ja) | 2009-11-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004230894A Expired - Fee Related JP4360298B2 (ja) | 2004-08-06 | 2004-08-06 | 内燃機関用点火装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7131436B2 (ja) |
JP (1) | JP4360298B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014051904A (ja) * | 2012-09-06 | 2014-03-20 | Rohm Co Ltd | 信号検出回路及びイグナイタ |
WO2014171127A1 (ja) * | 2013-04-16 | 2014-10-23 | 株式会社デンソー | 駆動制御回路および内燃機関点火装置 |
JP2016089813A (ja) * | 2014-11-11 | 2016-05-23 | ローム株式会社 | イグナイタおよび車両、イグニッションコイルの制御方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2972197B1 (fr) * | 2011-03-03 | 2013-12-20 | Snf Sas | Produit destine a etre additionne a l'eau d'irrigation de cultures |
US9488151B2 (en) * | 2012-02-08 | 2016-11-08 | Denso Corporation | Ignition system |
US9022010B2 (en) * | 2012-02-08 | 2015-05-05 | Denso Corporation | Ignition system |
KR101540147B1 (ko) * | 2012-10-31 | 2015-07-28 | 삼성전기주식회사 | 오작동 방지 기능이 구비된 전력 모듈 및 그 제어 방법 |
DE102015201167B3 (de) * | 2015-01-23 | 2016-06-23 | Ford Global Technologies, Llc | Zündkerze zum Einleiten einer Verbrennung in einem Zylinder eines Verbrennungsmotors sowie Verfahren zum Betreiben einer derartigen Zündkerze |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US4099998A (en) * | 1975-11-03 | 1978-07-11 | General Electric Company | Method of making zener diodes with selectively variable breakdown voltages |
JPH1077940A (ja) * | 1996-09-03 | 1998-03-24 | Hitachi Ltd | 内燃機関用点火装置 |
JPH10274142A (ja) | 1997-03-31 | 1998-10-13 | Hitachi Ltd | 内燃機関用点火装置 |
US6717412B1 (en) * | 1999-09-24 | 2004-04-06 | Snap-On Technologies, Inc. | Ignition signal pickup interface box |
JP3484123B2 (ja) * | 2000-01-12 | 2004-01-06 | 株式会社日立製作所 | 内燃機関用点火装置 |
JP3917865B2 (ja) * | 2000-05-26 | 2007-05-23 | 株式会社日立製作所 | 内燃機関用点火装置 |
JP2002141507A (ja) * | 2000-10-31 | 2002-05-17 | Mitsubishi Electric Corp | 半導体装置とその製造方法 |
US20020145843A1 (en) * | 2001-04-05 | 2002-10-10 | Parada Aida I | Protection circuit for two-wire electrical devices |
-
2004
- 2004-08-06 JP JP2004230894A patent/JP4360298B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-02 US US11/194,581 patent/US7131436B2/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014051904A (ja) * | 2012-09-06 | 2014-03-20 | Rohm Co Ltd | 信号検出回路及びイグナイタ |
WO2014171127A1 (ja) * | 2013-04-16 | 2014-10-23 | 株式会社デンソー | 駆動制御回路および内燃機関点火装置 |
JP2014208975A (ja) * | 2013-04-16 | 2014-11-06 | 株式会社デンソー | 駆動制御回路および内燃機関点火装置 |
JP2016089813A (ja) * | 2014-11-11 | 2016-05-23 | ローム株式会社 | イグナイタおよび車両、イグニッションコイルの制御方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4360298B2 (ja) | 2009-11-11 |
US7131436B2 (en) | 2006-11-07 |
US20060027220A1 (en) | 2006-02-09 |
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