JP2006041027A - 半導体製造装置およびデバイス製造方法 - Google Patents

半導体製造装置およびデバイス製造方法 Download PDF

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Publication number
JP2006041027A
JP2006041027A JP2004215870A JP2004215870A JP2006041027A JP 2006041027 A JP2006041027 A JP 2006041027A JP 2004215870 A JP2004215870 A JP 2004215870A JP 2004215870 A JP2004215870 A JP 2004215870A JP 2006041027 A JP2006041027 A JP 2006041027A
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Japan
Prior art keywords
pod
substrate
chamber
manufacturing apparatus
semiconductor manufacturing
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Pending
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JP2004215870A
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English (en)
Japanese (ja)
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JP2006041027A5 (cg-RX-API-DMAC7.html
Inventor
Kohei Yamada
幸平 山田
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Canon Inc
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Canon Inc
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Priority to JP2004215870A priority Critical patent/JP2006041027A/ja
Publication of JP2006041027A publication Critical patent/JP2006041027A/ja
Publication of JP2006041027A5 publication Critical patent/JP2006041027A5/ja
Pending legal-status Critical Current

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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2004215870A 2004-07-23 2004-07-23 半導体製造装置およびデバイス製造方法 Pending JP2006041027A (ja)

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JP2004215870A JP2006041027A (ja) 2004-07-23 2004-07-23 半導体製造装置およびデバイス製造方法

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JP2004215870A JP2006041027A (ja) 2004-07-23 2004-07-23 半導体製造装置およびデバイス製造方法

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JP2006041027A true JP2006041027A (ja) 2006-02-09
JP2006041027A5 JP2006041027A5 (cg-RX-API-DMAC7.html) 2007-09-13

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218466A (ja) * 2007-02-28 2008-09-18 Hitachi High-Technologies Corp 試料搬送装置及び方法
KR100911767B1 (ko) 2007-11-15 2009-08-10 (주)티이에스 반도체 제조 라인의 파드 교환장치
WO2009147838A1 (ja) 2008-06-06 2009-12-10 パナソニック株式会社 有機ｅｌディスプレイパネルおよびその製造方法
JP2010212648A (ja) * 2009-02-10 2010-09-24 Muratec Automation Co Ltd 移載装置
JP2012093184A (ja) * 2010-10-26 2012-05-17 Jfe Techno Research Corp 腐食促進試験用噴霧装置
JP2014529914A (ja) * 2011-09-05 2014-11-13 ダイナミックマイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー ベアワークピース保管庫用のコンテナストレージ付加装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242241A (ja) * 1997-02-26 1998-09-11 Canon Inc 半導体製造装置
JP2001022053A (ja) * 1999-07-09 2001-01-26 Nikon Corp 基板収納ケースおよび露光装置
JP2001077173A (ja) * 1999-09-02 2001-03-23 Canon Inc 半導体製造装置およびデバイス製造方法
JP2002329644A (ja) * 2001-05-02 2002-11-15 Seiko Epson Corp 半導体チップの製造方法およびその装置
JP2004157765A (ja) * 2002-11-06 2004-06-03 Tokyo Seimitsu Co Ltd 識別タグを備える半導体ウエハ、マスク、ウエハキャリアおよびマスクキャリアならびにこれらを用いる露光装置および半導体検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242241A (ja) * 1997-02-26 1998-09-11 Canon Inc 半導体製造装置
JP2001022053A (ja) * 1999-07-09 2001-01-26 Nikon Corp 基板収納ケースおよび露光装置
JP2001077173A (ja) * 1999-09-02 2001-03-23 Canon Inc 半導体製造装置およびデバイス製造方法
JP2002329644A (ja) * 2001-05-02 2002-11-15 Seiko Epson Corp 半導体チップの製造方法およびその装置
JP2004157765A (ja) * 2002-11-06 2004-06-03 Tokyo Seimitsu Co Ltd 識別タグを備える半導体ウエハ、マスク、ウエハキャリアおよびマスクキャリアならびにこれらを用いる露光装置および半導体検査装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218466A (ja) * 2007-02-28 2008-09-18 Hitachi High-Technologies Corp 試料搬送装置及び方法
KR100911767B1 (ko) 2007-11-15 2009-08-10 (주)티이에스 반도체 제조 라인의 파드 교환장치
WO2009147838A1 (ja) 2008-06-06 2009-12-10 パナソニック株式会社 有機ｅｌディスプレイパネルおよびその製造方法
US7842947B2 (en) 2008-06-06 2010-11-30 Panasonic Corporation Organic EL display panel and manufacturing method thereof
JP2010212648A (ja) * 2009-02-10 2010-09-24 Muratec Automation Co Ltd 移載装置
JP2012093184A (ja) * 2010-10-26 2012-05-17 Jfe Techno Research Corp 腐食促進試験用噴霧装置
JP2014529914A (ja) * 2011-09-05 2014-11-13 ダイナミックマイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー ベアワークピース保管庫用のコンテナストレージ付加装置
US11049750B2 (en) 2011-09-05 2021-06-29 Brooks Ccs Gmbh Container storage add-on for bare workpiece stocker
US11587816B2 (en) 2011-09-05 2023-02-21 Brooks Automation (Germany) Gmbh Container storage add-on for bare workpiece stocker

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