JP2006040921A - Part mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a part mounting apparatus which can detect the failure state of an electronic component sucked to a suction nozzle accurately. <P>SOLUTION: The part mounting apparatus includes image forming means (16, 17, 20) for sucking the electronic component (22) to the tip of the suction nozzle (14) and performing image formation of images (m, n) of light on the same surface (21) in at least two directions of an electronic component sucked to the tip of the suction nozzle based on placing the sucked electronic component on a printed substrate, imaging means (21, 15-1) for forming image data by imaging the image of each light in which the image formation is performed, and a failure state detection means for detecting the failure state (for example, the failure suction state of the electronic component sucked to the suction nozzle, the state that the electronic component different from the standard to be loaded is sucked to the suction nozzle, and the state that the electronic component is defective, or the like) of the electronic component based on the formed image data. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus that inspects a state of an electronic component when mounting the electronic component on a printed board.

Conventionally, a component mounting device is known as a device for mounting an electronic component on a printed circuit board.
In this component mounting device, the printed circuit board is carried into the component mounting device from the upstream side, and the work robot configured in the component mounting device supplies electronic components to the component mounting device with respect to the loaded printed circuit board. An electronic component is mounted at a predetermined position on the printed circuit board from the component supply device.

  This working robot is configured above the printed circuit board carried into the component mounting apparatus, and is disposed on the Y-axis rail horizontally with respect to the printed circuit board. X-axis rail slidably slid on the axis rail, mounting head support tower slidably slid on the X-axis rail, and ascending and descending in the Z-axis direction while being supported by the mounting head support tower And a mounting head that allows self-rotation around the Z-axis.

  The X-axis rail slides on the Y-axis rail by a positioning mechanism such as a motor or a ball screw, and the mounting head support tower also slides on the X-axis rail by a positioning mechanism having the same configuration as described above. it can. In addition, the mounting head includes an adsorption shaft that is allowed to move up and down in the Z-axis direction and self-rotation around the Z-axis, and can move up and down and self-rotate (rotation in the θ direction) by being driven by a motor. .

  Furthermore, a suction nozzle can be attached to the tip of the suction shaft. When mounting electronic components on a printed circuit board, the suction nozzle is attached to the tip of the suction shaft, and positive pressure or negative pressure is selectively applied to the tip from the pneumatic controller, so that Enables suction and release of parts.

  Each of these motors, air pressure applied to the suction nozzle, or electronic component supply processing in the component supply device is controlled by a computer, and based on a predetermined program, the work robot arbitrarily sets a predetermined path in the XYZ and θ directions. Along with this, the electronic component supplied from the component supply device is sucked at the tip of the suction nozzle at a predetermined timing, and the sucked electronic component is released on the printed circuit board.

  Generally, a component mounting apparatus is provided with a fixed component recognition camera between paths for transporting electronic components from a component supply device to a printed circuit board, and images the electronic components sucked by the suction nozzle from below by the component recognition camera. Then, the suction position of the suction nozzle with respect to the electronic component is analyzed from the captured image, and the mounting position of the electronic component on the printed circuit board is finely adjusted based on the analysis result.

  Furthermore, in order to inspect the suction state (normal suction state or defective suction state (for example, non-suction state or standing state)) of the electronic component with respect to the suction nozzle between the paths for transporting the electronic component from the component supply device to the printed circuit board. The optical sensor is provided. This optical sensor is composed of a light emitting element that irradiates laser light in parallel between the paths and a light receiving element that receives the light, and a position where the lower end of the electronic component normally sucked by the suction nozzle does not hit the laser light. Placed in. Under such a configuration, when the suction state is in the standing state, the lower end of the electronic component is positioned lower than in the normal suction state. Therefore, since the lower end of the standing electronic component blocks the laser light, the standing state of the electronic component can be detected by detecting the change in the light amount based on the blocking by the light receiving element. Note that the optical sensor must be arranged at a position where the laser beam is not blocked in the normal adsorption state, depending on the thickness of the adsorption component. In the non-adsorbed state, naturally, the laser beam is not blocked, so that it is determined as a normal adsorbed state. For this reason, when taking the detection of the non-adsorption state into consideration, the determination direction for determining the non-adsorption state from the value of the vacuum pressure at the tip of the adsorption nozzle must be used together (see Patent Document 1).

As described above, in the component mounting apparatus, it is possible to prevent an electronic component from being erroneously mounted on the printed board by having the above-described inspection mechanism.
JP-A-6-216484 (paragraphs [0010]-[0015], FIGS. 1 and 2)

  As described above, the component mounting apparatus is provided with the optical sensor that detects the suction state of the electronic component. The optical sensor is configured such that a portion of the electronic component positioned below the normal suction when the electronic component is defectively sucked blocks the laser light of the optical sensor, and the thickness of the electronic component is obtained as one-dimensional information. Can do.

  However, there are various types of electronic components handled by the component mounting device, and the thickness of the electronic components naturally changes due to differences in shape and size, and the lowest point of various electronic components is subtle even during normal adsorption. Will be different.

  For this reason, it is difficult to always stably and accurately detect the defective suction state in various electronic components while the optical sensor is fixed at a predetermined position, and the arrangement of the optical sensors is changed according to the type of the electronic component. There was a need.

  In addition, it may be considered to analyze the suction state of the electronic component using a captured image of a component recognition camera for detecting the suction position of the electronic component with respect to the suction nozzle. A tolerance is generated in the width of the component, and for example, a difference between an electronic component in a normal suction state and an electronic component sucked in a state slightly inclined from the normal suction state cannot be detected.

  Therefore, the present invention provides a defective state of the electronic component sucked by the suction nozzle (for example, a defective suction state of the electronic component sucked by the suction nozzle, a state where an electronic component different from the standard to be mounted is sucked by the suction nozzle. An object of the present invention is to provide a component mounting apparatus that can accurately detect a state in which the electronic component is defective.

In order to solve the above problems, the present invention is configured as follows.
One aspect of the component mounting apparatus of the present invention is that an electronic component is adsorbed on the tip of the suction nozzle and the electronic component adsorbed on the tip of the suction nozzle is premised on mounting the sucked electronic component on a printed circuit board. An imaging unit that forms an image of each light in at least two directions of the component on the same plane, an imaging unit that captures the image of each imaged light to generate image data, and the generated image Based on the data, the defective state of the electronic component (for example, the defective suction state of the electronic component sucked by the suction nozzle, the electronic component different from the standard to be mounted is sucked by the suction nozzle, the electronic component is And a defective state detecting means for detecting a non-defective state or the like).

  The imaging means includes an illuminating means for illuminating the electronic component from at least two directions, and a first light of the at least two directional light images of the electronic component that emerges from illumination by the illuminating means. An optical system that forms an image on a predetermined plane, and a second light image of the light images in at least two directions is formed on the predetermined plane via the optical system. It is desirable to have a reflection mirror that reflects the reflected light of the electronic component.

Furthermore, it is desirable that the first light image and the second light image are simultaneously formed at different positions on the predetermined plane.
The predetermined plane is a collection surface of the light receiving regions of the photoelectric conversion elements formed by collecting a plurality of photoelectric conversion elements, and the imaging unit is configured to generate a single light based on the light received by the collection surface. What generates image data is good.

  In another aspect of the component mounting apparatus of the present invention, the suction nozzle that sucks the electronic component is moved to the photographing range of the electronic component of the fixed camera, and the light image of the electronic component is an imaging surface of the fixed camera. Image data is generated from light incident on the imaging surface at a predetermined timing to form an image on the imaging surface, and it is assumed that the electronic component is mounted on a printed circuit board according to the determination result of the image data. The reflected light of the electronic component is formed so that the second light image of the electronic component having a different viewing angle with respect to the electronic component is formed on the imaging surface of the fixed camera at the predetermined timing. A reflection mirror that reflects light at different angles, an imaging unit that generates image data from the two light images formed on the imaging surface at the predetermined timing, and an image generated from the two light images To the data Zui detects a fault condition of the electronic component is configured to have a defective condition detecting means for recovery processing if was poor state.

It is preferable that the two light images are formed at different positions in the imaging surface, and the image data includes information on the two light images.
In addition, when the electronic component is sucked and sucked by the suction nozzle, the reflection mirror is preferably arranged so that information on the tilt is included in the second light image.

  In the present invention, an image of each light in at least two directions of the electronic component is formed on the same plane, and image data is generated based on the formed image of each light. Then, when inspecting the suction state of the electronic component, it is possible to use the image information of light at different viewpoint angles of the electronic component included in the image data.

  Therefore, if the suction state or type of the electronic component sucked by the suction nozzle is defective, it is normal from the image information of the electronic component observed when the electronic component is viewed from one direction (suction Even if it is determined that the state, type, quality, etc. of the electronic component are normal), the above determination is improved from the image information of the electronic component observed when the electronic component is viewed from other directions. It becomes possible to do.

  For example, if the electronic component sucked by the suction nozzle has the same standard as the normal electronic component and its height is different from that of the normal electronic component, the electron observed when viewed from the bottom Even if it is determined that the image information of the component is normal, it can be determined that the type of the electronic component is different from the image information of the electronic component observed when viewed from the side.

  In addition, the image information of the electronic component observed when the electronic component is viewed from one direction indicates an electronic component on a surface that does not include scratches or the like (those that cause problems when mounted on a printed circuit board). If the image information of the electronic component observed when the electronic component is viewed from a direction different from the above direction, even if it is determined from the image information that the product is not defective, Can be judged as defective.

  Further, when the electronic component is sucked and sucked by the suction nozzle, even if the image information of the electronic component observed when the electronic component is viewed from one direction is normal with no tilt, the electronic component Since the image information of the electronic component observed when the component is viewed from a direction different from the above direction includes image information of the defective electronic component having an inclination, the electronic component is in a defective suction state from the image information. It can be judged.

  As described above, according to the present invention, since the image of each light in the plurality of directions of the electronic component sucked by the suction nozzle is converted into image data, the image information of each light in the plurality of directions included in the image data. Thus, the defective state of the electronic component can be detected more accurately than ever.

Therefore, it is possible to greatly suppress the generation of a defective substrate due to the electronic component in a defective state being mounted on the printed circuit board.
Furthermore, the operator's work caused by the occurrence of a defective substrate can be reduced, and the production efficiency can be improved.

  In addition, it is possible to take images of each light in a plurality of directions of the electronic component sucked by the suction nozzle with an existing fixed camera without the need to provide a new camera.

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.
FIG. 1 is an example of a component mounting apparatus according to an embodiment of the present invention.
FIG. 1A is an external perspective view of the component mounting apparatus.

The component mounting apparatus 1 in FIG. 1A is a component mounting apparatus in a state where the upper cover above the base 2 in FIG.
The upper cover (not shown) includes a display device such as a CRT or a liquid crystal on its upper surface. On this display device, an image of an electronic component captured by a component recognition camera (15-1, 15-2), which will be described later, or various setting screens and information indicating the mounting status of the electronic component are displayed. The upper cover is configured with an input device such as a keyboard and a mouse, and various setting inputs on a setting screen displayed on the display device can be performed from the input device. Furthermore, a notification lamp is formed on the upper surface of the upper cover. For example, when an error is detected during component mounting, the notification lamp can be blinked to notify the operator of the error state. Each part is electrically connected to a control device configured inside the base 2 via a signal cable and controlled.

The internal mechanism of the component mounting apparatus 1 can be broadly classified into a work robot, a component supply mechanism, a transport mechanism, and an inspection mechanism.
The conveying mechanism is arranged along the base guide rail 3 extending from the upper left diagonal direction to the lower right diagonal direction in the figure, from the upstream side (left diagonal upper side in the figure) to the downstream side (right diagonal). The printed circuit board 4 is transported while being placed on a transport belt (not shown) in the downward direction. The transport mechanism detects the position of the loaded printed circuit board 4 by sensors (not shown) installed at a plurality of locations on the transport path of the printed circuit board 4, and the printed circuit board 4 is transported directly below the component mounting processing execution position. When this is detected, the lifting table is raised from behind the printed circuit board 4 to fix the position of the printed circuit board 4 to the component mounting processing execution position. Then, when it is detected that the mounting of the electronic component on the printed circuit board 4 is completed, the position fixing is released, and the printed circuit board 4 is discharged downstream. The control of the conveyor belt and the position fixing control are executed by driving a corresponding drive motor (each drive motor will be described later) from the controller via a signal cable.

  The component supply mechanism is simply referred to as a tape cassette type component supply device (generally simply a tape feeder, a cassette type, or a tape component supply device, etc.) on the component supply table 5 formed before and after the base 2. ) 6 is normally mounted in a large number of 50 to 70, and is electrically connected to the control device inside the base 2 so that the electronic components accommodated in the tape cassette type component supply device 6 can be placed at a predetermined timing. It is sent out to the component supply position 7. Note that the timing of supplying the electronic component is controlled by the control device.

  The work robot is configured above the base 2 and carries the electronic components supplied to the component supply position 7 onto the printed circuit board 4. Above the base 2, a pair of left and right fixed rails (Y axis rails) 8 extending in a direction perpendicular to the substrate transport direction (the positive direction of the X axis in the figure) are disposed. . A moving rail (X-axis rail) 9 crosses the two Y-axis rails 8 vertically, and the moving rail (X-axis rail) 9 is slidable along the Y-axis rail 8. The rail 8 is engaged. Further, a mounting head support tower 10 is suspended on the X-axis rail 9 so as to be slidable along the X-axis rail 9. The X-axis rail 9 is engaged with a ball screw inside the Y-axis rail 8 via a nut, and the Y-axis motor 11 shown in FIG. Axial movement is realized. Similarly, each mounting head support tower 10 is engaged with a ball screw inside the X-axis rail 9 via a nut, and is connected to the ball screw via a coupling (not shown). The movement in the X-axis direction in FIG. Each motor is connected to the control device via a signal cable and is driven and controlled. Each motor is provided with an optical encoder, and the movement position in the XY direction of the mounting head support tower 10 that moves by the rotational drive of the motor can be transmitted to the control device.

  FIG. 2B is a schematic diagram of the inside of the mounting head support tower 10. Note that the mounting head support tower 10 in FIG. 7B is constructed so that the interior of the mounting head support tower 10 shown in FIG. Only shown.

  As shown in FIG. 4B, the mounting head support tower 10 further includes a mounting head 12. The mounting head 12 includes a suction shaft 13 that extends in the vertical direction (Z-axis direction in the figure). The suction shaft 13 is configured to be movable up and down in the Z-axis direction of the figure, and is moved up and down by driving a Z-axis drive motor (not shown). Further, the suction shaft 13 is configured to be capable of self-rotation (θ rotation in the figure) about its own axis, and is also self-rotated by driving a θ-axis motor (not shown).

  Furthermore, a suction nozzle 14 that directly sucks an electronic component is attached to the tip of the suction shaft 13. The suction nozzle 14 is selectively attached to the tip of the suction shaft 13 from a suction nozzle exchange base (tool changer) (not shown) in which a plurality of types of suction nozzles are arranged in a replaceable manner. The inside of the suction shaft 13 and the suction nozzle 14 has a hollow structure, and the insides of the suction shaft 13 and the suction nozzle 14 are in communication with each other at the connecting portion. These internal air pressures are controlled by an air pressure control device (not shown), and a positive pressure or a negative pressure is applied to the end portion (suction surface) of the suction nozzle 14. Since the pneumatic control device has a conventional configuration, it will not be particularly described below.

  Further, since the suction nozzle 14 is fixed to the suction shaft 13, when the suction shaft 13 is self-rotating, naturally, the suction nozzle 14 with the tip attached is also self-rotating. The Z-axis drive motor and the θ-axis motor are connected to a control device via a signal cable, and are driven and controlled from this control device.

  The mounting head support tower 10 moves horizontally in the Y-axis direction of the X-axis rail 9 based on the rotational drive of the Y-axis motor 11 and moves in the X-axis direction of the mounting head support tower 10 itself based on the rotational drive of the X-axis motor. The horizontal movement allows the movement to an arbitrary position in the horizontal plane between the component supply position 7 and the printed board 4. Further, if the suction shaft 13 configured in the mounting head support tower 10 is combined with the up-and-down movement in the Z-axis direction and the rotation in the θ direction, it is attached to the tip of the suction shaft 13 or the tip of the suction shaft 13. The end face of the suction nozzle 14 can be freely moved back and forth, left and right and up and down in the movement path between the component supply position 7 and the printed circuit board 4, and the orientation of 360 degrees in the horizontal plane can be adjusted.

  The inspection mechanism is for preventing an installation error when the electronic component sucked at the component supply position 7 (also referred to as a sucked component in this case) is mounted at a predetermined position on the printed circuit board 4. Before the suction component is mounted at a predetermined position on the printed board described in the program in advance, the suction position on the suction component by the end face of the suction nozzle 14 is determined from a predetermined position (for example, the center of the upper surface of the electronic component). How much or how much the suction component is in a defective state (for example, a suction state in which the suction component is sucked or not sucked with respect to the suction surface of the suction nozzle 14). It is inspected whether it is out of the standard to be mounted or whether the suction part is defective.

  This example deals with the case of performing both the above-described misalignment inspection and the above-described suction failure inspection, and generates image data of each image when the suction component is viewed from a plurality of angles, and is configured inside the base 2. The control device performs inspection processing based on the image data.

  In this example, in order to generate the image data of each image, an optical system including a lens such as a convex lens or a plurality of combination lenses and a diaphragm, and light incident through the optical system is converted into an electrical signal. A CCD (Charge Coupled Device), a circuit for performing various processes on the electrical signal, and an illumination device for lifting an image of one part of the suction component imaged on the CCD via the optical system, etc. A component recognition camera 15-1 (or 15-2) is provided. Further, the component recognition camera 15-1 (or 15-2) is connected to a control device inside the base 2 via a signal cable, and the electric signal subjected to the various processes is transmitted via the signal cable. The data is transmitted to the control device, where it is subjected to processing such as conversion into a digital signal by an image processing circuit described later, and image data is generated.

  In addition, the component recognition camera 15-1 (or 15-2) of this example causes an image below the suction component to emerge at this timing and move the image when the suction component is moved to a predetermined position by the work robot. A conventional arrangement is adopted in which the photographing range is arranged on the base 2 so as to be imaged on the CCD via the optical system with the imaging range facing upward (positive direction of the Z axis in the figure).

  As a new configuration, the mounting head support tower is formed so that an image in a direction other than the lower side of the suction component is imaged on the CCD of the component recognition camera 15-1 (or 15-2) to be imaged at the timing. 10, a different direction image forming means is configured.

  The different-direction image imaging means of this example is from a direction different from the illumination device of the component recognition camera 15-1 (or 15-2) in order to raise an image in a direction other than the lower side of the suction component (in this example, An illumination device 16 that illuminates the suction component (in the positive direction of the Y axis) and an image in a direction other than the lower side of the suction component that emerges due to illumination (in this example, the negative direction of the Y axis) It consists of a mirror 17 arranged so as to form an image at the above timing on a CCD configured in the component recognition camera 15-1 (or 15-2).

  The illumination device and the illumination device 16 configured in the component recognition camera 15-1 (or 15-2) are suction components that form an image on the CCD of the component recognition camera 15-1 (or 15-2) to be photographed. For example, a ring-shaped illumination device arranged so as to surround the periphery of the optical path may be applied so as not to block the optical path of the image.

  Whether or not the suction component has reached the timing position by the work robot is configured by information transmitted from encoders provided in various motors of the work robot or at the entrance of the shooting range. It can be estimated by a sensor.

  From the image data generated based on such a configuration, the defect state and the deviation can be detected by performing various image processing in the control device. And, when a defective state is detected, the handling method may be divided according to the defective state, but for example, a recovery process is performed to shift to the teaching process or return to the process of sucking the electronic component to the suction nozzle, In addition, when a shift is detected, the planned mounting position on the printed circuit board can be reset so that a shift does not occur during mounting.

  In the image processing for detecting the defective adsorption, for example, when the image data is subjected to pattern recognition processing on the basis of the shape data of the electronic parts registered in advance in the respective directions and does not match the registered shape data. It can be determined as an error. Further, it is possible to perform image processing on whether or not inclination information (for example, oblique lines) is included in the image data, and to determine that the image is defectively adsorbed if included.

  In the image processing for detecting the displacement, for example, the position information of the suction surface of the suction nozzle 14 transmitted from the encoders provided in the various motors is displayed on the lower image of the suction component generated from the lower image. It is possible to calculate how much the position of the suction surface reflected and reflected on the lower image is shifted from the suction position set in advance in the component mounting apparatus.

  In the above-described example, the two component recognition cameras 15-1 and 15-2 are configured in order to perform the component mounting process smoothly. In the following description, these two component recognition cameras are used for easy understanding. Of these, the component recognition camera 15-1 will be described as a component recognition camera to be imaged. Therefore, it goes without saying that the description of the component recognition camera 15-1 described below can be applied to the component recognition camera 15-2.

FIG. 2 is an explanatory diagram of the arrangement relationship between the mounting head support tower 10 and the component recognition camera 15-1 at the time of photographing the adsorption portion, and the optical path of the image of the adsorption portion in this arrangement.
In the same figure as FIG. 1B, the main components inside the mounting head support tower 10 shown in FIG. 1A are drawn in the direction of A-A '. A part of the internal structure is schematically shown at the position of the component recognition camera 15-1.

Therefore, the same numbers are assigned to the same parts in FIG.
The component recognition camera 15-1 in the figure has an optical system 20 composed of a lens such as a convex lens and a plurality of combination lenses and a diaphragm (not shown), and light incident through the optical system 20 as an electrical signal. A CCD (Charge Coupled Device) 21 to be converted is shown. The CCD 21 is formed by gathering a plurality of photoelectric conversion elements, and a light receiving region made up of them is substantially flat.

  In the figure, a circuit for performing various processes on the electrical signal, an illuminating device for floating an image in one direction of the suction component imaged on the CCD 21 via the optical system 20, A signal cable connected to the control device inside the base 2 is omitted.

  A solid line m in the figure indicates an optical path when an image of light below the suction component 22 in the figure that is lifted by the illumination of the illuminating device is formed on the CCD 21. On the other hand, a broken line n in the figure is an example of an optical path when an image of light on the side of the suction component 22 that is lifted by the illumination device 16 is formed on the CCD 21.

  As can be seen from the optical path m shown in the figure, the arrangement in the figure is a case where the image of the light that emerges when the suction component 22 is illuminated from below is formed at the approximate center of the imaging range of the CCD 21. The central axis of the suction nozzle 14 is positioned approximately at the center of the photographing range in the XY plane by the component recognition camera 15-1. In this arrangement, when the lower surface of the suction portion is irradiated by illumination of a lighting device (not shown) of the component recognition camera 15-1, the reflected light enters from the upper surface of the optical system 20 and passes through the optical system 20. The formed light is imaged in an area near the center in the entire imaging area of the CCD 21.

  At the same time, as can be seen from the optical path n shown in the figure, when the side of the suction component is illuminated from the illumination device 16, the reflected light from the suction component is reflected by the mirror 17, and the light is reflected. Incident from the upper surface of the optical system 20. Then, the light that has passed through the optical system 20 is imaged in an area that is slightly away from the center in the entire imaging area of the CCD 21.

  Note that the imaging positions of the lower image and the side image of the suction component with respect to the imaging area of the CCD 21 are optically determined by the combination of various lenses in the optical system 20 and the angle (φ) adjustment of the mirror 17. Although depending on the distance, if the optical paths as shown in the figure are taken, the respective imaging positions can be prevented from overlapping each other.

Further, the resolution of the component recognition camera only needs to be such that each of the light images formed at different positions on the CCD 21 can be captured by different photoelectric conversion elements.
FIG. 3 is an example of image data generated when the lower image and the side image of the suction component are formed on different imaging regions on the CCD 21.

In this example, as an example of defective suction, an oblique suction state in which an electronic component is sucked and sucked with respect to a suction nozzle will be described.
FIG. 3A shows image data in the normal suction state, and FIG. 3B shows image data in the oblique suction state.

  In the example of the figure, image information 31-1 (or 31-2) of light below the suction component is shown in the center of the image data 30-1 (or 30-2), and light on the side of the suction part is shown on the left side. The image information 32-1 (or 32-2) is shown.

  In the case of the example in the figure, the image information 31-1 and 31-2 of the light below the suction portion shown in the center of each image data 30-1 and 30-2 is actually different in vertical length. However, in the image determination process, since the determination is made taking into account the tolerance, it is difficult to determine the image when the difference is absorbed by the tolerance.

  However, it is obvious when referring to the image information 32-1 and 32-2 on the side of the suction component shown on the left side of the image data 30-1 and 30-2. Since the image information is included in the image data, it is possible to determine that the suction is defective by the inspection by detecting the inclination from the image.

FIG. 4 is a block diagram of the control device.
This control apparatus has a CPU (Central Processing Unit) 40 that controls the entire component mounting apparatus. The CPU 40 includes a ROM 42 that is a read-only memory and a RAM 43 that is a readable / writable memory via a bus 41. An image processing unit 44 that processes a recognized image, a key input unit 45, an I / O control unit 46, and the like are connected.

The ROM 42 stores a program for controlling the above units.
The RAM 43 temporarily stores an area for storing a component mounting program read from an external recording device such as a floppy (registered trademark) disk or a compact disk via the I / O control unit 46, and intermediate data for arithmetic processing. A work area is provided.

  The CPU 40 executes a component mounting process (to be described later) according to the component mounting program read from the RAM 43 while controlling the above-described units based on the control program read from the ROM 42.

  The image processing unit 44 drives the component recognition camera 15 in FIG. 1, converts the captured analog signal into a digital signal, and transfers this to the CPU 20. In the CPU 20, information on the normal state described in the component mounting program (for example, the thickness of the component in the normal suction state) based on the image information of the light in the different directions of the suction component included in the digital signal (image data). If it is determined that it is in a defective state by performing a defective state inspection based on the inclination of the component, the position of the component shown in the captured image, or a shape pattern, or a positional deviation inspection of the suction position on the electronic component, The mounting process is interrupted and the process proceeds to a recovery process. In the case of a positional shift, the position on the printed board on which the suction component is mounted is reset.

The key input unit 45 is connected to an input operation key of the input device, and outputs an operation signal from the outside of the input operation key to the CPU 40.
The I / O control unit 46 drives a lighting device (not shown) configured in the component recognition camera 15-1 of FIG. 1, a driver for driving the lighting device 16 of FIG. Belt drive motor driver, cylinder driver that raises and lowers the lifting table to fix the position of the printed circuit board, each motor driver, sensor for detecting the state and movement position of the printed circuit board and component mounting head, and suction surface of the suction nozzle Various drivers such as a driver for driving various sensors such as a sensor for measuring air pressure, a driver for driving a notification lamp, a driver for driving a display device, and a driver for driving an external storage device are connected.

Next, a component mounting process in the component mounting apparatus will be described with reference to FIG.
When the printed circuit board 4 is carried in from the upstream side of the apparatus 1 by driving the transport belt, the position of the printed circuit board 4 is fixed at a predetermined position. Then, component mounting processing is executed on the printed circuit board 4 in accordance with the mounting order described in the component mounting program and various setting information (also referred to as component master) of the mounted components.

  When the position of the printed circuit board 4 is fixed, first, the drive motors of the X-axis rail 9 and the Y-axis rail 8 are driven to move the mounting head support tower 10 to a tool changer (not shown). Then, the suction shaft 13 is moved up and down by driving the Z-axis drive motor, and the suction nozzle 14 corresponding to the electronic component to be processed is attached to the tip of the suction shaft 13.

  Subsequently, the drive motors of the X-axis rail 9 and the Y-axis rail 8 are driven to move the mounting head support tower 10 to the component supply position 7 of the tape cassette type component supply device 6. Further, the suction shaft 13 is moved downward by driving the Z-axis drive motor, and a negative pressure is applied to the suction surface of the suction nozzle 14 so that the electronic component supplied to the component supply position 7 is sucked by the suction surface of the suction nozzle 14. To do. Then, with the negative pressure applied to the suction surface, the Z-axis drive motor is driven to raise the suction shaft 13, and the suction nozzle 14 is placed in the mounting head support tower 10 (the arrangement shown in FIG. 1B). ).

Subsequently, the drive motors of the X-axis rail 9 and the Y-axis rail 8 are driven, and the component mounting head 10 is moved to the printed circuit board 4 via the component recognition camera 15-1.
When the component mounting head 10 reaches the imaging range of the component recognition camera 15-1, the illumination device 16 and the illumination device (not shown) configured in the component recognition camera 15-1 are driven to move the suction component from below and from the side. Illuminate. The light images of the electronic components in different directions due to the illumination are formed at different positions in the imaging region of the CCD 21, and at this time, the light imaged on the CCD 21 of the component recognition camera 15-1 is converted into an electrical signal. This signal is transmitted to the control device and converted into digital image data. The above displacement inspection and the above-mentioned suction failure inspection are performed by the above-described image processing. If a displacement is found, the mounting position is reset and a suction failure is found. If this happens, perform recovery processing.

  When the component mounting head 10 reaches the component mounting position of the printed circuit board 4 after finishing the above processing, the suction shaft 13 is moved down by driving the Z-axis drive motor, and the suction surface of the suction surface nozzle 14 at the component mounting position. Apply positive pressure to release the suction parts. Then, the suction shaft 13 is moved up by driving the Z-axis drive motor, and the suction nozzle 14 is placed in the mounting head support tower 10 (the arrangement shown in FIG. 1B).

  In the embodiment of the present invention, images of light in at least two directions of the electronic component are formed on the same plane, and image data is generated based on the images of the formed lights. Then, when inspecting the suction state of the electronic component, it is possible to use the image information of light at different viewpoint angles of the electronic component included in the image data.

  Therefore, if the suction state or type of the electronic component sucked by the suction nozzle is defective, it is normal from the image information of the electronic component observed when the electronic component is viewed from one direction (suction Even if it is determined that the state, type, quality, etc. of the electronic component are normal), the above determination is improved from the image information of the electronic component observed when the electronic component is viewed from other directions. It becomes possible to do.

  For example, if the electronic component sucked by the suction nozzle has the same standard as the normal electronic component and its height is different from that of the normal electronic component, the electron observed when viewed from the bottom Even if it is determined that the image information of the component is normal, it can be determined that the type of the electronic component is different from the image information of the electronic component observed when viewed from the side.

  In addition, the image information of the electronic component observed when the electronic component is viewed from one direction indicates an electronic component on a surface that does not include scratches or the like (those that cause problems when mounted on a printed circuit board). If the image information of the electronic component observed when the electronic component is viewed from a direction different from the above direction, even if it is determined from the image information that the product is not defective, Can be judged as defective.

  Further, when the electronic component is sucked and sucked by the suction nozzle, even if the image information of the electronic component observed when the electronic component is viewed from one direction is normal with no tilt, the electronic component Since the image information of the electronic component observed when the component is viewed from a direction different from the above direction includes image information of the defective electronic component having an inclination, the electronic component is in a defective suction state from the image information. It can be judged.

  As described above, according to the embodiment of the present invention, since the image of each light in the plurality of directions of the electronic component sucked by the suction nozzle is converted into image data, each light in the plurality of directions included in the image data is converted. It is possible to detect the defective state of the electronic component more accurately than ever from the image information.

Therefore, it is possible to greatly suppress the generation of a defective substrate due to the electronic component in a defective state being mounted on the printed circuit board.
Furthermore, the operator's work caused by the occurrence of a defective substrate can be reduced, and the production efficiency can be improved.

  In addition, it is possible to take images of each light in a plurality of directions of the electronic component sucked by the suction nozzle with an existing fixed camera without the need to provide a new camera.

It is an example of the component mounting apparatus which is embodiment of this invention. It is explanatory drawing of the arrangement | positioning relationship of the mounting head support tower 10 at the time of adsorption | suction component imaging | photography, and the component recognition camera 15-1, and the optical path of the image of the adsorption | suction component in this arrangement | positioning. It is an example of the image data produced | generated from the image of the light of a suction component in a different direction. It is a block diagram of the control apparatus of this component mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Mount head support tower 12 Mount head 13 Suction shaft 14 Suction nozzle 15-1 Component recognition camera 16 Illumination device 17 Reflection mirror 20 Optical system 21 CCD
22 Adsorption parts

Claims (7)

A component mounting device that adsorbs an electronic component to the tip of a suction nozzle and mounts the adsorbed electronic component on a printed circuit board,
Imaging means for forming images of light in at least two directions of the electronic component sucked at the tip of the suction nozzle on the same plane;
Imaging means for capturing the image of each imaged light to generate image data;
A defective state detecting means for detecting a defective suction state of the electronic component based on the generated image data;
A component mounting apparatus characterized by comprising: The imaging means is
Illuminating means for illuminating the electronic component from at least two directions;
An optical system that forms a first light image on the predetermined plane of the image of the light in the at least two directions of the electronic component that emerges from illumination by the illumination means;
A reflection mirror that reflects the reflected light of the electronic component so that a second light image of the light images in at least two directions is formed on the predetermined plane via the optical system;
Having
The component mounting apparatus according to claim 1. The first light image and the second light image are simultaneously formed at different positions on the predetermined plane;
The component mounting apparatus according to claim 2. The predetermined plane is a collection surface of light receiving regions of the photoelectric conversion elements formed by a plurality of photoelectric conversion elements gathered,
The imaging means generates a single image data based on the light received by the collecting surface;
The component mounting apparatus according to claim 2 or 3, wherein The suction nozzle that sucks the electronic component is moved to the imaging range of the electronic component of the fixed camera, and the light image of the electronic component is incident on the imaging surface at a predetermined timing when the image is formed on the imaging surface of the fixed camera. A component mounting device that generates image data from light and mounts the electronic component on a printed circuit board according to a determination result of the image data,
The second light image of the electronic component having a different viewing angle with respect to the electronic component from the image of the light imaged on the imaging surface is formed on the imaging surface of the fixed camera at the predetermined timing. A reflection mirror that reflects the reflected light of the electronic component to a different angle;
An imaging unit that generates image data from the two light images formed on the imaging surface at the predetermined timing;
Defective state detecting means for detecting a defective state of the electronic component based on image data generated from the two light images and performing a recovery process when the electronic component is in a defective state;
A component mounting apparatus characterized by comprising: The two light images are formed at different positions in the imaging surface,
The image data includes information on the two light images, respectively.
The component mounting apparatus according to claim 5. When the electronic component is sucked and sucked by the sucking nozzle, the reflecting mirror is arranged so that the tilt information is included in the second light image.
The component mounting device according to claim 2, wherein the component mounting device is a component mounting device.

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