JP2006032684A - Heat dissipation cabinet for electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation cabinet for electronic equipment capable of cooling efficiently an electronic component having heat generating property. <P>SOLUTION: The heat dissipation cabinet 10 for electronic equipment is formed so as to have the shape of a box and receive the heat generating electronic component 12 therein while having a heat dissipating member 15 for dissipating heat from the electronic component 12 to the outside thereof. In the cabinet, a box body 27 is formed of a heat insulating member, and a heat dissipating member 15 is provided so as to be projected from the electronic component 12 to the upper part of the box body 27, and resin 28 has a heat conductivity higher than that of the box body 27 excluding the heat dissipating member 15 and provided with electric insulating property, and is filled into the box body 27. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat radiating casing of an electronic device for releasing heat from an exothermic electronic component.

  2. Description of the Related Art Conventionally, in an electronic device using an electronic component with a large amount of heat, such as an LD (laser diode) or an IC (integrated circuit), a heat radiating device is used to release heat from the electronic component.

  In a case having a heat dissipation structure in the prior art, a plurality of heat dissipation fins called heat sinks are formed outside the case. Further, the heat-generating electronic component is placed in close contact with the inner surface of the casing, or silicon oil having a high thermal conductivity is applied between the electronic component and the inner surface of the casing.

  As described above, the conventional technology has a structure in which heat generated from the electronic component is transmitted to the inner surface of the casing and radiated from the radiation fins formed outside the casing.

  The prior art document information related to the invention of this application includes the following.

JP-A-3-108364 Japanese National Patent Publication No. 8-508611

  However, in the heat radiating device having the structure of the prior art, the casing is made of one kind of metal material having high thermal conductivity such as aluminum alloy. For this reason, when the ambient environment temperature becomes high, the temperature of the entire casing also rises, and the characteristics of the electronic components inside the casing are deteriorated by heat. At this time, the electronic components inside the casing are hotter than the casing surface. When this casing is cooled by a fan or the like, it is necessary to cool the entire casing, which causes a problem that the entire apparatus becomes large.

  Further, there has been a problem that a temperature distribution due to air convection is generated inside the casing due to a change in ambient temperature.

  Accordingly, an object of the present invention is to provide a heat dissipating housing for an electronic device that can solve the problems of the prior art and efficiently cool the heat-generating electronic components.

  The present invention has been devised to achieve the above object, and the first invention is formed in a box shape, in which an exothermic electronic component is accommodated and heat from the electronic component is stored. In a heat radiating housing of an electronic device having a heat radiating member that radiates heat to the outside, a box is formed of a heat insulating member, and a heat radiating member is provided so as to protrude above the box from the electronic component. This is a heat radiating casing of an electronic device that is filled with a resin having a higher thermal conductivity than that of the box, excluding the heat radiating member, and having an electrical insulating property.

  According to a second aspect of the present invention, the heat dissipation member includes a contact portion provided so as to contact the electronic component via silicon oil in the box, and a plurality of heat dissipation fins extending from the contact portion to the upper surface of the box. It will be.

  3rd invention forms the said box with the heat insulation member which has electroconductivity.

  According to a fourth aspect of the present invention, a first through hole for injecting the resin into the box and a second through hole for allowing air inside the box to escape outside the box are formed on the upper surface of the box. It is what is done.

  ADVANTAGE OF THE INVENTION According to this invention, the thermal radiation housing | casing of the electronic device which can cool an exothermic electronic component efficiently can be obtained.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings.

  FIG. 1 is a cutaway perspective view of a heat dissipating casing of an electronic apparatus showing a preferred embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG.

As shown in the drawing, an exothermic electronic component 12 is provided on the circuit board 11. The circuit board 11 is accommodated inside a box 27 formed in a box shape.
The box 27 is formed of a heat insulating member having conductivity and having a thermal conductivity much lower than that of a heat radiating member described later, such as a conductive plastic material.

  For example, silicon oil 23 is applied to the upper surface of the electronic component 12 as a thermally conductive material having high thermal conductivity.

  On the upper surface of the electronic component 12 to which the silicon oil 23 is applied, a heat radiating member 15 is provided so as to protrude from the electronic component 12 above the box body 27.

  The heat radiating member 15 includes a contact portion 15b made of a rectangular parallelepiped member, and a heat sink 15s provided with a plurality of heat radiating fins extending in parallel upward from the upper surface of the contact portion 15b. It is made of a material with high conductivity.

  An opening for penetrating the heat radiating member 15 is provided on the upper surface of the box body 27, and a first through hole 29 a for penetrating the inside and outside of the box body 27 and filling the resin inside the box body 27, and a box A second through hole 29b is provided for penetrating the inside and outside of the body 27 and allowing the air inside the box body 27 to escape to the outside of the box body 27.

  The resin 28 filled in the box 27 is made of a material having high thermal conductivity and electrical insulation, low expansion coefficient due to moisture absorption or the like, and small curing shrinkage, and is liquid when injected into the box 27. Cure after filling.

  The inside of the box 27 is filled with the resin 28 without any gaps except for the heat dissipation member 15. Thereafter, the first through hole 29a and the second through hole 29b may be closed or covered with the heat insulating material used for the box 27 or the like.

  In this way, the heat-radiating casing 10 of the electronic device having the structure in which the heat-generating electronic component 12 is accommodated in the box 27 and the heat-radiating member 15 that dissipates heat from the electronic component 12 is provided.

  Although not shown, the box 27 is provided with a connector for connecting the inside and outside of the box 27 as necessary.

  Next, the effect | action of the thermal radiation housing | casing 10 of an electronic device is demonstrated.

  Most of the heat generated from the electronic component 12 is transmitted to the contact portion 15b of the heat radiating member 15 through the silicon oil 23, is thermally conducted from the contact portion 15b to the heat sink 15s, and is radiated from the heat sink 15s.

  As described above, the heat radiating housing 10 has a structure in which heat is radiated intensively to the outside of the box body 27 via the heat sink 15s, so that the entire heat radiating housing 10 is cooled by intensively cooling only the heat sink 15s. As a result, the cooling device can be downsized.

  Further, heat generated from the heat-generating electronic component 12 that has not been conducted to the heat dissipation member 15 and heat generated from other electronic components (not shown) on the circuit board 11 are filled in the box 27. Similarly, a part of the heat conducted to the contact portion 15b is also transferred to the resin 28 from the portion where the contact portion 15b and the resin 28 are in contact with each other.

  Since the resin 28 filled in the box 27 has a higher thermal conductivity than that of the box 27, the heat in the box 27 is evenly distributed. The temperature distribution does not occur due to the convection.

  Further, the thermal insulation effect of the box body 27 is not affected by the ambient environment temperature, and the temperature distribution can be prevented from being formed inside the box body 27.

  Further, in the prior art, when the ambient environment temperature where the electronic device is placed becomes high, if the material of the heat radiating housing 10 is one kind of material having high thermal conductivity as in the past, the inside of the heat radiating housing 10 When the ambient environment temperature where the electronic device is placed becomes low, the heat radiating housing 10 is made of one material having high thermal conductivity as in the prior art. The temperature inside the casing 10 was low.

  On the other hand, in the present embodiment, the heat radiating housing 10 includes a heat radiating member 15 formed of a material having high thermal conductivity and a heat-insulating box 27, and the box 27 is disposed inside the heat radiating member 15. The structure is such that the outside is thermally shielded and is not affected by the ambient temperature inside and outside, and the temperature inside the box 27 is made uniform by the resin 28 even with respect to the change in ambient temperature transmitted from the heat sink 15s. The temperature change inside the box 27 can be suppressed even when the ambient environment temperature becomes high or low.

  As a modification of the present invention, a cooling structure using a Peltier element instead of a heat sink can also provide efficient heat dissipation and a uniform temperature inside the heat dissipation housing, as in this embodiment.

  As described above, according to the present invention, in the heat radiating housing structure of an electronic device using a heat-generating electronic component, heat can be efficiently radiated from the heat radiating member, and the cooling device can be downsized. The heat generated from can be efficiently radiated.

  Further, the resin filled in the heat radiating case can suppress the temperature distribution inside the heat radiating case and make the temperature inside the heat radiating case uniform.

  Furthermore, by forming the box with a heat insulating member, even when the ambient environment temperature changes, the inside of the heat dissipation casing is not affected by the change in temperature, and the temperature inside the heat dissipation casing can be stabilized.

It is a fractured perspective view which shows the thermal radiation housing | casing of the electronic device which is embodiment of this invention. It is the sectional view on the AA line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Heat radiation | emission housing | casing 11 Circuit board 12 Electronic component 15 Heat radiation member 15b Contact part 15s Heat sink 23 Silicon oil 27 Box 28 Resin 29a 1st through-hole (through hole for resin injection | pouring)
29b Second through hole (through hole for air vent)

Claims (4)

  Formed in a box shape, heat-generating electronic components are housed inside, and in a heat radiating housing of an electronic device having a heat radiating member that radiates heat from the electronic components to the outside, the box is formed of a heat insulating member And a heat dissipating member is provided so as to protrude above the box from the electronic component, and a resin having a higher thermal conductivity than the box excluding the heat dissipating member and having an electrical insulating property is provided in the box. A heat dissipating housing for electronic equipment, characterized by being filled.   The said heat radiating member consists of a contact part provided so that the said electronic component and silicon oil may be contacted in a box through a silicone oil, and several radiating fin extended from the contact part to the box upper surface. Heat dissipation housing for electronic equipment.   The heat dissipating case of the electronic device according to claim 1, wherein the box is formed of a heat insulating member having conductivity. The 1st through-hole for inject | pouring the said resin into a box and the 2nd through-hole for releasing the air in a box outside a box are formed in the upper surface of a box. 4. A heat dissipating housing for an electronic device according to any one of 4 above.

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