JP2005106381A - Electronic cooling unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic cooling unit for cooling a heat generating body such as a CPU that is thin and highly efficient. <P>SOLUTION: This electronic cooling unit comprises a thermoelectric converting device 12 having a heat absorbing surface 12a and a heat radiation surface 12b, a heat radiator 13 thermally connected to the heat radiation surface 12b, a cooling block 14 thermally connected to the heat absorbing surface 12a, and a plurality of fins 20 provided on a connection surface of the heat radiator 13 to the thermoelectric converting device 12. The fins 20 are thus provided on the side of the thermoelectric converting device 12. The area of the fins 20 on the side of the heat radiation surface 12b can thus be enlarged without changing the thickness of the electronic cooling unit. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic cooling unit that cools a device or a semiconductor including a heating element such as a computer by using a thermoelectric conversion device that functions by a Peltier effect or a thermoelectron tunnel effect.

  In recent years, electronic cooling units using thermoelectric conversion devices that function by the Peltier effect have been used.

  A conventional electronic cooling unit has a heat sink fixed on the heat dissipation side of the thermoelectric conversion device, and an electric fan that forcibly air-cools the heat sink, a heat conduction plate provided on the cooling side of the thermoelectric conversion device, a thermoelectric conversion device, and a heat There is a thermal insulating frame provided around the conductive plate to cool the CPU from the thermal conductive plate (for example, see Patent Document 1).

  The conventional electronic cooling unit will be described below with reference to the drawings.

  FIG. 11 is a cross-sectional view of a conventional electronic cooling unit. As shown in FIG. 11, in the conventional electronic cooling unit, a heat sink 2 and an electric fan 3 that forcibly cools the heat sink are fixed to the heat radiation side of the thermoelectric conversion device 1. The heat sink 2 is provided with fins 2 a on the side opposite to the contact surface with the thermoelectric conversion device 1. A heat insulating frame 4 is provided around the heat conduction plate 4 provided on the cooling side of the thermoelectric conversion device 1 and the thermoelectric conversion device 1 and the heat conduction plate 5.

  The operation of the electronic cooling unit configured as described above will be described below.

First, when the thermoelectric conversion device 1 is energized, the endothermic surface 1a is cooled and the CPU 6 is cooled. On the other hand, heat is generated on the heat radiating surface 1 b, the heat is transmitted to the heat sink 2, and forced air cooling is performed by blowing air from the electric fan 3. Thereby, the heat generated by the CPU 6 can be dissipated and the temperature rise of the CPU 6 can be prevented.
JP 2002-76219 A

  However, the above-described conventional configuration has a drawback in that it cannot be thinned by maintaining or improving the cooling capability such as mounting on a notebook computer.

  Furthermore, when the rotational speed of the electric fan 3 is increased in order to supplement the heat dissipation capability, there is a drawback that noise from the electric fan 3 increases.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic cooling unit that solves the conventional problems and is thin with a very simple structure and can reduce fan noise.

  Further, since the heat insulating frame 4 is not sealed, the heat absorption loss from the connection surface between the heat insulating frame 4 and the heat conducting plate 5 is large, and not only the cooling capacity is lowered, but also moisture from the outside enters the thermoelectric conversion. There is a drawback that the lifetime of the device 1 is shortened and the reliability is low.

  Another object of the present invention is to provide a highly reliable electronic cooling unit.

  The present invention provides a thermoelectric conversion device having a heat absorption surface and a heat dissipation surface, a radiator thermally connected to the heat dissipation surface, a cooling block thermally connected to the heat absorption surface, and the thermoelectric of the radiator. An electronic cooling unit comprising a plurality of fins provided on a connection surface with the conversion device, and the fin is provided on the thermoelectric conversion device side. The area on the heat radiating surface side can be increased without changing the thickness.

  The present invention also relates to a thermoelectric conversion device having a heat absorption surface and a heat dissipation surface, a radiator thermally connected to the heat dissipation surface, a cooling block thermally connected to the heat absorption surface, and the radiator. The electronic cooling unit is characterized in that a plurality of fins and a fan are provided in parallel on the thermoelectric conversion device connection surface, and the fin is provided on the thermoelectric conversion device side. By increasing the area of the fin on the heat radiating surface side without changing the thickness, the heat radiating capability can be improved. Further, by cooling the fin with the fan, the heat radiating capability can be further increased.

  As described above, the electronic cooling unit of the present invention includes a thermoelectric conversion device having a heat absorption surface and a heat dissipation surface, a radiator thermally connected to the heat dissipation surface, and a cooling thermally connected to the heat absorption surface. An electronic cooling unit comprising a block and a plurality of fins provided on a connection surface between the radiator and the thermoelectric conversion device, and thereby the fin is provided on the thermoelectric conversion device side Therefore, the area on the heat radiation surface side can be increased without changing the thickness of the electronic cooling unit.

  Also, a thermoelectric conversion device having an endothermic surface and a heat dissipation surface, a radiator thermally connected to the heat dissipation surface, a cooling block thermally connected to the heat absorption surface, and a thermoelectric conversion device connection of the radiator The electronic cooling unit is characterized in that a plurality of fins and a fan are provided in parallel on the surface, and the fin is provided on the thermoelectric conversion device side, so that the thickness of the electronic cooling unit is not changed. By increasing the area of the fin on the heat dissipation surface side, the heat dissipation capability can be improved, and further, by cooling the fin with the fan, the heat dissipation capability can be further increased.

  The invention according to claim 1 of the present invention includes a thermoelectric conversion device having a heat absorbing surface and a heat radiating surface, a radiator thermally connected to the heat radiating surface, and a cooling block thermally connected to the heat absorbing surface. And a plurality of fins provided on the connection surface of the radiator with the thermoelectric conversion device, whereby the fin is provided on the thermoelectric conversion device side. Therefore, the area on the heat radiation surface side can be increased without changing the thickness of the electronic cooling unit.

  The invention according to claim 2 is a thermoelectric conversion device having a heat absorption surface and a heat dissipation surface, a radiator thermally connected to the heat dissipation surface, a cooling block thermally connected to the heat absorption surface, An electronic cooling unit characterized in that a plurality of fins and a fan are provided in parallel on the thermoelectric conversion device connection surface of the radiator, and the structure is such that the fins are provided on the thermoelectric conversion device side. The heat radiation capability can be improved by increasing the area of the fin on the heat radiation surface side without changing the thickness of the cooling unit, and the heat radiation capability can be further enhanced by cooling the fin with the fan.

The invention according to claim 3 is the electronic cooling unit according to claim 2, wherein a through-hole for sucking air is provided in a portion facing or close to the fan in the radiator. Thus, by providing the fan openings on both the cooling surface side and the radiator side, the opening area can be increased, the fan air volume is improved, and the heat dissipation capacity of the fins is increased. Can do.

  The invention according to claim 4 is characterized in that a plurality of fins are provided on the side opposite to the thermoelectric conversion device connection surface of the radiator. It is a cooling unit, and by providing the fins on both sides of the radiator, increasing the heat dissipation area can increase the heat dissipation capability.

  The present invention described in claim 5 is provided with a frame body that accommodates most of the cooling block and the thermoelectric conversion device so that the object connection surface of the cooling block is exposed. It is an electronic cooling unit as described in any one of Claims 1-4, and this can make a cooling efficiency high by preventing the thermal absorption from other than an unnecessary cooling surface.

  The present invention described in claim 6 is characterized in that the radiator is held by the frame, and the cooling block and the thermoelectric conversion device are housed in a space surrounded by the radiator and the frame. The electronic cooling unit according to claim 5, wherein the electronic cooling unit can be strengthened.

  According to a seventh aspect of the present invention, in the electronic cooling unit according to the sixth aspect, a sealing body that seals a gap between the radiator and the frame is provided between the radiator and the frame. With this, the confidentiality of the electronic cooling unit can be improved, moisture corrosion of the thermoelectric conversion device can be prevented, and the reliability can be improved.

  The present invention described in claim 8 is the electronic cooling unit according to claim 7, wherein a gap is provided between the frame and the cooling block, whereby the heat insulation between the frame and the cooling block. While improving performance, the freedom degree of a thermoelectric conversion device or a cooling block can be raised, the thermal stress which arises in a thermoelectric conversion device can be absorbed, and reliability can be improved.

  According to the ninth aspect of the present invention, an elastic body that seals a gap between the cooling block and the frame body and biases the cooling block toward the thermoelectric conversion device is provided between the cooling block and the frame body. 9. The electronic cooling unit according to claim 8, wherein the degree of freedom of the thermoelectric conversion device and the cooling block can be increased, and the cooling force can be stabilized by keeping the pressure applied to each contact portion constant.

  A tenth aspect of the present invention is the electronic cooling unit according to any one of the first to ninth aspects, wherein a fluid is sealed inside the cooling block, and the cooling is performed by convection of the fluid. Heat conduction in the block can be promoted and cooling efficiency can be increased.

  The eleventh aspect of the present invention is the electronic cooling unit according to the tenth aspect of the present invention, wherein the fluid is sealed in the cooling block by a heat pipe, thereby facilitating the sealing of the fluid. Can do.

  The present invention according to claim 12 is the electronic cooling unit according to any one of claims 1 to 11, wherein a fluid is sealed inside the radiator, and heat is dissipated by convection of the fluid. Heat conduction on the surface can be promoted, and heat dissipation efficiency can be increased.

  The present invention according to claim 13 is the electronic cooling unit according to claim 12, wherein the fluid is sealed in the radiator by a heat pipe, thereby facilitating the sealing of the fluid. Can do.

  Embodiments of an electronic cooling unit according to the present invention will be described below with reference to the drawings. In addition, about the same structure as the past, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

(Embodiment 1)
FIG. 1 is a cross-sectional view of an electronic cooling unit according to Embodiment 1 of the present invention. FIG. 2 is a bottom view of the frame of FIG.

  1 and 2, when a direct current is passed through the thermoelectric conversion device 12, the heat absorbing surface 12a is cooled by the Peltier effect, and the heat radiating surface 12b is heated. The cooling block 14 is in close contact with the heat absorption surface 12 b of the thermoelectric conversion device 12, and the radiator 13 is in close contact with the heat dissipation surface 12 b of the thermoelectric conversion device 12. A plurality of fins 20 are provided on the connection surface of the radiator 13 with the thermoelectric conversion device 12.

  Here, the radiator 13 may have a structure in which the thermoelectric conversion device 12 is provided near the center of the radiator 13 and the plurality of fins 20 are provided on both sides of the thermoelectric conversion device 12 side. The cooling surface 15 is provided so as to protrude from the periphery on the side facing the connection surface of the cooling block 14 to which the thermoelectric conversion device 12 and the cooling block 14 are connected. The frame 16 is held with the radiator 13. In addition, the frame 16 forms a space with the radiator 13 and encloses the thermoelectric conversion device 12 and the cooling block 14 therein, and the frame 16 is provided with an opening 16a from which the cooling surface 15 is exposed. doing.

  The heat pipe 17 a is inserted into the cooling block 14 and extends to the vicinity of the cooling surface 15. The heat pipe 17b is inserted into the radiator 13 and extends to the vicinity of the connection surface between the thermoelectric conversion device 12 and the heat radiation surface 12b. Sealing bodies 18 a and 18 b are provided between the heat radiator 13 and the frame body 16 to seal a gap between the heat radiator 13 and the frame body 16. Specifically, a sealing material, an O-ring, or the like can be used for the sealing bodies 18a and 18b.

  An elastic body 19a that seals the periphery of the cooling surface 15 exposed in the gap between the cooling block 14 and the frame body 16 between the cooling block 14 and the frame body 16 and biases the cooling block 14 toward the thermoelectric conversion device 12 side. , 19b. Specifically, springs or O-rings can be used for the elastic bodies 19a and 19b.

  An example in the case of using for cooling the apparatus provided with the CPU of the electronic cooling unit configured as described above is shown in FIG.

  In FIG. 3, a core heat generating portion 8 is provided on the top surface of the processor 7, and a terminal group 9 is provided on the bottom surface of the processor 7. The processor 7, the core heat generating unit 8, and the terminal group 9 are also referred to as a CPU 6. A terminal group 9 of the processor 7 is attached to a socket 10 provided on the circuit board 10. These are the same as those in FIG.

  Then, the heat absorption surface 12 a is cooled by the Peltier effect generated by applying a direct current to the thermoelectric conversion device 12, and the processor 7 is cooled via the cooling surface 15 through the cooling block 14 and the heat pipe 17 a. Further, when cooled by the Peltier effect, the heat radiating surface 12b generates heat and is radiated from the plurality of fins 20 from the radiator 13 via the heat pipe 17b.

  Therefore, the radiator 13 includes a plurality of fins 20 on the connection surface with the thermoelectric conversion device 12, so that even if the amount of heat of the CPU 6 increases, the area of the fins 20 on the heat dissipation surface side increases according to the cooling capacity. it can. Further, by providing the plurality of fins 20, the structure can be thinned without reducing the cooling capacity.

  Also, by providing the sealing bodies 18a and 18b and the elastic bodies 19a and 19b, moisture from the outside is blocked, and corrosion of the thermoelectric conversion device 12 due to moisture can be prevented, and a highly reliable electronic cooling unit is provided. Can do.

  As described above, the electronic cooling unit of the present embodiment includes the thermoelectric conversion device 12 having the heat absorbing surface 12a and the heat radiating surface 12b, the radiator 13 thermally connected to the heat radiating surface 12b, and the heat absorbing surface 12a. And a plurality of fins 20 provided on the connection surface of the radiator 13 to the thermoelectric conversion device 12, and the plurality of fins 20 are provided on the connection surface of the radiator 13 to the thermoelectric conversion device 12. By providing this, the area of the heat radiation surface can be increased without changing the thickness of the electronic cooling unit.

  In addition, since the frame body that substantially includes the cooling block 14 is provided and the cooling surface 15 is exposed from the frame body 16, heat absorption from other than the unnecessary cooling surface can be prevented, and the cooling efficiency can be increased.

  Moreover, the radiator 13 is hold | maintained at the frame 16, and the thermoelectric conversion device with the cooling block 14 is included in the space enclosed by the radiator 13 and the frame 16, and an electronic cooling unit can be strengthened.

  Moreover, by enclosing the fluid in the cooling block 14, heat conduction in the cooling block 14 can be promoted by convection of the fluid, and the cooling efficiency can be increased.

  Further, since the fluid is enclosed in the cooling block 14 by the heat pipe 17a, the heat conduction in the cooling block 14 is promoted by the convection of the fluid to enhance the cooling efficiency and the fluid is sealed by using the heat pipe 17a. Easy to do.

  Moreover, by enclosing the fluid inside the radiator 13, heat conduction in the radiator 13 can be promoted by convection of the fluid, and the heat radiation efficiency can be increased.

  Further, since the fluid is enclosed in the radiator 13 by the heat pipe 17b, the heat conduction in the radiator 13 is promoted by the convection of the fluid to enhance the heat radiation efficiency, and the fluid is sealed by using the heat pipe 17b. Easy to do.

  Further, by providing a sealing body 18 that seals a gap between the radiator 13 and the frame body 16 between the radiator 13 and the frame body 16, the confidentiality of the electronic cooling unit is increased, and the moisture of the thermoelectric conversion device 12 is increased. Corrosion can be prevented and reliability can be improved.

  Moreover, while providing the clearance gap between the frame 16 and the cooling block 14, the heat insulation performance between the frame 16 and the cooling block 14 is improved, and the freedom degree of the thermoelectric conversion device 12 and the cooling block 14 is raised, and the thermoelectric conversion device The thermal stress generated in the heat sink 12 can be absorbed and the reliability can be improved.

  Further, between the cooling block 14 and the frame body 16, the periphery of the cooling surface 15 exposed by the gap between the cooling block 14 and the frame body 16 is sealed, and the elasticity that urges the cooling block 14 toward the thermoelectric conversion device 12 side. By providing the bodies 19a and 19b, the degree of freedom of the thermoelectric conversion device 12 and the cooling block 14 can be increased, and the cooling ability can be stabilized by keeping the pressure of each contact portion constant.

  Moreover, in Embodiment 1, although the fluid was enclosed in the inside of the cooling block 14, as shown in FIG. 4, it is not necessary to enclose the fluid.

Moreover, in Embodiment 1, although the fluid was enclosed in the inside of the heat radiator 13, it is not necessary to enclose the fluid as shown in FIG. 5. Moreover, in Embodiment 1, the thermoelectric conversion device 12 utilizes the Peltier effect. It is needless to say that other effects such as thermionic tunnel effect may be used.

(Embodiment 2)
FIG. 6 is a sectional view of an electronic cooling unit according to Embodiment 2 of the present invention. FIG. 7 is a perspective view of the electronic cooling unit of FIG.

  6 and 7, a plurality of fins 20 and a fan 21 are provided in parallel on the connection surface of the radiator 13 with the thermoelectric conversion device 12. Here, the radiator 13 may have a structure in which the thermoelectric conversion device 12 is provided near the center of the radiator 13 and the fins 20 and the fans 21 are provided on both sides of the thermoelectric conversion device 12 side. Further, the structure may be such that the fins 20 are provided on both sides and the fan 21 is provided on one side.

  The operation of the electronic cooling unit configured as described above will be described below.

  The endothermic surface 12a is cooled by the Peltier effect generated by flowing a direct current through the thermoelectric conversion device 12, and the cooling surface 15 is cooled through the cooling block 14 and the heat pipe 17a. On the other hand, when cooled by the Peltier effect, the heat radiating surface 12b generates heat, and heat is transferred from the radiator 13 to the plurality of fins 20 through the heat pipes 17b. The fan 21 sucks air from the A ′ direction and applies the air sucked into the fin 20, so that heat is radiated by the fin 20 and discharged in the B ′ direction.

  Further, conversely, air may be sucked into the fins 20 from the C ′ direction, and heat and air radiated by the fins may be sucked by the fans 21 so that the air is discharged in the D ′ direction of the fans 21.

  Therefore, the heat radiator 13 includes a plurality of fins 20 and a fan 21 in parallel on the connection surface with the thermoelectric conversion device 12, so that even if the amount of heat of the CPU 6 increases, the heat radiation area of the fins 20 is increased according to the cooling capacity. Even if it is enlarged, the thinness can not be changed.

  As described above, the electronic cooling unit of the present embodiment includes the thermoelectric conversion device 12 having the heat absorbing surface 12a and the heat radiating surface 12b, the radiator 13 thermally connected to the heat radiating surface 12b, and the heat absorbing surface 12a. By providing a plurality of fins 20 provided on the connection surface of the cooling block 14 connected to the thermoelectric conversion device 12 of the radiator 13 and the fan 21 in parallel, the area of the fins 20 on the heat dissipation surface side is increased. Even so, the thickness can be reduced without changing the thickness.

(Embodiment 3)
FIG. 8 is a sectional view of an electronic cooling unit according to Embodiment 3 of the present invention. FIG. 9 is a perspective view of the electronic cooling unit of FIG.

  8 and 9, a plurality of fins 20 and a fan 21 are provided in parallel on the connection surface of the radiator 13 with the thermoelectric conversion device 12. The radiator 13 is provided with a through hole 22 through which air is sucked in a portion facing or close to the fan 21.

Here, the radiator 13 is provided with a thermoelectric conversion device 12 near the center of the radiator 13, a plurality of fins 20 and a fan 21 on both sides of the thermoelectric conversion device 12, and the radiator 13 facing the fan 21. Or you may make it the structure which provides the hole 22 in the position which adjoins. Further, the fins 20 on both sides and the holes 22 of the fan 21 on either side may be provided in the radiator 13.

  The operation of the electronic cooling unit configured as described above will be described below.

  The endothermic surface 12a is cooled by the Peltier effect generated by flowing a direct current through the thermoelectric conversion device 12, and the cooling surface 15 is cooled through the cooling block 14 and the heat pipe 17a. Further, when cooled by the Peltier effect, the heat radiating surface 12b generates heat, and heat is transmitted from the radiator to the plurality of fins 20 through the heat pipes 17b.

  The fan 21 sucks air from the D ′ direction and the E ′ direction of the hole 22 of the radiator 13 and applies the air sucked into the fin 20, so that heat is radiated by the fin 20 and discharged in the F ′ direction.

  Also, conversely, air is sucked from the G ′ direction into the fin 20 and the heat and air radiated by the fin are sucked by the fan 21, and the air is moved in the H ′ direction of the fan 21 and the I ′ direction of the hole 22 of the radiator 13. You may make it exhale.

  Accordingly, a plurality of fins 20 and a fan 21 are provided in parallel on the connection surface with the thermoelectric conversion device 12, and the radiator 13 is provided with a through-hole 22 through which air is sucked in a portion facing or close to the fan 21. By providing the openings of the fan 21 on both the surface 15 side and the radiator 13 side, the opening area can be increased, the air volume of the fan 21 can be improved, and the heat dissipation capability of the fins 20 can be increased.

  As described above, the electronic cooling unit according to the present embodiment provides both the cooling surface side and the radiator side by providing the holes 22 through which air is sucked in the portion of the radiator 13 facing or close to the fan 12. By providing the opening of the fan, the opening area can be increased, the air volume of the fan can be improved, and the heat dissipation ability of the fin can be increased.

(Embodiment 4)
FIG. 10 is a cross-sectional view of an electronic cooling unit according to Embodiment 4 of the present invention.

  In FIG. 10, the thin fin 23 includes a plurality of fins on the connection surface of the antithermoelectric conversion device 12 of the radiator 13.

  The operation of the electronic cooling unit configured as described above will be described below.

  The endothermic surface 12a is cooled by the Peltier effect generated by flowing a direct current through the thermoelectric conversion device 12, and the cooling surface 15 is cooled through the cooling block 14 and the heat pipe 17a. Further, when cooled by the Peltier effect, the heat radiating surface 12b generates heat and radiates heat from the radiator through the heat pipe 17b through the thin fins 23, and further heat is transferred to the plurality of fins 20 through the heat pipe 17b.

  Therefore, the radiator 13 is provided with a plurality of fins 20 on the connection surface with the thermoelectric conversion device 12 and the thin fins 23 on the connection surface of the antithermoelectric conversion device 12, so that the cooling capacity can be improved even if the amount of heat of the CPU 6 increases. Accordingly, the areas of the fins 20 and the thin fins 23 on the heat radiation surface side can be increased. Further, by providing the plurality of fins 20 and the thin fins 23, the structure can be made thin without degrading the cooling capacity, and the heat dissipation capacity can be further increased.

  As described above, the electronic cooling unit according to the present invention can increase the efficiency by increasing the area of the heat radiating surface without changing the thickness of the electronic cooling unit, and the electronic cooling unit using the thermoelectric conversion device and its application It can be widely applied to fields such as products.

Sectional drawing of the electronic cooling unit by Embodiment 1 of this invention Bottom view of the frame of the electronic cooling unit of the embodiment Sectional drawing which shows the use condition of the electronic cooling unit of the embodiment Sectional drawing which shows the modification of the electronic cooling unit of the embodiment Sectional drawing which shows another modification of the electronic cooling unit of the embodiment Sectional drawing of the electronic cooling unit by Embodiment 2 of this invention The perspective view of the electronic cooling unit of the embodiment Sectional drawing of the electronic cooling unit by Embodiment 3 of this invention The perspective view of the electronic cooling unit of the embodiment Sectional drawing of the electronic cooling unit by Embodiment 4 of this invention Sectional view of a conventional electronic cooling unit

Explanation of symbols

DESCRIPTION OF SYMBOLS 12 Thermoelectric conversion device 12a Heat absorption surface 12b Heat radiation surface 13 Radiator 14 Cooling block 15 Cooling surface 16 Frame body 17a, 17b Heat pipe 18a, 18b Sealing body 19a, 19b Elastic body 20 Fin 21 Fan 22 Hole 23 Thin fin

Claims (13)

  A thermoelectric conversion device having a heat absorption surface and a heat dissipation surface; a radiator thermally connected to the heat dissipation surface; a cooling block thermally connected to the heat absorption surface; and the thermoelectric conversion device of the radiator. An electronic cooling unit comprising a plurality of fins provided on a connection surface.   A thermoelectric conversion device having a heat absorption surface and a heat dissipation surface, a radiator thermally connected to the heat dissipation surface, a cooling block thermally connected to the heat absorption surface, and a thermoelectric conversion device connection surface of the radiator An electronic cooling unit comprising a plurality of fins and a fan provided in parallel.   3. The electronic cooling unit according to claim 2, wherein a through-hole for sucking air is provided in a portion of the radiator that faces or is close to the fan.   The electronic cooling unit according to any one of claims 1 to 3, wherein a plurality of fins are provided on a side surface of the radiator that is opposite to a thermoelectric conversion device connection surface.   The frame body which accommodates most of the said cooling block and the said thermoelectric conversion device so that the to-be-cooled object connection surface in the said cooling block may be exposed was provided. The electronic cooling unit according to item.   6. The electronic cooling unit according to claim 5, wherein the radiator is held by the frame body, and the cooling block and the thermoelectric conversion device are accommodated in a space surrounded by the radiator and the frame body. .   The electronic cooling unit according to claim 6, wherein a sealing body that seals a gap between the radiator and the frame is provided between the radiator and the frame.   The electronic cooling unit according to claim 7, wherein a gap is provided between the frame and the cooling block.   9. The electron according to claim 8, wherein an elastic body is provided between the cooling block and the frame to seal a gap between the cooling block and the frame and urge the cooling block toward the thermoelectric conversion device. Cooling unit.   The electronic cooling unit according to any one of claims 1 to 9, wherein a fluid is sealed inside the cooling block.   The electronic cooling unit according to claim 10, wherein a fluid is sealed inside the cooling block by a heat pipe.   The electronic cooling unit according to any one of claims 1 to 11, wherein a fluid is sealed inside the radiator.   13. The electronic cooling unit according to claim 12, wherein a fluid is sealed inside the radiator by a heat pipe.

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