JP2006024652A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006024652A5 JP2006024652A5 JP2004199870A JP2004199870A JP2006024652A5 JP 2006024652 A5 JP2006024652 A5 JP 2006024652A5 JP 2004199870 A JP2004199870 A JP 2004199870A JP 2004199870 A JP2004199870 A JP 2004199870A JP 2006024652 A5 JP2006024652 A5 JP 2006024652A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004199870A JP4286733B2 (ja) | 2004-07-06 | 2004-07-06 | インターポーザおよびインターポーザの製造方法 |
| KR1020067004600A KR100786156B1 (ko) | 2004-07-06 | 2005-07-05 | 인터포저 및 인터포저의 제조 방법 |
| PCT/JP2005/012424 WO2006004127A1 (ja) | 2004-07-06 | 2005-07-05 | インターポーザおよびインターポーザの製造方法 |
| CN200810089719.1A CN101256999B (zh) | 2004-07-06 | 2005-07-05 | 互连导电层及互连导电层的制造方法 |
| KR1020077014093A KR100786166B1 (ko) | 2004-07-06 | 2005-07-05 | 인터포저 및 인터포저의 제조 방법 |
| US11/631,635 US20080067073A1 (en) | 2004-07-06 | 2005-07-05 | Interposer And Manufacturing Method For The Same |
| EP05765494A EP1783832A4 (en) | 2004-07-06 | 2005-07-05 | INTERPOSER AND METHOD FOR PRODUCING AN INTERPOSER |
| TW094122867A TW200614896A (en) | 2004-07-06 | 2005-07-06 | Interposer and interposer producing method |
| US13/328,710 US20120085655A1 (en) | 2004-07-06 | 2011-12-16 | Interposer and manufacturing method for the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004199870A JP4286733B2 (ja) | 2004-07-06 | 2004-07-06 | インターポーザおよびインターポーザの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006024652A JP2006024652A (ja) | 2006-01-26 |
| JP2006024652A5 true JP2006024652A5 (enExample) | 2006-03-09 |
| JP4286733B2 JP4286733B2 (ja) | 2009-07-01 |
Family
ID=35797730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004199870A Expired - Fee Related JP4286733B2 (ja) | 2004-07-06 | 2004-07-06 | インターポーザおよびインターポーザの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4286733B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008066481A (ja) * | 2006-09-06 | 2008-03-21 | Shinko Electric Ind Co Ltd | パッケージ、半導体装置、パッケージの製造方法及び半導体装置の製造方法 |
| US8736066B2 (en) * | 2010-12-02 | 2014-05-27 | Tessera, Inc. | Stacked microelectronic assemby with TSVS formed in stages and carrier above chip |
| US8587126B2 (en) | 2010-12-02 | 2013-11-19 | Tessera, Inc. | Stacked microelectronic assembly with TSVs formed in stages with plural active chips |
| CN102918593B (zh) | 2011-03-08 | 2016-07-13 | 松下知识产权经营株式会社 | 信息记录介质及其制造方法 |
| JP6690142B2 (ja) * | 2015-07-09 | 2020-04-28 | 大日本印刷株式会社 | 貫通電極基板、貫通電極基板の製造方法及び貫通電極基板を用いたインターポーザ |
| JP6341245B2 (ja) * | 2016-09-05 | 2018-06-13 | 大日本印刷株式会社 | 貫通電極基板の製造方法、貫通電極基板および半導体装置 |
| JP7022365B2 (ja) * | 2017-03-24 | 2022-02-18 | 大日本印刷株式会社 | 貫通電極基板及びその製造方法 |
| JP2018195661A (ja) * | 2017-05-16 | 2018-12-06 | 大日本印刷株式会社 | 貫通電極基板、貫通電極基板の製造方法及び貫通電極基板を用いた半導体装置 |
| US11078112B2 (en) * | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| JP6369653B1 (ja) * | 2018-05-17 | 2018-08-08 | 大日本印刷株式会社 | 貫通電極基板および半導体装置 |
-
2004
- 2004-07-06 JP JP2004199870A patent/JP4286733B2/ja not_active Expired - Fee Related