JP2006019746A5 - - Google Patents

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Publication number
JP2006019746A5
JP2006019746A5 JP2005193258A JP2005193258A JP2006019746A5 JP 2006019746 A5 JP2006019746 A5 JP 2006019746A5 JP 2005193258 A JP2005193258 A JP 2005193258A JP 2005193258 A JP2005193258 A JP 2005193258A JP 2006019746 A5 JP2006019746 A5 JP 2006019746A5
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JP
Japan
Prior art keywords
gum
acrylic acid
acid
methacrylic acid
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005193258A
Other languages
English (en)
Japanese (ja)
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JP2006019746A (ja
Filing date
Publication date
Priority claimed from US10/882,567 external-priority patent/US7384871B2/en
Application filed filed Critical
Publication of JP2006019746A publication Critical patent/JP2006019746A/ja
Publication of JP2006019746A5 publication Critical patent/JP2006019746A5/ja
Pending legal-status Critical Current

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JP2005193258A 2004-07-01 2005-07-01 ケミカルメカニカルポリッシング組成物及びそれに関連する方法 Pending JP2006019746A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/882,567 US7384871B2 (en) 2004-07-01 2004-07-01 Chemical mechanical polishing compositions and methods relating thereto

Publications (2)

Publication Number Publication Date
JP2006019746A JP2006019746A (ja) 2006-01-19
JP2006019746A5 true JP2006019746A5 (cg-RX-API-DMAC7.html) 2008-08-14

Family

ID=35512461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005193258A Pending JP2006019746A (ja) 2004-07-01 2005-07-01 ケミカルメカニカルポリッシング組成物及びそれに関連する方法

Country Status (4)

Country Link
US (1) US7384871B2 (cg-RX-API-DMAC7.html)
JP (1) JP2006019746A (cg-RX-API-DMAC7.html)
CN (1) CN100355819C (cg-RX-API-DMAC7.html)
TW (1) TWI394820B (cg-RX-API-DMAC7.html)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7435356B2 (en) * 2004-11-24 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Abrasive-free chemical mechanical polishing compositions and methods relating thereto
KR20070120609A (ko) * 2005-04-15 2007-12-24 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 마이크로전자 소자로부터 이온 주입 포토레지스트층을세정하기 위한 배합물
JP2007088302A (ja) * 2005-09-22 2007-04-05 Fujifilm Corp 金属用研磨液及び化学的機械的研磨方法
KR100786949B1 (ko) * 2005-12-08 2007-12-17 주식회사 엘지화학 연마 선택도 조절 보조제 및 이를 함유한 ｃｍｐ 슬러리
US20070225187A1 (en) * 2006-03-22 2007-09-27 Fujifilm Corporation Cleaning solution for substrate for use in semiconductor device and cleaning method using the same
US20100015807A1 (en) * 2006-12-22 2010-01-21 Techno Semichem Co., Ltd. Chemical Mechanical Polishing Composition for Copper Comprising Zeolite
KR100949250B1 (ko) 2007-10-10 2010-03-25 제일모직주식회사 금속 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법
US20090215266A1 (en) * 2008-02-22 2009-08-27 Thomas Terence M Polishing Copper-Containing patterned wafers
EP2273537A4 (en) * 2008-04-15 2012-07-25 Hitachi Chemical Co Ltd POLISHING SOLUTION FOR METALLIC FILMS AND METHOD OF POLISHING USING THE SAME
US8540893B2 (en) * 2008-08-04 2013-09-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto
KR101674564B1 (ko) * 2009-01-05 2016-11-09 에프엔에스테크 주식회사 다층 화학-기계적 평탄화 패드
US8536106B2 (en) * 2010-04-14 2013-09-17 Ecolab Usa Inc. Ferric hydroxycarboxylate as a builder
US8435896B2 (en) 2011-03-03 2013-05-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable chemical mechanical polishing composition and methods relating thereto
US8440097B2 (en) 2011-03-03 2013-05-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition
JP6029895B2 (ja) * 2012-08-31 2016-11-24 株式会社フジミインコーポレーテッド 研磨用組成物及び基板の製造方法
US9299585B2 (en) 2014-07-28 2016-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing substrates containing ruthenium and copper
WO2018058396A1 (en) * 2016-09-29 2018-04-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten
WO2018058395A1 (en) * 2016-09-29 2018-04-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten
JP6936315B2 (ja) * 2016-09-29 2021-09-15 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド タングステンのためのケミカルメカニカルポリッシング法
KR102679492B1 (ko) * 2018-11-15 2024-07-01 솔브레인 주식회사 연마 첨가제 조성물, 연마 슬러리 조성물 및 반도체 소자의 절연막의 연마 방법
CN114916240B (zh) * 2020-12-10 2025-11-21 株式会社日立高新技术 半导体制造方法和半导体制造装置
CN114561187B (zh) * 2022-03-07 2022-10-21 山东麦丰新材料科技股份有限公司 一种环保型乳化精磨液及其制备方法

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
JP3371775B2 (ja) * 1997-10-31 2003-01-27 株式会社日立製作所 研磨方法
US6432828B2 (en) * 1998-03-18 2002-08-13 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
EP1102821A4 (en) 1998-06-10 2004-05-19 Rodel Inc COMPOSITION AND METHOD FOR CHEMICAL / MECHANICAL POLISHING
JP4095731B2 (ja) * 1998-11-09 2008-06-04 株式会社ルネサステクノロジ 半導体装置の製造方法及び半導体装置
JP4538109B2 (ja) * 1999-02-18 2010-09-08 株式会社トッパンＴｄｋレーベル 化学機械研磨組成物
TW501197B (en) 1999-08-17 2002-09-01 Hitachi Chemical Co Ltd Polishing compound for chemical mechanical polishing and method for polishing substrate
KR20020027571A (ko) 1999-08-24 2002-04-13 갤반 마틴 절연체와 금속의 ｃｍｐ용 조성물 및 이에 관련된 방법
US7232529B1 (en) 1999-08-26 2007-06-19 Hitachi Chemical Company, Ltd. Polishing compound for chemimechanical polishing and polishing method
JP2002050595A (ja) * 2000-08-04 2002-02-15 Hitachi Ltd 研磨方法、配線形成方法及び半導体装置の製造方法
US6936541B2 (en) * 2000-09-20 2005-08-30 Rohn And Haas Electronic Materials Cmp Holdings, Inc. Method for planarizing metal interconnects
US6605537B2 (en) * 2000-10-27 2003-08-12 Rodel Holdings, Inc. Polishing of metal substrates
JP4951808B2 (ja) * 2000-10-26 2012-06-13 日立化成工業株式会社 金属用研磨液及び研磨方法
JP3768402B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
TW584658B (en) * 2001-04-12 2004-04-21 Rodel Inc Polishing composition having a surfactant
US6632259B2 (en) * 2001-05-18 2003-10-14 Rodel Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto
JP2003068683A (ja) * 2001-08-22 2003-03-07 Hitachi Chem Co Ltd 金属用研磨液及び研磨方法
DE60311569T2 (de) * 2002-03-25 2007-11-15 Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark Tantalbarriere-Entfernungslösung
US20030219982A1 (en) * 2002-05-23 2003-11-27 Hitachi Chemical Co., Ltd CMP (chemical mechanical polishing) polishing liquid for metal and polishing method
US7736405B2 (en) * 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
US20050104048A1 (en) * 2003-11-13 2005-05-19 Thomas Terence M. Compositions and methods for polishing copper
US20050136671A1 (en) * 2003-12-22 2005-06-23 Goldberg Wendy B. Compositions and methods for low downforce pressure polishing of copper

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