JP2006013451A - 計算機式断層写真法(ct)検出器の製造方法 - Google Patents
計算機式断層写真法(ct)検出器の製造方法 Download PDFInfo
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- G—PHYSICS
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- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
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Abstract
【解決手段】エネルギ識別及び直接変換が可能なCT検出器20aは、半導体層厚が異なる第一の半導体層62、第二の半導体層64を含む。各々の半導体層62,64は検出素子65を二次元的に画定するようピクセル化された構造に構築され、連続した高電圧電極66、68を含む。高電圧電極層はX線吸収特性を低減するような厚さの金属化層とされるので、検出器20aは、計数速度性能を最適化すると共に飽和を回避するようにX線入射方向にセグメント分割されて構築されている。
【選択図】図6
Description
この定義から、厚みL=0.3cm及び電場Vを1000V/cmとし、μeを約1000とすると、100万個の最大計数速度を達成することができる。換言すると、3mm厚のCZT半導体層の計数速度は、100万個/秒の範囲の計数速度性能であり得る。しかしながら、後述するように、単一の比較的厚い層ではなく多数の層を備えた直接変換型半導体検出器を構築することにより、計数速度性能を高めることができる。
12、128 ガントリ
14 X線源
16 X線ビーム
18、134 検出器アセンブリ
20、20a、20b、20c、20d 検出器
22 患者
24 回転中心
26 制御機構
42 表示器
46 モータ式テーブル
48、130 ガントリ開口
50 検出器素子
52 セル型アレイ
54、56 スイッチ・アレイ
58 可撓性電気インタフェイス
60 検出器フレーム
62 装着用ブラケット(図4)
62 第一の半導体層(図6)
64 第二の半導体層
65 検出器素子(電気接点)
66、68、80、82、87、89、91、118 高電圧電極
67、69、78 二次元接点アレイ
74、76、84、86、88、90、96、98、100、102 半導体層
92、94 導電路
93、95、116 収集接点アレイ
104、106、108 高電圧印加用導電層
110、112 信号収集接点を含む層
114 半導体物質
120 孔
122 信号供給経路
124 収集接点
126 小荷物/手荷物検査システム
132 高周波電磁エネルギ源
136 コンベヤ・システム
138 コンベヤ・ベルト
140 支持構造
142 小荷物又は手荷物
Claims (11)
- 放射線撮像用の直接変換型検出器を製造する方法であって、
X線(16)を電気信号へ直接変換するように設計されている半導体物質の多数の層(62、64)を設けるステップと、
半導体物質の各々の層(62、64)の少なくともX線入射面に導電性フィルム層(67、69)を固着させるステップと、
前記半導体物質の多数の層(62、64)を、各々の層が少なくとも2層の導電性フィルム層に接触するようにして積層体として構成するステップと、
を備えた方法。 - 前記固着させるステップは、半導体物質の各々の層(62、64)の少なくともX線入射面を金属化するステップを含んでいる、請求項1に記載の方法。
- 前記設けるステップは、テルル化カドミウム亜鉛(CZT)バルクから半導体物質の各々の層(62、64)を成長させるステップを含んでいる、請求項1に記載の方法。
- 前記成長させるステップは、各々のテルル化カドミウム亜鉛層を成長させるために分子ビーム・エピタキシを用いるステップを含んでいる、請求項3に記載の方法。
- 1層の半導体物質(62、64)のX線入射面及び裏面(66、68)に導電性フィルム(67、69)を固着させるステップをさらに含んでいる請求項1に記載の方法。
- 前記多数の層を積層体として構成するステップは、前記多数の層を、導電性フィルムの2面の表面を有する前記層(64)がX線源(14)から最も遠い側に配置されるようにして互いに接合するステップを含んでいる、請求項5に記載の方法。
- 前記構成するステップは、前記多数の層(62、64)を、各々の層(62、64)が高電圧(HV)接続フィルム層(66、68)及び信号収集フィルム層(67、69)に接触するようにして、互いに対して配置するステップを含んでいる、請求項1に記載の方法。
- 前記構成するステップは、
共通軸に沿って前記多数の層(62、64)の各々に少なくとも1個ずつの孔(120)を形成するステップと、
前記積層体の前記多数の層(62、64)を接合するために前記少なくとも1個ずつの孔(120)を金属化する(122)ステップと、
を含んでいる、請求項1に記載の方法。 - 前記多数の層は、少なくとも3層の半導体層(96、98、100)を含んでいる、請求項1に記載の方法。
- 前記検出器は、解剖学的詳細及び組織特徴評価を与える単一の画像になるように処理され得る電気信号へX線を直接変換するように構成されている、請求項1に記載の方法。
- 放射線撮像用の直接変換型検出器であって、半導体物質の多数の層及び間隙導電層を有しており、
複数の半導体層の各々の少なくともX線入射面に金属化層を付着させて、
前記複数の半導体層を、各々の半導体層が1対の金属化層の間に介設されるようにX線入射方向に積層する
ことにより形成される直接変換型検出器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US10/842,978 | 2004-05-11 | ||
US10/842,978 US6953935B1 (en) | 2004-05-11 | 2004-05-11 | CT detector fabrication process |
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JP2006013451A true JP2006013451A (ja) | 2006-01-12 |
JP5138156B2 JP5138156B2 (ja) | 2013-02-06 |
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US (2) | US6953935B1 (ja) |
JP (1) | JP5138156B2 (ja) |
CN (1) | CN100486524C (ja) |
DE (1) | DE102005022496A1 (ja) |
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- 2005-05-06 JP JP2005134870A patent/JP5138156B2/ja active Active
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JP2011146541A (ja) * | 2010-01-14 | 2011-07-28 | Canon Inc | X線センサおよびその製造方法 |
KR20130076431A (ko) * | 2011-12-28 | 2013-07-08 | 삼성전자주식회사 | 다중 에너지 방사선 검출기 및 그 제조 방법 |
KR101894392B1 (ko) * | 2011-12-28 | 2018-09-04 | 삼성전자주식회사 | 다중 에너지 방사선 검출기 및 그 제조 방법 |
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US6953935B1 (en) | 2005-10-11 |
JP5138156B2 (ja) | 2013-02-06 |
CN1695558A (zh) | 2005-11-16 |
DE102005022496A1 (de) | 2005-12-01 |
US7034313B2 (en) | 2006-04-25 |
CN100486524C (zh) | 2009-05-13 |
US20050253079A1 (en) | 2005-11-17 |
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