JP2006013349A - 熱伝導材及びその製造方法 - Google Patents
熱伝導材及びその製造方法 Download PDFInfo
- Publication number
- JP2006013349A JP2006013349A JP2004191710A JP2004191710A JP2006013349A JP 2006013349 A JP2006013349 A JP 2006013349A JP 2004191710 A JP2004191710 A JP 2004191710A JP 2004191710 A JP2004191710 A JP 2004191710A JP 2006013349 A JP2006013349 A JP 2006013349A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heat
- graphite
- heat dissipation
- graphite layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000463 material Substances 0.000 title abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 45
- 239000010439 graphite Substances 0.000 claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000004544 sputter deposition Methods 0.000 claims abstract description 15
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 8
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000001301 oxygen Substances 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims description 28
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 46
- 230000005855 radiation Effects 0.000 description 8
- 239000003973 paint Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
【解決手段】 熱伝導材1は、シート状のグラファイト層3の表面に、二酸化ケイ素からなる放熱層5を形成したものである。グラファイト層3は、膨張黒鉛をローラでプレス圧延することによりシート状に形成され、放熱層5は、グラファイト層3の表面に酸素雰囲気中でケイ素をスパッタリングすることにより、厚さ約100nmの二酸化ケイ素の層として形成されている。グラファイト層3自身は表面に沿った方向に極めて良好な熱拡散性を有しており、しかも、グラファイト層3の表面に放熱層5が形成されているので、放熱性も良好に確保することができる。
【選択図】 図1
Description
スパッタ :反応スパッタ
ガス :Ar:91%、O2 :9.1%混合ガス
スパッタガス圧 :0.6〜0.7Pa
電力値 :2.5W/cm2 (DCパルス)
電流 :10.25mA/cm2
電圧 :245V
成膜時のサンプル送り速度:16cm/min(平板移動冶具使用)
このように構成された熱伝導材1では、グラファイト層3自身は表面に沿った方向に極めて良好な熱拡散性を有しており、しかも、グラファイト層3の表面には放熱層5が形成されているので、放熱性も良好に確保することができる。例えば、熱放射率は0.8と、従来品の0.3対して2倍以上に向上した。これに応じて、熱放射量も従来品の2倍以上となる。
Claims (4)
- シート状のグラファイト層と、
該グラファイト層の表面にスパッタリングにより形成され、放熱性を有する放熱層と、
を備えたことを特徴とする熱伝導材。 - 上記放熱層が、酸化物から構成されたことを特徴とする請求項1記載の熱伝導材。
- 上記酸化物がアルミナ、二酸化ケイ素、またはそれらの両者からなるものであることを特徴とする請求項2記載の熱伝導材。
- 請求項2または3記載の熱伝導材を製造する熱伝導材の製造方法であって、
酸素雰囲気中でスパッタリングを行うことにより、上記酸化物を生成しながら上記放熱層を形成することを特徴とする熱伝導材の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004191710A JP3939317B2 (ja) | 2004-06-29 | 2004-06-29 | 熱伝導材及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004191710A JP3939317B2 (ja) | 2004-06-29 | 2004-06-29 | 熱伝導材及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006013349A true JP2006013349A (ja) | 2006-01-12 |
JP3939317B2 JP3939317B2 (ja) | 2007-07-04 |
Family
ID=35780192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004191710A Expired - Fee Related JP3939317B2 (ja) | 2004-06-29 | 2004-06-29 | 熱伝導材及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3939317B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008126564A1 (ja) * | 2007-03-12 | 2008-10-23 | Toyo Tanso Co., Ltd. | 放熱部材、それを用いた回路基板、電子部品モジュール及びその製造方法 |
JP2011066057A (ja) * | 2009-09-15 | 2011-03-31 | Kitagawa Ind Co Ltd | 熱拡散シート及びその製造方法,製造装置 |
JP2011189700A (ja) * | 2010-03-16 | 2011-09-29 | Sekisui Chem Co Ltd | 複合シート |
CN102468395A (zh) * | 2010-11-04 | 2012-05-23 | 浙江雄邦节能产品有限公司 | 一种陶瓷基板led装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120122266A (ko) * | 2011-04-28 | 2012-11-07 | 매그나칩 반도체 유한회사 | 칩온필름형 반도체 패키지 |
-
2004
- 2004-06-29 JP JP2004191710A patent/JP3939317B2/ja not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008126564A1 (ja) * | 2007-03-12 | 2008-10-23 | Toyo Tanso Co., Ltd. | 放熱部材、それを用いた回路基板、電子部品モジュール及びその製造方法 |
JPWO2008126564A1 (ja) * | 2007-03-12 | 2010-07-22 | 東洋炭素株式会社 | 放熱部材、それを用いた回路基板、電子部品モジュール及びその製造方法 |
JP2011066057A (ja) * | 2009-09-15 | 2011-03-31 | Kitagawa Ind Co Ltd | 熱拡散シート及びその製造方法,製造装置 |
JP2011189700A (ja) * | 2010-03-16 | 2011-09-29 | Sekisui Chem Co Ltd | 複合シート |
CN102468395A (zh) * | 2010-11-04 | 2012-05-23 | 浙江雄邦节能产品有限公司 | 一种陶瓷基板led装置 |
Also Published As
Publication number | Publication date |
---|---|
JP3939317B2 (ja) | 2007-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4653029B2 (ja) | 熱伝導材料及びその製造方法 | |
JP4754995B2 (ja) | 熱伝導材料及びその製造方法 | |
JP2011035403A (ja) | 放熱構造体及び放熱システム | |
JP2007284679A (ja) | カーボンナチューブを含む複合材料及びその製造方法 | |
WO2013139058A1 (zh) | 散热基板及其制造方法 | |
JP2009117656A (ja) | 熱伝導材及びその製造方法 | |
JP2005210035A (ja) | グラファイト複合材 | |
JP3939317B2 (ja) | 熱伝導材及びその製造方法 | |
CN102479819A (zh) | 场效应晶体管及其制备方法 | |
JP5343620B2 (ja) | 放熱材料及びその製造方法並びに電子機器及びその製造方法 | |
JP2007096279A5 (ja) | ||
CN103025127A (zh) | 散热贴膜 | |
KR20170093601A (ko) | 그래핀 코팅 방열부재의 제조방법과 이에 의하여 제조된 방열부재 | |
TWI299341B (ja) | ||
CN203633041U (zh) | 电子元件散热装置 | |
JP2001232712A (ja) | 熱伝導性部材 | |
CN204946906U (zh) | 一种中小功率变频器用igbt功率组件 | |
JP2009266983A (ja) | 放熱構造及び該放熱構造の製造方法並びに該放熱構造を用いた放熱装置 | |
TWM538240U (zh) | 用於積體電路的散熱片 | |
JP2012162412A (ja) | 化学修飾グラフェン及びその剥離方法 | |
CN216775326U (zh) | 一种石墨膜 | |
CN207995618U (zh) | 一种具有玻璃纤维的导热硅胶片 | |
TWI797722B (zh) | 複合基板及其製造方法 | |
JP2003068954A (ja) | 半導体素子収納用パッケージ | |
JP4830326B2 (ja) | 半導体モジュールおよびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060419 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060509 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060710 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060801 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060929 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061107 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070109 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20070206 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070313 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070327 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 3939317 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100406 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110406 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120406 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120406 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120406 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120406 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130406 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130406 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130406 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130406 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140406 Year of fee payment: 7 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |