JP2006007506A5 - - Google Patents

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Publication number
JP2006007506A5
JP2006007506A5 JP2004185884A JP2004185884A JP2006007506A5 JP 2006007506 A5 JP2006007506 A5 JP 2006007506A5 JP 2004185884 A JP2004185884 A JP 2004185884A JP 2004185884 A JP2004185884 A JP 2004185884A JP 2006007506 A5 JP2006007506 A5 JP 2006007506A5
Authority
JP
Japan
Prior art keywords
mold
sheet
cleaning
resin
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004185884A
Other languages
English (en)
Japanese (ja)
Other versions
JP4373291B2 (ja
JP2006007506A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004185884A priority Critical patent/JP4373291B2/ja
Priority claimed from JP2004185884A external-priority patent/JP4373291B2/ja
Publication of JP2006007506A publication Critical patent/JP2006007506A/ja
Publication of JP2006007506A5 publication Critical patent/JP2006007506A5/ja
Application granted granted Critical
Publication of JP4373291B2 publication Critical patent/JP4373291B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004185884A 2004-06-24 2004-06-24 半導体装置の製造方法 Expired - Fee Related JP4373291B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004185884A JP4373291B2 (ja) 2004-06-24 2004-06-24 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004185884A JP4373291B2 (ja) 2004-06-24 2004-06-24 半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009163477A Division JP2009283955A (ja) 2009-07-10 2009-07-10 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006007506A JP2006007506A (ja) 2006-01-12
JP2006007506A5 true JP2006007506A5 (enExample) 2009-06-04
JP4373291B2 JP4373291B2 (ja) 2009-11-25

Family

ID=35775284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004185884A Expired - Fee Related JP4373291B2 (ja) 2004-06-24 2004-06-24 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4373291B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242924A (ja) * 2006-03-09 2007-09-20 Renesas Technology Corp 半導体装置の製造方法
KR100884733B1 (ko) * 2007-07-31 2009-02-19 이교안 칩 패키징 금형에 에폭시 릴리즈 왁스를 도포하기 위한 방법 및 이에 적합한 도포 시트
CN102292406B (zh) * 2009-02-13 2013-07-03 李教安 用于模具的蜡涂覆构件及使用该构件的蜡涂覆方法
JP5741398B2 (ja) * 2011-11-21 2015-07-01 日立化成株式会社 金型クリーニングシート
KR101450152B1 (ko) 2014-03-27 2014-10-13 임상수 전자제품의 국부적 방수 구조의 형성방법
JP7318927B2 (ja) * 2019-11-15 2023-08-01 東北物流株式会社 クリーニング用シート、半導体装置の製造方法およびクリーニング用シートの製造方法

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