JP2005535114A5 - - Google Patents

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Publication number
JP2005535114A5
JP2005535114A5 JP2004524569A JP2004524569A JP2005535114A5 JP 2005535114 A5 JP2005535114 A5 JP 2005535114A5 JP 2004524569 A JP2004524569 A JP 2004524569A JP 2004524569 A JP2004524569 A JP 2004524569A JP 2005535114 A5 JP2005535114 A5 JP 2005535114A5
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JP
Japan
Prior art keywords
data
semiconductor wafer
processing
obtaining
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2004524569A
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English (en)
Japanese (ja)
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JP2005535114A (ja
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Publication date
Priority claimed from US10/207,525 external-priority patent/US6773931B2/en
Application filed filed Critical
Publication of JP2005535114A publication Critical patent/JP2005535114A/ja
Publication of JP2005535114A5 publication Critical patent/JP2005535114A5/ja
Ceased legal-status Critical Current

Links

JP2004524569A 2002-07-29 2003-07-09 プロセス制御システムのための動的目標設定 Ceased JP2005535114A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/207,525 US6773931B2 (en) 2002-07-29 2002-07-29 Dynamic targeting for a process control system
PCT/US2003/021285 WO2004012230A2 (en) 2002-07-29 2003-07-09 Dynamic targeting for a process control system

Publications (2)

Publication Number Publication Date
JP2005535114A JP2005535114A (ja) 2005-11-17
JP2005535114A5 true JP2005535114A5 (https=) 2011-06-16

Family

ID=31186693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004524569A Ceased JP2005535114A (ja) 2002-07-29 2003-07-09 プロセス制御システムのための動的目標設定

Country Status (8)

Country Link
US (1) US6773931B2 (https=)
EP (1) EP1532674A2 (https=)
JP (1) JP2005535114A (https=)
KR (1) KR20050026062A (https=)
CN (1) CN100392840C (https=)
AU (1) AU2003253820A1 (https=)
TW (1) TWI295755B (https=)
WO (1) WO2004012230A2 (https=)

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US20050021272A1 (en) * 2003-07-07 2005-01-27 Jenkins Naomi M. Method and apparatus for performing metrology dispatching based upon fault detection
JP4209373B2 (ja) * 2003-10-13 2009-01-14 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置またはリソグラフィ処理セルの作動方法、リソグラフィ装置およびリソグラフィ処理セル
US20050197721A1 (en) * 2004-02-20 2005-09-08 Yung-Cheng Chen Control of exposure energy on a substrate
US7415317B2 (en) * 2004-02-25 2008-08-19 Micron Technology, Inc. Method and system for correlating and combining production and non-production data for analysis
US7395130B2 (en) * 2004-02-27 2008-07-01 Micron Technology, Inc. Method and system for aggregating and combining manufacturing data for analysis
US8615314B1 (en) * 2004-09-02 2013-12-24 Advanced Micro Devices, Inc. Process control using analysis of an upstream process
US7242998B2 (en) * 2005-03-07 2007-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Etching operation management systems and methods
US8825444B1 (en) * 2005-05-19 2014-09-02 Nanometrics Incorporated Automated system check for metrology unit
US7236848B2 (en) * 2005-09-12 2007-06-26 Advanced Micro Devices, Inc. Data representation relating to a non-sampled workpiece
KR100759684B1 (ko) * 2006-04-17 2007-09-17 삼성에스디아이 주식회사 건식식각장치 및 이를 이용한 유기전계발광 표시장치의식각방법
US7954072B2 (en) * 2006-05-15 2011-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Model import for electronic design automation
US8145337B2 (en) * 2007-05-04 2012-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment
US8682466B2 (en) * 2007-05-04 2014-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic virtual metrology for semiconductor wafer result prediction
US7783999B2 (en) * 2008-01-18 2010-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Electrical parameter extraction for integrated circuit design
CN101504543B (zh) * 2008-02-05 2011-04-20 台湾积体电路制造股份有限公司 提取关键工艺参数的方法及系统
US8037575B2 (en) 2008-02-28 2011-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method for shape and timing equivalent dimension extraction
US7622308B2 (en) * 2008-03-07 2009-11-24 Mks Instruments, Inc. Process control using process data and yield data
US8271122B2 (en) 2008-03-07 2012-09-18 Mks Instruments, Inc. Process control using process data and yield data
JP2010056367A (ja) * 2008-08-29 2010-03-11 Panasonic Corp 半導体製造装置
US8001494B2 (en) * 2008-10-13 2011-08-16 Taiwan Semiconductor Manufacturing Company, Ltd. Table-based DFM for accurate post-layout analysis
US8806386B2 (en) * 2009-11-25 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. Customized patterning modulation and optimization
US8745554B2 (en) * 2009-12-28 2014-06-03 Taiwan Semiconductor Manufacturing Company, Ltd. Practical approach to layout migration
US9367882B2 (en) 2012-08-07 2016-06-14 GlobalFoundries, Inc. Waferstart processes and systems for integrated circuit fabrication
US10642255B2 (en) * 2013-08-30 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Component control in semiconductor performance processing with stable product offsets
CN104538330B (zh) * 2014-12-10 2018-07-20 苏州润阳光伏科技有限公司 自动调节硅片制绒工艺的装置
CN105425749B (zh) * 2015-12-15 2018-03-06 西安电子科技大学 批量加工晶圆的统计过程控制方法
CN108604093A (zh) * 2016-02-05 2018-09-28 依视路国际公司 用于监测光学镜片制造过程的方法
DE102016204392A1 (de) * 2016-03-16 2017-09-21 Trumpf Werkzeugmaschinen Gmbh + Co. Kg System und Verfahren zur Produktionsplanung
KR20180022030A (ko) * 2016-08-23 2018-03-06 전자부품연구원 뉴럴 네트워크 학습을 이용한 시멘트 석회 소성 공정 온도 예측 시스템 및 방법
US10824137B2 (en) * 2017-06-19 2020-11-03 Panasonic Intellectual Property Management Co., Ltd. Mounting board manufacturing system
US11087065B2 (en) * 2018-09-26 2021-08-10 Asml Netherlands B.V. Method of manufacturing devices
US11592812B2 (en) 2019-02-19 2023-02-28 Applied Materials, Inc. Sensor metrology data integration
CN113647208B (zh) * 2019-03-28 2023-08-18 松下知识产权经营株式会社 生产数据制成装置以及生产数据制成方法
JP7601692B2 (ja) * 2021-04-13 2024-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム、及びデータ処理方法
CN116500988B (zh) * 2023-04-26 2026-02-03 创新奇智(合肥)科技有限公司 多晶硅还原炉的控制方法及装置

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US5270222A (en) * 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
US5937541A (en) * 1997-09-15 1999-08-17 Siemens Aktiengesellschaft Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
US6408220B1 (en) * 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques
AU5881700A (en) * 1999-06-22 2001-01-09 Brooks Automation, Inc. Run-to-run controller for use in microelectronic fabrication
US6470230B1 (en) * 2000-01-04 2002-10-22 Advanced Micro Devices, Inc. Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication
US6856849B2 (en) * 2000-12-06 2005-02-15 Advanced Micro Devices, Inc. Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters
US6444481B1 (en) * 2001-07-02 2002-09-03 Advanced Micro Devices, Inc. Method and apparatus for controlling a plating process

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