JP2005535114A - プロセス制御システムのための動的目標設定 - Google Patents

プロセス制御システムのための動的目標設定 Download PDF

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Publication number
JP2005535114A
JP2005535114A JP2004524569A JP2004524569A JP2005535114A JP 2005535114 A JP2005535114 A JP 2005535114A JP 2004524569 A JP2004524569 A JP 2004524569A JP 2004524569 A JP2004524569 A JP 2004524569A JP 2005535114 A JP2005535114 A JP 2005535114A
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JP
Japan
Prior art keywords
data
processing
workpiece
semiconductor wafer
manufacturing
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Ceased
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JP2004524569A
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English (en)
Japanese (ja)
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JP2005535114A5 (https=
Inventor
ジェイ． パサディン アレクサンダー
ジェイ． ソンダーマン トーマス
ワン ジン
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2005535114A publication Critical patent/JP2005535114A/ja
Publication of JP2005535114A5 publication Critical patent/JP2005535114A5/ja
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37295—Measure workpiece while machining other workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Multi-Process Working Machines And Systems (AREA)
JP2004524569A 2002-07-29 2003-07-09 プロセス制御システムのための動的目標設定 Ceased JP2005535114A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/207,525 US6773931B2 (en) 2002-07-29 2002-07-29 Dynamic targeting for a process control system
PCT/US2003/021285 WO2004012230A2 (en) 2002-07-29 2003-07-09 Dynamic targeting for a process control system

Publications (2)

Publication Number Publication Date
JP2005535114A true JP2005535114A (ja) 2005-11-17
JP2005535114A5 JP2005535114A5 (https=) 2011-06-16

Family

ID=31186693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004524569A Ceased JP2005535114A (ja) 2002-07-29 2003-07-09 プロセス制御システムのための動的目標設定

Country Status (8)

Country Link
US (1) US6773931B2 (https=)
EP (1) EP1532674A2 (https=)
JP (1) JP2005535114A (https=)
KR (1) KR20050026062A (https=)
CN (1) CN100392840C (https=)
AU (1) AU2003253820A1 (https=)
TW (1) TWI295755B (https=)
WO (1) WO2004012230A2 (https=)

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US6898558B2 (en) * 2002-12-31 2005-05-24 Tokyo Electron Limited Method and apparatus for monitoring a material processing system
TWI283817B (en) * 2003-05-30 2007-07-11 Tokyo Electron Ltd Method of operating a process control system and method of operating an advanced process control system
US20050021272A1 (en) * 2003-07-07 2005-01-27 Jenkins Naomi M. Method and apparatus for performing metrology dispatching based upon fault detection
JP4209373B2 (ja) * 2003-10-13 2009-01-14 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置またはリソグラフィ処理セルの作動方法、リソグラフィ装置およびリソグラフィ処理セル
US20050197721A1 (en) * 2004-02-20 2005-09-08 Yung-Cheng Chen Control of exposure energy on a substrate
US7415317B2 (en) * 2004-02-25 2008-08-19 Micron Technology, Inc. Method and system for correlating and combining production and non-production data for analysis
US7395130B2 (en) * 2004-02-27 2008-07-01 Micron Technology, Inc. Method and system for aggregating and combining manufacturing data for analysis
US8615314B1 (en) * 2004-09-02 2013-12-24 Advanced Micro Devices, Inc. Process control using analysis of an upstream process
US7242998B2 (en) * 2005-03-07 2007-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Etching operation management systems and methods
US8825444B1 (en) * 2005-05-19 2014-09-02 Nanometrics Incorporated Automated system check for metrology unit
US7236848B2 (en) * 2005-09-12 2007-06-26 Advanced Micro Devices, Inc. Data representation relating to a non-sampled workpiece
KR100759684B1 (ko) * 2006-04-17 2007-09-17 삼성에스디아이 주식회사 건식식각장치 및 이를 이용한 유기전계발광 표시장치의식각방법
US7954072B2 (en) * 2006-05-15 2011-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Model import for electronic design automation
US8145337B2 (en) * 2007-05-04 2012-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment
US8682466B2 (en) * 2007-05-04 2014-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic virtual metrology for semiconductor wafer result prediction
US7783999B2 (en) * 2008-01-18 2010-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Electrical parameter extraction for integrated circuit design
CN101504543B (zh) * 2008-02-05 2011-04-20 台湾积体电路制造股份有限公司 提取关键工艺参数的方法及系统
US8037575B2 (en) 2008-02-28 2011-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method for shape and timing equivalent dimension extraction
US7622308B2 (en) * 2008-03-07 2009-11-24 Mks Instruments, Inc. Process control using process data and yield data
US8271122B2 (en) 2008-03-07 2012-09-18 Mks Instruments, Inc. Process control using process data and yield data
JP2010056367A (ja) * 2008-08-29 2010-03-11 Panasonic Corp 半導体製造装置
US8001494B2 (en) * 2008-10-13 2011-08-16 Taiwan Semiconductor Manufacturing Company, Ltd. Table-based DFM for accurate post-layout analysis
US8806386B2 (en) * 2009-11-25 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. Customized patterning modulation and optimization
US8745554B2 (en) * 2009-12-28 2014-06-03 Taiwan Semiconductor Manufacturing Company, Ltd. Practical approach to layout migration
US9367882B2 (en) 2012-08-07 2016-06-14 GlobalFoundries, Inc. Waferstart processes and systems for integrated circuit fabrication
US10642255B2 (en) * 2013-08-30 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Component control in semiconductor performance processing with stable product offsets
CN104538330B (zh) * 2014-12-10 2018-07-20 苏州润阳光伏科技有限公司 自动调节硅片制绒工艺的装置
CN105425749B (zh) * 2015-12-15 2018-03-06 西安电子科技大学 批量加工晶圆的统计过程控制方法
CN108604093A (zh) * 2016-02-05 2018-09-28 依视路国际公司 用于监测光学镜片制造过程的方法
DE102016204392A1 (de) * 2016-03-16 2017-09-21 Trumpf Werkzeugmaschinen Gmbh + Co. Kg System und Verfahren zur Produktionsplanung
KR20180022030A (ko) * 2016-08-23 2018-03-06 전자부품연구원 뉴럴 네트워크 학습을 이용한 시멘트 석회 소성 공정 온도 예측 시스템 및 방법
US10824137B2 (en) * 2017-06-19 2020-11-03 Panasonic Intellectual Property Management Co., Ltd. Mounting board manufacturing system
US11087065B2 (en) * 2018-09-26 2021-08-10 Asml Netherlands B.V. Method of manufacturing devices
US11592812B2 (en) 2019-02-19 2023-02-28 Applied Materials, Inc. Sensor metrology data integration
CN113647208B (zh) * 2019-03-28 2023-08-18 松下知识产权经营株式会社 生产数据制成装置以及生产数据制成方法
JP7601692B2 (ja) * 2021-04-13 2024-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム、及びデータ処理方法
CN116500988B (zh) * 2023-04-26 2026-02-03 创新奇智(合肥)科技有限公司 多晶硅还原炉的控制方法及装置

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WO2001050522A1 (en) * 2000-01-04 2001-07-12 Advanced Micro Devices, Inc. Method for determining optimal process targets in microelectronic fabrication
US20020095278A1 (en) * 2000-12-06 2002-07-18 Riley Terrence J. Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters

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US5270222A (en) * 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
US5937541A (en) * 1997-09-15 1999-08-17 Siemens Aktiengesellschaft Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
US6408220B1 (en) * 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques
AU5881700A (en) * 1999-06-22 2001-01-09 Brooks Automation, Inc. Run-to-run controller for use in microelectronic fabrication
US6444481B1 (en) * 2001-07-02 2002-09-03 Advanced Micro Devices, Inc. Method and apparatus for controlling a plating process

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
WO2001050522A1 (en) * 2000-01-04 2001-07-12 Advanced Micro Devices, Inc. Method for determining optimal process targets in microelectronic fabrication
US20020095278A1 (en) * 2000-12-06 2002-07-18 Riley Terrence J. Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters

Also Published As

Publication number Publication date
CN1672253A (zh) 2005-09-21
AU2003253820A1 (en) 2004-02-16
WO2004012230A9 (en) 2005-05-26
WO2004012230A3 (en) 2004-04-15
TW200402617A (en) 2004-02-16
CN100392840C (zh) 2008-06-04
TWI295755B (en) 2008-04-11
AU2003253820A8 (en) 2004-02-16
EP1532674A2 (en) 2005-05-25
US6773931B2 (en) 2004-08-10
KR20050026062A (ko) 2005-03-14
US20040029299A1 (en) 2004-02-12
WO2004012230A2 (en) 2004-02-05

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