CN100392840C - 处理控制系统用的动态目标设定方法及装置 - Google Patents

处理控制系统用的动态目标设定方法及装置 Download PDF

Info

Publication number
CN100392840C
CN100392840C CNB038181371A CN03818137A CN100392840C CN 100392840 C CN100392840 C CN 100392840C CN B038181371 A CNB038181371 A CN B038181371A CN 03818137 A CN03818137 A CN 03818137A CN 100392840 C CN100392840 C CN 100392840C
Authority
CN
China
Prior art keywords
processing
data
tool
workpiece
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038181371A
Other languages
English (en)
Chinese (zh)
Other versions
CN1672253A (zh
Inventor
A·J·帕萨丁
T·J·桑德曼
J·王
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of CN1672253A publication Critical patent/CN1672253A/zh
Application granted granted Critical
Publication of CN100392840C publication Critical patent/CN100392840C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37295—Measure workpiece while machining other workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Multi-Process Working Machines And Systems (AREA)
CNB038181371A 2002-07-29 2003-07-09 处理控制系统用的动态目标设定方法及装置 Expired - Fee Related CN100392840C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/207,525 2002-07-29
US10/207,525 US6773931B2 (en) 2002-07-29 2002-07-29 Dynamic targeting for a process control system

Publications (2)

Publication Number Publication Date
CN1672253A CN1672253A (zh) 2005-09-21
CN100392840C true CN100392840C (zh) 2008-06-04

Family

ID=31186693

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038181371A Expired - Fee Related CN100392840C (zh) 2002-07-29 2003-07-09 处理控制系统用的动态目标设定方法及装置

Country Status (8)

Country Link
US (1) US6773931B2 (https=)
EP (1) EP1532674A2 (https=)
JP (1) JP2005535114A (https=)
KR (1) KR20050026062A (https=)
CN (1) CN100392840C (https=)
AU (1) AU2003253820A1 (https=)
TW (1) TWI295755B (https=)
WO (1) WO2004012230A2 (https=)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6898558B2 (en) * 2002-12-31 2005-05-24 Tokyo Electron Limited Method and apparatus for monitoring a material processing system
TWI283817B (en) * 2003-05-30 2007-07-11 Tokyo Electron Ltd Method of operating a process control system and method of operating an advanced process control system
US20050021272A1 (en) * 2003-07-07 2005-01-27 Jenkins Naomi M. Method and apparatus for performing metrology dispatching based upon fault detection
JP4209373B2 (ja) * 2003-10-13 2009-01-14 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置またはリソグラフィ処理セルの作動方法、リソグラフィ装置およびリソグラフィ処理セル
US20050197721A1 (en) * 2004-02-20 2005-09-08 Yung-Cheng Chen Control of exposure energy on a substrate
US7415317B2 (en) * 2004-02-25 2008-08-19 Micron Technology, Inc. Method and system for correlating and combining production and non-production data for analysis
US7395130B2 (en) * 2004-02-27 2008-07-01 Micron Technology, Inc. Method and system for aggregating and combining manufacturing data for analysis
US8615314B1 (en) * 2004-09-02 2013-12-24 Advanced Micro Devices, Inc. Process control using analysis of an upstream process
US7242998B2 (en) * 2005-03-07 2007-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Etching operation management systems and methods
US8825444B1 (en) * 2005-05-19 2014-09-02 Nanometrics Incorporated Automated system check for metrology unit
US7236848B2 (en) * 2005-09-12 2007-06-26 Advanced Micro Devices, Inc. Data representation relating to a non-sampled workpiece
KR100759684B1 (ko) * 2006-04-17 2007-09-17 삼성에스디아이 주식회사 건식식각장치 및 이를 이용한 유기전계발광 표시장치의식각방법
US7954072B2 (en) * 2006-05-15 2011-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Model import for electronic design automation
US8145337B2 (en) * 2007-05-04 2012-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment
US8682466B2 (en) * 2007-05-04 2014-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic virtual metrology for semiconductor wafer result prediction
US7783999B2 (en) * 2008-01-18 2010-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Electrical parameter extraction for integrated circuit design
CN101504543B (zh) * 2008-02-05 2011-04-20 台湾积体电路制造股份有限公司 提取关键工艺参数的方法及系统
US8037575B2 (en) 2008-02-28 2011-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method for shape and timing equivalent dimension extraction
US7622308B2 (en) * 2008-03-07 2009-11-24 Mks Instruments, Inc. Process control using process data and yield data
US8271122B2 (en) 2008-03-07 2012-09-18 Mks Instruments, Inc. Process control using process data and yield data
JP2010056367A (ja) * 2008-08-29 2010-03-11 Panasonic Corp 半導体製造装置
US8001494B2 (en) * 2008-10-13 2011-08-16 Taiwan Semiconductor Manufacturing Company, Ltd. Table-based DFM for accurate post-layout analysis
US8806386B2 (en) * 2009-11-25 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. Customized patterning modulation and optimization
US8745554B2 (en) * 2009-12-28 2014-06-03 Taiwan Semiconductor Manufacturing Company, Ltd. Practical approach to layout migration
US9367882B2 (en) 2012-08-07 2016-06-14 GlobalFoundries, Inc. Waferstart processes and systems for integrated circuit fabrication
US10642255B2 (en) * 2013-08-30 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Component control in semiconductor performance processing with stable product offsets
CN104538330B (zh) * 2014-12-10 2018-07-20 苏州润阳光伏科技有限公司 自动调节硅片制绒工艺的装置
CN105425749B (zh) * 2015-12-15 2018-03-06 西安电子科技大学 批量加工晶圆的统计过程控制方法
CN108604093A (zh) * 2016-02-05 2018-09-28 依视路国际公司 用于监测光学镜片制造过程的方法
DE102016204392A1 (de) * 2016-03-16 2017-09-21 Trumpf Werkzeugmaschinen Gmbh + Co. Kg System und Verfahren zur Produktionsplanung
KR20180022030A (ko) * 2016-08-23 2018-03-06 전자부품연구원 뉴럴 네트워크 학습을 이용한 시멘트 석회 소성 공정 온도 예측 시스템 및 방법
US10824137B2 (en) * 2017-06-19 2020-11-03 Panasonic Intellectual Property Management Co., Ltd. Mounting board manufacturing system
US11087065B2 (en) * 2018-09-26 2021-08-10 Asml Netherlands B.V. Method of manufacturing devices
US11592812B2 (en) 2019-02-19 2023-02-28 Applied Materials, Inc. Sensor metrology data integration
CN113647208B (zh) * 2019-03-28 2023-08-18 松下知识产权经营株式会社 生产数据制成装置以及生产数据制成方法
JP7601692B2 (ja) * 2021-04-13 2024-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム、及びデータ処理方法
CN116500988B (zh) * 2023-04-26 2026-02-03 创新奇智(合肥)科技有限公司 多晶硅还原炉的控制方法及装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1212363A (zh) * 1997-09-15 1999-03-31 西门子公司 通过测量气体温度测量和控制半导体晶片的温度
WO2001050522A1 (en) * 2000-01-04 2001-07-12 Advanced Micro Devices, Inc. Method for determining optimal process targets in microelectronic fabrication
US20020095278A1 (en) * 2000-12-06 2002-07-18 Riley Terrence J. Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270222A (en) * 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
US6408220B1 (en) * 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques
AU5881700A (en) * 1999-06-22 2001-01-09 Brooks Automation, Inc. Run-to-run controller for use in microelectronic fabrication
US6444481B1 (en) * 2001-07-02 2002-09-03 Advanced Micro Devices, Inc. Method and apparatus for controlling a plating process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1212363A (zh) * 1997-09-15 1999-03-31 西门子公司 通过测量气体温度测量和控制半导体晶片的温度
WO2001050522A1 (en) * 2000-01-04 2001-07-12 Advanced Micro Devices, Inc. Method for determining optimal process targets in microelectronic fabrication
US20020095278A1 (en) * 2000-12-06 2002-07-18 Riley Terrence J. Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters

Also Published As

Publication number Publication date
CN1672253A (zh) 2005-09-21
AU2003253820A1 (en) 2004-02-16
WO2004012230A9 (en) 2005-05-26
WO2004012230A3 (en) 2004-04-15
JP2005535114A (ja) 2005-11-17
TW200402617A (en) 2004-02-16
TWI295755B (en) 2008-04-11
AU2003253820A8 (en) 2004-02-16
EP1532674A2 (en) 2005-05-25
US6773931B2 (en) 2004-08-10
KR20050026062A (ko) 2005-03-14
US20040029299A1 (en) 2004-02-12
WO2004012230A2 (en) 2004-02-05

Similar Documents

Publication Publication Date Title
CN100392840C (zh) 处理控制系统用的动态目标设定方法及装置
CN100578747C (zh) 用于模型预测的动态适应性取样率
US8676538B2 (en) Adjusting weighting of a parameter relating to fault detection based on a detected fault
US6751518B1 (en) Dynamic process state adjustment of a processing tool to reduce non-uniformity
KR100727048B1 (ko) 공정 제어 시스템
US6708129B1 (en) Method and apparatus for wafer-to-wafer control with partial measurement data
WO2004030081A1 (en) Correlating an inline parameter to a device operation parameter in semiconductor processing
US6597447B1 (en) Method and apparatus for periodic correction of metrology data
US20050021272A1 (en) Method and apparatus for performing metrology dispatching based upon fault detection
US6947803B1 (en) Dispatch and/or disposition of material based upon an expected parameter result
US6645780B1 (en) Method and apparatus for combining integrated and offline metrology for process control
KR101000545B1 (ko) 1차 공정 제어기를 보완하기 위한 2차 공정 제어기
US6698009B1 (en) Method and apparatus for modeling of batch dynamics based upon integrated metrology
US6834213B1 (en) Process control based upon a metrology delay
US6905895B1 (en) Predicting process excursions based upon tool state variables
US6871114B1 (en) Updating process controller based upon fault detection analysis
TWI446402B (zh) 基於資訊可信度之增進的狀態估計
US6788988B1 (en) Method and apparatus using integrated metrology data for pre-process and post-process control
US6834211B1 (en) Adjusting a trace data rate based upon a tool state
US7117062B1 (en) Determining transmission of error effects for improving parametric performance

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: GLOBALFOUNDRIES SEMICONDUCTORS CO., LTD

Free format text: FORMER OWNER: ADVANCED MICRO DEVICES CORPORATION

Effective date: 20100721

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: CALIFORNIA STATE, THE USA TO: GRAND CAYMAN ISLAND, BRITISH CAYMAN ISLANDS

TR01 Transfer of patent right

Effective date of registration: 20100721

Address after: Grand Cayman, Cayman Islands

Patentee after: Globalfoundries Semiconductor Inc.

Address before: American California

Patentee before: Advanced Micro Devices Inc.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080604

Termination date: 20160709

CF01 Termination of patent right due to non-payment of annual fee