AU2003253820A1 - Dynamic targeting for a process control system - Google Patents

Dynamic targeting for a process control system

Info

Publication number
AU2003253820A1
AU2003253820A1 AU2003253820A AU2003253820A AU2003253820A1 AU 2003253820 A1 AU2003253820 A1 AU 2003253820A1 AU 2003253820 A AU2003253820 A AU 2003253820A AU 2003253820 A AU2003253820 A AU 2003253820A AU 2003253820 A1 AU2003253820 A1 AU 2003253820A1
Authority
AU
Australia
Prior art keywords
control system
process control
dynamic targeting
targeting
dynamic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003253820A
Other languages
English (en)
Other versions
AU2003253820A8 (en
Inventor
Alexander J. Pasadyn
Thomas J. Sonderman
Jin Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2003253820A1 publication Critical patent/AU2003253820A1/en
Publication of AU2003253820A8 publication Critical patent/AU2003253820A8/xx
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37295—Measure workpiece while machining other workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Multi-Process Working Machines And Systems (AREA)
AU2003253820A 2002-07-29 2003-07-09 Dynamic targeting for a process control system Abandoned AU2003253820A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/207,525 2002-07-29
US10/207,525 US6773931B2 (en) 2002-07-29 2002-07-29 Dynamic targeting for a process control system
PCT/US2003/021285 WO2004012230A2 (en) 2002-07-29 2003-07-09 Dynamic targeting for a process control system

Publications (2)

Publication Number Publication Date
AU2003253820A1 true AU2003253820A1 (en) 2004-02-16
AU2003253820A8 AU2003253820A8 (en) 2004-02-16

Family

ID=31186693

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003253820A Abandoned AU2003253820A1 (en) 2002-07-29 2003-07-09 Dynamic targeting for a process control system

Country Status (8)

Country Link
US (1) US6773931B2 (https=)
EP (1) EP1532674A2 (https=)
JP (1) JP2005535114A (https=)
KR (1) KR20050026062A (https=)
CN (1) CN100392840C (https=)
AU (1) AU2003253820A1 (https=)
TW (1) TWI295755B (https=)
WO (1) WO2004012230A2 (https=)

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US6898558B2 (en) * 2002-12-31 2005-05-24 Tokyo Electron Limited Method and apparatus for monitoring a material processing system
TWI283817B (en) * 2003-05-30 2007-07-11 Tokyo Electron Ltd Method of operating a process control system and method of operating an advanced process control system
US20050021272A1 (en) * 2003-07-07 2005-01-27 Jenkins Naomi M. Method and apparatus for performing metrology dispatching based upon fault detection
JP4209373B2 (ja) * 2003-10-13 2009-01-14 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置またはリソグラフィ処理セルの作動方法、リソグラフィ装置およびリソグラフィ処理セル
US20050197721A1 (en) * 2004-02-20 2005-09-08 Yung-Cheng Chen Control of exposure energy on a substrate
US7415317B2 (en) * 2004-02-25 2008-08-19 Micron Technology, Inc. Method and system for correlating and combining production and non-production data for analysis
US7395130B2 (en) * 2004-02-27 2008-07-01 Micron Technology, Inc. Method and system for aggregating and combining manufacturing data for analysis
US8615314B1 (en) * 2004-09-02 2013-12-24 Advanced Micro Devices, Inc. Process control using analysis of an upstream process
US7242998B2 (en) * 2005-03-07 2007-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Etching operation management systems and methods
US8825444B1 (en) * 2005-05-19 2014-09-02 Nanometrics Incorporated Automated system check for metrology unit
US7236848B2 (en) * 2005-09-12 2007-06-26 Advanced Micro Devices, Inc. Data representation relating to a non-sampled workpiece
KR100759684B1 (ko) * 2006-04-17 2007-09-17 삼성에스디아이 주식회사 건식식각장치 및 이를 이용한 유기전계발광 표시장치의식각방법
US7954072B2 (en) * 2006-05-15 2011-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Model import for electronic design automation
US8145337B2 (en) * 2007-05-04 2012-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment
US8682466B2 (en) * 2007-05-04 2014-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic virtual metrology for semiconductor wafer result prediction
US7783999B2 (en) * 2008-01-18 2010-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Electrical parameter extraction for integrated circuit design
CN101504543B (zh) * 2008-02-05 2011-04-20 台湾积体电路制造股份有限公司 提取关键工艺参数的方法及系统
US8037575B2 (en) 2008-02-28 2011-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method for shape and timing equivalent dimension extraction
US7622308B2 (en) * 2008-03-07 2009-11-24 Mks Instruments, Inc. Process control using process data and yield data
US8271122B2 (en) 2008-03-07 2012-09-18 Mks Instruments, Inc. Process control using process data and yield data
JP2010056367A (ja) * 2008-08-29 2010-03-11 Panasonic Corp 半導体製造装置
US8001494B2 (en) * 2008-10-13 2011-08-16 Taiwan Semiconductor Manufacturing Company, Ltd. Table-based DFM for accurate post-layout analysis
US8806386B2 (en) * 2009-11-25 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. Customized patterning modulation and optimization
US8745554B2 (en) * 2009-12-28 2014-06-03 Taiwan Semiconductor Manufacturing Company, Ltd. Practical approach to layout migration
US9367882B2 (en) 2012-08-07 2016-06-14 GlobalFoundries, Inc. Waferstart processes and systems for integrated circuit fabrication
US10642255B2 (en) * 2013-08-30 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Component control in semiconductor performance processing with stable product offsets
CN104538330B (zh) * 2014-12-10 2018-07-20 苏州润阳光伏科技有限公司 自动调节硅片制绒工艺的装置
CN105425749B (zh) * 2015-12-15 2018-03-06 西安电子科技大学 批量加工晶圆的统计过程控制方法
CN108604093A (zh) * 2016-02-05 2018-09-28 依视路国际公司 用于监测光学镜片制造过程的方法
DE102016204392A1 (de) * 2016-03-16 2017-09-21 Trumpf Werkzeugmaschinen Gmbh + Co. Kg System und Verfahren zur Produktionsplanung
KR20180022030A (ko) * 2016-08-23 2018-03-06 전자부품연구원 뉴럴 네트워크 학습을 이용한 시멘트 석회 소성 공정 온도 예측 시스템 및 방법
US10824137B2 (en) * 2017-06-19 2020-11-03 Panasonic Intellectual Property Management Co., Ltd. Mounting board manufacturing system
US11087065B2 (en) * 2018-09-26 2021-08-10 Asml Netherlands B.V. Method of manufacturing devices
US11592812B2 (en) 2019-02-19 2023-02-28 Applied Materials, Inc. Sensor metrology data integration
CN113647208B (zh) * 2019-03-28 2023-08-18 松下知识产权经营株式会社 生产数据制成装置以及生产数据制成方法
JP7601692B2 (ja) * 2021-04-13 2024-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム、及びデータ処理方法
CN116500988B (zh) * 2023-04-26 2026-02-03 创新奇智(合肥)科技有限公司 多晶硅还原炉的控制方法及装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270222A (en) * 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
US5719796A (en) * 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
US5937541A (en) * 1997-09-15 1999-08-17 Siemens Aktiengesellschaft Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
US6408220B1 (en) * 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques
AU5881700A (en) * 1999-06-22 2001-01-09 Brooks Automation, Inc. Run-to-run controller for use in microelectronic fabrication
US6470230B1 (en) * 2000-01-04 2002-10-22 Advanced Micro Devices, Inc. Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication
US6856849B2 (en) * 2000-12-06 2005-02-15 Advanced Micro Devices, Inc. Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters
US6444481B1 (en) * 2001-07-02 2002-09-03 Advanced Micro Devices, Inc. Method and apparatus for controlling a plating process

Also Published As

Publication number Publication date
CN1672253A (zh) 2005-09-21
WO2004012230A9 (en) 2005-05-26
WO2004012230A3 (en) 2004-04-15
JP2005535114A (ja) 2005-11-17
TW200402617A (en) 2004-02-16
CN100392840C (zh) 2008-06-04
TWI295755B (en) 2008-04-11
AU2003253820A8 (en) 2004-02-16
EP1532674A2 (en) 2005-05-25
US6773931B2 (en) 2004-08-10
KR20050026062A (ko) 2005-03-14
US20040029299A1 (en) 2004-02-12
WO2004012230A2 (en) 2004-02-05

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase