TWI295755B - Method, apparatus and system for dynamically adjusting a process target setting and computer readable program storage device and coded with instructions - Google Patents

Method, apparatus and system for dynamically adjusting a process target setting and computer readable program storage device and coded with instructions Download PDF

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Publication number
TWI295755B
TWI295755B TW092118443A TW92118443A TWI295755B TW I295755 B TWI295755 B TW I295755B TW 092118443 A TW092118443 A TW 092118443A TW 92118443 A TW92118443 A TW 92118443A TW I295755 B TWI295755 B TW I295755B
Authority
TW
Taiwan
Prior art keywords
data
tool
workpiece
target setting
processing
Prior art date
Application number
TW092118443A
Other languages
English (en)
Chinese (zh)
Other versions
TW200402617A (en
Inventor
J Pasadyn Alexander
J Sonderman Thomas
Wang Jin
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of TW200402617A publication Critical patent/TW200402617A/zh
Application granted granted Critical
Publication of TWI295755B publication Critical patent/TWI295755B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37295—Measure workpiece while machining other workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Multi-Process Working Machines And Systems (AREA)
TW092118443A 2002-07-29 2003-07-07 Method, apparatus and system for dynamically adjusting a process target setting and computer readable program storage device and coded with instructions TWI295755B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/207,525 US6773931B2 (en) 2002-07-29 2002-07-29 Dynamic targeting for a process control system

Publications (2)

Publication Number Publication Date
TW200402617A TW200402617A (en) 2004-02-16
TWI295755B true TWI295755B (en) 2008-04-11

Family

ID=31186693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092118443A TWI295755B (en) 2002-07-29 2003-07-07 Method, apparatus and system for dynamically adjusting a process target setting and computer readable program storage device and coded with instructions

Country Status (8)

Country Link
US (1) US6773931B2 (https=)
EP (1) EP1532674A2 (https=)
JP (1) JP2005535114A (https=)
KR (1) KR20050026062A (https=)
CN (1) CN100392840C (https=)
AU (1) AU2003253820A1 (https=)
TW (1) TWI295755B (https=)
WO (1) WO2004012230A2 (https=)

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US6898558B2 (en) * 2002-12-31 2005-05-24 Tokyo Electron Limited Method and apparatus for monitoring a material processing system
TWI283817B (en) * 2003-05-30 2007-07-11 Tokyo Electron Ltd Method of operating a process control system and method of operating an advanced process control system
US20050021272A1 (en) * 2003-07-07 2005-01-27 Jenkins Naomi M. Method and apparatus for performing metrology dispatching based upon fault detection
JP4209373B2 (ja) * 2003-10-13 2009-01-14 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置またはリソグラフィ処理セルの作動方法、リソグラフィ装置およびリソグラフィ処理セル
US20050197721A1 (en) * 2004-02-20 2005-09-08 Yung-Cheng Chen Control of exposure energy on a substrate
US7415317B2 (en) * 2004-02-25 2008-08-19 Micron Technology, Inc. Method and system for correlating and combining production and non-production data for analysis
US7395130B2 (en) * 2004-02-27 2008-07-01 Micron Technology, Inc. Method and system for aggregating and combining manufacturing data for analysis
US8615314B1 (en) * 2004-09-02 2013-12-24 Advanced Micro Devices, Inc. Process control using analysis of an upstream process
US7242998B2 (en) * 2005-03-07 2007-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Etching operation management systems and methods
US8825444B1 (en) * 2005-05-19 2014-09-02 Nanometrics Incorporated Automated system check for metrology unit
US7236848B2 (en) * 2005-09-12 2007-06-26 Advanced Micro Devices, Inc. Data representation relating to a non-sampled workpiece
KR100759684B1 (ko) * 2006-04-17 2007-09-17 삼성에스디아이 주식회사 건식식각장치 및 이를 이용한 유기전계발광 표시장치의식각방법
US7954072B2 (en) * 2006-05-15 2011-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Model import for electronic design automation
US8145337B2 (en) * 2007-05-04 2012-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment
US8682466B2 (en) * 2007-05-04 2014-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic virtual metrology for semiconductor wafer result prediction
US7783999B2 (en) * 2008-01-18 2010-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Electrical parameter extraction for integrated circuit design
CN101504543B (zh) * 2008-02-05 2011-04-20 台湾积体电路制造股份有限公司 提取关键工艺参数的方法及系统
US8037575B2 (en) 2008-02-28 2011-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method for shape and timing equivalent dimension extraction
US7622308B2 (en) * 2008-03-07 2009-11-24 Mks Instruments, Inc. Process control using process data and yield data
US8271122B2 (en) 2008-03-07 2012-09-18 Mks Instruments, Inc. Process control using process data and yield data
JP2010056367A (ja) * 2008-08-29 2010-03-11 Panasonic Corp 半導体製造装置
US8001494B2 (en) * 2008-10-13 2011-08-16 Taiwan Semiconductor Manufacturing Company, Ltd. Table-based DFM for accurate post-layout analysis
US8806386B2 (en) * 2009-11-25 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. Customized patterning modulation and optimization
US8745554B2 (en) * 2009-12-28 2014-06-03 Taiwan Semiconductor Manufacturing Company, Ltd. Practical approach to layout migration
US9367882B2 (en) 2012-08-07 2016-06-14 GlobalFoundries, Inc. Waferstart processes and systems for integrated circuit fabrication
US10642255B2 (en) * 2013-08-30 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Component control in semiconductor performance processing with stable product offsets
CN104538330B (zh) * 2014-12-10 2018-07-20 苏州润阳光伏科技有限公司 自动调节硅片制绒工艺的装置
CN105425749B (zh) * 2015-12-15 2018-03-06 西安电子科技大学 批量加工晶圆的统计过程控制方法
CN108604093A (zh) * 2016-02-05 2018-09-28 依视路国际公司 用于监测光学镜片制造过程的方法
DE102016204392A1 (de) * 2016-03-16 2017-09-21 Trumpf Werkzeugmaschinen Gmbh + Co. Kg System und Verfahren zur Produktionsplanung
KR20180022030A (ko) * 2016-08-23 2018-03-06 전자부품연구원 뉴럴 네트워크 학습을 이용한 시멘트 석회 소성 공정 온도 예측 시스템 및 방법
US10824137B2 (en) * 2017-06-19 2020-11-03 Panasonic Intellectual Property Management Co., Ltd. Mounting board manufacturing system
US11087065B2 (en) * 2018-09-26 2021-08-10 Asml Netherlands B.V. Method of manufacturing devices
US11592812B2 (en) 2019-02-19 2023-02-28 Applied Materials, Inc. Sensor metrology data integration
CN113647208B (zh) * 2019-03-28 2023-08-18 松下知识产权经营株式会社 生产数据制成装置以及生产数据制成方法
JP7601692B2 (ja) * 2021-04-13 2024-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム、及びデータ処理方法
CN116500988B (zh) * 2023-04-26 2026-02-03 创新奇智(合肥)科技有限公司 多晶硅还原炉的控制方法及装置

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US6856849B2 (en) * 2000-12-06 2005-02-15 Advanced Micro Devices, Inc. Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters
US6444481B1 (en) * 2001-07-02 2002-09-03 Advanced Micro Devices, Inc. Method and apparatus for controlling a plating process

Also Published As

Publication number Publication date
CN1672253A (zh) 2005-09-21
AU2003253820A1 (en) 2004-02-16
WO2004012230A9 (en) 2005-05-26
WO2004012230A3 (en) 2004-04-15
JP2005535114A (ja) 2005-11-17
TW200402617A (en) 2004-02-16
CN100392840C (zh) 2008-06-04
AU2003253820A8 (en) 2004-02-16
EP1532674A2 (en) 2005-05-25
US6773931B2 (en) 2004-08-10
KR20050026062A (ko) 2005-03-14
US20040029299A1 (en) 2004-02-12
WO2004012230A2 (en) 2004-02-05

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