JP2005531926A5 - - Google Patents

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Publication number
JP2005531926A5
JP2005531926A5 JP2004517576A JP2004517576A JP2005531926A5 JP 2005531926 A5 JP2005531926 A5 JP 2005531926A5 JP 2004517576 A JP2004517576 A JP 2004517576A JP 2004517576 A JP2004517576 A JP 2004517576A JP 2005531926 A5 JP2005531926 A5 JP 2005531926A5
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JP
Japan
Prior art keywords
etching process
etching
tool
etch
etch process
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JP2004517576A
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English (en)
Japanese (ja)
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JP4995419B2 (ja
JP2005531926A (ja
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Priority claimed from PCT/US2003/016239 external-priority patent/WO2004003822A1/en
Publication of JP2005531926A publication Critical patent/JP2005531926A/ja
Publication of JP2005531926A5 publication Critical patent/JP2005531926A5/ja
Application granted granted Critical
Publication of JP4995419B2 publication Critical patent/JP4995419B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004517576A 2002-06-28 2003-06-27 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム Expired - Fee Related JP4995419B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39196602P 2002-06-28 2002-06-28
US60/391,966 2002-06-28
PCT/US2003/016239 WO2004003822A1 (en) 2002-06-28 2003-06-27 Controlling a material processing tool and performance data

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009258231A Division JP2010093272A (ja) 2002-06-28 2009-11-11 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム

Publications (3)

Publication Number Publication Date
JP2005531926A JP2005531926A (ja) 2005-10-20
JP2005531926A5 true JP2005531926A5 (enExample) 2011-10-20
JP4995419B2 JP4995419B2 (ja) 2012-08-08

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2004517576A Expired - Fee Related JP4995419B2 (ja) 2002-06-28 2003-06-27 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム
JP2009258231A Pending JP2010093272A (ja) 2002-06-28 2009-11-11 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2009258231A Pending JP2010093272A (ja) 2002-06-28 2009-11-11 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム

Country Status (5)

Country Link
US (1) US7167766B2 (enExample)
JP (2) JP4995419B2 (enExample)
AU (1) AU2003256257A1 (enExample)
TW (1) TWI239032B (enExample)
WO (1) WO2004003822A1 (enExample)

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WO2006021251A1 (en) * 2004-08-26 2006-03-02 Scientific Systems Research Limited A method for transferring process control models between plasma procesing chambers
WO2006034179A2 (en) * 2004-09-17 2006-03-30 Mks Instruments, Inc. Method and apparatus for multivariate control of semiconductor manufacturing processes
US8676538B2 (en) 2004-11-02 2014-03-18 Advanced Micro Devices, Inc. Adjusting weighting of a parameter relating to fault detection based on a detected fault
US8825444B1 (en) * 2005-05-19 2014-09-02 Nanometrics Incorporated Automated system check for metrology unit
US7352439B2 (en) * 2006-08-02 2008-04-01 Asml Netherlands B.V. Lithography system, control system and device manufacturing method
US20080233269A1 (en) * 2007-03-20 2008-09-25 Tokyo Electron Limited Apparatus and methods for applying a layer of a spin-on material on a series of substrates
US8699027B2 (en) * 2007-07-27 2014-04-15 Rudolph Technologies, Inc. Multiple measurement techniques including focused beam scatterometry for characterization of samples
US8126881B1 (en) * 2007-12-12 2012-02-28 Vast.com, Inc. Predictive conversion systems and methods
US8224475B2 (en) * 2009-03-13 2012-07-17 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for advanced process control
US8983631B2 (en) * 2009-06-30 2015-03-17 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8538572B2 (en) * 2009-06-30 2013-09-17 Lam Research Corporation Methods for constructing an optimal endpoint algorithm
US8473089B2 (en) * 2009-06-30 2013-06-25 Lam Research Corporation Methods and apparatus for predictive preventive maintenance of processing chambers
US8618807B2 (en) * 2009-06-30 2013-12-31 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US10295993B2 (en) 2011-09-01 2019-05-21 Kla-Tencor Corporation Method and system for detecting and correcting problematic advanced process control parameters
CN102492931B (zh) * 2011-12-12 2013-07-31 合肥工业大学 物理气相薄膜沉积工艺中控制薄膜沉积速率的模型补偿方法
US9002498B2 (en) * 2012-02-02 2015-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Tool function to improve fab process in semiconductor manufacturing
US10128090B2 (en) 2012-02-22 2018-11-13 Lam Research Corporation RF impedance model based fault detection
US9114666B2 (en) 2012-02-22 2015-08-25 Lam Research Corporation Methods and apparatus for controlling plasma in a plasma processing system
US9197196B2 (en) 2012-02-22 2015-11-24 Lam Research Corporation State-based adjustment of power and frequency
US9462672B2 (en) 2012-02-22 2016-10-04 Lam Research Corporation Adjustment of power and frequency based on three or more states
US9842725B2 (en) 2013-01-31 2017-12-12 Lam Research Corporation Using modeling to determine ion energy associated with a plasma system
US10157729B2 (en) 2012-02-22 2018-12-18 Lam Research Corporation Soft pulsing
JP2013251071A (ja) * 2012-05-30 2013-12-12 Advantest Corp 信号測定装置、信号測定方法、プログラム、記録媒体
WO2014009942A1 (en) 2012-07-10 2014-01-16 Matitiahu Tiano A modular system for real-time evaluation and monitoring of a machining production-line overall performances calculated from each given workpiece, tool and machine
CN104570942A (zh) * 2013-10-15 2015-04-29 鸿富锦精密工业（深圳）有限公司 Cnc加工能力验证系统及方法
US20150147830A1 (en) * 2013-11-26 2015-05-28 Applied Materials, Inc. Detection of substrate defects by tracking processing parameters
US10950421B2 (en) * 2014-04-21 2021-03-16 Lam Research Corporation Using modeling for identifying a location of a fault in an RF transmission system for a plasma system
CN113675115B (zh) 2015-05-22 2025-08-08 应用材料公司 方位可调整的多区域静电夹具
CN107301941B (zh) * 2016-04-14 2019-04-23 北京北方华创微电子装备有限公司 等离子体处理设备及其操作方法
US10784174B2 (en) * 2017-10-13 2020-09-22 Lam Research Corporation Method and apparatus for determining etch process parameters
CN111985673A (zh) * 2019-05-22 2020-11-24 三菱重工业株式会社 预测装置、预测系统、预测方法以及记录介质
CN114914165B (zh) * 2022-05-06 2024-09-20 北京燕东微电子科技有限公司 监测晶圆腐蚀液更换周期的方法
US20240184858A1 (en) * 2022-12-05 2024-06-06 Applied Materials, Inc. Methods and mechanisms for automatic sensor grouping to improve anomaly detection

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JPH06132251A (ja) * 1992-10-19 1994-05-13 Hitachi Ltd プラズマエッチング装置のエッチングモニタ
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US20030045098A1 (en) * 2001-08-31 2003-03-06 Applied Materials, Inc. Method and apparatus for processing a wafer
US6960416B2 (en) * 2002-03-01 2005-11-01 Applied Materials, Inc. Method and apparatus for controlling etch processes during fabrication of semiconductor devices

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