JP4995419B2 - 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム - Google Patents

材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム Download PDF

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Publication number
JP4995419B2
JP4995419B2 JP2004517576A JP2004517576A JP4995419B2 JP 4995419 B2 JP4995419 B2 JP 4995419B2 JP 2004517576 A JP2004517576 A JP 2004517576A JP 2004517576 A JP2004517576 A JP 2004517576A JP 4995419 B2 JP4995419 B2 JP 4995419B2
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Prior art keywords
etching
tool
etch process
etching process
etch
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JP2004517576A
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Japanese (ja)
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JP2005531926A5 (enExample
JP2005531926A (ja
Inventor
ラム、ヒュー・エー
ユ、ホンギュ
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31443—Keep track of nc program, recipe program
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32366—Line performance evaluation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
JP2004517576A 2002-06-28 2003-06-27 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム Expired - Fee Related JP4995419B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39196602P 2002-06-28 2002-06-28
US60/391,966 2002-06-28
PCT/US2003/016239 WO2004003822A1 (en) 2002-06-28 2003-06-27 Controlling a material processing tool and performance data

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009258231A Division JP2010093272A (ja) 2002-06-28 2009-11-11 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム

Publications (3)

Publication Number Publication Date
JP2005531926A JP2005531926A (ja) 2005-10-20
JP2005531926A5 JP2005531926A5 (enExample) 2011-10-20
JP4995419B2 true JP4995419B2 (ja) 2012-08-08

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Family Applications (2)

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JP2004517576A Expired - Fee Related JP4995419B2 (ja) 2002-06-28 2003-06-27 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム
JP2009258231A Pending JP2010093272A (ja) 2002-06-28 2009-11-11 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム

Family Applications After (1)

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JP2009258231A Pending JP2010093272A (ja) 2002-06-28 2009-11-11 材料プロセスツール及びパフォーマンスデータを用いてプロセスを制御する方法及びシステム

Country Status (5)

Country Link
US (1) US7167766B2 (enExample)
JP (2) JP4995419B2 (enExample)
AU (1) AU2003256257A1 (enExample)
TW (1) TWI239032B (enExample)
WO (1) WO2004003822A1 (enExample)

Cited By (1)

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US10440777B2 (en) 2015-05-22 2019-10-08 Applied Materials, Inc. Azimuthally tunable multi-zone electrostatic chuck

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US7127358B2 (en) * 2004-03-30 2006-10-24 Tokyo Electron Limited Method and system for run-to-run control
JP4678372B2 (ja) * 2004-06-29 2011-04-27 株式会社ニコン 管理方法及び管理システム、並びにプログラム
WO2006021251A1 (en) * 2004-08-26 2006-03-02 Scientific Systems Research Limited A method for transferring process control models between plasma procesing chambers
TW200632719A (en) * 2004-09-17 2006-09-16 Mks Instr Inc Multivariate control of semiconductor processes
US8676538B2 (en) * 2004-11-02 2014-03-18 Advanced Micro Devices, Inc. Adjusting weighting of a parameter relating to fault detection based on a detected fault
US8825444B1 (en) * 2005-05-19 2014-09-02 Nanometrics Incorporated Automated system check for metrology unit
US7352439B2 (en) * 2006-08-02 2008-04-01 Asml Netherlands B.V. Lithography system, control system and device manufacturing method
US20080233269A1 (en) * 2007-03-20 2008-09-25 Tokyo Electron Limited Apparatus and methods for applying a layer of a spin-on material on a series of substrates
US8699027B2 (en) * 2007-07-27 2014-04-15 Rudolph Technologies, Inc. Multiple measurement techniques including focused beam scatterometry for characterization of samples
US8126881B1 (en) * 2007-12-12 2012-02-28 Vast.com, Inc. Predictive conversion systems and methods
US8224475B2 (en) * 2009-03-13 2012-07-17 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for advanced process control
US8473089B2 (en) * 2009-06-30 2013-06-25 Lam Research Corporation Methods and apparatus for predictive preventive maintenance of processing chambers
US8618807B2 (en) * 2009-06-30 2013-12-31 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8538572B2 (en) * 2009-06-30 2013-09-17 Lam Research Corporation Methods for constructing an optimal endpoint algorithm
US8983631B2 (en) * 2009-06-30 2015-03-17 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US10295993B2 (en) * 2011-09-01 2019-05-21 Kla-Tencor Corporation Method and system for detecting and correcting problematic advanced process control parameters
CN102492931B (zh) * 2011-12-12 2013-07-31 合肥工业大学 物理气相薄膜沉积工艺中控制薄膜沉积速率的模型补偿方法
US9002498B2 (en) * 2012-02-02 2015-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Tool function to improve fab process in semiconductor manufacturing
US10157729B2 (en) 2012-02-22 2018-12-18 Lam Research Corporation Soft pulsing
US9114666B2 (en) 2012-02-22 2015-08-25 Lam Research Corporation Methods and apparatus for controlling plasma in a plasma processing system
US9462672B2 (en) 2012-02-22 2016-10-04 Lam Research Corporation Adjustment of power and frequency based on three or more states
US9197196B2 (en) 2012-02-22 2015-11-24 Lam Research Corporation State-based adjustment of power and frequency
US10128090B2 (en) 2012-02-22 2018-11-13 Lam Research Corporation RF impedance model based fault detection
US9842725B2 (en) 2013-01-31 2017-12-12 Lam Research Corporation Using modeling to determine ion energy associated with a plasma system
JP2013251071A (ja) * 2012-05-30 2013-12-12 Advantest Corp 信号測定装置、信号測定方法、プログラム、記録媒体
US10101735B2 (en) 2012-07-10 2018-10-16 Matitiahu Tiano Modular system for real-time evaluation and monitoring of a machining production-line overall performances calculated from each given workpiece, tool and machine
CN104570942A (zh) * 2013-10-15 2015-04-29 鸿富锦精密工业（深圳）有限公司 Cnc加工能力验证系统及方法
US20150147830A1 (en) * 2013-11-26 2015-05-28 Applied Materials, Inc. Detection of substrate defects by tracking processing parameters
US10950421B2 (en) * 2014-04-21 2021-03-16 Lam Research Corporation Using modeling for identifying a location of a fault in an RF transmission system for a plasma system
CN107301941B (zh) * 2016-04-14 2019-04-23 北京北方华创微电子装备有限公司 等离子体处理设备及其操作方法
US10784174B2 (en) * 2017-10-13 2020-09-22 Lam Research Corporation Method and apparatus for determining etch process parameters
CN111985673A (zh) * 2019-05-22 2020-11-24 三菱重工业株式会社 预测装置、预测系统、预测方法以及记录介质
CN114914165B (zh) * 2022-05-06 2024-09-20 北京燕东微电子科技有限公司 监测晶圆腐蚀液更换周期的方法
US20240184858A1 (en) * 2022-12-05 2024-06-06 Applied Materials, Inc. Methods and mechanisms for automatic sensor grouping to improve anomaly detection

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US20030045098A1 (en) * 2001-08-31 2003-03-06 Applied Materials, Inc. Method and apparatus for processing a wafer
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11622419B2 (en) 2015-01-18 2023-04-04 Applied Materials, Inc. Azimuthally tunable multi-zone electrostatic chuck
US10440777B2 (en) 2015-05-22 2019-10-08 Applied Materials, Inc. Azimuthally tunable multi-zone electrostatic chuck

Also Published As

Publication number Publication date
US20050234574A1 (en) 2005-10-20
TWI239032B (en) 2005-09-01
JP2005531926A (ja) 2005-10-20
US7167766B2 (en) 2007-01-23
TW200404330A (en) 2004-03-16
WO2004003822A1 (en) 2004-01-08
AU2003256257A1 (en) 2004-01-19
JP2010093272A (ja) 2010-04-22

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