TWI239032B - Method and system for controlling a process using material processing tool and performance data - Google Patents
Method and system for controlling a process using material processing tool and performance data Download PDFInfo
- Publication number
- TWI239032B TWI239032B TW092117603A TW92117603A TWI239032B TW I239032 B TWI239032 B TW I239032B TW 092117603 A TW092117603 A TW 092117603A TW 92117603 A TW92117603 A TW 92117603A TW I239032 B TWI239032 B TW I239032B
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Links
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Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31443—Keep track of nc program, recipe program
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32366—Line performance evaluation
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39196602P | 2002-06-28 | 2002-06-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200404330A TW200404330A (en) | 2004-03-16 |
| TWI239032B true TWI239032B (en) | 2005-09-01 |
Family
ID=30000786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092117603A TWI239032B (en) | 2002-06-28 | 2003-06-27 | Method and system for controlling a process using material processing tool and performance data |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7167766B2 (enExample) |
| JP (2) | JP4995419B2 (enExample) |
| AU (1) | AU2003256257A1 (enExample) |
| TW (1) | TWI239032B (enExample) |
| WO (1) | WO2004003822A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101840207A (zh) * | 2009-03-13 | 2010-09-22 | 台湾积体电路制造股份有限公司 | 先进工艺控制的方法和装置 |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7127358B2 (en) * | 2004-03-30 | 2006-10-24 | Tokyo Electron Limited | Method and system for run-to-run control |
| JP4678372B2 (ja) * | 2004-06-29 | 2011-04-27 | 株式会社ニコン | 管理方法及び管理システム、並びにプログラム |
| WO2006021251A1 (en) * | 2004-08-26 | 2006-03-02 | Scientific Systems Research Limited | A method for transferring process control models between plasma procesing chambers |
| WO2006034179A2 (en) * | 2004-09-17 | 2006-03-30 | Mks Instruments, Inc. | Method and apparatus for multivariate control of semiconductor manufacturing processes |
| US8676538B2 (en) | 2004-11-02 | 2014-03-18 | Advanced Micro Devices, Inc. | Adjusting weighting of a parameter relating to fault detection based on a detected fault |
| US8825444B1 (en) * | 2005-05-19 | 2014-09-02 | Nanometrics Incorporated | Automated system check for metrology unit |
| US7352439B2 (en) * | 2006-08-02 | 2008-04-01 | Asml Netherlands B.V. | Lithography system, control system and device manufacturing method |
| US20080233269A1 (en) * | 2007-03-20 | 2008-09-25 | Tokyo Electron Limited | Apparatus and methods for applying a layer of a spin-on material on a series of substrates |
| US8699027B2 (en) * | 2007-07-27 | 2014-04-15 | Rudolph Technologies, Inc. | Multiple measurement techniques including focused beam scatterometry for characterization of samples |
| US8126881B1 (en) * | 2007-12-12 | 2012-02-28 | Vast.com, Inc. | Predictive conversion systems and methods |
| US8983631B2 (en) * | 2009-06-30 | 2015-03-17 | Lam Research Corporation | Arrangement for identifying uncontrolled events at the process module level and methods thereof |
| US8538572B2 (en) * | 2009-06-30 | 2013-09-17 | Lam Research Corporation | Methods for constructing an optimal endpoint algorithm |
| US8473089B2 (en) * | 2009-06-30 | 2013-06-25 | Lam Research Corporation | Methods and apparatus for predictive preventive maintenance of processing chambers |
| US8618807B2 (en) * | 2009-06-30 | 2013-12-31 | Lam Research Corporation | Arrangement for identifying uncontrolled events at the process module level and methods thereof |
| US10295993B2 (en) | 2011-09-01 | 2019-05-21 | Kla-Tencor Corporation | Method and system for detecting and correcting problematic advanced process control parameters |
| CN102492931B (zh) * | 2011-12-12 | 2013-07-31 | 合肥工业大学 | 物理气相薄膜沉积工艺中控制薄膜沉积速率的模型补偿方法 |
| US9002498B2 (en) * | 2012-02-02 | 2015-04-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Tool function to improve fab process in semiconductor manufacturing |
| US10128090B2 (en) | 2012-02-22 | 2018-11-13 | Lam Research Corporation | RF impedance model based fault detection |
| US9114666B2 (en) | 2012-02-22 | 2015-08-25 | Lam Research Corporation | Methods and apparatus for controlling plasma in a plasma processing system |
| US9197196B2 (en) | 2012-02-22 | 2015-11-24 | Lam Research Corporation | State-based adjustment of power and frequency |
| US9462672B2 (en) | 2012-02-22 | 2016-10-04 | Lam Research Corporation | Adjustment of power and frequency based on three or more states |
| US9842725B2 (en) | 2013-01-31 | 2017-12-12 | Lam Research Corporation | Using modeling to determine ion energy associated with a plasma system |
| US10157729B2 (en) | 2012-02-22 | 2018-12-18 | Lam Research Corporation | Soft pulsing |
| JP2013251071A (ja) * | 2012-05-30 | 2013-12-12 | Advantest Corp | 信号測定装置、信号測定方法、プログラム、記録媒体 |
| WO2014009942A1 (en) | 2012-07-10 | 2014-01-16 | Matitiahu Tiano | A modular system for real-time evaluation and monitoring of a machining production-line overall performances calculated from each given workpiece, tool and machine |
| CN104570942A (zh) * | 2013-10-15 | 2015-04-29 | 鸿富锦精密工业（深圳）有限公司 | Cnc加工能力验证系统及方法 |
| US20150147830A1 (en) * | 2013-11-26 | 2015-05-28 | Applied Materials, Inc. | Detection of substrate defects by tracking processing parameters |
| US10950421B2 (en) * | 2014-04-21 | 2021-03-16 | Lam Research Corporation | Using modeling for identifying a location of a fault in an RF transmission system for a plasma system |
| CN113675115B (zh) | 2015-05-22 | 2025-08-08 | 应用材料公司 | 方位可调整的多区域静电夹具 |
| CN107301941B (zh) * | 2016-04-14 | 2019-04-23 | 北京北方华创微电子装备有限公司 | 等离子体处理设备及其操作方法 |
| US10784174B2 (en) * | 2017-10-13 | 2020-09-22 | Lam Research Corporation | Method and apparatus for determining etch process parameters |
| CN111985673A (zh) * | 2019-05-22 | 2020-11-24 | 三菱重工业株式会社 | 预测装置、预测系统、预测方法以及记录介质 |
| CN114914165B (zh) * | 2022-05-06 | 2024-09-20 | 北京燕东微电子科技有限公司 | 监测晶圆腐蚀液更换周期的方法 |
| US20240184858A1 (en) * | 2022-12-05 | 2024-06-06 | Applied Materials, Inc. | Methods and mechanisms for automatic sensor grouping to improve anomaly detection |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH04212414A (ja) * | 1990-08-16 | 1992-08-04 | Fuji Electric Co Ltd | プラズマ処理装置 |
| JPH06132251A (ja) * | 1992-10-19 | 1994-05-13 | Hitachi Ltd | プラズマエッチング装置のエッチングモニタ |
| US5591299A (en) | 1995-04-28 | 1997-01-07 | Advanced Micro Devices, Inc. | System for providing integrated monitoring, control and diagnostics functions for semiconductor spray process tools |
| WO1997012300A1 (en) * | 1995-09-26 | 1997-04-03 | Boiquaye William J N O | Adaptive control process and system |
| JP3630931B2 (ja) * | 1996-08-29 | 2005-03-23 | 富士通株式会社 | プラズマ処理装置、プロセスモニタ方法及び半導体装置の製造方法 |
| US6000830A (en) | 1997-04-18 | 1999-12-14 | Tokyo Electron Limited | System for applying recipe of semiconductor manufacturing apparatus |
| US6035293A (en) | 1997-10-20 | 2000-03-07 | Advanced Micro Devices, Inc. | Validating process data in manufacturing process management |
| US6153115A (en) * | 1997-10-23 | 2000-11-28 | Massachusetts Institute Of Technology | Monitor of plasma processes with multivariate statistical analysis of plasma emission spectra |
| US6151532A (en) * | 1998-03-03 | 2000-11-21 | Lam Research Corporation | Method and apparatus for predicting plasma-process surface profiles |
| US8044793B2 (en) * | 2001-03-01 | 2011-10-25 | Fisher-Rosemount Systems, Inc. | Integrated device alerts in a process control system |
| US6415193B1 (en) | 1999-07-08 | 2002-07-02 | Fabcentric, Inc. | Recipe editor for editing and creating process recipes with parameter-level semiconductor-manufacturing equipment |
| JP5789353B2 (ja) * | 2000-09-20 | 2015-10-07 | ケーエルエー−テンカー コーポレイション | 半導体製造プロセスのための方法とシステム |
| US20020192966A1 (en) * | 2001-06-19 | 2002-12-19 | Shanmugasundram Arulkumar P. | In situ sensor based control of semiconductor processing procedure |
| US20030045098A1 (en) * | 2001-08-31 | 2003-03-06 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
| US6960416B2 (en) * | 2002-03-01 | 2005-11-01 | Applied Materials, Inc. | Method and apparatus for controlling etch processes during fabrication of semiconductor devices |
-
2003
- 2003-06-27 TW TW092117603A patent/TWI239032B/zh not_active IP Right Cessation
- 2003-06-27 US US10/512,863 patent/US7167766B2/en not_active Expired - Lifetime
- 2003-06-27 JP JP2004517576A patent/JP4995419B2/ja not_active Expired - Fee Related
- 2003-06-27 AU AU2003256257A patent/AU2003256257A1/en not_active Abandoned
- 2003-06-27 WO PCT/US2003/016239 patent/WO2004003822A1/en not_active Ceased
-
2009
- 2009-11-11 JP JP2009258231A patent/JP2010093272A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101840207A (zh) * | 2009-03-13 | 2010-09-22 | 台湾积体电路制造股份有限公司 | 先进工艺控制的方法和装置 |
| CN101840207B (zh) * | 2009-03-13 | 2013-01-23 | 台湾积体电路制造股份有限公司 | 先进工艺控制的方法和装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4995419B2 (ja) | 2012-08-08 |
| JP2010093272A (ja) | 2010-04-22 |
| JP2005531926A (ja) | 2005-10-20 |
| US7167766B2 (en) | 2007-01-23 |
| WO2004003822A1 (en) | 2004-01-08 |
| TW200404330A (en) | 2004-03-16 |
| US20050234574A1 (en) | 2005-10-20 |
| AU2003256257A1 (en) | 2004-01-19 |
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| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |