JP2005525556A - 集積回路試験用プローブカード - Google Patents
集積回路試験用プローブカード Download PDFInfo
- Publication number
- JP2005525556A JP2005525556A JP2004503975A JP2004503975A JP2005525556A JP 2005525556 A JP2005525556 A JP 2005525556A JP 2004503975 A JP2004503975 A JP 2004503975A JP 2004503975 A JP2004503975 A JP 2004503975A JP 2005525556 A JP2005525556 A JP 2005525556A
- Authority
- JP
- Japan
- Prior art keywords
- die
- probe
- test
- pad
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 150
- 239000000523 sample Substances 0.000 title claims abstract description 136
- 239000000758 substrate Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 230000008901 benefit Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
Claims (19)
- テスターに結合されている第1のダイと、
試験用に設計されている第2のダイと、
前記第1のダイと前記第2のダイの間の脱着可能な接続であって、前記第1のダイから前記第2のダイの接触点に信号を接続するように設計されている脱着可能な接続とを含む試験環境。 - 前記脱着可能な接続が導電性エラストマー介在体を含む請求項1に記載の試験環境。
- 前記脱着可能な接続が前記第1のダイに取り付けられているプローブを含む請求項1に記載の試験環境。
- 前記第1のダイがダイのアレイの一部である請求項1に記載の試験環境。
- 前記第2のダイが半導体ウエハの一部である請求項1に記載の試験環境。
- 前記第1のダイ上の第1の層と、
前記第2のダイ上のパッドに結合されている前記第1の層上のパッドとをさらに含む請求項1に記載の試験環境。 - 前記第1のダイの上に重なっている第2の層であって、前記第1の層のパッドを前記第2のダイのパッドに結合するパッドを含む第2の層をさらに含む請求項6に記載の試験環境。
- 前記テスターに結合されている回路基板と基板との間の断熱材をさらに含み、前記第1のダイが該基板に取り付けられている請求項1に記載の試験環境。
- 前記基板がセラミック製の円盤を含む請求項8に記載の試験環境。
- 前記第1のダイがプローブカード上に配置されている請求項1に記載の試験環境。
- 信号を生成するステップと、
第1のダイから、試験用に設計されている第2のダイ上の接触点に前記信号を取り去り可能に結合するステップとを含む集積回路の試験方法。 - 前記信号がテスターによって生成される請求項11に記載の方法。
- 前記第1のダイから前記第2のダイ上の前記接触点に前記信号を取り去り可能に結合するステップが、前記第1のダイと前記第2のダイの間にエラストマー製の介在体を設けるステップを含む請求項11に記載の方法。
- 前記第1のダイから前記第2のダイ上の前記接触点に前記信号を取り去り可能に結合するステップが、前記接触点をプローブに接触させるステップを含む請求項11に記載の方法。
- 前記第2のダイがウエハの一部である請求項11に記載の方法。
- 前記接触点がパッドを含む請求項11に記載の方法。
- テスターから信号を受容するための手段と、
試験用に設計されている第2のダイに第1のダイを結合するための手段とを含む集積回路を試験するためのプローブカード。 - 前記第1のダイのパッド配列に適合させるための手段をさらに含む請求項17に記載のプローブカード。
- 前記受容するための手段から前記第1のダイに前記信号を結合するための手段をさらに含む請求項17に記載のプローブカード。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/144,676 US6847218B1 (en) | 2002-05-13 | 2002-05-13 | Probe card with an adapter layer for testing integrated circuits |
PCT/US2003/014844 WO2003096035A1 (en) | 2002-05-13 | 2003-05-12 | Probe card for testing integrated circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005525556A true JP2005525556A (ja) | 2005-08-25 |
Family
ID=29418521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004503975A Pending JP2005525556A (ja) | 2002-05-13 | 2003-05-12 | 集積回路試験用プローブカード |
Country Status (6)
Country | Link |
---|---|
US (1) | US6847218B1 (ja) |
JP (1) | JP2005525556A (ja) |
KR (1) | KR20050063752A (ja) |
CN (1) | CN1668931A (ja) |
AU (1) | AU2003245273A1 (ja) |
WO (1) | WO2003096035A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015014556A (ja) * | 2013-07-08 | 2015-01-22 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP2015014555A (ja) * | 2013-07-08 | 2015-01-22 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP2016191563A (ja) * | 2015-03-30 | 2016-11-10 | 株式会社東芝 | プローブカード及びそれを含む試験装置 |
JP2018146444A (ja) * | 2017-03-07 | 2018-09-20 | 株式会社東京精密 | プローバ |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070245553A1 (en) * | 1999-05-27 | 2007-10-25 | Chong Fu C | Fine pitch microfabricated spring contact structure & method |
US6812718B1 (en) * | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US7247035B2 (en) * | 2000-06-20 | 2007-07-24 | Nanonexus, Inc. | Enhanced stress metal spring contactor |
US7382142B2 (en) * | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
US7952373B2 (en) | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7579848B2 (en) * | 2000-05-23 | 2009-08-25 | Nanonexus, Inc. | High density interconnect system for IC packages and interconnect assemblies |
WO2003018865A1 (en) * | 2001-08-24 | 2003-03-06 | Nanonexus, Inc. | Method and apparatus for producing uniform isotropic stresses in a sputtered film |
US7112975B1 (en) * | 2003-03-26 | 2006-09-26 | Cypress Semiconductor Corporation | Advanced probe card and method of fabricating same |
DE102004009337A1 (de) * | 2004-02-26 | 2005-09-22 | Infineon Technologies Ag | Kontaktplatte zur Verwendung bei einer Kalibrierung von Testerkanälen eines Testersystems sowie ein Kalibriersystem mit einer solchen Kontaktplatte |
US7332921B2 (en) * | 2004-03-26 | 2008-02-19 | Cypress Semiconductor Corporation | Probe card and method for constructing same |
US7330040B2 (en) * | 2004-06-25 | 2008-02-12 | Infineon Technologies Ag | Test circuitry wafer |
US7071724B2 (en) * | 2004-06-25 | 2006-07-04 | Infineon Technologies Ag | Wafer probecard interface |
US20060074836A1 (en) * | 2004-09-03 | 2006-04-06 | Biowisdom Limited | System and method for graphically displaying ontology data |
US7046027B2 (en) * | 2004-10-15 | 2006-05-16 | Teradyne, Inc. | Interface apparatus for semiconductor device tester |
US7330038B2 (en) * | 2004-12-14 | 2008-02-12 | Silicon Light Machines Corporation | Interleaved MEMS-based probes for testing integrated circuits |
KR101304031B1 (ko) * | 2005-07-08 | 2013-09-04 | 폼팩터, 인코포레이티드 | 상호 교환 가능한 프로브 인서트를 구비한 프로브 카드조립체 |
US20080290885A1 (en) * | 2007-05-23 | 2008-11-27 | Texas Instruments Incorporated | Probe test system and method for testing a semiconductor package |
US9759772B2 (en) | 2011-10-28 | 2017-09-12 | Teradyne, Inc. | Programmable test instrument |
US10776233B2 (en) | 2011-10-28 | 2020-09-15 | Teradyne, Inc. | Programmable test instrument |
KR101317634B1 (ko) * | 2012-03-28 | 2013-10-10 | 주식회사 브리지 | 반도체 테스트용 mvp 프로브 보드 제조방법 |
US10551411B2 (en) * | 2018-02-09 | 2020-02-04 | Silicon Laboratories Inc. | Semiconductor test system with flexible and robust form factor |
JP7471240B2 (ja) * | 2018-06-14 | 2024-04-19 | テクトロニクス・インコーポレイテッド | 試験測定装置及び試験測定装置の送信部 |
CN109377704B (zh) * | 2018-12-08 | 2021-07-09 | 湖南明盛高新科技有限公司 | 一种电气设备专用的节能型电气火灾探测器 |
Family Cites Families (12)
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US5061033A (en) | 1990-12-03 | 1991-10-29 | Motorola, Inc. | Removable optical interconnect for electronic modules |
US5477160A (en) * | 1992-08-12 | 1995-12-19 | Fujitsu Limited | Module test card |
US6064213A (en) * | 1993-11-16 | 2000-05-16 | Formfactor, Inc. | Wafer-level burn-in and test |
US5807767A (en) | 1996-01-02 | 1998-09-15 | Micron Technology, Inc. | Technique for attaching die to leads |
US6551844B1 (en) * | 1997-01-15 | 2003-04-22 | Formfactor, Inc. | Test assembly including a test die for testing a semiconductor product die |
DE69842191D1 (de) * | 1997-11-05 | 2011-05-05 | Tokyo Electron Ltd | Halbleiterscheibenhaltevorrichtung |
US6288559B1 (en) | 1998-03-30 | 2001-09-11 | International Business Machines Corporation | Semiconductor testing using electrically conductive adhesives |
US6452411B1 (en) | 1999-03-01 | 2002-09-17 | Formfactor, Inc. | Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses |
US6400173B1 (en) | 1999-11-19 | 2002-06-04 | Hitachi, Ltd. | Test system and manufacturing of semiconductor device |
US6531335B1 (en) | 2000-04-28 | 2003-03-11 | Micron Technology, Inc. | Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods |
US6483330B1 (en) | 2000-09-11 | 2002-11-19 | Eaglestone Partners I, Llc | Method for selecting components for a matched set using wafer interposers |
US6527563B2 (en) | 2000-10-04 | 2003-03-04 | Gary A. Clayton | Grid interposer |
-
2002
- 2002-05-13 US US10/144,676 patent/US6847218B1/en not_active Expired - Lifetime
-
2003
- 2003-05-12 KR KR1020047018221A patent/KR20050063752A/ko not_active Application Discontinuation
- 2003-05-12 JP JP2004503975A patent/JP2005525556A/ja active Pending
- 2003-05-12 CN CNA03816695XA patent/CN1668931A/zh active Pending
- 2003-05-12 WO PCT/US2003/014844 patent/WO2003096035A1/en active Application Filing
- 2003-05-12 AU AU2003245273A patent/AU2003245273A1/en not_active Abandoned
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015014556A (ja) * | 2013-07-08 | 2015-01-22 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP2015014555A (ja) * | 2013-07-08 | 2015-01-22 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP2016191563A (ja) * | 2015-03-30 | 2016-11-10 | 株式会社東芝 | プローブカード及びそれを含む試験装置 |
JP2018146444A (ja) * | 2017-03-07 | 2018-09-20 | 株式会社東京精密 | プローバ |
Also Published As
Publication number | Publication date |
---|---|
AU2003245273A1 (en) | 2003-11-11 |
CN1668931A (zh) | 2005-09-14 |
KR20050063752A (ko) | 2005-06-28 |
US6847218B1 (en) | 2005-01-25 |
WO2003096035A1 (en) | 2003-11-20 |
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