JP2005522867A - 電気的絶縁体及び電子デバイス - Google Patents
電気的絶縁体及び電子デバイス Download PDFInfo
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- JP2005522867A JP2005522867A JP2003583073A JP2003583073A JP2005522867A JP 2005522867 A JP2005522867 A JP 2005522867A JP 2003583073 A JP2003583073 A JP 2003583073A JP 2003583073 A JP2003583073 A JP 2003583073A JP 2005522867 A JP2005522867 A JP 2005522867A
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- insulator
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- electrical insulator
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- 239000004020 conductor Substances 0.000 claims abstract description 89
- 239000012212 insulator Substances 0.000 claims abstract description 78
- 238000010295 mobile communication Methods 0.000 claims abstract description 10
- 239000004065 semiconductor Substances 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000008901 benefit Effects 0.000 description 8
- 239000011888 foil Substances 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 238000010924 continuous production Methods 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
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- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical group [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
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- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0376—Etching temporary metallic carrier substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (12)
- 導体パターンを備えた絶縁体であって、第1の側面及び第2の側面を備え、前記側面相互間の夾角は、180゜未満であり、導体パターンは、第1及び第2の側面上に延びていて、多数のストリップ状導体から成り、前記ストリップ状導体は各々、前記ストリップ状導体の幅よりも大きな寸法の少なくとも1つの領域を備え、前記領域は、前記絶縁体と一緒に組み立てられるべき電子要素との電気的接触に適しており、前記絶縁体は、導体パターンの前記キャリヤとして且つ前記電子要素のキャリヤとして働くことを特徴とする電気的絶縁体。
- 電子要素を取り付けるためのキャビティ又は開口部が、前記絶縁体に設けられていることを特徴とする請求項1に記載の電気的絶縁体。
- 前記キャビティは、底部及び側壁を有し、導体パターンは、側壁上に延びると共に任意的に前記キャビティの底部上に延び、前記電子要素との電気的接触のための接続領域が、キャビティ内に設けられていることを特徴とする請求項2に記載の電気的絶縁体。
- 前記開口部は、前記第1の側面から、前記第1の側面から遠ざかる方向に向いた第3の側面まで貫通して延びていて、第1の部品を第1の側面のところに配置すると共に第2の部品を前記第3の側面に配置できるようになっており、前記部品は、これらの間に介在する絶縁体と一緒になって電子要素を構成していることを特徴とする請求項2に記載の電気的絶縁体。
- 少なくとも或る数のストリップ状導体が、それぞれの端部のところに、接続領域として働き、閉じられた、好ましくは矩形の構造をなして配置された領域をそれぞれ備えていることを特徴とする請求項1又は4に記載の電気的絶縁体。
- 前記絶縁体は、第1の側面から遠ざかる方向に向いた第3の側面を有し、前記導体パターンは、第1の側面から前記第2の側面上でこれに沿って前記第3の側面上まで延びていることを特徴とする請求項1に記載の電気的絶縁体。
- 少なくとも或る数のストリップ状導体が、それぞれのストリップ状端部を有し、該端部は、少なくとも実質的に互いに平行に向けられた状態で第1の側面のところに位置していることを特徴とする請求項1に記載の電気的絶縁体。
- 前記ストリップ状導体の幅は、10〜500μmであることを特徴とする請求項1に記載の電気的絶縁体。
- 電子要素と、請求項1〜8のうち何れか一に記載の導体パターンが施された電気的絶縁体とを備える電子デバイス。
- 請求項4記載の電気的絶縁体が設けられ、前記第1の部品は、感光性半導体素子であり、前記第2の部品は、光学レンズであり、前記第1及び第2の部品は、協働してカメラを構成していることを特徴とする請求項9に記載の電子デバイス。
- 前記電気的絶縁体に電気的且つ機械的に接続されたディスプレイが設けられ、導体パターンは、感光性半導体素子からの信号を前記ディスプレイに伝送できるよう構成されていることを特徴とする請求項10に記載の電子デバイス。
- 請求項9〜11のうち何れか一に記載の電子デバイスを備える移動通信機器。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02076427 | 2002-04-11 | ||
EP02076427.0 | 2002-04-11 | ||
EP02078210.8 | 2002-08-05 | ||
EP02078210 | 2002-08-05 | ||
PCT/IB2003/001343 WO2003086034A1 (en) | 2002-04-11 | 2003-04-10 | Electrically insulating body, and electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005522867A true JP2005522867A (ja) | 2005-07-28 |
JP4919243B2 JP4919243B2 (ja) | 2012-04-18 |
Family
ID=28793210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003583073A Expired - Fee Related JP4919243B2 (ja) | 2002-04-11 | 2003-04-10 | 電気的絶縁体及び電子デバイス |
Country Status (7)
Country | Link |
---|---|
US (1) | US7652895B2 (ja) |
EP (1) | EP1500314A1 (ja) |
JP (1) | JP4919243B2 (ja) |
KR (1) | KR101002116B1 (ja) |
CN (1) | CN1647595A (ja) |
AU (1) | AU2003219358A1 (ja) |
WO (1) | WO2003086034A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011049331A (ja) * | 2009-08-26 | 2011-03-10 | Panasonic Electric Works Co Ltd | スイッチ機能付き回路基板 |
CN104925735A (zh) * | 2014-03-18 | 2015-09-23 | 精工爱普生株式会社 | 电子装置、电子模块、电子设备以及移动体 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1500314A1 (en) * | 2002-04-11 | 2005-01-26 | Koninklijke Philips Electronics N.V. | Electrically insulating body, and electronic device |
JP4112448B2 (ja) * | 2003-07-28 | 2008-07-02 | 株式会社東芝 | 電気光配線基板及び半導体装置 |
WO2005038911A1 (en) | 2003-10-15 | 2005-04-28 | Koninklijke Philips Electronics N.V. | Device, system and electric element |
US7258549B2 (en) * | 2004-02-20 | 2007-08-21 | Matsushita Electric Industrial Co., Ltd. | Connection member and mount assembly and production method of the same |
CN100399637C (zh) * | 2005-05-16 | 2008-07-02 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
CN200941518Y (zh) * | 2006-08-01 | 2007-08-29 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
US10219381B2 (en) | 2017-03-22 | 2019-02-26 | Carling Technologies, Inc. | Circuit board mounted switch with electro static discharge shield |
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DE2920091A1 (de) * | 1979-05-18 | 1980-11-27 | Subklew Christof Fa | Kunststoff-formteil |
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DE9300867U1 (de) * | 1993-01-22 | 1994-05-26 | Siemens AG, 80333 München | Einstückiges Isolierteil, insbesondere Spritzgießteil |
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DE19535714C1 (de) * | 1995-09-26 | 1997-02-06 | Weidmueller Interface | Statuszeigeeinrichtung für Leiterplattenanschlußelemente |
US5994648A (en) * | 1997-03-27 | 1999-11-30 | Ford Motor Company | Three-dimensional molded sockets for mechanical and electrical component attachment |
KR100259359B1 (ko) * | 1998-02-10 | 2000-06-15 | 김영환 | 반도체 패키지용 기판 및 반도체 패키지, 그리고 그 제조방법 |
US6037641A (en) * | 1998-08-25 | 2000-03-14 | Hewlett-Packard Company | Optical device package including an aligned lens |
DE19944383A1 (de) * | 1999-09-16 | 2001-04-19 | Ticona Gmbh | Gehäuse für elektrische oder elektronische Vorrichtungen mit integrierten Leiterbahnen |
JP2001245267A (ja) | 2000-02-28 | 2001-09-07 | Matsushita Electric Ind Co Ltd | ビデオカメラ付き携帯型情報通信端末装置 |
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US6555906B2 (en) * | 2000-12-15 | 2003-04-29 | Intel Corporation | Microelectronic package having a bumpless laminated interconnection layer |
US7053381B2 (en) * | 2001-12-06 | 2006-05-30 | General Electric Company | Dual para-xylylene layers for an X-ray detector |
EP1500314A1 (en) * | 2002-04-11 | 2005-01-26 | Koninklijke Philips Electronics N.V. | Electrically insulating body, and electronic device |
JP2004063425A (ja) * | 2002-07-31 | 2004-02-26 | Mitsumi Electric Co Ltd | モジュール用コネクタ |
US20050237424A1 (en) * | 2002-08-05 | 2005-10-27 | Koninklijke Philips Electronics N.V. | Device for mobile image communication |
CN2703341Y (zh) * | 2004-01-08 | 2005-06-01 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
CN100399637C (zh) * | 2005-05-16 | 2008-07-02 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
-
2003
- 2003-04-10 EP EP03715168A patent/EP1500314A1/en not_active Withdrawn
- 2003-04-10 AU AU2003219358A patent/AU2003219358A1/en not_active Abandoned
- 2003-04-10 KR KR1020047016003A patent/KR101002116B1/ko not_active IP Right Cessation
- 2003-04-10 JP JP2003583073A patent/JP4919243B2/ja not_active Expired - Fee Related
- 2003-04-10 WO PCT/IB2003/001343 patent/WO2003086034A1/en active Application Filing
- 2003-04-10 CN CNA038081334A patent/CN1647595A/zh active Pending
- 2003-04-10 US US10/510,302 patent/US7652895B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011049331A (ja) * | 2009-08-26 | 2011-03-10 | Panasonic Electric Works Co Ltd | スイッチ機能付き回路基板 |
CN104925735A (zh) * | 2014-03-18 | 2015-09-23 | 精工爱普生株式会社 | 电子装置、电子模块、电子设备以及移动体 |
Also Published As
Publication number | Publication date |
---|---|
CN1647595A (zh) | 2005-07-27 |
WO2003086034A1 (en) | 2003-10-16 |
US7652895B2 (en) | 2010-01-26 |
US20050142917A1 (en) | 2005-06-30 |
AU2003219358A1 (en) | 2003-10-20 |
KR101002116B1 (ko) | 2010-12-16 |
JP4919243B2 (ja) | 2012-04-18 |
EP1500314A1 (en) | 2005-01-26 |
KR20040099408A (ko) | 2004-11-26 |
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