JP2005521235A5 - - Google Patents

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Publication number
JP2005521235A5
JP2005521235A5 JP2003513033A JP2003513033A JP2005521235A5 JP 2005521235 A5 JP2005521235 A5 JP 2005521235A5 JP 2003513033 A JP2003513033 A JP 2003513033A JP 2003513033 A JP2003513033 A JP 2003513033A JP 2005521235 A5 JP2005521235 A5 JP 2005521235A5
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JP
Japan
Prior art keywords
wafer
processing
transfer
dimensions
transfer mechanism
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JP2003513033A
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English (en)
Japanese (ja)
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JP2005521235A (ja
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Priority claimed from US09/901,462 external-priority patent/US6625497B2/en
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Publication of JP2005521235A publication Critical patent/JP2005521235A/ja
Publication of JP2005521235A5 publication Critical patent/JP2005521235A5/ja
Pending legal-status Critical Current

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JP2003513033A 2001-07-10 2002-07-01 半導体ウエハの処理装置及び方法 Pending JP2005521235A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/901,462 US6625497B2 (en) 2000-11-20 2001-07-10 Semiconductor processing module with integrated feedback/feed forward metrology
PCT/US2002/020705 WO2003007365A2 (en) 2001-07-10 2002-07-01 Semiconductor processing module with integrated feedback/feed forward metrology

Publications (2)

Publication Number Publication Date
JP2005521235A JP2005521235A (ja) 2005-07-14
JP2005521235A5 true JP2005521235A5 (https=) 2006-01-05

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JP2003513033A Pending JP2005521235A (ja) 2001-07-10 2002-07-01 半導体ウエハの処理装置及び方法

Country Status (7)

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US (2) US6625497B2 (https=)
EP (1) EP1405338A2 (https=)
JP (1) JP2005521235A (https=)
KR (1) KR20040020906A (https=)
AU (1) AU2002316463A1 (https=)
TW (1) TW546697B (https=)
WO (1) WO2003007365A2 (https=)

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