JP2005520331A5 - - Google Patents
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- JP2005520331A5 JP2005520331A5 JP2003575688A JP2003575688A JP2005520331A5 JP 2005520331 A5 JP2005520331 A5 JP 2005520331A5 JP 2003575688 A JP2003575688 A JP 2003575688A JP 2003575688 A JP2003575688 A JP 2003575688A JP 2005520331 A5 JP2005520331 A5 JP 2005520331A5
- Authority
- JP
- Japan
- Prior art keywords
- shielding material
- emi shielding
- flame retardant
- gap
- material according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 148
- 239000003063 flame retardant Substances 0.000 claims description 122
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 110
- 239000006260 foam Substances 0.000 claims description 40
- 239000011148 porous material Substances 0.000 claims description 39
- 239000011248 coating agent Substances 0.000 claims description 36
- 238000000576 coating method Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910019142 PO4 Inorganic materials 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- 239000010452 phosphate Substances 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 239000011496 polyurethane foam Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 239000004254 Ammonium phosphate Substances 0.000 claims description 3
- ZRIUUUJAJJNDSS-UHFFFAOYSA-N ammonium phosphates Chemical group [NH4+].[NH4+].[NH4+].[O-]P([O-])([O-])=O ZRIUUUJAJJNDSS-UHFFFAOYSA-N 0.000 claims description 3
- 235000019289 ammonium phosphates Nutrition 0.000 claims description 3
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical group [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910000148 ammonium phosphate Inorganic materials 0.000 claims description 2
- 229910052755 nonmetal Inorganic materials 0.000 claims description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 claims 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 14
- 239000000523 sample Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- 235000021317 phosphate Nutrition 0.000 description 5
- 230000009977 dual effect Effects 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 4
- 239000000080 wetting agent Substances 0.000 description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 3
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000006261 foam material Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- -1 baradium Chemical compound 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 235000019837 monoammonium phosphate Nutrition 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000005696 Diammonium phosphate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 229920013820 alkyl cellulose Polymers 0.000 description 1
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- UGQQAJOWXNCOPY-UHFFFAOYSA-N dechlorane plus Chemical compound C12CCC3C(C4(Cl)Cl)(Cl)C(Cl)=C(Cl)C4(Cl)C3CCC2C2(Cl)C(Cl)=C(Cl)C1(Cl)C2(Cl)Cl UGQQAJOWXNCOPY-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910000388 diammonium phosphate Inorganic materials 0.000 description 1
- 235000019838 diammonium phosphate Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007760 metering rod coating Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ASLWPAWFJZFCKF-UHFFFAOYSA-N tris(1,3-dichloropropan-2-yl) phosphate Chemical compound ClCC(CCl)OP(=O)(OC(CCl)CCl)OC(CCl)CCl ASLWPAWFJZFCKF-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/093,667 US7060348B2 (en) | 2002-03-08 | 2002-03-08 | Flame retardant, electrically conductive shielding materials and methods of making the same |
| PCT/US2003/006965 WO2003077627A1 (en) | 2002-03-08 | 2003-03-07 | Flame retardant, electrically conductive emi shielding materials amd methods of making the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008325895A Division JP2009111408A (ja) | 2002-03-08 | 2008-12-22 | 難燃性の導電性ｅｍｉ遮蔽物質及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005520331A JP2005520331A (ja) | 2005-07-07 |
| JP2005520331A5 true JP2005520331A5 (enExample) | 2008-09-18 |
| JP4289669B2 JP4289669B2 (ja) | 2009-07-01 |
Family
ID=27804219
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003575688A Expired - Fee Related JP4289669B2 (ja) | 2002-03-08 | 2003-03-07 | 難燃性の導電性ｅｍｉ遮蔽物質及びその製造方法 |
| JP2008325895A Pending JP2009111408A (ja) | 2002-03-08 | 2008-12-22 | 難燃性の導電性ｅｍｉ遮蔽物質及びその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008325895A Pending JP2009111408A (ja) | 2002-03-08 | 2008-12-22 | 難燃性の導電性ｅｍｉ遮蔽物質及びその製造方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US7060348B2 (enExample) |
| EP (1) | EP1483949B1 (enExample) |
| JP (2) | JP4289669B2 (enExample) |
| KR (1) | KR100885012B1 (enExample) |
| CN (1) | CN100393188C (enExample) |
| AT (1) | ATE508623T1 (enExample) |
| AU (1) | AU2003217977A1 (enExample) |
| DE (1) | DE60336990D1 (enExample) |
| TW (1) | TWI339561B (enExample) |
| WO (1) | WO2003077627A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030036326A1 (en) * | 2001-08-13 | 2003-02-20 | Seiren Co. Ltd. | Flame retardant conductive material and producing method thereof |
| CN1810068A (zh) * | 2003-06-19 | 2006-07-26 | 波零公司 | 印刷电路板的emi吸收屏蔽 |
| US20100258344A1 (en) * | 2005-02-09 | 2010-10-14 | Laird Technologies, Inc. | Flame retardant emi shields |
| US8545974B2 (en) * | 2005-02-09 | 2013-10-01 | Laird Technologies, Inc. | Flame retardant EMI shields |
| CN101120629A (zh) * | 2005-02-16 | 2008-02-06 | 帕克-汉尼芬公司 | 阻燃emi屏蔽垫 |
| CN101151311A (zh) * | 2005-03-30 | 2008-03-26 | 帕克-汉尼芬公司 | 用于emi屏蔽垫的阻燃泡沫材料 |
| US7935410B2 (en) * | 2006-04-19 | 2011-05-03 | Furio Orologio | Metallized polymeric film reflective insulation material |
| US7935411B2 (en) * | 2006-04-19 | 2011-05-03 | Furio Orologio | Metallized polymeric film reflective insulation material |
| US20080157915A1 (en) * | 2007-01-03 | 2008-07-03 | Ethan Lin | Flame retardant, electrically-conductive pressure sensitive adhesive materials and methods of making the same |
| WO2009045990A1 (en) * | 2007-10-02 | 2009-04-09 | Parker Hannifin Corporation | Nano inks for imparting emi shielding to windows |
| CN102127269B (zh) * | 2010-01-12 | 2014-01-29 | 盛亚军 | 一种阻燃聚合物泡沫材料及其制备方法 |
| US8838022B2 (en) | 2010-04-13 | 2014-09-16 | Radeum, Inc. | System and method for securely pairing a wireless device using wireless communication |
| US20130133942A1 (en) * | 2010-07-26 | 2013-05-30 | Laird Technologies, Inc. | Process for the fabrication of highly electrically-conductive polymer foams with controlled compression set suitable for use in emi shielding applications |
| CN101955246B (zh) * | 2010-08-31 | 2012-04-18 | 中国矿业大学(北京) | 电化学氧化法处理污水专用三维电极材料的制备方法及电化学氧化系统 |
| GB2491414B (en) * | 2011-06-03 | 2017-11-01 | Acell Ind Ltd | Composite Open-Cell Foam Insulating Panels |
| DE212013000167U1 (de) | 2012-07-28 | 2015-03-06 | Laird Technologies, Inc. | Mit metallischem Film überzogener Schaumstoffkontakt |
| CN103963365B (zh) | 2013-01-31 | 2017-03-01 | 莱尔德技术股份有限公司 | 导电多孔材料组件及其制造方法 |
| WO2014139126A1 (en) | 2013-03-14 | 2014-09-18 | Laird Technologies, Inc. | Flame-retardant electrically-conductive adhesive material and method of making the same |
| JP2015076526A (ja) * | 2013-10-09 | 2015-04-20 | 旭化成せんい株式会社 | ノイズ抑制シート |
| US9357683B2 (en) * | 2014-09-26 | 2016-05-31 | Laird Technologies, Inc. | Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam |
| CN107027254B (zh) * | 2016-02-02 | 2020-12-25 | 3M创新有限公司 | 可压缩衬垫、其制备方法和包含其的电子产品 |
| JP6926416B2 (ja) * | 2016-08-25 | 2021-08-25 | コニカミノルタ株式会社 | 樹脂成形体および樹脂成形体の製造方法 |
| CN112094492B (zh) * | 2019-06-17 | 2021-09-24 | 四川大学 | 一种兼具优异阻燃和电磁屏蔽性能的柔性聚氨酯基复合材料及其制备方法 |
| US11064636B2 (en) | 2019-09-27 | 2021-07-13 | Laird Technologies, Inc. | EMI shields including electrically-conductive foam |
| KR102734208B1 (ko) * | 2020-01-20 | 2024-11-25 | 주식회사 엘지화학 | 복합재의 제조 방법 |
| CN114213791B (zh) * | 2022-01-06 | 2022-12-13 | 常德力元新材料有限责任公司 | 一种阻燃剂、阻燃导电屏蔽材料和制备方法 |
| CN114230853B (zh) * | 2022-01-06 | 2023-01-17 | 常德力元新材料有限责任公司 | 一种孔洞型阻燃导电屏蔽材料和制备方法 |
| CN114388174B (zh) * | 2022-01-24 | 2023-12-05 | 苏州迪玛科电子科技有限公司 | 一种多层导电泡棉 |
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| BR0017076B1 (pt) | 2000-02-18 | 2014-09-02 | Parker Hannifin Corp | Método de fabricação de gaxeta de blindagem emi de formação no lugar, de força de fechamento baixa |
| JP5014529B2 (ja) * | 2000-07-18 | 2012-08-29 | 株式会社イノアックコーポレーション | 難燃性を有する導電性多孔体およびその製造方法 |
| JP2002275306A (ja) * | 2001-03-21 | 2002-09-25 | Bridgestone Corp | 導電性多孔質体及びその製造方法 |
| JP4112307B2 (ja) * | 2001-08-13 | 2008-07-02 | セーレン株式会社 | 難燃性を有する導電性材料及びその製造方法 |
| US20030036326A1 (en) | 2001-08-13 | 2003-02-20 | Seiren Co. Ltd. | Flame retardant conductive material and producing method thereof |
-
2002
- 2002-03-08 US US10/093,667 patent/US7060348B2/en not_active Expired - Lifetime
-
2003
- 2003-03-07 KR KR1020047014078A patent/KR100885012B1/ko not_active Expired - Fee Related
- 2003-03-07 EP EP20030713954 patent/EP1483949B1/en not_active Expired - Lifetime
- 2003-03-07 WO PCT/US2003/006965 patent/WO2003077627A1/en not_active Ceased
- 2003-03-07 CN CNB038103281A patent/CN100393188C/zh not_active Expired - Lifetime
- 2003-03-07 JP JP2003575688A patent/JP4289669B2/ja not_active Expired - Fee Related
- 2003-03-07 DE DE60336990T patent/DE60336990D1/de not_active Expired - Lifetime
- 2003-03-07 AU AU2003217977A patent/AU2003217977A1/en not_active Abandoned
- 2003-03-07 AT AT03713954T patent/ATE508623T1/de not_active IP Right Cessation
- 2003-03-07 TW TW92104921A patent/TWI339561B/zh not_active IP Right Cessation
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2006
- 2006-03-24 US US11/389,301 patent/US20060182877A1/en not_active Abandoned
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2008
- 2008-12-22 JP JP2008325895A patent/JP2009111408A/ja active Pending
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