JP2005514780A5 - - Google Patents

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Publication number
JP2005514780A5
JP2005514780A5 JP2003557747A JP2003557747A JP2005514780A5 JP 2005514780 A5 JP2005514780 A5 JP 2005514780A5 JP 2003557747 A JP2003557747 A JP 2003557747A JP 2003557747 A JP2003557747 A JP 2003557747A JP 2005514780 A5 JP2005514780 A5 JP 2005514780A5
Authority
JP
Japan
Prior art keywords
force
spindle
load cell
wafer
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003557747A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005514780A (ja
Filing date
Publication date
Priority claimed from US10/033,671 external-priority patent/US6712670B2/en
Application filed filed Critical
Publication of JP2005514780A publication Critical patent/JP2005514780A/ja
Publication of JP2005514780A5 publication Critical patent/JP2005514780A5/ja
Pending legal-status Critical Current

Links

JP2003557747A 2001-12-27 2002-12-20 Ｃｍｐ中にウエハに下降力を印加する方法及び装置 Pending JP2005514780A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/033,671 US6712670B2 (en) 2001-12-27 2001-12-27 Method and apparatus for applying downward force on wafer during CMP
PCT/US2002/040942 WO2003057404A2 (en) 2001-12-27 2002-12-20 Method and apparatus for applying downward force on wafer during cmp

Publications (2)

Publication Number Publication Date
JP2005514780A JP2005514780A (ja) 2005-05-19
JP2005514780A5 true JP2005514780A5 (enExample) 2006-01-05

Family

ID=21871758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003557747A Pending JP2005514780A (ja) 2001-12-27 2002-12-20 Ｃｍｐ中にウエハに下降力を印加する方法及び装置

Country Status (8)

Country Link
US (2) US6712670B2 (enExample)
EP (1) EP1467839A4 (enExample)
JP (1) JP2005514780A (enExample)
KR (1) KR20040066195A (enExample)
CN (1) CN1607994A (enExample)
AU (1) AU2002358257A1 (enExample)
TW (1) TWI226083B (enExample)
WO (1) WO2003057404A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2869604B1 (fr) * 2004-04-28 2006-06-23 Saint Gobain Activation d'une surface de verre
EP1628202A1 (de) * 2004-08-19 2006-02-22 Ubs Ag Daten-Ausgabe-System und Daten-Ausgabe-Verfahren mit Daten-Ausgabe-Überwachung
KR100796466B1 (ko) * 2006-08-31 2008-01-21 인하대학교 산학협력단 반도체 웨이퍼 폴리싱 장치의 유동헤드장치
JP5365243B2 (ja) * 2009-02-19 2013-12-11 凸版印刷株式会社 ベルト搬送研磨機
FR2980386B1 (fr) * 2011-09-27 2014-09-12 Visioptimum Internat Dispositif de polissage de lentilles optiques
JP5973883B2 (ja) * 2012-11-15 2016-08-23 株式会社荏原製作所 基板保持装置および研磨装置
US9662761B2 (en) * 2013-12-02 2017-05-30 Ebara Corporation Polishing apparatus
US10350722B2 (en) 2016-02-05 2019-07-16 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
US10363647B2 (en) 2016-02-05 2019-07-30 Toshiba Kikai Kabushiki Kaisha Grinding tool
JP7638815B2 (ja) * 2021-07-21 2025-03-04 株式会社荏原製作所 ブレークイン処理装置、およびブレークイン処理方法
CN117381656B (zh) * 2023-11-27 2025-08-26 北京晶亦精微科技股份有限公司 一种晶圆加载状态检测装置及抛光装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5498199A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
US5795215A (en) * 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
GB9512262D0 (en) * 1995-06-16 1995-08-16 Bingham Richard G Tool for computer-controlled machine for optical polishing and figuring
US5653622A (en) * 1995-07-25 1997-08-05 Vlsi Technology, Inc. Chemical mechanical polishing system and method for optimization and control of film removal uniformity
DE29513946U1 (de) * 1995-08-30 1997-01-09 Weber, Georg, 96317 Kronach Vorrichtung zum Andrücken eines umlaufenden Schleifbandes
US5762536A (en) * 1996-04-26 1998-06-09 Lam Research Corporation Sensors for a linear polisher
JPH1071560A (ja) * 1996-08-27 1998-03-17 Speedfam Co Ltd ウエハ加圧装置
US5738568A (en) * 1996-10-04 1998-04-14 International Business Machines Corporation Flexible tilted wafer carrier
JP3763975B2 (ja) * 1998-07-21 2006-04-05 株式会社荏原製作所 トップリング制御装置及びポリッシング装置
US6352466B1 (en) * 1998-08-31 2002-03-05 Micron Technology, Inc. Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
US6241593B1 (en) * 1999-07-09 2001-06-05 Applied Materials, Inc. Carrier head with pressurizable bladder
US6439978B1 (en) * 2000-09-07 2002-08-27 Oliver Design, Inc. Substrate polishing system using roll-to-roll fixed abrasive

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