JP2005514212A - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

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Publication number
JP2005514212A
JP2005514212A JP2003559715A JP2003559715A JP2005514212A JP 2005514212 A JP2005514212 A JP 2005514212A JP 2003559715 A JP2003559715 A JP 2003559715A JP 2003559715 A JP2003559715 A JP 2003559715A JP 2005514212 A JP2005514212 A JP 2005514212A
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JP
Japan
Prior art keywords
laser
laser beam
deflection
partially reflecting
laser beams
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003559715A
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English (en)
Japanese (ja)
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JP2005514212A5 (enExample
Inventor
ユルゲン マイアー ハンス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JP2005514212A publication Critical patent/JP2005514212A/ja
Publication of JP2005514212A5 publication Critical patent/JP2005514212A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2003559715A 2002-01-16 2003-01-07 レーザ加工装置 Pending JP2005514212A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10201476A DE10201476B4 (de) 2002-01-16 2002-01-16 Laserbearbeitungsvorrichtung
PCT/DE2003/000019 WO2003059567A1 (de) 2002-01-16 2003-01-07 Laserbearbeitungsvorrichtung

Publications (2)

Publication Number Publication Date
JP2005514212A true JP2005514212A (ja) 2005-05-19
JP2005514212A5 JP2005514212A5 (enExample) 2009-06-18

Family

ID=7712285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003559715A Pending JP2005514212A (ja) 2002-01-16 2003-01-07 レーザ加工装置

Country Status (7)

Country Link
US (1) US6727462B2 (enExample)
EP (1) EP1465747B1 (enExample)
JP (1) JP2005514212A (enExample)
KR (1) KR20040073563A (enExample)
CN (1) CN1310733C (enExample)
DE (2) DE10201476B4 (enExample)
WO (1) WO2003059567A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013215804A (ja) * 2012-04-05 2013-10-24 Samsung Electro-Mechanics Co Ltd レーザ加工装置
WO2016143520A1 (ja) * 2015-03-11 2016-09-15 オムロン株式会社 接合構造体の製造方法および接合構造体
KR20190127845A (ko) * 2017-03-15 2019-11-13 포이에티스 바이오-잉크 전사를 위한 장비

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4299185B2 (ja) * 2004-04-27 2009-07-22 株式会社ディスコ レーザー加工装置
DE102004040068B4 (de) * 2004-08-18 2018-01-04 Via Mechanics, Ltd. Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks
US20060128073A1 (en) * 2004-12-09 2006-06-15 Yunlong Sun Multiple-wavelength laser micromachining of semiconductor devices
WO2006063153A2 (en) * 2004-12-09 2006-06-15 Electro Scientific Industries, Inc. Multiple-wavelength laser micromachining of semiconductor devices
DE102006013929A1 (de) * 2006-03-21 2007-09-27 Hauni Maschinenbau Ag Perforationsvorrichtung der tabakverarbeitenden Industrie zum Perforieren einer Umhüllung eines stabförmigen Artikels
TWI308880B (en) * 2006-11-17 2009-04-21 Chunghwa Picture Tubes Ltd Laser cutting apparatus and laser cutting method
KR100761238B1 (ko) * 2007-03-13 2007-09-27 에스엔유 프리시젼 주식회사 레이저빔 가공장치
US8116341B2 (en) * 2007-05-31 2012-02-14 Electro Scientific Industries, Inc. Multiple laser wavelength and pulse width process drilling
DE102007032903A1 (de) * 2007-07-14 2009-01-15 Schepers Gmbh + Co. Kg Verfahren zum Betreiben einer Lasergravureinrichtung
CN100493814C (zh) * 2007-10-10 2009-06-03 厦门大学 带有测量装置的多功能激光加工刀具
EP2113332B1 (de) * 2008-05-02 2010-08-18 Leister Process Technologies Verfahren und Laservorrichtung zum Bearbeiten und/oder Verbinden von Werkstücken mittels Laserstrahlung mit Leistungswirk- und Pilotlaser und mindestens einem diffraktiven optischen Element
EP2208568A1 (en) * 2009-01-20 2010-07-21 Synova S.A. Apparatus and method for processing material by means of laser
JP5580826B2 (ja) * 2009-08-11 2014-08-27 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
US8525073B2 (en) * 2010-01-27 2013-09-03 United Technologies Corporation Depth and breakthrough detection for laser machining
KR101283557B1 (ko) * 2010-05-20 2013-07-15 (주)미래컴퍼니 레이저 가공장치
KR101290519B1 (ko) * 2011-09-07 2013-07-26 주식회사 이오테크닉스 레이저 가공 장치
US9287987B2 (en) * 2011-12-01 2016-03-15 Futurewei Technologies, Inc. Self-seeded colorless burst-mode transmitter using reflective semiconductor optical amplifier and injection locked Fabry-Perot laser
US20130153552A1 (en) * 2011-12-14 2013-06-20 Gwangju Institute Of Science And Technology Scribing apparatus and method for having analysis function of material distribution
CN105562947B (zh) * 2016-02-19 2017-09-15 武汉铱科赛科技有限公司 一种旋转对称轴平行的旋转光束组钻孔系统及钻孔方法
CN107470786A (zh) * 2017-09-14 2017-12-15 深圳市牧激科技有限公司 多激光头装置
CN108572061B (zh) * 2018-07-23 2023-10-13 中国工程物理研究院激光聚变研究中心 全口径谐波转换效率测量系统及其测量方法
EP3685954B1 (en) * 2019-01-22 2024-01-24 Synova S.A. Method for cutting a workpiece with a complex fluid-jet-guided laser beam
DE102019115554A1 (de) * 2019-06-07 2020-12-10 Bystronic Laser Ag Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks
CN111856768B (zh) * 2020-07-31 2025-04-15 陕西精耀光电技术有限公司 一种基于双色镜的双光同轴模组
WO2025122611A1 (en) * 2023-12-04 2025-06-12 Ipg Photonics Corporation Systems and methods for simulation of laser fuence on a surface of a part during a laser treatment process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810970A (ja) * 1994-06-22 1996-01-16 Sony Corp レーザ加工装置及び方法
JP2000190087A (ja) * 1998-12-25 2000-07-11 Sumitomo Heavy Ind Ltd ２軸レ―ザ加工機
JP2001196665A (ja) * 2000-01-13 2001-07-19 Hamamatsu Kagaku Gijutsu Kenkyu Shinkokai 二波長レーザ加工光学装置およびレーザ加工方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
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DE299702C (enExample) *
US4789770A (en) * 1987-07-15 1988-12-06 Westinghouse Electric Corp. Controlled depth laser drilling system
JPH01189503A (ja) * 1988-01-25 1989-07-28 Hitachi Ltd パターン検出方法及びその装置
US5293213A (en) * 1992-08-12 1994-03-08 Klein Uwe K A Utilization of a modulated laser beam in heterodyne interferometry
US6229940B1 (en) * 1998-11-30 2001-05-08 Mcdonnell Douglas Corporation Incoherent fiber optic laser system
DE19910880A1 (de) * 1999-03-11 2000-09-14 Deckel Maho Gmbh Werkzeugmaschine für die Werkstückbearbeitung mit spanenden Werkzeugen und Laserstrahl
DE19955383A1 (de) * 1999-10-29 2001-05-03 Orga Kartensysteme Gmbh Verfahren zum Aufbringen von farbigen Informationen auf einen Gegenstand
JP2001170788A (ja) * 1999-12-10 2001-06-26 Canon Inc レーザー加工方法およびその装置
DE19959862A1 (de) * 1999-12-10 2001-06-13 Forschungszentrum Juelich Gmbh Lasersystem mit steuerbarer Pulsdauer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810970A (ja) * 1994-06-22 1996-01-16 Sony Corp レーザ加工装置及び方法
JP2000190087A (ja) * 1998-12-25 2000-07-11 Sumitomo Heavy Ind Ltd ２軸レ―ザ加工機
JP2001196665A (ja) * 2000-01-13 2001-07-19 Hamamatsu Kagaku Gijutsu Kenkyu Shinkokai 二波長レーザ加工光学装置およびレーザ加工方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013215804A (ja) * 2012-04-05 2013-10-24 Samsung Electro-Mechanics Co Ltd レーザ加工装置
WO2016143520A1 (ja) * 2015-03-11 2016-09-15 オムロン株式会社 接合構造体の製造方法および接合構造体
JP2016168600A (ja) * 2015-03-11 2016-09-23 オムロン株式会社 接合構造体の製造方法および接合構造体
KR20190127845A (ko) * 2017-03-15 2019-11-13 포이에티스 바이오-잉크 전사를 위한 장비
KR102520129B1 (ko) 2017-03-15 2023-04-10 포이에티스 바이오-잉크 전사를 위한 장비

Also Published As

Publication number Publication date
CN1617784A (zh) 2005-05-18
DE10201476A1 (de) 2003-07-31
DE10201476B4 (de) 2005-02-24
US6727462B2 (en) 2004-04-27
CN1310733C (zh) 2007-04-18
WO2003059567A1 (de) 2003-07-24
US20030141288A1 (en) 2003-07-31
DE50306459D1 (de) 2007-03-22
EP1465747A1 (de) 2004-10-13
KR20040073563A (ko) 2004-08-19
EP1465747B1 (de) 2007-02-07

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